CN217825498U - Circuit board assembly and electronic device thereof - Google Patents

Abstract

The present application relates to a circuit board assembly and an electronic device thereof. The circuit board assembly comprises a substrate layer, components and parts and a noise shielding structure; the component is fixed on the substrate layer; the noise shielding structure is arranged on the component and comprises an insulating layer and a shielding layer; the insulating layer covers the surface of the component; the shielding layer is arranged on the insulating layer, and the orthographic projection area of the shielding layer on the base material layer completely covers the insulating layer. The insulating layer covers the surfaces of the components and the shielding layer is arranged on the insulating layer, so that each component on the circuit board assembly is shielded independently, and noise shielding among the components inside the circuit board assembly is realized.

Description

A circuit board assembly and its electronic device

technical field

The present application relates to the technical field of noise protection, in particular to a circuit board assembly and an electronic device thereof.

Background technique

Noise refers to the collection of other signals except the target signal. When the noise signal is large enough to a certain extent, it will often become an interference signal and affect the performance of the components on the circuit board assembly. Common noise hazards include control signal control errors or clock signal phase errors. Therefore, in various consumer electronic products, noise protection measures are often taken in the IC device area on the circuit board.

The existing noise protection measures on the circuit board assembly are: welding a metal shielding bracket or a metal shielding cover on the circuit board assembly, the outer layer of the metal shielding cover is attached with shielding materials such as copper foil, conductive cloth, and the inner layer of the metal shielding cover Attach an insulating film layer to prevent components from contacting the metal shielding cover.

The defect of the existing noise protection measures is: only the noise from outside the circuit board assembly can be shielded, but there are still some noises that interfere with each other between the components inside the circuit board assembly.

Utility model content

In order to solve the above-mentioned problems in the prior art, the present application provides a circuit board assembly and its electronic device, which can solve the problem of noise interference between components inside the circuit board assembly.

The application provides a circuit board assembly. The circuit board assembly includes a base material layer, components and noise shielding structures. The components are fixed on the base material layer. The noise shielding structure is arranged on the components for shielding noise. The noise shielding structure includes an insulating layer and a shielding layer. The insulating layer covers the surface of the components. The shielding layer is disposed on the insulating layer, and the orthographic projection area of the shielding layer on the base layer completely covers the insulating layer.

The application also provides an electronic device. The electronic device includes a functional device and the circuit board assembly, and the circuit board assembly is electrically connected to the functional device.

Compared with the prior art, the present application has at least the following beneficial effects:

By covering the surface of components with an insulating layer and setting the shielding layer on the insulating layer, each component on the circuit board assembly is individually shielded, thereby realizing noise shielding between components inside the circuit board assembly. In addition, the insulating layer is directly covered on the surface of the components, and the shielding layer is directly arranged on the insulating layer, so that the overall thickness of the circuit board assembly is much smaller than that of the circuit board assembly with traditional noise protection measures.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

Fig. 1 is a schematic cross-sectional view of a circuit board assembly provided by an embodiment of the present application;

Fig. 2 is an exploded schematic diagram of the circuit board assembly of Fig. 1;

3 is a schematic cross-sectional view of a circuit board assembly provided by another embodiment of the present application;

Fig. 4 is a schematic cross-sectional view of a circuit board assembly provided in yet another embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a circuit board assembly provided in yet another embodiment of the present application;

6 is a schematic diagram of calculating the shielding thickness of a circuit board assembly in the prior art;

Fig. 7 is a schematic diagram of calculating the shielding thickness of the circuit board assembly of Fig. 3;

Fig. 8 is a schematic diagram of calculating the safety distance of the circuit board assembly in the prior art;

Fig. 9 is a schematic diagram of calculating the safety distance of the circuit board assembly of Fig. 3;

FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

Fig. 11 is a schematic sectional view of the structure of the electronic device in Fig. 10 at A-A;

FIG. 12 is a schematic structural block diagram of the electronic device in FIG. 10 .

Detailed ways

The application will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present application, but not to limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of them, and all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

It should be noted that the terms "first", "second", and "third" in this application are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. quantity. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship between the various components in a certain posture (as shown in the drawings) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or apparatuses.

The terms in this specification are used to describe the embodiments of the present application, but are not intended to limit the present application. It should also be noted that, unless otherwise clearly stipulated and limited, the terms "set", "connected" and "connected" should be interpreted in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral Ground connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediary, or an internal connection between two components. Those skilled in the art can specifically understand the above-mentioned specific meanings in this application.

Referring to FIG. 1 , an embodiment of the present application provides a circuit board assembly 110 . The circuit board assembly 110 may include but not limited to a substrate layer 111 , components 112 and a noise shielding structure 113 . The components 112 are fixed on the base layer 111 . The noise shielding structure 113 is disposed on the component 112 for shielding noise. The noise shielding structure 113 may include but not limited to an insulating layer 1131 and a shielding layer 1132 . The insulating layer 1131 covers the surface of the component 112 . The shielding layer 1132 is disposed on the insulating layer 1131 , and the orthographic projection area of the shielding layer 1132 on the substrate layer 111 completely covers the insulating layer 1131 . In this way, the shielding layer 1132 and the insulating layer 1131 individually encapsulate and shield the components 112 on the circuit board assembly 110 , which can effectively prevent the components 112 on the circuit board assembly 110 from generating noise interference with each other.

Further, please refer to FIG. 1 and FIG. 2 , the insulating layer 1131 may include but not limited to a first surface 1131a and a second surface 1131b disposed opposite to each other, and a first end surface 1131c connecting the first surface 1131a and the second surface 1131b. The first surface 1131 a is attached to the surface of the component 112 . The first end surface 1131c is attached to the surface of the base material layer 111 .

Optionally, the material of the insulating layer 1131 may be one of polyurethane and ethylene terephthalate. When polyurethane or polyethylene terephthalate is in the form of paint, the insulating layer 1131 can be sprayed to cover the surface of the component 112 . When polyurethane or polyethylene terephthalate is in the form of a film, the insulating layer 1131 can cover the surface of the component 112 by molding.

It can be understood that both polyurethane and polyethylene terephthalate are materials with relatively good insulating properties, so the insulating layer 1131 covering the surface of the component 112 can effectively prevent the shielding layer 1132 from affecting the component 112 or the circuit board assembly. Short circuit and false touch of the network on 110.

It can be understood that polyurethane or polyethylene terephthalate in film form has shape plasticity, so an adaptive covering film layer can be formed on the circuit board assembly 110 according to the three-dimensional shape of the board surface.

Optionally, from the perspective of heat dissipation, a thermally conductive material may be added to the insulating layer 1131 to improve the heat conduction performance of the insulating layer 1131 and prevent heat dissipation from affecting the performance of the components 112 . Specifically, the thermally conductive material may be thermally conductive silicone grease.

Further, please refer to FIG. 1 and FIG. 2 , the shielding layer 1132 may include but not limited to a third surface 1132a and a fourth surface 1132b disposed opposite to each other, and a second end surface 1132c connecting the third surface 1132a and the fourth surface 1132b. A ground pad 1111 is provided on the surface of the substrate layer 111 . The third surface 1132a is attached to the second surface 1131b. The second end surface 1132c is attached to the surface of the ground pad 1111 , so that the noise signal can be guided away through the shielding layer 1132 and the ground pad 1111 .

In addition, the ground pad 1111 may be provided with a via hole penetrating through the ground pad 1111 and the base material layer 111 to improve heat dissipation efficiency.

Optionally, the material of the shielding layer 1132 may be a blend of polyurethane and silver-coated copper powder or a blend of polyethylene terephthalate and silver-coated copper powder. When the blend of polyurethane and silver-clad copper powder is in the form of paint, the shielding layer 1132 can be sprayed to cover the second surface 1131b of the insulating layer 1131 . When the blend of polyurethane and silver-coated copper powder is in the form of a thin film, the shielding layer 1132 can cover the second surface 1131b of the insulating layer 1131 by compression molding.

It can be understood that the silver-coated copper powder is a conductive particle, and the second end surface 1132c of the shielding layer 1132 is electrically connected to the ground pad 1111 on the base layer 111 through the silver-coated copper powder. In this way, noise signals from outside the circuit board assembly 110 and noise signals from inside the circuit board assembly 110 will be guided away through the shielding layer 1132 and the ground pad 1111 , thereby realizing noise shielding. Silver-coated copper powder has excellent electrical conductivity, is cheaper than pure silver powder, and is less prone to oxidation than pure copper powder, so it is suitable as conductive particles commonly used in industry.

It can be understood that the conductivity of the shielding layer 1132 depends on the filling rate of the conductive particles. In this embodiment, the conductivity of the shielding layer 1132 depends on the filling rate of the silver-coated copper powder. The higher the filling rate of the silver-coated copper powder is, the higher the conductivity of the shielding layer 1132 is. The size and uniformity of the conductive particles will affect the conductive properties of the shielding layer 1132 . Specifically, if the particle size of the conductive particles is too large, the ground pad 1111 will be contacted with too few conductive particles; if the particle size of the conductive particles is too small, the conductive particles will easily gather in the shielding layer 1132 . Therefore, the particle size of the conductive particles should be selected appropriately, specifically, the particle size of the silver-coated copper powder is 4-6 microns.

Further, referring to FIG. 1 , the insulating layer 1131 has a uniform thickness. The thickness of the insulating layer 1131 is 0.05-0.2mm. Specifically, it can be: 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.15mm, and 0.2mm. The shielding layer 1132 has a uniform thickness. The thickness of the shielding layer is 0.01-0.15mm. Specifically, it may be: specifically, it may be: 0.01mm, 0.12mm, 0.13mm, and 0.15mm. Wherein, the thickness of the insulating layer 1131 and the shielding layer 1132 should ensure that the normal performance of the component 112 is not affected. On this basis, the thickness of the insulating layer 1131 and the shielding layer 1132 should also have a certain structural strength and hardness.

Further, referring to FIG. 1 , the minimum distance between the ground pad 1111 facing the edge of the substrate layer 111 and the component 112 is 0.1-0.5 mm.

Referring to FIG. 3 , another embodiment of the present application provides a circuit board assembly 110 . The circuit board assembly 110 may include but not limited to a substrate layer 111 , components 112 and a noise shielding structure 113 . The components 112 are fixed on the base layer 111 . The noise shielding structure 113 is disposed on the component 112 for shielding noise. The noise shielding structure 113 includes an insulating layer 1131 and a shielding layer 1132 . The insulating layer 1131 covers the surfaces of the components 112 and the gaps between the components 112 . The shielding layer 1132 is disposed on the insulating layer 1131 , and the orthographic projection area of the shielding layer 1132 on the substrate layer 111 completely covers the insulating layer 1131 . In this way, the shielding layer 1132 and the insulating layer 1131 individually encapsulate and shield the components 112 on the circuit board assembly 110 , which can effectively prevent the components 112 on the circuit board assembly 110 from generating noise interference with each other.

The difference between the circuit board assembly 110 of another embodiment and the circuit board assembly 110 of the first embodiment is that the insulating layer 1131 also covers the gaps between the components 112 .

It can be understood that when the components 112 on the circuit board assembly 110 have a low density and are relatively far apart, the insulating layer 1131 only covers the surface of the components 112 . When the density of the components 112 on the circuit board assembly 110 is high and the distance between them is relatively close, the insulating layer 1131 covers the surface of the components 112 and the space between the components 112 .

Please refer to FIG. 4 , yet another embodiment of the present application provides a circuit board assembly 110 , the circuit board assembly 110 may include but not limited to a substrate layer 111 , components 112 and a noise shielding structure 113 . The components 112 are fixed on the base layer 111 . The noise shielding structure 113 is disposed on the component 112 for shielding noise. The noise shielding structure 113 includes an insulating layer 1131 and a shielding layer 1132 . The insulating layer 1131 covers the surfaces of the components 112 and the gaps between the components 112 . The shielding layer 1132 is disposed on the insulating layer 1131 , and the orthographic projection area of the shielding layer 1132 on the substrate layer 111 completely covers the insulating layer 1131 . In this way, the shielding layer 1132 and the insulating layer 1131 individually encapsulate and shield the components 112 on the circuit board assembly 110 , which can effectively prevent the components 112 on the circuit board assembly 110 from generating noise interference with each other. Wherein, the thickness of the insulating layer 1131 is uneven. The thickness of the shielding layer 1132 is also not uniform.

The difference between the circuit board assembly 110 of another embodiment and the circuit board assembly 110 of the first embodiment is that the insulating layer 1131 and the shielding layer 1132 have uneven thicknesses.

It can be understood that when some components 112 on the circuit board assembly 110 require high heat dissipation for normal operation, the thickness of the insulating layer 1131 and the shielding layer 1132 can be relatively small to ensure the heat dissipation capability of such components 112 . When other components 112 on the circuit board assembly 110 have relatively low heat dissipation requirements for normal operation, the thickness of the insulating layer 1131 and the shielding layer 1132 can be relatively large to ensure a certain structural strength and hardness.

Or, when some components 112 on the circuit board assembly 110 generate relatively large noise signals or are relatively sensitive to noise signals, the thickness of the shielding layer 1132 covered on such components 112 can be relatively large; otherwise, the shielding layer The thickness of 1132 can be relatively small.

Referring to FIG. 5 , another embodiment of the present application provides a circuit board assembly 110 . The circuit board assembly 110 may include but not limited to a substrate layer 111 , components 112 and a noise shielding structure 113 . The components 112 are fixed on the base layer 111 . The noise shielding structure 113 is disposed on the component 112 for shielding noise. The noise shielding structure 113 includes an insulating layer 1131 and a shielding layer 1132 . The insulating layer 1131 covers the surfaces of the components 112 and the gaps between the components 112 . The shielding layer 1132 is disposed on the insulating layer 1131 , and the orthographic projection area of the shielding layer 1132 on the substrate layer 111 completely covers the insulating layer 1131 . In this way, the shielding layer 1132 and the insulating layer 1131 individually encapsulate and shield the components 112 on the circuit board assembly 110 , which can effectively prevent the components 112 on the circuit board assembly 110 from generating noise interference with each other. The circuit board assembly 110 further includes a copper foil layer 114 and an ink layer 115 . The copper foil layer 114 is disposed on the base material layer 111 . The component 112 is electrically connected to the copper foil layer 114 . The ink layer 115 is disposed on the copper foil layer 114 to protect the copper foil layer 114 .

The difference between the circuit board assembly 110 of another embodiment and the circuit board assembly 110 of another embodiment is that the circuit board assembly 110 further includes a copper foil layer 114 and an ink layer 115 . The copper foil layer 114 is disposed on the base material layer 111 . The component 112 is electrically connected to the copper foil layer 114 . The ink layer 115 is disposed on the copper foil layer 114 to protect the copper foil layer 114 .

It can be understood that the copper foil layer 114 forms a circuit network on the circuit board assembly 110 to communicate with the components 112 . The ink layer 115 disposed on the copper foil layer 114 can protect the circuit network on the circuit board assembly 110 .

Further, referring to FIG. 6 , in the prior art, the circuit board assembly 210 may include but not limited to a substrate layer 211 , components 212 , and a noise shielding structure 213 . The components 212 are fixed on the base layer 211 . The substrate layer 211 is provided with pads. The noise shielding structure 213 is soldered to the base material layer 211 through a pad. The noise shielding structure 213 may include but not limited to a shielding layer 2131 , an insulating layer 2132 and a metal shielding cover 2133 . The metal shielding cover 2133 may include but not limited to a top plate and a side plate, the top plate and the side plates form a receiving cavity, and the components 212 are stored in the receiving cavity. The side of the top plate away from the components 212 is covered with a shielding layer 2131 . The side of the top plate facing the components 212 is covered with an insulating layer 2132 to prevent the components 212 from contacting the metal shielding cover 2133 .

In the circuit board assembly 210 of the prior art, the thickness of the metal layer of the metal shielding cover 2133 is 0.15-0.2mm, the thickness of the insulating layer 2132 is 0.04-0.05mm, and the top gap between the highest point of the component 212 and the lower surface of the insulating layer 2132 0.1-0.2mm, the thickness of the shielding layer 2131 is 0.01-0.15mm, so the shielding thickness H1 of the circuit board assembly 210=the thickness of the metal layer+the thickness of the insulating layer 2132+the top gap+the thickness of the shielding layer 2131=0.3-0.5mm .

Please refer to FIG. 7 , the shielding thickness H2 of the circuit board assembly 110 provided by another embodiment of the present application=thickness of the insulating layer 1131+thickness of the shielding layer 1132=0.06-0.35mm. It can be seen that the shielding thickness of the circuit board assembly 110 is more than 50% smaller than that of the circuit board assembly 210, which frees up more space for the layout of other modules inside the electronic device or reduces the overall thickness of the electronic device .

Understandably, referring to FIG. 8 , in the circuit board assembly 210 of the prior art, the width of the pad is 0.2-0.5mm, and the gap between the side of the pad facing the component 212 and the component 212 is 0.1-0.3mm , the reserved distance between the side of the pad away from the component 212 and the edge of the substrate layer 211 is 0.1-0.3mm, then the safe distance D1 of the circuit board assembly 210=pad width+gap distance+reserved distance=0.4- 1.1mm.

Please refer to FIG. 9 , the safe spacing of the circuit board assembly 110 provided by another embodiment of the present application is the minimum distance between the side of the ground pad 1111 facing the edge of the substrate layer 111 and the component 112 , so the safety of the circuit board assembly 110 Distance D2 = 0.1-0.5mm. It can be seen that the safety distance of the circuit board assembly 110 is more than 50% smaller than that of the circuit board assembly 210, which frees up more space for the layout of other modules inside the electronic device or saves more space for the electronic device. space.

It can be understood that the overall weight of the circuit board assembly 110 is much lighter than that of the circuit board assembly 210 in the prior art because the circuit board assembly 110 provided in another embodiment of the present application has no metal shield frame or metal shield cover.

Please refer to FIG. 10 and FIG. 11 , the embodiment of the present application also provides an electronic device 10 . Specifically, the electronic device 10 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc., and the illustration in this embodiment takes a mobile phone as an example. The electronic device 10 may include but not limited to a housing assembly 120 , a display module 130 and a circuit board assembly 110 . Wherein, the housing assembly 120 may include a rear cover 121 and a middle frame 122 . Wherein, for the detailed structure of the circuit board assembly 110 , please refer to the related descriptions of the foregoing embodiments, which will not be repeated here. It should be noted here that the embodiment of the present application only uses the structure of the electronic device 10 including the middle frame 122 for illustration. The matching structure of the display module 130 is not specifically limited here.

Optionally, the display module 130 and the rear cover 121 of the housing assembly 120 are respectively disposed on opposite sides of the middle frame 122 . The display module 130 cooperates with the housing assembly 120 to form an accommodating space 100 , and the circuit board assembly 110 is disposed in the accommodating space 100 . The circuit board assembly 110 is coupled to the display screen module 130 , and the circuit board assembly 110 is used to control the working state of the display screen module 130 . The detailed technical features of the structure of other parts of the electronic device 10 are within the comprehension scope of those skilled in the art, and will not be repeated here.

Referring to FIG. 12 , the structural composition of the electronic device 10 may include but not limited to an RF circuit 910, a memory 920, an input unit 930, a display unit 940, a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, and a power supply 990. Wherein, the RF circuit 910 , the memory 920 , the input unit 930 , the display unit 940 , the sensor 950 , the audio circuit 960 and the wifi module 970 are respectively coupled to the processor 980 ;

Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, and specifically may include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may Including display panel 941, etc.; sensor 950 includes infrared sensor, laser sensor, etc., for detecting user approach signal, distance signal, etc.; speaker 961 and microphone (or microphone) 962 are connected with processor 980 through audio circuit 960, for sending and receiving sound signal; the wifi module 970 is used for receiving and transmitting wifi signal, and the processor 980 is used for processing the data information of the electronic device.

The circuit board assembly 110 provided by the application covers the surface of the component 112 through the insulating layer 1131 and the shielding layer 1132 is arranged on the insulating layer 1131, so that each component 112 on the circuit board assembly 110 is individually shielded, thereby realizing a circuit Noise shielding between components 112 within board assembly 110 .

The circuit board assembly 110 provided by this application directly covers the surface of the component 112 through the insulating layer 1131, and the shielding layer 1132 is directly arranged on the insulating layer 1131, and the thickness of the insulating layer 1131 and the shielding layer 1132 is small, so that the circuit board assembly 110 The overall thickness is much smaller than when using traditional noise protection measures. At the same time, compared with the traditional noise shielding technical solutions using metal shielding brackets or metal shielding covers, the overall weight of the circuit board assembly 110 provided by the present application is also much smaller.

The safe spacing of the circuit board assembly 110 provided in the present application is 0.1-0.5 mm. However, the safety distance of the circuit board assembly 210 using the metal shield bracket or the metal shield cover noise shielding solution is 0.4-1.1 mm. Therefore, the circuit board assembly 110 provided by the present application can save more than 50% of the occupied space compared with traditional noise protection measures.

The above descriptions are only part of the embodiments of the application, and are not intended to limit the scope of protection of the application. All equivalent devices or equivalent process transformations made by using the contents of the specification and drawings of the application, or directly or indirectly used in other related All technical fields are equally included in the patent protection scope of the present application.

Claims (10)

1. A circuit board assembly, comprising:

a substrate layer;

the component is fixed on the base material layer;

noise shielding structure set up in on the components and parts for the shielding noise includes:

the insulating layer covers the surface of the component;

the shielding layer is arranged on the insulating layer, and the orthographic projection area of the shielding layer on the base material layer completely covers the insulating layer.

2. The circuit board assembly of claim 1, wherein the insulating layer covers gaps between the components and surfaces of the components.

3. The circuit board assembly of claim 1, wherein the insulating layer includes a first surface and a second surface disposed opposite to each other, and a first end surface connecting the first surface and the second surface, the first surface being attached to the surface of the component, and the first end surface being attached to the surface of the substrate layer.

4. The circuit board assembly according to claim 3, wherein the shielding layer comprises a third surface and a fourth surface which are opposite to each other, and a second end surface connecting the third surface and the fourth surface, the substrate layer surface is provided with a ground pad, the third surface is attached to the second surface, and the second end surface is attached to the ground pad surface.

5. The circuit board assembly of claim 4, wherein a minimum distance between a side of the ground pad facing the edge of the substrate layer and the component is 0.1-0.5mm.

6. The circuit board assembly of claim 1, wherein the insulating layer and the shielding layer are of uniform thickness.

7. The circuit board assembly of claim 1, wherein the insulating layer has a thickness of 0.05-0.2mm.

8. The circuit board assembly of claim 1, wherein the shielding layer has a thickness of 0.01-0.15mm.

9. The circuit board assembly of claim 1, further comprising a copper foil layer disposed on the substrate layer, the component electrically connected to the copper foil layer, and an ink layer disposed on the copper foil layer to protect the copper foil layer.

10. An electronic device comprising a functional device and the circuit board assembly of any one of claims 1-9, wherein the circuit board assembly is electrically connected to the functional device.

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