CN217955823U - Wafer horizontal transmission mechanism - Google Patents
Wafer horizontal transmission mechanism Download PDFInfo
- Publication number
- CN217955823U CN217955823U CN202221613572.3U CN202221613572U CN217955823U CN 217955823 U CN217955823 U CN 217955823U CN 202221613572 U CN202221613572 U CN 202221613572U CN 217955823 U CN217955823 U CN 217955823U
- Authority
- CN
- China
- Prior art keywords
- horizontal
- wafer
- supporting seat
- locking
- wafer supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a horizontal transmission device of wafer, the wafer supporting seat is adjusted to the level by horizontal adjustment mechanism when material loading section and unloading section to make things convenient for straight-up grabbing of manipulator, when the transmission section transmits, the horizontal part of wafer supporting seat has certain slope, can make the wafer to a direction slope on the wafer supporting seat, prevents to lead to the wafer to collide with because the state of wafer slope about is different, reduces the fish tail risk of wafer.
Description
Technical Field
The application belongs to the technical field of wafer cleaning and preparation equipment, and particularly relates to a wafer horizontal transmission mechanism.
Background
In the fabrication of semiconductor wafers, the cleanliness of the wafer surface is an important factor affecting the reliability of semiconductor devices. Therefore, cleaning is one of the most important and frequent processes. The purpose of wafer cleaning is to remove various contaminants, such as organic matters, metal impurities or fine particles, PSG layers to be removed, etc., attached to the surface of the wafer, and the cleaning is usually performed in different cleaning tanks containing various cleaning solutions, so that a transfer device is required to transfer the wafer while the wafer moves between the different cleaning tanks.
Chinese patent document CN206116363U discloses a boat, which is disposed in an inclined manner to enable wafers to be arranged in an inclined manner in one direction, so as to prevent the wafers from being disorderly inclined in the boat, further prevent the wafers from colliding with each other, and improve the integrity of the wafers. However, in this document, whether the boat is horizontal or not is realized by using whether the support member moves downward and contacts with the table top carrying the boat or not, and the structure is complicated, the structural stability is insufficient, and the boat is not suitable for use in the transportation process.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: in order to solve the defects in the prior art, the mechanism for ensuring the inclination of the wafer and the horizontal transmission of the vertical wafer during feeding and discharging is provided.
The utility model provides a technical scheme that its technical problem adopted is:
a wafer level transfer mechanism comprising:
a horizontal mounting base;
the horizontal sliding rail is arranged on the horizontal mounting seat, is positioned on the top surface of the horizontal mounting seat and is sequentially divided into a feeding section, a transmission section and a discharging section from the transmission direction of the horizontal mounting seat;
the wafer supporting seat is used for receiving wafers, is arranged on the horizontal sliding rail and is provided with a vertical part and a horizontal part which is rotatably connected to the vertical part through a rotating shaft, the horizontal part can enable the horizontal part to form a certain included angle relative to a horizontal plane after receiving the wafers, and the horizontal part is provided with arc-shaped wafer receiving grooves which are arranged in rows;
the driving piece is used for driving the horizontal mounting seat to move on the horizontal sliding rail;
the wafer supporting seat is characterized by further comprising a horizontal adjusting mechanism, the horizontal adjusting mechanism comprises a horizontal adjusting wheel arranged on the wafer supporting seat and a horizontal adjusting block fixedly arranged on an external frame corresponding to the feeding section and the discharging section, the horizontal adjusting block is provided with an inclined bottom surface, and the horizontal adjusting wheel slides on the bottom surface of the horizontal adjusting block in the process that the wafer supporting seat moves from the transmission section to the feeding section or from the transmission section to the discharging section, so that the horizontal part of the wafer supporting seat is adjusted to be horizontal.
Preferably, the wafer horizontal transmission mechanism of the utility model,
the bottom surface of the horizontal adjusting block corresponding to the feeding section has undulation.
Preferably, the wafer horizontal transmission mechanism of the utility model,
the bottom surface of the horizontal adjusting block corresponding to the feeding section is composed of a horizontal plane, an upward inclined plane, a downward inclined plane and a terminal inclined plane, when the horizontal adjusting wheel runs on the horizontal plane, the horizontal part of the wafer supporting seat is horizontally arranged, when the horizontal adjusting wheel runs on the upward inclined plane, one end of the horizontal part of the wafer supporting seat, which is far away from the horizontal adjusting wheel, moves downwards, when the horizontal adjusting wheel runs on the downward inclined plane, one end of the horizontal part of the wafer supporting seat, which is far away from the horizontal adjusting wheel, moves upwards, when the horizontal adjusting wheel runs on the terminal inclined plane, one end of the horizontal part of the wafer supporting seat, which is far away from the horizontal adjusting wheel, moves downwards, and when the horizontal part of the wafer supporting seat and the horizontal plane form a required specific included angle.
Preferably, the horizontal wafer conveying mechanism of the utility model,
the highest point of the downward inclined surface is not higher than the highest point of the tail end inclined surface, the lowest point of the downward inclined surface is higher than the height of the horizontal plane, the vertical height from the lowest point of the downward inclined surface to the horizontal plane is recorded as H, the vertical height from the highest point of the downward inclined surface to the horizontal plane is recorded as H, and H is two-thirds to one-half H.
Preferably, the wafer horizontal transmission mechanism of the utility model,
the device also comprises a position locking mechanism used for locking the wafer supporting seat in the feeding section or the discharging section.
Preferably, the wafer horizontal transmission mechanism of the utility model,
the position locking mechanism comprises a locking wheel arranged on the wafer supporting seat and a locking driving piece fixedly arranged on the external frame, wherein a U-shaped locking piece is arranged on a telescopic rod of the locking driving piece, when the locking is needed, the locking driving piece drives the locking piece to ascend, so that the locking piece clamps the locking wheel, and when the locking is needed to be released, the locking driving piece drives the locking piece to descend, so that the locking piece leaves the locking wheel.
Preferably, the horizontal wafer conveying mechanism of the utility model,
and a limiting rod is arranged on the vertical part of the wafer supporting seat and used for limiting the maximum inclination angle of the horizontal part.
Preferably, the driving member of the horizontal wafer conveying mechanism of the present invention includes a driving motor and a belt transmission belt;
the belt transmission belt is arranged on the side face of the horizontal mounting seat and is driven by a driving motor to move, and the belt transmission belt is fixed with the bottom of the wafer supporting seat through a fixing clamp.
Preferably, the utility model discloses a wafer horizontal transmission mechanism, still be provided with spacing round on the horizontal installation seat to the position of restriction belt drive belt.
Preferably, the utility model discloses a horizontal transmission mechanism of wafer still is provided with on the horizontal installation seat and is used for responding to the horizontal part position the sensor.
The beneficial effects of the utility model are that:
the utility model discloses a horizontal transmission of wafer mechanism, the wafer supporting seat is adjusted to the level by horizontal adjustment mechanism when material loading section and unloading section to make things convenient for snatching of manipulator straight-up, when the transmission section transmits, the horizontal part of wafer supporting seat has certain slope, can make the wafer to a direction slope on the wafer supporting seat, prevents to lead to the wafer to collide with because the state of wafer slope about is different, reduces the fish tail risk of wafer.
Drawings
The technical solution of the present application is further explained below with reference to the drawings and the embodiments.
Fig. 1 is a perspective view of a wafer level transport mechanism according to an embodiment of the present application in one direction;
FIG. 2 is a perspective view of another orientation of the horizontal transport mechanism for wafers according to the embodiment of the present application;
FIG. 3 is a schematic view of a wafer support pedestal according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a wafer support of the blanking segment according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a wafer support pedestal of the loading section according to one embodiment of the present disclosure;
fig. 6 is a block diagram of a leveling block according to an embodiment of the present application.
The reference numbers in the figures are:
1. a horizontal mounting base;
2. a horizontal slide rail;
3. a wafer supporting seat;
4. a belt drive belt;
22. a drive motor;
31. a vertical portion;
32. a horizontal portion;
33. a rotating shaft;
41. a limiting wheel;
42. a fixing clip;
43. a limiting rod;
311. a locking wheel;
312. locking the drive member;
313. a locking member;
321. a horizontal adjustment wheel;
322. a horizontal adjustment block;
323. a sensor;
3221. a horizontal plane;
3222. an upward inclined surface;
3223. a downward sloping surface;
3224. a terminal inclined surface.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus are not to be construed as limiting the scope of the present application. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise specified, "a plurality" means two or more.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.
The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Examples
The present embodiment provides a wafer horizontal transfer mechanism, as shown in fig. 1, including:
a horizontal mounting base 1;
the horizontal sliding rail 2 is arranged on the horizontal installation seat 1, is positioned on the top surface of the horizontal installation seat 1, and is sequentially divided into a feeding section, a transmission section and a discharging section from the transmission direction, the feeding section corresponds to the wafer which is placed on the wafer supporting seat 3 below by using a manipulator, the transmission section corresponds to the wafer supporting seat 3 which bears the wafer to move, and the discharging section corresponds to the wafer which is taken away from the wafer supporting seat 3 by using the manipulator;
the wafer support seat 3, as shown in fig. 3, is used for receiving a wafer, is disposed on the horizontal slide rail 2, and has a vertical portion 31 and a horizontal portion 32 rotatably connected to the vertical portion 31 through a rotating shaft 33, the horizontal portion 32 can make the horizontal portion 32 form an included angle (the included angle is preferably 10 ° -20 °) with respect to a horizontal plane after receiving the wafer, and the horizontal portion 32 has arc-shaped wafer receiving grooves arranged in rows;
the driving piece is used for driving the horizontal mounting seat 1 to move on the horizontal sliding rail 2;
the wafer supporting seat is characterized by further comprising a horizontal adjusting mechanism, wherein the horizontal adjusting mechanism comprises a horizontal adjusting wheel 321 arranged on the wafer supporting seat 3 and a horizontal adjusting block 322 fixedly arranged on an outer frame corresponding to the feeding section and the discharging section, the horizontal adjusting block 322 is provided with an inclined bottom surface, and the horizontal adjusting wheel 321 slides on the bottom surface of the horizontal adjusting block 322 in the process that the wafer supporting seat 3 moves from the conveying section to the feeding section or from the conveying section to the discharging section, so that the horizontal part 32 of the wafer supporting seat 3 is adjusted to be horizontal.
The horizontal transmission device of wafer of this embodiment, wafer supporting seat 3 is the level by the adjustment of horizontal adjustment mechanism when material loading section and unloading section to make things convenient for straight-up grabbing of manipulator, when the transmission section transmits, the horizontal part 32 of wafer supporting seat 3 has certain slope, can make the wafer incline to an orientation on wafer supporting seat 3, prevents to lead to the wafer to collide with because the state of wafer slope about is different, reduces the fish tail risk of wafer.
Preferably, the driving member specifically includes a belt 4, as shown in fig. 2, disposed on a side surface of the horizontal mounting base 1, the belt 4 is driven by the driving motor 22 to move, the belt 4 is fixed to the bottom of the wafer supporting base 3 through a fixing clamp 42, and a limiting wheel 41 is further disposed on the horizontal mounting base 1 to limit the position of the belt 4.
The bottom surface of the horizontal adjustment block 322 corresponding to the feeding section has undulation, and the fold line may undulate or may undulate in a wavy line.
As shown in fig. 6, the specific structure is: the bottom surface of the leveling block 322 corresponding to the loading segment is composed of a horizontal surface 3221, an upward inclined surface 3222, a downward inclined surface 3223, and a distal inclined surface 3224, wherein when the leveling wheel 321 travels on the horizontal surface 3221, the horizontal portion of the wafer support base 3 is horizontally disposed, when the leveling wheel 321 travels on the upward inclined surface 3222, an end of the horizontal portion 32 of the wafer support base 3, which is away from the leveling wheel 321, moves downward, when the leveling wheel 321 travels on the downward inclined surface 3223, an end of the horizontal portion 32 of the wafer support base 3, which is away from the leveling wheel 321, moves upward, when the leveling wheel 321 travels on the distal inclined surface 3224, an end of the horizontal portion 32 of the wafer support base 3, which is away from the leveling wheel 321, moves downward, and when the distal inclined surface 3224, the horizontal portion 32 of the wafer support base 3 forms a desired specific included angle with the horizontal surface.
Preferably, the highest point of the downward inclined surface 3223 (the connection between the downward inclined surface 3223 and the downward inclined surface 3223) is not higher than the highest point of the end inclined surface 3224, the lowest point of the downward inclined surface 3223 (the connection between the downward inclined surface 3223 and the end inclined surface 3224) is higher than the height of the horizontal surface 3221, the vertical height from the lowest point of the downward inclined surface 3223 to the horizontal surface 3221 is recorded as H, the vertical height from the highest point of the downward inclined surface 3223 to the horizontal surface 3221 is recorded as H, and H is two-thirds to one-half H.
The wafer is shaken by the fluctuation of the horizontal part 32 of the wafer supporting seat 3, so that the wafer is easier to keep consistent in the subsequent tilting stage, and the wafer is more orderly in the basket-free wafer bearing seat. Of course, the speed of operation should be controlled at a lower speed to prevent the wafer from being damaged due to violent movement.
The wafer positioning device further comprises a position locking mechanism, wherein the position locking mechanism comprises a locking wheel 311 arranged on the wafer supporting seat 3 and a locking driving piece 312 fixedly arranged on the outer frame, a U-shaped locking piece 313 is arranged on a telescopic rod of the locking driving piece 312, when locking is needed, the locking driving piece 312 drives the locking piece 313 to ascend, so that the locking piece 313 clamps the locking wheel 311, and when the locking is needed to be released, the locking driving piece 312 drives the locking piece 313 to descend, so that the locking piece 313 leaves the locking wheel 311. The position lock mechanism can fix the wafer support base 3 and maintain the stability of the components.
Further, a stopper rod 43 is disposed on the vertical portion 31 of the wafer support base 3 for limiting the maximum inclination angle of the horizontal portion 32 and preventing the horizontal portion 32 from being excessively inclined.
Further, the horizontal installation base 1 is also provided with the sensor 323 for sensing the position of the horizontal portion 32. As shown in fig. 3, when the horizontal part 32 is inclined, one end of the horizontal part 32 is close to the sensor 323 so that the sensor 323 can sense the object, and when the horizontal part 32 is horizontal, the sensor 323 cannot sense the object, and the sensor 323 is connected to the controller so that the position of the horizontal part 32 can be monitored.
In light of the foregoing description of the preferred embodiments according to the present application, it is to be understood that various changes and modifications may be made without departing from the spirit and scope of the invention. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A wafer horizontal transfer mechanism, comprising:
a horizontal mounting base (1);
the horizontal sliding rail (2) is arranged on the horizontal mounting seat (1), is positioned on the top surface of the horizontal mounting seat (1), and is sequentially divided into a feeding section, a transmission section and a discharging section from the transmission direction;
the wafer supporting seat (3) is used for receiving wafers, arranged on the horizontal sliding rail (2) and provided with a vertical part (31) and a horizontal part (32) rotationally connected to the vertical part (31) through a rotating shaft (33), the horizontal part (32) can enable the horizontal part (32) to form a certain included angle relative to the horizontal plane after the wafers are contained in the horizontal part (32), and arc-shaped wafer containing grooves which are arranged in rows are formed in the horizontal part (32);
the driving piece is used for driving the horizontal mounting seat (1) to move on the horizontal sliding rail (2);
the wafer supporting seat is characterized by further comprising a horizontal adjusting mechanism, wherein the horizontal adjusting mechanism comprises a horizontal adjusting wheel (321) arranged on the wafer supporting seat (3) and a horizontal adjusting block (322) fixedly arranged on an outer frame corresponding to the feeding section and the discharging section, the horizontal adjusting block (322) is provided with an inclined bottom surface, and the horizontal adjusting wheel (321) slides on the bottom surface of the horizontal adjusting block (322) in the process that the wafer supporting seat (3) moves from the transmission section to the feeding section or from the transmission section to the discharging section, so that the horizontal part (32) of the wafer supporting seat (3) is adjusted to be horizontal.
2. The wafer level transport mechanism of claim 1,
the bottom surface of the horizontal adjusting block (322) corresponding to the feeding section has undulation.
3. The wafer level transport mechanism of claim 2,
the bottom surface of the horizontal adjusting block (322) corresponding to the feeding section is composed of a horizontal plane (3221), an upward inclined plane (3222), a downward inclined plane (3223) and a tail end inclined plane (3224), when the horizontal adjusting wheel (321) runs on the horizontal plane (3221), the horizontal part of the wafer supporting seat (3) is horizontally arranged, when the horizontal adjusting wheel (321) runs on the upward inclined plane (3222), one end, far away from the horizontal adjusting wheel (321), of the horizontal part (32) of the wafer supporting seat (3) moves downwards, when the horizontal adjusting wheel (321) runs on the downward inclined plane (3223), one end, far away from the horizontal adjusting wheel (321), of the horizontal part (32) of the wafer supporting seat (3) moves upwards, when the horizontal adjusting wheel (321) runs on the tail end inclined plane (3224), one end, far away from the horizontal adjusting wheel (321), of the horizontal part (32) of the wafer supporting seat (3) moves downwards, and when the horizontal part (32) of the wafer supporting seat (3) leaves the tail end inclined plane (3224), a required specific included angle is formed between the horizontal part (32) of the wafer supporting seat and the horizontal plane.
4. The wafer level transport mechanism of claim 3,
the highest point of the downward inclined surface (3223) is not higher than the highest point of the tail end inclined surface (3224), the lowest point of the downward inclined surface (3223) is higher than the height of the horizontal surface (3221), the vertical height from the lowest point of the downward inclined surface (3223) to the horizontal surface (3221) is recorded as H, the vertical height from the highest point of the downward inclined surface (3223) to the horizontal surface (3221) is recorded as H, and the H is two-thirds to one-half H.
5. The wafer level transport mechanism of claim 1,
the device also comprises a position locking mechanism which is used for locking the wafer supporting seat (3) at the feeding section or the discharging section.
6. The wafer level transport mechanism of claim 5,
the position locking mechanism comprises a locking wheel (311) arranged on a wafer supporting seat (3) and a locking driving piece (312) fixedly arranged on an outer frame, wherein a U-shaped locking piece (313) is arranged on a telescopic rod of the locking driving piece (312), when locking is needed, the locking driving piece (312) drives the locking piece (313) to ascend, so that the locking piece (313) can clamp the locking wheel (311), and when the locking is needed to be released, the locking driving piece (312) drives the locking piece (313) to descend, so that the locking piece (313) leaves the locking wheel (311).
7. The wafer level transport mechanism of claim 1,
a limiting rod (43) is arranged on the vertical part (31) of the wafer supporting seat (3) and used for limiting the maximum inclination angle of the horizontal part (32).
8. The wafer level transport mechanism of claim 1, wherein the drive member comprises a drive motor (22) and a belt (4);
the belt transmission belt (4) is arranged on the side face of the horizontal mounting seat (1), the belt transmission belt (4) is driven to move by the driving motor (22), and the belt transmission belt (4) is fixed with the bottom of the wafer supporting seat (3) through the fixing clamp (42).
9. The wafer horizontal transmission mechanism according to claim 8, wherein a limiting wheel (41) is further arranged on the horizontal mounting seat (1) to limit the position of the belt transmission belt (4).
10. The wafer level transmission mechanism according to claim 1, wherein a sensor (323) for sensing the position of the horizontal portion (32) is further provided on the horizontal mount (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221613572.3U CN217955823U (en) | 2022-06-23 | 2022-06-23 | Wafer horizontal transmission mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221613572.3U CN217955823U (en) | 2022-06-23 | 2022-06-23 | Wafer horizontal transmission mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217955823U true CN217955823U (en) | 2022-12-02 |
Family
ID=84219042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221613572.3U Active CN217955823U (en) | 2022-06-23 | 2022-06-23 | Wafer horizontal transmission mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217955823U (en) |
-
2022
- 2022-06-23 CN CN202221613572.3U patent/CN217955823U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20130036307A (en) | Plate-shaped member transfer facility | |
| KR20130033292A (en) | Transfer robot and substrate processing apparatus | |
| TW512119B (en) | Article storage system | |
| CN217955823U (en) | Wafer horizontal transmission mechanism | |
| CN1162997A (en) | IC conveyor, IC posture changer and IC takeout apparatus | |
| CN115148649A (en) | Wafer horizontal transmission mechanism | |
| CN210824319U (en) | Conveying device for energy storage spring of circuit breaker | |
| JPH05294410A (en) | Load storage equipment | |
| CN112455995A (en) | Rotary conveyor | |
| CN115274516B (en) | Basket-free wafer horizontal transmission method | |
| US8622686B2 (en) | Stabilized device for moving a plurality of containers | |
| JPH07335718A (en) | Wafer carrier device | |
| CN114291468A (en) | Portable high-freedom transfer robot | |
| CN114524144A (en) | Cup turning device | |
| JP4731815B2 (en) | Board storage device | |
| CN222599668U (en) | Sample loading assembly and sample processing unit | |
| CN220866997U (en) | Buffer storage device for lifter | |
| JP2002093892A (en) | Substrate processing equipment | |
| JP2001230304A (en) | Apparatus for centering substrate | |
| JP2528416B2 (en) | Transfer equipment | |
| JP4254980B2 (en) | Wafer transfer equipment | |
| CN219443884U (en) | Loading and unloading device and processing equipment | |
| CN221274199U (en) | Tray conveying line and printing device | |
| CN221680049U (en) | Electronic paper circulating feeding device | |
| CN216511356U (en) | Unloader on batching |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
|
| CP03 | Change of name, title or address |