CN218394507U - Slide glass for spraying glue on hollow-out structure chip and glue spraying structure - Google Patents

Abstract

The utility model discloses a slide glass and spout glued structure for hollow out construction chip spout glue, this slide glass include the circular slide glass body that the level set up, evenly distributed has the support column of a plurality of vertical settings on the slide glass body, and every support column area is less than and waits to support the clearance that hollow out construction chip interval set up the constitution on the wafer, and all support column protrusion slide glass bodies highly uniform just is 0.05 to 0.15mm. The slide glass not only can effectively reduce photoresist diffraction, but also can uniformly support the wafer, reduce the occurrence of cracking and improve the yield of chip manufacturing.

Description

A carrier and glue spraying structure for hollow structure chips

technical field

The utility model belongs to the field of photolithography of MEMS devices, in particular to a carrier sheet and a glue-spraying structure used for glue-spraying of chips with a hollow structure.

Background technique

The development trend of MEMS devices is that the precision requirements are getting higher and higher, and the volume is getting smaller and smaller. As shown in FIG. 1 , an existing MEMS device generally has several hollow-structure chips 2 distributed on a wafer 1 , and all the hollow-structure chips 2 are evenly spaced.

For the hollow structure chip on the wafer, it is usually necessary to make electrodes on the front, back and side of the chip, that is, it is necessary to coat the front, back and side of the chip with photoresist as a protective layer during etching, while the hollow structure chip cannot The conventional method of spin-coating photoresist is used, therefore, spray coating is usually used. At present, a circular carrier is used to support the wafer, and then the glue is sprayed. However, in the process of spraying photoresist, due to the small size of photoresist droplets, when spraying the front side, a part of the photoresist will be diffracted to the back side driven by the airflow, and the diffracted photoresist will affect the exposure. The electrode shape will cause device failure; in addition, the ring-shaped carrier cannot support the wafer evenly, especially in the process of sheet corrosion, the wafer is prone to damage due to uneven force, and the airflow during glue spraying will aggravate the cracks and reduce the Yield of chip fabrication.

Contents of the invention

In view of the above-mentioned deficiencies in the prior art, the purpose of this utility model is to provide a carrier sheet and a glue spraying structure for spraying glue on chips with hollow structures. The carrier sheet can not only effectively reduce the diffraction of photoresist, but also Evenly support the wafer, reduce the occurrence of splits, and improve the yield of chip production.

The technical scheme of the utility model is achieved in that:

A carrier used for glue spraying of chips with a hollow structure, comprising a circular carrier body arranged horizontally, a number of vertically arranged support columns are evenly distributed on the carrier body, and the area occupied by each support column is smaller than that to be supported The hollow structure chips on the wafer are arranged at intervals to form a gap, and the height of all support columns protruding from the carrier body is consistent and is 0.05~0.15mm.

Further, the support column has a hemispherical, cylindrical or multi-layered cylindrical structure.

Further, the support column is made by a spot welding machine.

A glue-spraying structure for hollow-out structure chip glue-spraying, including a wafer and hollow-out structure chips evenly spaced on the wafer, and also includes the aforementioned carrier, the wafer is placed horizontally above the carrier, And all the support columns on the carrier body are arranged on the wafers corresponding to the gaps between the chips with the hollow structure, so as to support the wafers.

Compared with the prior art, the utility model has the following beneficial effects:

The support columns on the carrier body in the utility model are evenly distributed, and compared with the existing ring-shaped carrier, the wafer can be evenly supported, so that the wafer will not be damaged due to uneven force, and the risk of fragmentation is reduced. It can also effectively reduce the contact area between the carrier and the wafer, thereby avoiding damage to the back of the wafer. At the same time, it can also avoid the influence of the air flow on the wafer during the glue spraying process, thereby helping to improve the yield of chip production.

In addition, the support column is limited to 0.05~0.15mm. It has been verified by experiments that at this height, not only can the wafer be supported, but also the photoresist will not diffract to Hollow out the back of the chip to avoid device failure caused by photoresist diffraction and further improve the yield of chip manufacturing.

Description of drawings

Figure 1 - Schematic diagram of wafer and hollow structure chips.

Figure 2 - Schematic diagram of the structure of the slide.

Figure 3 - Manufacturing process of support columns.

Figure 4 - Schematic diagram of the structure of the spray glue structure.

Among them: 1-wafer; 2-hollow structure chip; 3-carrier body; 4-supporting column.

Detailed ways

The utility model is described in further detail below in conjunction with accompanying drawing and specific embodiment.

Referring to Fig. 1, Fig. 2 and Fig. 4, a carrier sheet used for glue spraying of hollow-out structure chips includes a horizontally arranged circular carrier body 3, and several vertically arranged supports are evenly distributed on the carrier body 3 Columns 4, the area occupied by each support column 4 is smaller than the gap formed by the hollow structure chips 2 on the wafer 1 to be supported, and the height of all support columns 4 protruding from the carrier body 3 is the same and is 0.05~0.15mm.

First of all, the support column here is equivalent to a small support point. The support columns on the carrier body are evenly distributed. Damage due to unevenness, and at the same time, it can also avoid the influence of airflow on the wafer during the glue spraying process, which is conducive to improving the yield of chip production.

Secondly, here, the support column is limited to 0.05~0.15mm. Through experiments, it is verified that at this height, not only can the wafer be supported, but also the photoresist will generally not Diffraction to the back of the chip with a hollow structure, thereby avoiding device failure caused by photoresist diffraction, and further improving the yield of chip manufacturing. This is like holding an umbrella on a rainy day. If the height of the umbrella is too high, the raindrops will float under the umbrella.

Thirdly, compared with the existing ring-shaped carrier, the wafer is supported by several support columns, which can effectively reduce the contact area between the carrier and the wafer, thereby avoiding damage to the back of the wafer.

During specific implementation, the support column 4 is in a hemispherical, cylindrical or multi-layered cylindrical structure.

Here, if it is a hemispherical support column, the arc surface of the support column is used to support the wafer. Among them, the support column is made by the ball planting function of the spot welding machine, and the thickness and shape are controlled by applying constant pressure to the top surface of the support column. As shown in Figure 3, the steps are as follows: the first step is to use a magnetron sputtering coating machine to coat a metal film on the carrier body, and then draw two dotted lines that pass through the center of the circle and are perpendicular to each other on the carrier body. Plant the support column ① at the intersection of the straight lines, and then apply constant pressure to the support column to control the thickness and shape; in the second step, take the position of the support column ① as the center of the circle, and draw a circle with a radius of 2/5 of the slide radius. Evenly plant support columns ②~⑤ on it; in the third step, also take the position of support column ① as the center of the circle, draw a circle with a radius of 4/5 of the radius of the slide, and plant on it evenly ⑥~No. 13 support column. The support column planted on the metal film has sufficient adhesion, will not fall off during normal operation and cleaning, and can be reused.

Referring to FIG. 4 , a glue spraying structure for glue spraying of hollow-out structure chips includes a wafer 1 and hollow-out structure chips 2 evenly spaced on the wafer 1 , and also includes the above-mentioned carrier sheet, the wafer 1 is placed horizontally above the carrier, and all the support columns 3 on the carrier body 3 are set on the wafer 1 corresponding to the gap between the chips 2 with the hollow structure, so as to support the wafer 1.

Finally, it should be noted that the above-mentioned embodiments of the present utility model are only examples for illustrating the present utility model, and are not intended to limit the implementation of the present utility model. For those of ordinary skill in the art, other variations and modifications in various forms can be made on the basis of the above description. All the implementation manners cannot be exhaustively listed here. All obvious changes or variations derived from the technical solutions of the utility model are still within the scope of protection of the utility model.

Claims (4)

1. The carrier glass for spraying the glue on the chips with the hollow structures is characterized by comprising a horizontally arranged circular carrier glass body (3), wherein a plurality of vertically arranged support columns (4) are uniformly distributed on the carrier glass body (3), the occupied area of each support column (4) is smaller than the gap formed by the hollow structures of the chips (2) on a wafer (1) to be supported at intervals, and the height of all the support columns (4) protruding out of the carrier glass body (3) is consistent and is 0.05 to 0.15mm.

2. The slide glass for spraying the glue on the chips with the hollow structures as claimed in claim 1, wherein the supporting columns (4) are of a hemispherical, cylindrical or multi-layer cylindrical structure.

3. The slide glass for spraying the glue on the chips with the hollowed-out structures as claimed in claim 2, wherein the supporting columns are manufactured by a spot welding machine.

4. A glue spraying structure for spraying glue on hollow-out structure chips comprises a wafer (1) and hollow-out structure chips (2) uniformly distributed on the wafer (1) at intervals, and is characterized by further comprising a slide glass as claimed in any one of claims 1 to 3, wherein the wafer (1) is horizontally placed above the slide glass, and all supporting columns (4) on the slide glass body (3) are arranged on the wafer (1) corresponding to gaps among the hollow-out structure chips (2), so that the wafer (1) is supported.

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