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CN218140419U - Anti-static binding band - Google Patents

Anti-static binding band Download PDF

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Publication number
CN218140419U
CN218140419U CN202122595529.0U CN202122595529U CN218140419U CN 218140419 U CN218140419 U CN 218140419U CN 202122595529 U CN202122595529 U CN 202122595529U CN 218140419 U CN218140419 U CN 218140419U
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CN
China
Prior art keywords
film layer
static
heat
seal film
layer
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Application number
CN202122595529.0U
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Chinese (zh)
Inventor
朱火安
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Shenzhen Xinhongming Technology Co ltd
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Shenzhen Xinhongming Technology Co ltd
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Priority to CN202122595529.0U priority Critical patent/CN218140419U/en
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Publication of CN218140419U publication Critical patent/CN218140419U/en
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Abstract

The utility model relates to a semiconductor and prevent static technical field, especially relate to an prevent static bandage. An anti-static bandage comprises a PET film layer, a heat sealing film layer and an anti-static coating layer. In the technical scheme of the utility model, the heat sealing performance and the heat sealing strength of the anti-static binding band are increased, so that the anti-static binding band is more suitable for packaging semiconductor devices; the anti-static performance of the anti-static binding band is improved, so that damage to semiconductor devices caused by static damage in the transportation and storage processes is reduced, the reject ratio and the production cost are effectively reduced, and the phenomenon that the reputation of a product is influenced due to the fact that defective products are generated in the process that the product control cannot be controlled is avoided.

Description

Anti-static binding band
Technical Field
The utility model relates to a semiconductor and prevent static technical field, especially relate to an prevent static bandage.
Background
In the manufacturing, testing, storing, transporting and assembling processes of the semiconductor device, damage or failure of one-way conductivity is easily caused, the reject ratio is high, the production cost is high, and the customer dissatisfaction is easily caused to influence the company reputation.
The inventor finds that the electrostatic voltage is easily generated by friction of instruments, materials and operators. When the semiconductor device is in contact with these charged bodies, the charged bodies will discharge through the semiconductor device Pin, making the PN junction of the semiconductor device susceptible to breakdown due to static electricity, resulting in failure of the semiconductor device. electrostatic-Discharge (Electro-Static-Discharge) damage is not only very sensitive to MOS devices, but also has ESD damage problems in other semiconductor devices as well.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a prevent static bandage to prior art not enough, aim at reducing the semiconductor because of the damage that the static damage caused in transportation and storage process to reduce the defective rate.
The utility model discloses a following technical scheme realizes above-mentioned purpose: an anti-static bandage comprises a PET film layer, a heat sealing film layer and an anti-static coating layer;
the heat-seal film layer is provided with two layers, namely a first heat-seal film layer and a second heat-seal film layer, wherein one surface of the first heat-seal film layer is arranged on one surface of the PET film layer, and one surface of the second heat-seal film layer is arranged on the other surface of the PET film layer;
the anti-static coating layer is provided with two layers, namely a first anti-static coating layer and a second anti-static coating layer, the first anti-static coating layer is arranged on the other side of the first heat sealing film layer, and the second anti-static coating layer is arranged on the other side of the second heat sealing film layer.
As a further aspect of the present invention: the material of the first heat-seal film layer and/or the second heat-seal film layer is a CPP material or a PE material.
As a further aspect of the present invention: the material of the heat sealing film layer comprises a CPP material or a PE material.
As a further aspect of the present invention: the thickness of the PET film layer is 0.01 mm-0.08 mm.
As a further aspect of the present invention: the thickness of the first heat-seal film layer and/or the second heat-seal film layer is 0.03-0.08 mm.
As a further aspect of the present invention: the first antistatic coating layer and/or the second antistatic coating layer include an antistatic liquid.
As a further aspect of the present invention: and the first heat-sealing film layer and/or the second heat-sealing film layer are/is compositely glued on the PET film layer.
As a further aspect of the present invention: the total thickness of the PET film layer, the first heat-seal film layer and the second heat-seal film layer is 0.05 mm-0.25 mm.
The use process comprises the following steps: cutting the size of the anti-static binding band according to the size of the semiconductor device, wherein the cut size corresponds to the size of the semiconductor device, or customizing the uniform size of the anti-static binding band in advance according to the use requirement; and binding or heat-sealing the anti-static binding tape on the semiconductor device, thereby completing the anti-static packaging of the semiconductor device.
The utility model has the advantages that:
in the technical scheme of the anti-static binding belt, the PET film layer takes PET as a base material, and the heat sealing film layer is compounded with viscose glue on the PET film layer, so that the heat sealing performance and the heat sealing strength of the anti-static binding belt are improved, and the anti-static binding belt is more suitable for packaging semiconductor devices; by coating the anti-static coating layer on the heat seal film layer, the anti-static performance of the anti-static binding band is improved, so that damage to a semiconductor device caused by static damage in the transportation and storage processes is reduced, the reject ratio and the production cost are effectively reduced, and the phenomenon that the reputation of a product is influenced due to the fact that defective products are produced in the process that product control cannot be performed is avoided.
Drawings
Fig. 1 is a schematic structural section view of the anti-static binding band of the present invention.
Fig. 2 is a schematic cross-sectional view of another structure of the anti-static binding band of the present invention.
The reference numerals include:
1-PET film layer;
2-a heat-seal film layer,
21-a first heat seal film layer, 22-a second heat seal film layer;
3-an anti-static coating layer,
31-the first antistatic coating layer, 32-the second antistatic coating layer.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1-2, in an embodiment of the present invention, an anti-static bandage is provided, which includes a PET film layer 1, a heat sealing film layer 2, and an anti-static coating layer 3.
In the technical scheme of the anti-static binding band, the PET film layer 1 is compounded with the viscose glue on the PET film layer 1 by taking the PET as a base material, and the heat sealing film layer 2 increases the heat sealing performance and the heat sealing strength of the anti-static binding band, so that the anti-static binding band is more suitable for packaging semiconductor devices; by coating the anti-static coating layer 3 on the heat seal film layer 2, the anti-static performance of the anti-static binding band is improved, so that damage to a semiconductor device caused by static damage in the transportation and storage processes is reduced, the reject ratio and the production cost are effectively reduced, and the phenomenon that the reputation of a product is influenced by defective products in the process that the product control cannot be performed is avoided.
When the anti-static binding belt is used, the size of the anti-static binding belt is cut according to the size of a semiconductor device, so that the cut size corresponds to the size of the semiconductor device, or the uniform size of the anti-static binding belt can be customized in advance according to the use requirement; and binding or heat-sealing the anti-static binding tape on the semiconductor device, thereby completing the anti-static packaging of the semiconductor device.
In a further scheme, referring to fig. 2, the heat-seal film layer 2 is provided with two layers, namely a first heat-seal film layer 21 and a second heat-seal film layer 22, one surface of the first heat-seal film layer 21 is arranged on one surface of the PET film layer 1, and one surface of the second heat-seal film layer 22 is arranged on the other surface of the PET film layer 1;
prevent that static coating layer 3 is equipped with two-layerly, is first prevent static coating layer 31 and second respectively and prevents static coating layer 32, first prevent static coating layer 31 locate the another side of first heat seal rete 21, the second prevents static coating layer 32 and locates the another side of second heat seal rete 22. Specifically, the PET film layer 1 and the heat-sealing film layer 2 are connected through composite adhesive, and the anti-static coating layer 3 and the heat-sealing film layer 2 are coated.
In a further scheme, referring to fig. 1, the PET film layer 1 is disposed on one surface of the heat seal film layer 2, and the anti-static coating layer 3 is disposed on the other surface of the heat seal film layer 2. Specifically, the heat-sealing film layer 2 is compositely adhered to the PET film layer 1, and the anti-static coating layer 3 is coated on the heat-sealing film layer 2.
Further, the material of the first heat-seal film layer 21 and/or the second heat-seal film layer 22 is a CPP material or a PE material. Specifically, both the CPP material and the PE material have high heat seal strength, and are easy to coat with antistatic liquid.
In a further scheme, the thickness of the PET film layer 1 is 0.01 mm-0.08 mm. Specifically, preferably 0.05mm or 0.065mm or 0.075mm, and the corresponding thickness is determined according to the requirements of users and the size of products applied by the users, and the inventors repeatedly research and find that the applicable range and the binding strength are better when the optimal values are taken.
Further, the thickness of the first heat-seal film layer 21 and/or the second heat-seal film layer 22 is 0.03mm to 0.08mm. Specifically, preferably 0.02mm or 0.03mm or 0.04mm, and the corresponding thickness is determined according to the user's needs and the size of the product to which it is applied, and the inventors have repeatedly found that the applicable range, the binding strength, and the heat-seal strength are optimal when preferred values are taken.
Further, the first antistatic coating layer 31 and/or the second antistatic coating layer 32 include an antistatic liquid. Specifically, the antistatic liquid is coated on the heat seal film layer 2, so that the antistatic binding band can reach the antistatic index, namely the antistatic index can reach 4 th power to 10 th power of ohm/sq.
Further, the first heat-seal film layer 21 and/or the second heat-seal film layer 22 are/is compositely adhered to the PET film layer 1, and the anti-static coating layer 3 is coated on the heat-seal film layer 2.
Further, the total thickness of the PET film layer, the first heat-seal film layer 21 and the second heat-seal film layer 22 is 0.05 mm-0.25 mm.
In conclusion, the present invention has the above-mentioned excellent characteristics, so that it can be used to enhance the effectiveness of the prior art and has practicability, and thus it is a product with practical value.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims (7)

1. An anti-static bandage is characterized by comprising a PET film layer, a heat seal film layer and an anti-static coating layer;
the heat-seal film layer is provided with two layers, namely a first heat-seal film layer and a second heat-seal film layer, wherein one surface of the first heat-seal film layer is arranged on one surface of the PET film layer, and one surface of the second heat-seal film layer is arranged on the other surface of the PET film layer;
the anti-static coating layer is provided with two layers, namely a first anti-static coating layer and a second anti-static coating layer, the first anti-static coating layer is arranged on the other side of the first heat sealing film layer, and the second anti-static coating layer is arranged on the other side of the second heat sealing film layer.
2. An antistatic strap according to claim 1 wherein: the material of the first heat-seal film layer and/or the second heat-seal film layer is a CPP material or a PE material.
3. An antistatic strap according to claim 1 wherein: the thickness of the PET film layer is 0.01 mm-0.08 mm.
4. An antistatic strap according to claim 1 wherein: the thickness of the first heat-seal film layer and/or the second heat-seal film layer is 0.03-0.08 mm.
5. An antistatic strap according to claim 1 wherein: the first antistatic coating layer and/or the second antistatic coating layer include an antistatic liquid.
6. An antistatic strap according to claim 1 wherein: and the first heat-sealing film layer and/or the second heat-sealing film layer are/is compositely glued on the PET film layer.
7. An antistatic strap according to claim 1 wherein: the total thickness of the PET film layer, the first heat-seal film layer and the second heat-seal film layer is 0.05 mm-0.25 mm.
CN202122595529.0U 2021-10-27 2021-10-27 Anti-static binding band Active CN218140419U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122595529.0U CN218140419U (en) 2021-10-27 2021-10-27 Anti-static binding band

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122595529.0U CN218140419U (en) 2021-10-27 2021-10-27 Anti-static binding band

Publications (1)

Publication Number Publication Date
CN218140419U true CN218140419U (en) 2022-12-27

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ID=84548921

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122595529.0U Active CN218140419U (en) 2021-10-27 2021-10-27 Anti-static binding band

Country Status (1)

Country Link
CN (1) CN218140419U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113910731A (en) * 2021-10-27 2022-01-11 深圳市昕宏明科技有限公司 An anti-static strap and method of using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113910731A (en) * 2021-10-27 2022-01-11 深圳市昕宏明科技有限公司 An anti-static strap and method of using the same

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