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CN217689875U - A high-precision shunt assembly - Google Patents

A high-precision shunt assembly Download PDF

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Publication number
CN217689875U
CN217689875U CN202122815708.0U CN202122815708U CN217689875U CN 217689875 U CN217689875 U CN 217689875U CN 202122815708 U CN202122815708 U CN 202122815708U CN 217689875 U CN217689875 U CN 217689875U
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Prior art keywords
printed circuit
circuit board
shunt
assembly
temperature
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CN202122815708.0U
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Chinese (zh)
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刘青峰
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Shenzhen Huada New Energy Technology Co ltd
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Shenzhen Chaoda Investment Partnership LP
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Abstract

The utility model discloses a high-precision shunt assembly, which comprises a shunt, a first printed circuit board, a second printed circuit board, at least one power resistor, at least one thermistor, a heat-conducting medium and a fixing external member; the shunt is arranged on the first printed circuit board, the power resistor and the thermistor are arranged on the second printed circuit board, the first printed circuit board and the second printed circuit board are assembled together by using a fixing sleeve, the power resistor, the thermistor and the shunt are close to but not in contact, and a gap is filled with a heat-conducting medium; the power resistor can effectively heat the shunt and control the temperature of the shunt, and the thermistor can effectively detect the actual temperature of the shunt.

Description

一种高精度的分流器组件A high-precision shunt component

技术领域technical field

本实用新型属于恒温控制领域,尤其涉及一种将检测大电流用的分流器和分流器恒温控制的相关部件组装起来的方法。The utility model belongs to the field of constant temperature control, in particular to a method for assembling a shunt used for detecting large current and related components for constant temperature control of the shunt.

背景技术Background technique

用于检测大电流的分流器,流过大电流的时候会因为本身发热导致温度升高,而温升会改变它的电阻值,即所谓的温漂,典型值有50PPM(百万分之五十);因此用分流器测量大电流时,稳定分流器本体温度,减少温漂是提高检测精度的有效方式。将分流器,以及其他的一些温度敏感器件,如运放、ADC、晶振等一起放于恒温箱体中,是一种典型的恒温手段,但是恒温箱体的尺寸大、控制复杂,而且在电流变化导致分流器的自加热功率变化相对大的时候,分流器的温度不能快速稳定在一个确定的温度值,导致温度控制有很大的滞后性。A shunt used to detect large currents will cause a temperature rise due to self-heating when a large current flows through it, and the temperature rise will change its resistance value, which is the so-called temperature drift. The typical value is 50PPM (five parts per million) 10); Therefore, when using a shunt to measure large currents, stabilizing the temperature of the shunt body and reducing temperature drift is an effective way to improve detection accuracy. Putting shunts and other temperature-sensitive devices, such as operational amplifiers, ADCs, crystal oscillators, etc., together in a constant temperature box is a typical means of constant temperature, but the size of the constant temperature box is large, the control is complicated, and in the current When the change causes the self-heating power of the shunt to change relatively large, the temperature of the shunt cannot be quickly stabilized at a certain temperature value, resulting in a large hysteresis in temperature control.

发明内容SUMMARY OF THE INVENTION

本实用新型的目的在于克服现有技术中的不足而发明的一种高精度的分流器组件,能快速、直接控制并检测分流器的温度,从而实现高精度的电流检测。The purpose of the utility model is to overcome the deficiencies in the prior art and invent a high-precision shunt assembly, which can quickly and directly control and detect the temperature of the shunt, thereby realizing high-precision current detection.

本发明将分流器安装在第一印刷电路板上;将加热电阻和温度检测部件安装在第二印刷电路板上,第二印刷电路板上温度检测部件的两侧开槽,温度检测部件可以是正温度系数的热敏电阻PTC、温度系数的热敏电阻NTC、电阻温度检测器(RTD)、IC温度传感器,还可以是热电偶。在第一印刷电路板和第二印刷电路板器件中间填充导热介质,然后可通过螺丝和螺丝柱套件;也可以是排针及其相应的传递电信号的连接器,将第一印刷电路板和第二印刷电路板的器件面对面组装固定在一起后,把第二印刷电路板所开的槽清除温度检测部件两侧的导热介质,功率电阻和温度检测部件和分流器靠近但不接触,使得加热电阻可以直接加热分流器,而且温度检测部件也能直接检测分流器本体的温度,从而直接而迅速地控制和检测分流器的本体温度。In the present invention, the shunt is installed on the first printed circuit board; the heating resistor and the temperature detection component are installed on the second printed circuit board, and the two sides of the temperature detection component on the second printed circuit board are slotted, and the temperature detection component can be positive Temperature coefficient thermistor PTC, temperature coefficient thermistor NTC, resistance temperature detector (RTD), IC temperature sensor, and also a thermocouple. Fill the middle of the first printed circuit board and the second printed circuit board with a heat-conducting medium, and then pass the screw and the screw column set; it can also be the pin header and its corresponding connector for transmitting electrical signals, and connect the first printed circuit board and the second printed circuit board. After the components of the second printed circuit board are assembled face-to-face and fixed together, remove the heat conduction medium on both sides of the temperature detection part from the groove opened by the second printed circuit board, and the power resistor and the temperature detection part are close to but not in contact with the shunt, so that the heating The resistance can directly heat the shunt, and the temperature detection component can also directly detect the temperature of the shunt body, so that the body temperature of the shunt can be directly and rapidly controlled and detected.

附图说明Description of drawings

下面结合附图和实施例对本实用新型进一步说明。Below in conjunction with accompanying drawing and embodiment the utility model is further described.

图1 为组装分流器及其恒温控制部件的正视图。Figure 1 is a front view of the assembled diverter and its thermostatically controlled components.

图2 为显示分流器组装细节的爆炸图。Figure 2 is an exploded view showing the assembly details of the shunt.

图3 为显示加热电阻和温度检测细节的爆炸图。Figure 3 is an exploded view showing details of the heating resistor and temperature sensing.

图4 为热敏电阻两侧开槽的细节图。Figure 4 is a detailed view of the slots on both sides of the thermistor.

具体实施方式Detailed ways

以下结合附图及具体实施方式进一步说明本发明。The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

一种高精度的分流器组件,包括分流器101、至少一个功率电阻102、热敏电阻103、第一印刷电路板104、第二印刷电路板105、固定用螺丝107及相应的螺杆106、导热介质108;所述的分流器101贴片安装在第一印刷电路板104上,功率电阻102和热敏电阻103贴片安装在第二印刷电路板105上,两块印刷电路板的器件面相对,通过螺丝和螺杆固定。A high-precision shunt assembly, including a shunt 101, at least one power resistor 102, a thermistor 103, a first printed circuit board 104, a second printed circuit board 105, fixing screws 107 and corresponding screw rods 106, heat conduction Medium 108; the shunt 101 is patch-mounted on the first printed circuit board 104, the power resistor 102 and thermistor 103 are patch-mounted on the second printed circuit board 105, and the device faces of the two printed circuit boards are opposite , fixed by screws and threaded rods.

在本实施案例中,加热电阻102为2512封装的贴片功率电阻,热敏电阻选择0402的NTC部件,两种部件的高度都在0.5mm左右,因此加热电阻和热敏电阻都可以很平整的贴近分流器,由于需要功能绝缘,因此可以在中间需填充导热介质,比如硅脂或者导热垫片。In this implementation case, the heating resistor 102 is a SMD power resistor packaged in 2512, and the thermistor is an NTC component of 0402. The height of both components is about 0.5mm, so the heating resistor and thermistor can be very flat Close to the shunt, due to the need for functional insulation, a heat-conducting medium, such as silicone grease or a heat-conducting gasket, can be filled in the middle.

两块印刷电路板可以通过螺丝和螺丝柱连接,也可以通过排针及其相应的连接器连接;在本实施案例中,优选螺丝和螺丝柱连接,螺丝柱铆接在第一印刷电路板上。The two printed circuit boards can be connected by screws and screw posts, or by pin headers and their corresponding connectors; in this implementation case, the screw and screw posts are preferably connected, and the screw posts are riveted on the first printed circuit board.

分流器需要传输大的电流,所以分流器所在的印刷电路板一般是主板,主板上可以包含主控制器件,比如MCU、运放、模数转换芯片等等;热电阻和热敏电阻所在的印刷电路板可以看作一块子板;因为连接部件是金属,固定套件同时可以用来在两块印刷电路板直接传输的电信号,子板上的温度检测信号通过固定套件传递到主板的MCU,而主板的MCU发出的功率控制相关的信号也可以通过固定套件去控制加热电阻的发热。The shunt needs to transmit a large current, so the printed circuit board where the shunt is located is generally the main board, which can contain main control devices, such as MCU, op amp, analog-to-digital conversion chip, etc.; the printed circuit board where the thermal resistor and thermistor are located The circuit board can be regarded as a daughter board; because the connecting parts are metal, the fixing kit can also be used to directly transmit electrical signals between the two printed circuit boards, and the temperature detection signal on the daughter board is transmitted to the MCU of the main board through the fixing kit, while The power control-related signals sent by the MCU of the motherboard can also control the heating of the heating resistor through the fixed kit.

为了让热敏电阻准确检测分流器的温度,而不受临近的发热电阻影响,如图4所示,可以在热敏电阻两侧的电路板上开分别宽度超过1mm槽109;在两块印刷电路板安装完成之后,可以通过所开的槽109,将加热电阻和热敏电阻之间的导热介质清除,降低热敏电阻受加热电阻的影响,检测的是分流器的真实的温度。In order to allow the thermistor to accurately detect the temperature of the shunt without being affected by the adjacent heating resistors, as shown in Figure 4, grooves 109 with a width of more than 1 mm can be opened on the circuit boards on both sides of the thermistor; After the circuit board is installed, the heat conduction medium between the heating resistor and the thermistor can be removed through the opened slot 109 to reduce the influence of the thermistor on the heating resistor and detect the real temperature of the shunt.

尽管上面已经通过对本公开的具体实施方式的描述对本公开进行了披露,但是,应该理解,本领域的技术人员可在所附权利要求的精神和范围内设计对本公开的各种修改、改进或者等同物。这些修改、改进或者等同物也应当被认为包括在本公开的保护范围内。Although the present disclosure has been disclosed above through the description of specific embodiments of the present disclosure, it should be understood that those skilled in the art can design various modifications, improvements or equivalents to the present disclosure within the spirit and scope of the appended claims thing. These modifications, improvements or equivalents should also be considered to be included in the protection scope of the present disclosure.

Claims (5)

1. A high-precision shunt assembly is characterized by comprising a shunt, a first printed circuit board, a second printed circuit board, at least one power resistor, at least one temperature detection component, a heat conducting medium and a fixing sleeve; the shunt is arranged on the first printed circuit board, the power resistor and the temperature detection component are arranged on the second printed circuit board, the first printed circuit board and the second printed circuit board are assembled together by utilizing the fixing sleeve, the power resistor, the temperature detection component and the shunt are close to but not in contact, and a gap is filled with a heat conduction medium.
2. The high precision shunt assembly of claim 1, wherein the temperature sensing member is formed with a groove on the second pcb on both sides of the temperature sensing member, and the heat transfer medium on both sides of the temperature sensing member is removed through the groove formed on the second pcb after the assembly.
3. The shunt assembly of claim 1, wherein said temperature sensing element is selected from the group consisting of a PTC thermistor, a NTC thermistor, a resistance temperature sensor, an IC temperature sensor, and a thermocouple.
4. The high precision shunt assembly of claim 1, wherein said fastening assembly is a screw and stud assembly; or a pin header and its corresponding connector.
5. The high precision shunt assembly of claim 4, wherein said first printed circuit board and said second printed circuit board transmit electrical signals through said mounting assembly.
CN202122815708.0U 2021-11-17 2021-11-17 A high-precision shunt assembly Active CN217689875U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122815708.0U CN217689875U (en) 2021-11-17 2021-11-17 A high-precision shunt assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122815708.0U CN217689875U (en) 2021-11-17 2021-11-17 A high-precision shunt assembly

Publications (1)

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CN217689875U true CN217689875U (en) 2022-10-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116360523A (en) * 2023-03-26 2023-06-30 深圳市开步电子有限公司 Shunt temperature control method, shunt, electric equipment and energy storage equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116360523A (en) * 2023-03-26 2023-06-30 深圳市开步电子有限公司 Shunt temperature control method, shunt, electric equipment and energy storage equipment
CN116360523B (en) * 2023-03-26 2024-02-27 深圳市开步电子有限公司 Shunt temperature control method, shunt, electric equipment and energy storage equipment

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20250314

Address after: Building 201, Building 2, Antongda Industrial Park, Xingdong Community, Xin'an Street, Bao'an District, Shenzhen City, Guangdong Province 518000

Patentee after: Shenzhen Huada New Energy Technology Co.,Ltd.

Country or region after: China

Address before: 518101 Chuangwei Innovation Valley 2 # B1331, No. 8 Tangtou 1st Road, Tangtou Community, Shiyan Street, Bao'an District, Shenzhen City, Guangdong Province

Patentee before: Shenzhen Chaoda Investment Partnership (Limited Partnership)

Country or region before: China