CN218211669U - Fixed packaged temperature sensor - Google Patents
Fixed packaged temperature sensor Download PDFInfo
- Publication number
- CN218211669U CN218211669U CN202222292266.0U CN202222292266U CN218211669U CN 218211669 U CN218211669 U CN 218211669U CN 202222292266 U CN202222292266 U CN 202222292266U CN 218211669 U CN218211669 U CN 218211669U
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- China
- Prior art keywords
- thermistor
- shell
- positioning seat
- groove
- temperature sensor
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- 239000000565 sealant Substances 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 229920006335 epoxy glue Polymers 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
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- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Abstract
The utility model discloses a fixed packaged temperature sensor, which comprises a shell, a thermistor, leads connected with two ends of the thermistor, sealant filled in the shell and a positioning seat, wherein the thermistor is arranged on the positioning seat; a groove is formed in the inner side of the positioning seat, and the thermistor is installed in the groove and movably connected with the groove; the positioning seat is provided with a through hole for installing the lead, and the end part of the lead passes through the through hole and then extends out of the shell. The utility model is provided with the groove on the positioning seat, the thermistor is arranged in the groove and movably connected with the groove, thereby avoiding the thermistor from being directly pressed in the shell, reducing the risk of desoldering of the thermistor and reducing the rejection rate; the lead is led out of the shell through the through hole in the fixing seat, and the lead is connected with the circuit board outside the shell, so that the welding point and the working procedure time are reduced, and the production efficiency is improved.
Description
Technical Field
The utility model relates to a temperature sensing device technical field, especially a temperature sensor of fixed encapsulation.
Background
The patent document with publication number CN107219018B discloses a PCB packaging temperature sensor, which comprises a shell, a circuit board and a thermistor, wherein a closed end of the shell is internally provided with a position fixing seat, and the circuit board is arranged between the lower end face of the position fixing seat and the closed end face of the shell; the pin welding of thermistor is on the bottom surface of circuit board, and the conducting strip and the lead wire are worn to locate in the position fixing seat on the top surface of circuit board, are equipped with the encapsulating hole that link up its upper and lower terminal surface on the position fixing seat, and the open end intussuseption of casing is filled with sealed glue. "
In the invention, the thermistor and the circuit board are arranged in the shell in the middle of the position fixing seat, so that the response speed can be effectively improved, the lead wire is welded on the conductive strip of the circuit board, the sealant is filled into the sealant filling hole and is preferentially filled in the insulating groove and the bottom of the shell, and the conductive strip and the welding point of the thermistor are subjected to insulating packaging to improve the insulating property.
The technology has the following defects: 1) The thermistor is required to be welded on the circuit board firstly and then pressed in the shell, pins at two ends of the thermistor are likely to be desoldered when the temperature sensor is assembled, and the rejection rate is high; 2) The circuit board is internally provided with the temperature sensor, a plurality of welding points exist on the circuit board, the welding process consumes more time, and the production efficiency is lower.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model aims to provide a: provided is a temperature sensor which can reduce the rejection rate and can improve the production efficiency.
The utility model discloses a technical scheme that the solution problem adopted is:
a fixedly packaged temperature sensor comprises a shell, a thermistor, lead wires connected to two ends of the thermistor, sealant filled in the shell and a positioning seat, wherein the thermistor is arranged on the positioning seat; a groove is formed in the inner side of the positioning seat, and the thermistor is installed in the groove and movably connected with the groove; the positioning seat is provided with a through hole for installing the lead, and the end part of the lead passes through the through hole and then extends out of the shell.
A first step surface is arranged in the shell, and the positioning seat is in compression joint with the first step surface.
The utility model discloses a thermistor, including shell, ring shape, thermistor, installation cavity, thermistor, casing edge is equipped with a plurality of first step faces, first step is personally submitted the ring form, and first step face encloses into an installation cavity in the shell, the thermistor laminating is in the inner wall of installation cavity.
A gap is reserved between the through hole and the lead, and the sealant can enter the groove through the through hole.
The positioning seat is in transition fit or clearance fit with the shell.
The positioning seat is further provided with a glue filling hole, and the glue filling hole is located right above the thermistor.
The positioning seat is provided with a multiple step surface, and the multiple step surface comprises a third step surface, a fourth step surface, a fifth step surface and a sixth step surface.
The both sides of shell are provided with the installation wing, set up the mounting hole on the installation wing.
The beneficial effects of the utility model are that:
1. the utility model discloses set up the recess on the positioning seat, thermistor install in the recess and with recess swing joint, avoided thermistor directly to be pressed in the casing, reduce thermistor desoldering's risk, reduce the rejection rate.
2. The utility model discloses passing through the break-through hole with the lead wire on the fixing base and drawing forth the shell, the lead wire is connected with the circuit board outside the shell, reduces welding point and process time, improves production efficiency.
Drawings
The invention will be further explained with reference to the drawings and the detailed description.
FIG. 1 is a schematic structural diagram of a preferred embodiment of the present invention;
FIG. 2 is a partial exploded view of the present invention;
FIG. 3 is a second exploded view of the present invention;
FIG. 4 is a sectional view of the structure of the present invention;
in the figure: the method comprises the following steps of 1-a shell, 2-a thermistor, 3-a lead, 4-epoxy glue, 5-a positioning seat, 6-a groove, 7-a second step surface, 8-a first step surface, 9-an installation cavity, 10-a glue filling hole, 11-a through hole, 12-a third step surface, 14-a fifth step surface, 15-a sixth step surface, 16-an installation wing and 17-an installation hole.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, it should be understood that the directional descriptions, such as the directions or positional relationships indicated by upper, lower, front, rear, left, right, etc., are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but not for indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention.
In the description of the present invention, a plurality of meanings are one or more, a plurality of meanings are two or more, and the terms greater than, smaller than, exceeding, etc. are understood as excluding the number, and the terms greater than, lower than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the terms such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the terms in the present invention by combining the specific contents of the technical solution.
Referring to fig. 1 to 4, a fixedly packaged temperature sensor includes a housing 1, a thermistor 2, a lead 3 connected to two ends of the thermistor 2, and a sealant 4 filled in the housing, wherein the sealant 4 is epoxy glue, and a rubber sleeve is wrapped around the lead 3 for protecting the lead 3; the thermistor positioning device further comprises a positioning seat 5, and the thermistor 2 is mounted on the positioning seat 5; a groove 6 is formed in the inner side of the positioning seat 5, the thermistor 2 is installed in the groove 6 and movably connected with the groove 6, the width of the thermistor 2 is smaller than the depth of the groove 6, and the thermistor 2 can move in the groove 6; a first step surface 8 is arranged in the shell 1, and the positioning seat 5 is in compression joint with the first step surface 8; the positioning seat 5 is provided with a through hole 11 for installing the lead 3, and the end of the lead 3 passes through the through hole 11 and then extends out of the shell 1 and is connected with a terminal or a circuit board outside the shell 1. The utility model is provided with the groove on the positioning seat, the thermistor is arranged in the groove and movably connected with the groove, thereby avoiding the thermistor from being directly pressed in the shell, reducing the risk of desoldering of the thermistor and reducing the rejection rate; the lead is led out of the shell through the through hole in the fixing seat, and the lead is connected with the circuit board outside the shell, so that the welding point and the working procedure time are reduced, and the production efficiency is improved. The circuit board and the temperature sensor can be welded with the circuit board outside the shell, and even though the circuit board and the temperature sensor are subjected to desoldering, the circuit board and the temperature sensor can be welded again, so that the rejection rate is further reduced.
The first step face 8 is arranged in the shell 1, the edge of the positioning seat 5 is in compression joint with the first step face 8, the first step face 8 serves as a reinforcing rib of the shell 1, the strength of the shell 1 is enhanced, meanwhile, the positioning seat 5 has a supporting effect, and the situation that the positioning seat 5 is directly in compression joint with the thermistor 2 is further avoided.
The edge of the shell 1 is sunken into the shell 1 at intervals to form a plurality of first step surfaces 8, the first step surfaces 8 are annular, the first step surfaces 8 enclose a mounting cavity 9 in the shell 1, and the thermistor 2 is pressed on the inner wall of the mounting cavity 9. The spacing is provided in order to allow the sealant 4 to flow into the recess from the spacing between the first step surfaces 8.
The upper edge of the groove 6 is provided with a second step surface 7, and the second step surface 7 is attached to the first step surface 8. Enough space is reserved between the thermistor 2 mounting groove 6 and the mounting cavity 9 and between the groove 6 and the mounting cavity 9 to enable the thermistor 2 to move up and down, so that the purpose of design is to prevent the thermistor 2 from being squeezed between the positioning seat 5 and the shell 1 and damage to the thermistor 2; the purpose of the flexible connection is to reduce the distance between the housing 1 and the thermistor 2, improving the response speed and accuracy of the thermistor 2.
Leave the clearance between interlude hole 11 and the lead wire 3, sealed glue 4 can get into through interlude hole 11 recess 6, during the encapsulating, sealed glue can flow into recess 6 from the clearance between interlude hole 11 and the lead wire, and fixed recess 6 inner structure makes lead wire 3 can glue simultaneously and connects on interlude hole 11, prevents that lead wire 3 from becoming flexible.
The positioning seat 5 is in transition fit or clearance fit with the shell 1. During transition fit, after the positioning seat 5 is inserted into the shell 1, the side wall of the positioning seat 5 can be tightly attached to the inner wall of the shell 1, so that the thermistor 2 on the positioning seat 5 can be positioned and installed in the installation cavity 9, and the problem of offset between the thermistor 2 and the metal shell 1 is solved.
The positioning seat 5 is further provided with a glue filling hole 10, and the glue filling hole 10 is located right above the thermistor 2. Epoxy 4 is through encapsulating hole 10 entering recess 6 in, and inboard bonds thermistor 2 and positioning seat 5 in shell 1, fixed thermistor 2.
The positioning seat 5 is provided with multiple step surfaces, and the multiple step surfaces comprise a third step surface 12, a fourth step surface, a fifth step surface 14 and a sixth step surface 15. The inner side of the positioning seat 5, namely the groove 6, is provided with a third step surface 12 and a fourth step surface, the outer side of the positioning seat 5 is provided with a fifth step surface 14 and a sixth step surface 15, and the bonding interface between the epoxy glue 4 and the positioning seat 5 is increased by arranging multiple step surfaces, so that the bonding strength between the shell 1 and the positioning seat 5 is enhanced.
The two sides of the shell 1 are provided with mounting wings 16, the mounting wings 16 are provided with mounting holes 17, and the mounting wings 16 are used for fixedly mounting the temperature sensor in a device.
The above is only the preferred embodiment of the present invention, not limiting the patent scope of the present invention, all of which are under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct or indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (8)
1. The utility model provides a fixed encapsulated temperature sensor, includes shell (1), thermistor (2), connects lead wire (3) and sealed glue (4) of packing in the shell at thermistor (2) both ends, its characterized in that:
the thermistor is characterized by further comprising a positioning seat (5), wherein the thermistor (2) is arranged on the positioning seat (5);
a groove (6) is formed in the inner side of the positioning seat (5), and the thermistor (2) is installed in the groove (6) and movably connected with the groove (6);
the positioning seat (5) is provided with a through hole (11) for installing the lead (3), and the end part of the lead (3) penetrates through the through hole and then extends out of the shell (1).
2. A fixed package temperature sensor as claimed in claim 1, wherein:
be provided with first step face (8) in shell (1), positioning seat (5) crimping is in on first step face (8).
3. A fixed package temperature sensor as claimed in claim 2, wherein:
the utility model discloses a thermistor assembly, including shell (1), first step face (8) are the ring form, first step face (8) enclose into installation cavity (9) in shell (1), thermistor (2) laminating is in the inner wall of installation cavity (9).
4. A fixed package temperature sensor as claimed in claim 3, wherein:
a gap is reserved between the through hole (11) and the lead (3), and the sealant (4) can enter the groove (6) through the through hole (11).
5. A fixed package temperature sensor as claimed in claim 1, wherein:
the positioning seat (5) is in transition fit or clearance fit with the shell (1).
6. A fixed package temperature sensor as claimed in claim 1, wherein:
the positioning seat (5) is further provided with a glue pouring hole (10), and the glue pouring hole (10) is located right above the thermistor (2).
7. A fixed package temperature sensor as claimed in claim 1, wherein:
the positioning seat (5) is provided with multiple step surfaces, and the multiple step surfaces comprise a third step surface (12), a fourth step surface, a fifth step surface (14) and a sixth step surface (15).
8. A fixed package temperature sensor as claimed in claim 1, wherein:
the mounting structure is characterized in that mounting wings (16) are arranged on two sides of the shell (1), and mounting holes (17) are formed in the mounting wings (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222292266.0U CN218211669U (en) | 2022-08-30 | 2022-08-30 | Fixed packaged temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222292266.0U CN218211669U (en) | 2022-08-30 | 2022-08-30 | Fixed packaged temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218211669U true CN218211669U (en) | 2023-01-03 |
Family
ID=84629114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222292266.0U Active CN218211669U (en) | 2022-08-30 | 2022-08-30 | Fixed packaged temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218211669U (en) |
-
2022
- 2022-08-30 CN CN202222292266.0U patent/CN218211669U/en active Active
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| GR01 | Patent grant |