CN2181025Y - Fastening device for heat dissipation components of microprocessor - Google Patents

Abstract

The utility model relates to a microprocessor heat dissipation component's lock device indicates a can promote radiating element lock device of packaging efficiency by a wide margin especially, it mainly is to establish fan and fin in a casket seat, wherein this casket seat is a cavity box body roughly, and top surface and inside wall are formed with reference column and rib piece respectively in it to fixed fan, the inside wall lower edge is then formed with the flange again, supplies to inlay the card fin, is formed with the clip at casket seat bottom edge, can make up with microprocessor by the lock mode, and accomplish radiating element's equipment on microprocessor rapidly.

Description

The utility model relates to a fastening device for a cooling element of a microprocessor.

At present, large-scale integrated circuits such as microprocessors are individually equipped with heat dissipation devices to prevent data damage or loss of file configuration tables caused by excessively high operating temperatures. Taking the 486 microprocessor as an example, the surface temperature during operation is It can reach about 170 degrees Fahrenheit, but according to technical data, the temperature at the center of the surface of the microprocessor must not be lower than 32 degrees Fahrenheit (0°C), nor higher than 185 degrees Fahrenheit. Measured by this standard, the above The operating temperature of the 486 microprocessor is very close to its maximum safety limit, so it is necessary to reduce its surface temperature by appropriate heat dissipation measures to maintain normal operation, and the current common heat dissipation measures are mostly to install a heat sink on the microprocessor , and then screw a fan on the heat sink, use the large heat dissipation area of the heat sink to quickly conduct heat, and the airflow generated by the fan will dissipate the heat energy on the surface of the heat sink, so that the surface of the microprocessor can be maintained at an appropriate temperature.

As for the combination of the heat sink and the microprocessor, there are currently many different structures coming out, such as Taiwan Patent No. 81204342 "Structure Improvement of the Heat Dissipating Device of the Central Processor of a Computer", the main A frame and tenons are formed on it to fasten the microprocessor and the heat sink. As for the fan, it is the same as the traditional method, and is assembled on the heat sink by screwing; another example is Taiwan Patent No. 812,162 In the No. 95 patent case "Structure Improvement of the Fastening Part of Computer Microchip Heat Dissipating Device", grooves are formed on both sides of the heat sink respectively, and clips are nested on it, so that the heat sink can be snapped together. It is assembled on the microprocessor, and the fan is still assembled by screwing; from the above, it can be seen that the industry is currently working on how to quickly and conveniently assemble the heat sink on the microprocessor, but the combined structure of the fan and the heat sink It is still maintained in the traditional way, which is a fly in the ointment for the assembly efficiency of the heat sink. In order to make up for this shortcoming, at present, some industry players have developed a combined structure that directly fits the fan on the heat sink to improve the above-mentioned structure. The main disadvantage is that the surface of the heat sink is densely covered with a large number of heat dissipation columns, and the heat dissipation columns on both sides extend upward to form a fastening part, and the heat sink uses the fastening part to fit a fan on it, but this A direct fitting method can certainly improve the assembly efficiency of the fan. However, the heat sink is extruded from aluminum and will be slightly deformed after extrusion. This deformation will also change the original shape of the engaging part of the heat sink. Specifications, if the engaging part becomes larger, it will form a larger gap with the engaged fan, and will generate greater operating noise when the fan is running, and if the engaging part becomes smaller, there will be the disadvantage of difficult assembly It can be seen that the existing heat sinks of various microprocessors are not perfect in terms of assembly efficiency or practicability, and need to be thoroughly improved.

The main purpose of this utility model is to provide a fastening device for heat dissipation components of a microprocessor, which is a fastening device for combining a fan, a heat sink and a microprocessor at the same time. Fan and heat sink, wherein the top surface and side wall of the box seat are divided into positioning columns and ribs to fix the fan, and the lower edge of the inner wall of the box seat is formed with a flange for inserting the heat sink, and the bottom edge of the box seat Then there is a buckle hook extended to be fastened on the microprocessor, and a block is formed on the inner bottom of the box seat to resist the fan and make it tightly bonded with the heat sink, so as to avoid noise. This structure can be used quickly Complete the assembly of the fan and heat sink on the microprocessor, and obtain excellent heat dissipation effect.

The utility model provides a fastening device for a cooling element of a microprocessor, which includes a fan, a heat sink, and a box seat. Fixing holes are respectively formed at the four corners of the frame,

The box seat is a hollow box body, and its top surface and front and rear walls are respectively formed with air grooves and grid holes for air convection, and its inner top surface is adjacent to each corner to form positioning posts respectively, and each positioning post corresponds to the insertion position respectively. It is set on the fixing hole of the fan, and there are buckle hooks formed on the bottom ends of both sides of the box seat respectively, so as to fasten the microprocessor by it.

The feature of the snap-fitting device for the cooling element of the microprocessor is that ribs are respectively formed on the upper ends of the inner walls on both sides of the box seat, so as to provide a positioning function for the fan.

The aforementioned fastening device for heat dissipation components of the microprocessor is characterized in that: the inner top surface of the box seat is respectively formed with a plurality of abutting blocks, so that the fan, the heat sink and the microprocessor inside can be closely connected.

The aforementioned fastening device for heat dissipation components of the microprocessor is characterized in that flanges are respectively formed on the inner walls on both sides of the box base, and continuous slots are respectively formed on both sides of the heat sink, corresponding to the flanges nested in the box base. superior.

The main advantages of the utility model are that the assembly is convenient and fast, the combination of the cooling element and the microprocessor is compact, noise can be avoided, and the cooling effect is good.

Further illustrate structural feature and purpose of the present utility model below in conjunction with accompanying drawing.

Brief description of the drawings:

Fig. 1 is an exploded view of the utility model.

Fig. 2 is a cross-sectional view of the box seat of the present invention and a schematic diagram of its combination with the fan.

Fig. 3 is a schematic diagram of the combination of the box seat of the present invention, the fan and the heat sink.

Regarding the structural part of the present utility model, please first refer to shown in Fig. 1, it is mainly to combine fan 20, cooling fin 30 and microprocessor 40 simultaneously by a box base 10, wherein fan 20 is identical with conventional structure, its The fan blades are driven by a stator in the center, and a fixing hole 21 is formed at each corner of the outer frame, and a plurality of convex ribs 31 are formed on the surface of the heat sink 30 to increase the heat dissipation area, and continuous inlays are formed on both sides of the fins. slot 32;

The box seat 10 is roughly a hollow box body, and an air groove 11 is formed on its top surface to circulate the airflow generated by the fan 20, and a plurality of ventilation grid holes 12 are densely covered on the front and rear walls respectively, so as to facilitate the box seat 10 The air circulation inside and outside, and the detailed structure of the inside of the box seat 10, please refer to Fig. 2, the box seat 10 is respectively formed with positioning columns 13 of appropriate length at the adjacent corners of the inner top surface, and each positioning column 13 is arranged separately. Corresponding to each fixing hole 21 on the fan 20, there are respectively formed resisting blocks 17 with compression resilience on the side ends of each positioning column 13; The distance between the two opposing ribs 14 is equal to the width of the outer frame of the fan 20. When the fan 20 is assembled in the box seat 10, the ribs 14 on the inner walls of the box seat 10 on both sides will provide a positioning effect;

The inner walls on both sides of the box seat 10 are formed with a flange 15 with a conical cross-section below the rib 14, and the flange 15 corresponds to the slots 32 on both sides of the heat sink 30; There are more than one set of hooks 16 (in this embodiment, there are two sets of hooks 16 ), so as to fasten the microprocessor 40 .

The specific structure of the utility model can be seen from the above description. As for its combination type, first please refer to FIG. At this time, the ribs 14 on the inner walls on both sides of the box seat 10 will provide a guiding function, so that the fan 20 can be inserted in a predetermined direction. In the hole 21, and when the fan 20 is fully inserted, the top surface of the outer frame will compress the block 17 against the inner top surface of the box seat 10, and the block 17 will also generate a downward pressure on the fan 20 at this time.

After the fan 20 is inserted, the heat sink 30 is then inserted. When the heat sink 30 is inserted into the box seat 10, one end must be inserted obliquely, and then the other end is inserted to avoid the hook at the bottom of the buckle hook 16. During the inserting process, the sockets 32 on both sides are correspondingly nested on the flanges 15 on both sides of the inner wall of the box seat 10. Before the microprocessor 40 is combined on the box seat 10, due to the influence of the inner top surface Influenced by the thrust of the block 17, the heat sink 30 will move down slightly, so the flange 15 on the inner wall of the box seat 10 will be positioned at the upper half of the slot 32, and the box seat 10 will buckle the microprocessor 40 with its hook 16 At this time, the microprocessor 40 will push the heat sink 30 and the fan 20 upward, so that the block 17 will be greatly compressed, and the fan 20, the heat sink 30 and the microprocessor 40 will be closely connected (as shown in Figure 3 As shown), the microprocessor 40 can be plugged into the preset socket of the motherboard after being buckled into the box seat 10 and combined with the fan 20 and the heat sink 30. When the microprocessor 40 is working, the surface generated The heat energy will be conducted to the heat sink 30, and the airflow generated by the fan 20 will quickly dissipate the heat on it, so as to achieve the purpose of heat dissipation and cooling.

Claims (4)

1, a kind of buckling device of microprocessor heat dissipation element comprises fan, heat radiator, casket seat, it is characterized in that: fan, heat radiator and microprocessor are arranged at respectively in this casket seat, and wherein these fan housing four corners are formed with fixed orifice respectively,

This casket seat is a hollow box, its end face and front and rear wall are formed with respectively for cross-ventilated air drain and grid hole, contiguous each corner of its inner top surface is respectively equipped with reference column again, each reference column and the corresponding sleeve of difference are on the fixed orifice of fan, and bottom, casket seat both sides is formed with the button hook that fastens microprocessor respectively.

2, according to the buckling device of the described microprocessor heat dissipation element of claim 1, it is characterized in that: this casket seat both sides inwall upper end is formed with the rib piece of location fan respectively.

3, according to the buckling device of the described microprocessor heat dissipation element of claim 1, it is characterized in that: this casket seat inner top surface is formed with a plurality of pieces that support that make its interior fan, heat radiator and microprocessor fluid-tight engagement respectively.

4, according to the buckling device of the described microprocessor heat dissipation element of claim 1, it is characterized in that: this casket seat both sides inwall is formed with flange respectively, and the heat radiator two side ends is formed with continuous caulking groove respectively again, and correspondence is nested on the flange of casket seat.

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