CN218037922U

CN218037922U - Auxiliary heat dissipation device for rack-mounted server

Info

Publication number: CN218037922U
Application number: CN202222153793.3U
Authority: CN
Inventors: 侯宁华
Original assignee: Suoxiang Network Technology Shanghai Co ltd
Current assignee: Suoxiang Network Technology Shanghai Co ltd
Priority date: 2022-08-16
Filing date: 2022-08-16
Publication date: 2022-12-13
Anticipated expiration: 2032-08-16

Abstract

The utility model discloses a heat abstractor is assisted to rack-mounted server, belong to server technical field, heat abstractor is assisted to rack-mounted server, including accomodating the frame, the inside sliding connection who accomodates the frame has places the board, and the upper end of placing the board is equipped with rack-mounted server body, the upper end of placing the board inlays to establish the fixed suction cup of installing a plurality of evenly distributed, and a plurality of fixed suction cups all contact with rack-mounted server body, accomodate two external logical frames of upper end fixedly connected with of frame, and it runs through the upper end of accomodating the frame, and be linked together with the inside of accomodating the frame, the inner wall fixedly connected with dust screen of external logical frame, and install radiator fan between the dust screen and it, this scheme distributes away the heat that rack-mounted server body produced through two radiator fan, tentatively dispel the heat, and the semiconductor refrigeration piece can further accelerate thermal giving off, make the temperature of rack-mounted server body fall down fast, strengthen its radiating effect and cooling effect.

Description

Auxiliary heat dissipation device for rack-mounted server

Technical Field

The utility model relates to a server technical field, more specifically say, relate to the supplementary heat abstractor of rack-mounted server.

Background

A server, also called a server, is a device that provides a computing service, and since the server needs to respond to a service request and process the service request, the server generally has a capability of bearing the service and securing the service, and the server is configured to include a processor, a hard disk, a memory, a system bus, and the like, similarly to a general-purpose computer architecture. The servers can be classified into rack servers, tower servers and blade servers according to the shapes, wherein the rack servers are most commonly used.

The rack-mounted server can generate a large amount of heat in the long-term working process, the heat dissipation effect of the structure of the rack-mounted server is poor, and heat is accumulated in the rack-mounted server, so that the internal temperature of the rack-mounted server is increased, the operation of the rack-mounted server is slowed down, the work of the rack-mounted server is affected, and even the rack-mounted server is damaged, therefore, an additional heat dissipation device is required to assist the rack-mounted server in dissipating heat, and the normal work of the rack-mounted server is guaranteed.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

To the problem that exists among the prior art, the utility model aims to provide a heat abstractor is assisted to rack-mounted server, this scheme distributes away the heat that rack-mounted server body produced through two radiator fan, tentatively dispels the heat, and the semiconductor refrigeration piece can further accelerate thermal giving off, makes the temperature of rack-mounted server body fall down fast, strengthens its radiating effect and cooling effect.

2. Technical scheme

In order to solve the above problems, the utility model adopts the following technical proposal.

The auxiliary heat dissipation device for the rack-mounted server comprises a storage frame, wherein a storage plate is connected to the inside of the storage frame in a sliding mode, a rack-mounted server body is arranged at the upper end of the storage plate, a plurality of evenly-distributed fixed suckers are embedded in the upper end of the storage plate, the fixed suckers are all in contact with the rack-mounted server body, two external through frames are fixedly connected to the upper end of the storage frame and penetrate through the upper end of the storage frame and are communicated with the inside of the storage frame, a dustproof net is fixedly connected to the inner wall of the external through frames, heat dissipation fans are installed between the dustproof net and the storage frame, semiconductor refrigeration pieces are embedded in the top end of the storage frame and are installed on the semiconductor refrigeration pieces, the lower ends of the semiconductor refrigeration pieces are heat absorption ends, the upper ends of the semiconductor refrigeration pieces are heat dissipation ends, two symmetrical heat conduction plates are fixedly connected between the inner walls of the storage frame, the two heat conduction plates are all in contact with the rack-mounted on the storage frame, a control switch is installed inside of the storage frame, the control switch is electrically connected with the semiconductor refrigeration pieces, a pressing mechanism is arranged outside the control switch, heat dissipation mechanism distributes heat generated by the rack-mounted on the storage frame through the two heat dissipation fans, the rack-mounted server body, and further cools the semiconductor refrigeration pieces, and further quickly cools the heat dissipation effect of the semiconductor refrigeration pieces, and the heat dissipation effect of the rack-mounted server body is enhanced.

Further, pressing means includes and accomodates frame inner wall fixed connection's T shape pole, the outer end cover of T shape pole is equipped with the movable block, the outer end cover of T shape pole is equipped with deformation memory spring, and deformation memory spring about both ends respectively with accomodate frame and movable block fixed connection, the upper end fixedly connected with of movable block presses the press rod, and presses the press rod and corresponding with control switch, along with rack-type server body continuous work, heat release is more and more, and radiator fan heat dissipation is limited simultaneously, and drive these heats that can not be timely quick distribute away for the heat accumulation is inside it, drives the temperature and risees, makes deformation memory spring be heated deformation shrink, stimulates the movable block and is close to control switch according to the press rod, and presses it to drive refrigeration piece work, makes its heat absorption end cooperation heat-conducting plate absorb the heat that rack-type server body produced, goes out by its heat release end again, makes thermal heat dissipation comprehensive fast, further strengthens radiating effect, the effectual temperature that has reduced.

Further, the lower extreme fixedly connected with two symmetrical sliders of placing the board, the inner bottom end of accomodating the frame is opened and chisels and is had two symmetrical spouts, the slider is located the spout to rather than sliding connection, through the setting of slider and spout, conveniently place the extension or the shrink of board, thereby make things convenient for placing and taking out of rack-mounted server body.

Further, two the heat-conducting plate all adopts the metal copper product material to make, two the outer end of dust screen all is equipped with high temperature resistant layer, and the heat-conducting plate of making through using the metal copper product material has good heat conductivility, can be served the heat absorption of conducting the heat on the rack-mounted server body to the semiconductor refrigeration piece, and the setting on high temperature resistant layer makes the dust screen be difficult for receiving high temperature in long-term use and influences, reduces its possibility of damaging, prolongs its life.

Further, the inner wall of movable block is opened and is dug there are two symmetrical spherical grooves, and the inside of two spherical grooves is all rotated and is connected with the ball, two the outer end of ball all contacts with T shape pole, shape memory spring adopts shape memory alloy material to make, and its initial state is the extension state, has memory effect through the shape memory spring who uses shape memory alloy material, and after the temperature risees, the shrink of being heated, the pulling movable block moves left, and after the temperature resumes, resumes to initial state, promotes the movable block and resets, and the setting of ball makes the motion of movable block more smooth and easy convenient.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages of:

(1) This scheme distributes away the heat that rack-mounted server body produced through two radiator fan, tentatively dispels the heat, and semiconductor refrigeration piece can further accelerate thermal giving off, makes the temperature of rack-mounted server body fall down fast, strengthens its radiating effect and cooling effect.

(2) Pressing means includes and accomodates frame inner wall fixed connection's T shape pole, the outer pot head of T shape pole is equipped with the movable block, the outer pot head of T shape pole is equipped with deformation memory spring, and deformation memory spring's the left and right sides both ends respectively with accomodate frame and movable block fixed connection, the upper end fixedly connected with of movable block presses the depression bar, and press the depression bar corresponding with control switch, along with rack-mounted server body continuous work, the heat release is more and more, radiator fan heat dissipation is limited simultaneously, can not in time quick drive these heats distribute away, make the heat accumulation inside it, it rises to drive the temperature, make deformation memory spring be heated deformation shrink, the pulling movable block is close to control switch with pressing the depression bar, and press it to drive semiconductor refrigeration piece work, make its heat absorption end cooperation heat-conducting plate absorb the heat that rack-mounted server body produced, distribute away by its heat release end again, make thermal heat dissipation comprehensive fast, further strengthen the radiating effect, the effectual temperature that has reduced.

(3) The lower extreme fixedly connected with two symmetrical sliders of placing the board, the inner bottom end of accomodating the frame is opened and chiseled and is had two symmetrical spouts, and the slider is located the spout to rather than sliding connection, through the setting of slider and spout, conveniently place the extension or the shrink of board, thereby make things convenient for placing and taking out of rack-mounted server body.

(4) Two heat-conducting plates all adopt metal copper material to make, and the outer end of two dust screens all is equipped with high temperature resistant layer, and the heat-conducting plate of making through using metal copper material has good heat conductivility, can hold the heat absorption of heat conduction on the rack-mounted server body to the semiconductor refrigeration piece, and the setting on high temperature resistant layer makes the dust screen be difficult for receiving high temperature influence in long-term use, reduces its possibility of damaging, prolongs its life.

(5) The inner wall of movable block is opened and is dug there are two symmetrical spherical grooves, and the inside of two spherical grooves is all rotated and is connected with the ball, the outer end of two balls all contacts with T shape pole, deformation memory spring adopts shape memory alloy material to make, and its initial state is the extension state, deformation memory spring through using shape memory alloy material has the memory effect, rise the back at the temperature, the shrink of being heated, the pulling movable block moves left, and after the temperature resumes, resume to initial state, promote the movable block and reset, and the setting of ball, it is more smooth and easy convenient to make the motion of movable block.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall cross-sectional structure of the present invention;

fig. 3 is an enlarged schematic view of a portion a in fig. 2.

The reference numbers in the figures illustrate:

1. a storage frame; 2. placing the plate; 201. a chute; 202. a slider; 3. a rack-mounted server body; 4. fixing the sucker; 5. a heat conducting plate; 6. a semiconductor refrigeration sheet; 7. an external through frame; 8. a heat radiation fan; 9. a dust screen; 10. a T-shaped rod; 11. a movable block; 1101. a ball bearing; 12. a deformation memory spring; 13. a pressing lever; 14. and controlling the switch.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

please refer to fig. 1-3, a rack server auxiliary heat dissipation device, including a storage frame 1, a placement plate 2 is slidably connected inside the storage frame 1, a rack server body 3 is disposed on an upper end of the placement plate 2, a plurality of evenly distributed fixed suckers 4 are embedded on an upper end of the placement plate 2, the fixed suckers 4 are all in contact with the rack server body 3, two external through frames 7 are fixedly connected on an upper end of the storage frame 1 and penetrate through the upper end of the storage frame 1 and are communicated with the inside of the storage frame 1, a dust screen 9 is fixedly connected on an inner wall of the external through frame 7, a heat dissipation fan 8 is installed between the dust screen 9 and the dust screen, a semiconductor refrigeration sheet 6 is embedded on a top end of the storage frame 1, a control switch 14 is installed inside the storage frame 1, the control switch 14 is electrically connected with the semiconductor refrigeration sheet 6, two heat conduction plates 5 are fixedly connected between the semiconductor refrigeration sheet 6 and the inner wall of the storage frame 1, the two heat conduction plates 5 are both in contact with the rack server body 3, the control switch 14 is electrically connected with the rack server body, and a heat dissipation mechanism is arranged outside the rack server body for further increasing heat dissipation effect of the heat dissipation and dissipating the heat dissipation effect of the rack server, and further increasing the heat dissipation effect of the heat dissipation mechanism by the heat dissipation mechanism 3.

Referring to fig. 2-3, the pressing mechanism includes a T-shaped rod 10 fixedly connected to the inner wall of the receiving frame 1, the outer end of the T-shaped rod 10 is sleeved with a movable block 11, the outer end of the T-shaped rod 10 is sleeved with a shape-changing memory spring 12, and the left and right ends of the shape-changing memory spring 12 are respectively fixedly connected to the receiving frame 1 and the movable block 11, the upper end of the movable block 11 is fixedly connected to a pressing rod 13, and the pressing rod 13 corresponds to the control switch 14, so as to continuously operate the rack-mounted server body 3, and the heat dissipation fan 8 dissipates heat more and more, and cannot timely and rapidly dissipate the heat, so that the heat is accumulated in the interior of the movable block 11, and the temperature of the shape-changing memory spring 12 is increased, and the movable block 11 and the pressing rod 13 are pulled to approach the control switch 14, and the heat is pressed to drive the semiconductor cooling fins 6 to operate, so that the heat-absorbing end of the heat-conducting plate 5 absorbs the heat generated by the rack-mounted server body 3, and the heat-dissipating end of the heat-absorbing plate 5 is dissipated by the heat-dissipating end of the heat-absorbing plate, so that the heat-dissipating end of the heat-absorbing plate is rapidly and overall heat-dissipating end of the heat-dissipating device, the heat-absorbing device, thereby further enhancing the heat-dissipating effect and effectively reducing the temperature.

Referring to fig. 1-2, the lower end of the placing plate 2 is fixedly connected with two symmetrical sliding blocks 202, two symmetrical sliding grooves 201 are drilled at the inner bottom end of the containing frame 1, the sliding blocks 202 are located in the sliding grooves 201 and are in sliding connection with the sliding grooves 201, and the placing plate 2 can be extended or retracted conveniently through the arrangement of the sliding blocks 202 and the sliding grooves 201, so that the rack-mounted server body 3 can be placed and taken out conveniently.

Referring to fig. 1-2, the two heat-conducting plates 5 are made of copper metal, the outer ends of the two dust screens 9 are provided with high temperature resistant layers, the heat-conducting plates 5 made of copper metal have excellent heat-conducting performance, and can conduct the heat on the rack-mounted server body 3 to the heat-absorbing end of the semiconductor refrigeration sheet 6, and the arrangement of the high temperature resistant layers makes the dust screens 9 not easily affected by high temperature in the long-term use process, reduces the possibility of damage, and prolongs the service life.

Referring to fig. 3, two symmetrical spherical grooves are cut in the inner wall of the movable block 11, balls 1101 are rotatably connected to the insides of the two spherical grooves, the outer ends of the two balls 1101 are in contact with the T-shaped rod 10, the shape-change memory spring 12 is made of a shape-memory alloy material, and its initial state is an extended state, the shape-change memory spring 12 using the shape-memory alloy material has a memory effect, and after a temperature rises, it is heated to contract, the movable block 11 is pulled to move leftward, and after a temperature recovers, it returns to the initial state, the movable block 11 is pushed to reset, and the balls 1101 are disposed, so that the movement of the movable block 11 is smoother and more convenient.

The utility model discloses in, at first the pulling is placed board 2 and is outwards extended under slider 202 and the slip of spout 201, place rack-mounted server body 3 on placing board 2 after that, and adsorb it fixedly with the help of fixed sucking disc 4, treat to fix the back, the promotion is placed board 2 and is got back to and accomodate inside frame 1, make rack-mounted server body 3 contact with heat-conducting plate 5, in rack-mounted server body 3 course of work, synchronous start radiator fan 8, the heat that extracts its production outwards gives off, and along with the long-time work that rack-mounted server body 3 lasts, heat release is more and more, radiator fan 8 dispels the heat limitedly, can not be timely quick carry out whole heat dissipations, make the heat accumulation accomodate inside frame 1, it risees to drive the temperature, make deformation memory spring 12 be heated the shrink, pulling movable block 11 and press the depression bar 13 to be close to control switch 14, and press it to drive semiconductor refrigeration piece 6 work, make its heat absorption end cooperation heat-conducting plate 5 absorb the heat that rack-mounted server body 3 produced, distribute away by its heat release end again, make thermal dissipation comprehensive fast, make thermal energy, further, the heat dissipation effect is further strengthened the radiating effect, the effectual temperature that has reduced.

The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. Supplementary heat abstractor of rack-mounted server, including accomodating frame (1), its characterized in that: the utility model discloses a take in heat-insulating rack-mounted server, including accomodate frame (1), the inside sliding connection who accomodates frame (1) has places board (2), and the upper end of placing board (2) is equipped with rack-mounted server body (3), the upper end of placing board (2) inlays establishes fixed suction cup (4) of installing a plurality of evenly distributed, and a plurality of fixed suction cup (4) all contact with rack-mounted server body (3), accomodate two external logical frames (7) of upper end fixedly connected with of frame (1), and it runs through the upper end of accomodating frame (1) to be linked together with the inside of accomodating frame (1), the inner wall fixedly connected with dust screen (9) of external logical frame (7), and dust screen (9) and install radiator fan (8) between them, the top of accomodating frame (1) inlays to establish and installs semiconductor refrigeration piece (6), the lower extreme of semiconductor piece (6) is the heat absorption end, and its upper end is the end and is the end of giving out heat, semiconductor refrigeration piece (6) and accomodate two heat-conducting plate (5) that fixedly connected with two symmetrical heat-conducting plates (5) between frame (1) inner wall, and all with rack-mounted server body (3), the control switch (14) outside of accomodating frame (1), the control switch (14) and control mechanism (14) are connected.

2. The rack-mounted server auxiliary heat dissipation device of claim 1, wherein: pressing means includes and accomodates frame (1) inner wall fixed connection's T shape pole (10), the outer end cover of T shape pole (10) is equipped with movable block (11), the outer pot head of T shape pole (10) is equipped with deformation memory spring (12), and deformation memory spring (12) about both ends respectively with accomodate frame (1) and movable block (11) fixed connection, the upper end fixedly connected with of movable block (11) presses down pole (13), and presses down pole (13) and control switch (14) corresponding.

3. The rack-mounted server auxiliary heat dissipation device of claim 1, wherein: the lower end of the placing plate (2) is fixedly connected with two symmetrical sliding blocks (202), two symmetrical sliding grooves (201) are formed in the inner bottom end of the containing frame (1), and the sliding blocks (202) are located in the sliding grooves (201) and are in sliding connection with the sliding grooves.

4. The rack-mounted server auxiliary heat dissipation device of claim 1, wherein: two heat-conducting plate (5) all adopt the metal copper material to make, two the outer end of dust screen (9) all is equipped with high temperature resistant layer.

5. The rack-mounted server auxiliary heat dissipation device of claim 2, wherein: the inner wall of movable block (11) is opened and is dug there are two symmetrical spherical grooves, and the inside of two spherical grooves is all rotated and is connected with ball (1101), two the outer end of ball (1101) all contacts with T shape pole (10), shape memory spring (12) adopt shape memory alloy material to make, and its initial condition is the extended state.