CN217643862U - Connection structure of flexible spring circuit board and base, shooting assembly and electronic equipment - Google Patents

Abstract

The embodiment of the application discloses connection structure of flexible spring circuit board and base, including flexible spring circuit board and base, on the base was located to the flexible spring circuit board, the flexible spring circuit board included: the flexible circuit board, the hard circuit board and the elastic arm are arranged, and a supporting bump is arranged between the hard circuit board and the base; the embodiment of the application discloses a shooting assembly, which comprises a flexible spring circuit board and a connecting structure of a base; the embodiment of the application discloses an electronic device, which comprises a shooting component; like this, when carrying out the anti-shake and remove, through the effect that supports the lug, reduced the area of contact between base and the stereoplasm circuit board to reduced the friction between base and the stereoplasm circuit board, and then prolonged the life of stereoplasm circuit board and base, simultaneously, the friction that reduces can reduce the heat of transmission to PCB plate and image sensor because of the friction produces, make the life of whole subassembly of making a video recording longer, avoided the influence of heat to the formation of image effect.

Description

Connection structure of flexible spring circuit board and base, shooting assembly and electronic equipment

Technical Field

The application belongs to the technical field of imaging instruments, and particularly relates to a connection structure of a flexible spring circuit board and a base, a shooting assembly and electronic equipment.

Background

Hand-held type or portable shooting device all can have certain demand to the use of anti-shake to avoid the low problem of image quality of shooting device photograph because of shake problem leads to. The conventional anti-shake method can be used for anti-shake by driving the image sensor to move.

In the present shooting subassembly, image sensor is when the anti-shake removes, the flexible spring circuit board that is connected with image sensor through the PCB board can remove along with image sensor, because the flexible spring circuit board meets with the base, be used for bearing PCB board and image sensor on the event flexible spring circuit board, and also can meet with the base with image sensor's stereoplasm circuit board that is anti-shake motion together, when carrying out the anti-shake motion like this, can appear causing the great problem of frictional force because of the mutual removal between stereoplasm circuit board and the base, thereby the result of use of shooting device has been influenced.

Disclosure of Invention

This application aims at least can solve to a certain extent that frictional force is great between stereoplasm circuit board and the base to the technical problem at the result of use of shooting device has been influenced. For this reason, this application provides connection structure, anti-shake device and shooting device of flexible spring circuit board and base.

The connection structure of flexible spring circuit board and base that this application embodiment provided, including flexible spring circuit board and base, the flexible spring circuit board is located on the base, the flexible spring circuit board includes:

the flexible circuit board is fixed on the base and provided with a central hollow part;

the rigid circuit board is arranged in the central hollow-out part and is connected with the flexible circuit board through the elastic arm, a supporting convex block used for supporting the rigid circuit board is arranged between the rigid circuit board and the base, and a supporting plane used for being in contact with the rigid circuit board is arranged on the supporting convex block.

In the embodiment of the present application, when there is one support protrusion, a central axis of the support protrusion is coaxially disposed with a central axis of the hard circuit board.

In the embodiment of the application, when the number of the supporting convex blocks is two or more, the supporting convex blocks are uniformly distributed between the base and the hard circuit board.

In this application embodiment, the base includes the plane, set up flutedly on going up the plane, set up in the recess support convex block, support convex block's support plane with be located the last plane of recess notch department flushes the setting, the stereoplasm circuit board passes through support convex block with the recess sets up relatively.

In this application embodiment, be equipped with the stopper on going up the plane, the stopper distributes and sets up week side of groove notch, wherein, the stopper with it constitutes spacing installation position to go up the plane, the flexible circuit board is through installing in the spacing installation position, and set up on the base.

In this application embodiment, go up the plane and be the rectangle plane, and four corners on rectangle plane all are equipped with the stopper, flexible circuit is through setting up four in the region that the stopper encloses the constitution, and set up on the base.

The embodiment of the application provides a shooting assembly, which comprises the flexible spring circuit board and a base connecting structure.

In this application embodiment, shoot the subassembly and still include the shell, outer with the base surrounds to constitute and holds the cavity, it has contained in the cavity:

the flexible spring circuit board is fixed on the base;

the PCB is connected to the hard circuit board of the flexible spring circuit board;

the support is fixedly arranged on the PCB; the support and the PCB are encircled to form a chip accommodating cavity;

the image sensor chip is positioned in the chip accommodating cavity and connected to the PCB;

the frame-shaped FPC board is fixedly arranged on the support and is electrically connected with the PCB;

the magnetic coil assembly is used for controlling the translational movement of the image sensor chip in the X-axis direction and the Y-axis direction and the rotational movement around the Z axis, and comprises a magnetic part and a coil which is arranged opposite to the magnetic part, and the magnetic part is fixedly arranged on the shell; the coil is connected to the frame-shaped FPC board.

In the embodiment of the application, the support comprises a frame-shaped support plate part and a cover part arranged at the hollow part of the center of the frame-shaped support plate part;

the chip accommodating cavity is formed by surrounding the cover part and the PCB;

the frame-shaped support plate part is provided with a mounting groove, the frame-shaped FPC plate part is sleeved outside the cover part, and the frame-shaped FPC plate part (600) is fixedly arranged in the mounting groove.

The embodiment of the application provides a shooting device which comprises the shooting assembly in the embodiment of the application.

The connection structure of flexible spring circuit board and base that this application embodiment provided, including flexible spring circuit board and base, the flexible spring circuit board is located on the base, the flexible spring circuit board includes: the flexible circuit board is fixed on the base and provided with a central hollow part; the hard circuit board is arranged in the central hollow part and is connected with the flexible circuit board through the elastic arm, a supporting convex block for supporting the hard circuit board is arranged between the hard circuit board and the base, and a supporting plane for contacting with the hard circuit board is arranged on the supporting convex block; the embodiment of the application provides a shooting assembly, which comprises a flexible spring circuit board and a base connection structure, wherein the flexible spring circuit board is connected with the base connection structure; the embodiment of the application provides a shooting device, which comprises the shooting component in the embodiment of the application; like this, when carrying out the anti-shake and remove, through the effect that supports the lug, reduced the area of contact between base and the stereoplasm circuit board to reduced the friction between base and the stereoplasm circuit board, and then prolonged the life of stereoplasm circuit board and base, simultaneously, the friction that reduces can reduce the heat of transmission to PCB plate and image sensor because of the friction produces, make the life of whole subassembly of making a video recording longer, avoided the influence of heat to the formation of image effect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic structural diagram showing a connection structure of a flexible spring circuit board and a base in an embodiment of the present application;

FIG. 2 is a sectional view showing a connection structure of a flexible spring circuit board and a chassis in an embodiment of the present application;

FIG. 3 is a sectional view showing another connection structure of a flexible spring circuit board and a chassis in an embodiment of the present application;

FIG. 4 shows a cross-sectional view of a camera assembly in an embodiment of the present application;

fig. 5 shows a schematic structural view of the support in fig. 4.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The applicant finds that, in the current shooting assembly, the image sensor is generally disposed on the flexible spring circuit board through the PCB, the flexible spring circuit board is fixed on the base, when the anti-shake movement is performed, the hard circuit board on the flexible spring circuit board can perform the anti-shake movement together with the image sensor, but because the bottom surface of the hard circuit board is connected with the top surface of the base, when the movement is performed, friction can be generated between the bottom surface of the hard circuit board and the top surface of the base due to mutual contact, so that the service lives of the hard circuit board and the base are affected, and meanwhile, when the friction is performed, deformation can also be generated between the bottom surfaces of the hard circuit board due to relative dislocation, in addition, heat can be generated due to the friction, and the heat can be transmitted to the PCB and the image sensor through the hard circuit board, so that the PCB and the image sensor are heated, thereby affecting the shooting use of the shooting assembly.

Therefore, in order to solve the above problems, the present application provides a connection structure of a flexible spring circuit board and a base, a camera module, and an electronic apparatus.

The application is described below with reference to specific embodiments in conjunction with the following drawings:

as shown in fig. 1 to 3, an embodiment of the present application provides a connection structure of a flexible spring circuit board and a base, including a flexible spring circuit board 200 and a base 120, where the flexible spring circuit board 200 is disposed on the base 120, and the flexible spring circuit board 200 includes: the flexible circuit board 210 is fixed on the base 120, and the flexible circuit board 210 is provided with a central hollow-out part 211; the hard circuit board 220 is disposed in the central hollow portion 211 and connected to the flexible circuit board 210 through the elastic arm 230, a supporting protrusion 121 for supporting the hard circuit board 220 is disposed between the hard circuit board 220 and the base 120, and a supporting plane 1210 for contacting the hard circuit board 220 is disposed on the supporting protrusion 121.

Referring to fig. 1 to 3, the base 120 is a base of the camera module, and the base 120 may be used to support the flexible spring circuit board 200, the PCB, the image sensor chip, the support, and the coil of the camera module. The flexible spring circuit board 200 may be fixed on the base 120 and used to support the PCB board, the image sensor chip, the support and the coil for anti-shake movement. Specifically, the flexible spring circuit board 200 includes a flexible circuit board 210, a rigid circuit board 220 and an elastic arm 230, where the flexible circuit board 210 is used for fixing the flexible spring circuit board 200 to the base 120, and the flexible circuit board 210 is fixed on the base 120; the hard circuit board 220 is used for supporting the PCB, the image sensor chip, the support and the coil, and the hard circuit board 220 is disposed above the base 120 through the supporting protrusion 121, so as to reduce a contact area with the base 120; the elastic arm 230 is used to connect the flexible circuit board 210 and the hard circuit board 220, and enables the hard circuit board 220 to perform an anti-shake movement in the central hollow portion 211 of the flexible circuit board 210. When carrying out the anti-shake and remove, through the effect of supporting lug 121, reduced the area of contact between base 120 and the stereoplasm circuit board 220 to reduced the friction between base 120 and the stereoplasm circuit board 220, and then prolonged the life of stereoplasm circuit board 220 and base 120, and can be with heat transfer to base 120 that image sensor and PCB plate produced through supporting lug 121, the radiating effect is good like this, makes the life of whole subassembly of making a video recording longer.

Specifically, referring to fig. 1, in order to facilitate the movement of the rigid circuit board 220 in the flexible circuit board 210, the flexible circuit board 210 may be in a frame shape, and a hollow portion of the frame-shaped flexible circuit board 210 is a central hollow portion 211 of the flexible circuit board 210. The rigid circuit board 220 is disposed at the central hollow portion 211 of the flexible circuit board 210, the rigid circuit board 220 is connected to the flexible circuit board 210 through the elastic arm 230, and moves at the central hollow portion of the flexible circuit board 210 through the action of the elastic arm 230, where the elastic arm 230 may be a spring wire or other elastic connecting wires. Taking the spring wire as an example, the spring wire is used for being electrically connected with the hard circuit board 220 and playing a role of suspending and supporting the hard circuit board 220, so that the hard circuit board 220 is supported to translate in the X-axis and Y-axis directions or rotate around the Z-axis direction to realize multi-axis anti-shake, and playing a role of buffering. If not specifically stated, the structure composed of the flexible circuit board 210, the hard circuit board 220 and the spring wire is taken as the flexible spring circuit board 200 in this embodiment.

Further, as shown in fig. 2 and 3, in order to provide more movement space for the hard circuit board 220, a groove 1221 is formed in the base 120, and the hard circuit board 220 is disposed above a notch of the groove 1221 by the flexible circuit board 210 and the elastic arm 230, wherein the size of the notch of the groove 1221 is larger than that of the hard circuit board 220. The supporting protrusions 121 are disposed in the recesses 1221 and are supportingly coupled between the base 120 and the hard circuit board 220. Specifically, the supporting protrusion 121 may be fixedly connected with the base 120, and a supporting plane 1210 for contacting the hard circuit board 220 is disposed on a top of the supporting protrusion 121, that is, the supporting protrusion 121 is slidably connected with the hard circuit board 220 through the supporting plane 1210.

Specifically, in order to make the friction between the hard circuit board 220 and the supporting protrusion 121 smaller when the hard circuit board 220 performs the anti-shake movement, as shown in fig. 2, the supporting plane 1210 of the supporting protrusion 121 for contacting the hard circuit board 220 may be a smooth plane and arranged parallel to the lower bottom surface of the hard circuit board 220.

Further, the number and the arrangement positions of the supporting protrusions 121 may be set according to the relative sizes between the supporting protrusions 121 and the hard circuit board 220, wherein, when the size of the supporting protrusions 121 is close to that of the hard circuit board 220, as shown in fig. 2, the number of the supporting protrusions 121 may be set as one, and in order to ensure symmetry of the entire connection structure, the central axis of the supporting protrusions 121 is coaxially arranged with the central axis of the hard circuit board 220. When the size of the supporting protrusions 121 is much smaller than that of the hard circuit board 220, the number of the supporting protrusions 121 may be multiple, and in order to ensure symmetry of the whole connecting structure, the supporting protrusions 121 are uniformly distributed between the base 120 and the hard circuit board 220, that is, as shown in fig. 3, the number of the supporting protrusions 121 may be two, and the two supporting protrusions 121 are uniformly distributed between the base 120 and the hard circuit board 220.

Further, referring to fig. 1 to 3, the flexible spring circuit board 200 is fixed on the base 120 through the flexible circuit board 210, and in order to fix the flexible circuit board 210 on the base 120 quickly, the base 120 is provided with a stopper 123, and the flexible circuit board 210 is limited on the base 120 through the stopper 123. Specifically, the limiting blocks 123 may be disposed on the upper plane 122 of the base 120 and distributed around the notches of the grooves 1221, the limiting blocks 123 and the upper plane 122 constitute limiting installation positions, and the flexible circuit board 210 is disposed on the base 120 by being installed in the limiting installation positions. More specifically, the base 120 is rectangular plate-shaped, the upper plane 122 of the base 120 is rectangular plane, and the flexible circuit board 210 is a frame-shaped flexible circuit board 210 relatively matched with the base 120 in shape and size, so in order to position the flexible circuit board 210 quickly, the limiting blocks 123 are arranged at four corners of the upper plane 122, so that the flexible circuit board 210 is limited between the limiting blocks 123 formed at the four corners of the base 120, and the limiting blocks 123 formed at the four corners can position the flexible circuit board 210 quickly for fixing the flexible circuit board 210 later. More specifically, the edge of the flexible circuit board 210 may also be fixed by fixing the clamp on the edge of the base 120; the terminal pin of the flexible circuit board 210 extends out of the accommodating cavity to be electrically connected to the circuit board, and is electrically connected to the connecting seat of the electronic device through the connector of the circuit board.

The embodiment of the application provides a camera module, as shown in fig. 4 to 5, the camera module includes a housing 110, a base 120, a flexible spring circuit board 200, a PCB 300, a support 400, an image sensor chip 500, a frame-shaped FPC 600, a magnet coil assembly 700, a position sensor group 800, a lens 920, and a focusing motor 910.

Referring to fig. 4, lens 920 is mounted on housing 110 through focusing motor 91, specifically, focusing motor 910 is fixed on housing 110, lens 920 is connected to a carrier in focusing motor 910, and focusing motor 910 is capable of moving lens 920 in Z-axis; in order to make the installation of the focusing motor 910 faster, the top surface of the housing 110 is provided with a positioning groove and a wiring groove communicated with the positioning groove, when the focusing motor 910 is installed, the bottom of the focusing motor 910 is fixed in the positioning groove by glue, so as to achieve fast positioning and fixing, wherein the terminal pin on the side of the bottom of the focusing motor 910 is required to be arranged over against the wiring groove, so as to be electrically connected with the terminal pin on the side of the bottom of the focusing motor 910 through the wiring groove.

Continuing with fig. 4, the housing 110 and the base 120 surround to form an accommodating cavity, specifically, the base 120 is a plate-shaped structure, after the limiting blocks 123 at the four corners of the base 120 are inserted into the housing 110 for positioning, the housing 110 and the base 120 are fixed by gluing, and at this time, the inner space of the housing 110 and the base 120 surround to form an accommodating cavity; the accommodating cavity is provided with a Flexible spring Circuit Board 200, a PCB Board 300 (Printed Circuit Board), a carrier 400, an image sensor chip 500, a frame-shaped FPC Board 600 (Flexible Printed Circuit Board), a magneto coil assembly 700, and a position sensor group 800.

Referring to fig. 1, the PCB 300 is located above the rigid circuit board 220, and the PCB 300 is connected to the rigid circuit board 220; the support 400 is positioned above the PCB 300, and the support 400 is fixedly arranged on the PCB 300; the support 400 and the PCB 300 form a chip accommodating cavity 410; an image sensor chip 500 is arranged in the chip accommodating cavity 410, and the image sensor chip 500 is connected to the PCB 300; the frame-shaped FPC board 600 is positioned above the support 400, the frame-shaped FPC board 600 is fixedly arranged on the support 400, and the frame-shaped FPC board 600 is electrically connected with the PCB board 300; the magneto coil assembly 700 is located above the frame-shaped FPC board 600, the magneto coil assembly 700 includes a magnetic member 710 and a coil 720 arranged opposite to the magnetic member 710, the magnetic member 710 is fixedly arranged on the housing 110, specifically, the magnetic member 710 is installed and positioned in a slot on the inner wall of the housing 110 and is fixed by gluing; the coil 720 is connected to the frame-shaped FPC board 600, and the magnet coil assembly 700 is used to control the translational movement of the image sensor chip 500 in the X-axis direction and the Y-axis direction and the rotational movement around the Z-axis;

because the image sensor chip 500 is connected to the PCB 300, the frame-shaped FPC 600 and the coil 720 are disposed on the support 400, and the coil 720 and the PCB 300 are electrically connected through the frame-shaped FPC 600, a coil mounting area is not required to be disposed on the PCB 300, as long as the size of the processed PCB 300 is equal to or smaller than the size of the rigid circuit board 220, and the image sensor chip 500 and the support 400 can be supported, and because the size of the PCB 300 is equal to or smaller than the size of the rigid circuit board 220, there is no need to improve the structure of the PCB to solve the problem of contact interference between the PCB and the elastic arm 230, so that the processing of the PCB is faster, in this embodiment, the size of the rigid circuit board 220 of the flexible spring circuit board 200 is equal to the size of the PCB 300.

In some embodiments, regarding the structural connection of the bracket 400, the PCB panel 300 and the PCB panel 300, wherein, referring to fig. 4 and 5, the bracket 400 is an integrally formed structure, the bracket 400 includes a frame-shaped supporting plate portion 420 and a cover portion 430 disposed at a central hollow of the frame-shaped supporting plate portion 420, the cover portion 430 is a main body portion of the bracket 400; the chip accommodating cavity 410 is formed by surrounding the cover part 430 and the PCB board 300; a light through hole 431 communicated with the chip accommodating cavity 410 is formed in the cover part 430, and specifically, the axis of the light through hole 431 is coaxial with the axis of the lens 920; an optical filter 432 for covering the light transmission hole 431 is fixedly arranged above the cover 430, and specifically, in order to facilitate the installation and positioning of the optical filter 432, an optical filter installation groove which is communicated with the light transmission hole 431 and is used for installing the optical filter 432 is recessed in the upper surface of the cover 430.

Further, referring to fig. 5, in order to make the PCB 300 faster to be mounted and positioned, a PCB positioning groove is formed at the concave of the cover opening at the bottom of the cover part 430, the PCB 300 is engaged with the PCB positioning groove and fixed by glue, and in order to avoid the contact interference between the frame supporting plate part 420 and the elastic arm 230 of the flexible spring circuit board 200, a gap avoiding the elastic arm 230 may exist between the lower surface of the frame supporting plate part 420 and the lower surface of the cover part 430, and the depth of the PCB positioning groove may be smaller than the thickness of the PCB 300 when the lower surface of the frame supporting plate part 420 is flush with the lower surface of the cover part 430.

Further, referring to fig. 4, in order to make the mounting and positioning of the frame-shaped FPC board 600 faster, an installation groove is concavely formed in the upper surface of the frame-shaped supporting plate portion 420, the frame-shaped FPC board 600 is fitted over the cover portion 430, and the frame-shaped supporting plate portion 420 is installed and fixed in the installation groove.

In some embodiments, referring to fig. 4, the frame-shaped FPC board 600 is electrically connected to the PCB board 300, wherein the frame-shaped FPC board 600 may be electrically connected to the PCB board 300 through a flexible board, that is, one end of the flexible board is electrically connected to the PCB board 300, and the other end of the flexible board is folded and electrically connected to the frame-shaped FPC board 600 by bypassing the support 400; the frame-shaped FPC board 600 and the PCB board 300 can be directly connected through tin soldering, namely, a through hole is formed in the support 400, an orifice at one end of the through hole is close to a hard board connecting position on the frame-shaped FPC board 600 and used for being electrically connected with the PCB board 300, an orifice at the other end of the through hole is close to a soft board connecting position on the PCB board 300 and used for being electrically connected with the frame-shaped FPC board 600, and therefore tin can be injected into the through hole to connect the soft board connecting position with the hard board connecting position.

Further, considering the requirements of miniaturization of the camera module and minimization of the PCB 300, the frame-shaped FPC 600 is directly connected to the PCB 300 by soldering, i.e., a through hole needs to be formed in the support; specifically, referring to fig. 4, the upper surface of the PCB 300 is provided with a chip and electronic component welding area and an annular adhesive area located at the periphery of the chip and electronic component welding area, in order to minimize the size of the PCB 300, a soft board connection position may be arranged at the outer annular edge of the annular adhesive area, and in order to facilitate the electrical connection of the frame-shaped FPC board 600 with the PCB 300, a hard board connection position on the frame-shaped FPC board 600 is arranged corresponding to the soft board connection position on the PCB 300, that is, the hard board connection position is arranged at the inner annular edge of the frame-shaped FPC board 600;

specifically, referring to fig. 4, a through hole penetrating through the holder 400 is provided at a position of the holder 400 corresponding to a corner of the PCB panel 300, and the frame-shaped FPC panel 600 is electrically connected to the PCB panel 300 through the through hole, that is, the flexible board connection site is provided at an outer ring corner of the annular adhesive area, that is, at a corner of the PCB panel 300, and the rigid board connection site is provided at an inner ring corner of the frame-shaped FPC panel 600.

Further, the PCB 300 is fixed in the PCB positioning groove, and the through hole is disposed at the corner of the PCB positioning groove;

further, the through holes are provided with four through holes which are respectively positioned at four corners of the positioning groove of the PCB 300.

In some embodiments, with respect to the specific distribution of the magnetic members 710 and the coils 720, wherein referring to fig. 4, the magnetic members 710 include a first magnetic member, a second magnetic member, a third magnetic member, and a fourth magnetic member, the first magnetic member and the second magnetic member are symmetrically distributed on both sides of the case portion 430 of the cradle 400 along the X-axis direction, and the third magnetic member and the fourth magnetic member are symmetrically distributed on both sides of the case portion 430 of the cradle 400 along the Y-axis direction;

the coil 720 includes a first coil, a second coil, a third coil, a fourth coil, a fifth coil, a sixth coil, a seventh coil and an eighth coil, the first coil and the second coil are arranged below the first magnetic member in parallel along the length direction of the first magnetic member, the third coil and the fourth coil are arranged below the second magnetic member in parallel along the length direction of the second magnetic member, the fifth coil and the sixth coil are arranged below the third magnetic member in parallel along the length direction of the third magnetic member, the seventh coil and the eighth coil are arranged below the fourth magnetic member in parallel along the fourth magnetic member, the first coil and the third coil are symmetrically arranged, the second coil and the fourth coil are symmetrically arranged, the fifth coil and the seventh coil are symmetrically arranged, the sixth coil and the eighth coil are symmetrically arranged, and during anti-shake, the power-on condition of the coil 720 can be controlled as long as the image can be controlled to perform translational movement in the X-axis direction and the Y-axis direction and rotational movement around the Z-axis of the image sensor chip 500 with the magnetic member 710.

Further, the magnetic member 710 may be a single-pole magnet or a multi-pole magnetizing magnet, and specifically, in this embodiment, when the magnetic member 710 is a multi-stage magnet, in order to improve the use effect of the magnetic member 710 and the coil 720, each magnetic member 710 may be composed of two first and second magnets arranged side by side, where the magnetic poles of the first and second magnets are opposite, so that when in use, the coil 720 can be better controlled to generate ampere forces in different directions through the positive and negative poles of the first and second magnets.

Further, the coil 720 is a PCB coil, and the PCB coil is provided with a first coil, a second coil, a third coil, a fourth coil, a fifth coil, a sixth coil, a seventh coil and an eighth coil, so that the PCB coil is more quickly connected with the frame-shaped FPC board 600 by soldering, specifically, the coil 720 is a PCB coil manufactured by using an MEMS Micro-processing technology (Micro-Electro-Mechanical System) because the PCB itself is a multilayer structure composed of copper foils and insulating layers, each layer of copper foil can be etched to form a plurality of coils, the coils of the upper and lower layers are conducted through via holes, and finally, the PCB coil integrated with the PCB is formed.

Further, in order to make the PCB coil more accurate swift with the welding of frame shape FPC plate 600, be equipped with the first locating piece that is used for spacing PCB coil installation on the frame shape supporting plate portion 420, the second locating piece, first locating piece sets up the notch both sides at the mounting groove along X axial direction symmetry, the second locating piece sets up the notch both sides at the mounting groove along Y axial direction symmetry, as long as with the PCB coil spacing just can accomplish the installation location of PCB coil in the region of enclosing the structure by two first locating pieces and two second locating pieces like this, that is to say can directly carry out the soldering of PCB coil and frame shape FPC plate 600 and be connected.

Furthermore, all set up the direction inclined plane on first locating piece and the second locating piece, the PCB coil can be fixed a position in the notch department of mounting groove fast through the direction inclined plane when the installation, namely makes the PCB coil enter into the region of being enclosed by two first locating pieces and two second locating pieces more smoothly under the guiding action on direction inclined plane.

In some embodiments, referring to fig. 4, in order to feed back the position change of the image sensor chip 500 caused by the camera module shake in real time, a position sensor group 800 is disposed on the support 400, specifically, the position sensor group 800 may be electrically connected to the image sensor chip 500, and the position sensor group 800 may include an integrated type position sensor of a hall sensor (hall), a magnetic sensor (TMR), a hall sensor (hall), and a driver chip (drivernic); the position sensor group 800 is located under the magnetic member 710, and the position sensor group 800 is electrically connected to the frame-shaped FPC board 600.

Further, in order to more accurately detect the position change of the image sensor chip 500 during the anti-shake movement, a position sensor group 800 may be disposed directly below or obliquely below the magnetic member 710, wherein when the position sensor group 800 is used, the position change of the image sensor chip 500 caused by the shake of the camera module may be determined by detecting the change of the integrated magnetic angle of the magnetic member 710.

Further, in order to better detect the position change of the image sensor chip 500 along the X-axis direction and the position change along the Y-axis direction, the position sensor set 800 includes a first position sensor assembly and a second position sensor assembly, the first position sensor assembly is disposed under the first magnetic member or the second magnetic member disposed along the X-axis direction, so as to obtain the position change signal of the image sensor chip 500 along the X-axis direction, the second position sensor assembly is disposed under the third magnetic member or the fourth magnetic member disposed along the Y-axis direction, so as to obtain the position change signal of the image sensor chip 500 along the Y-axis direction, so that the position change condition of the image sensor chip 500 can be known in real time by disposing the first position sensor assembly and the second position sensor assembly, and the anti-shake movement is facilitated. More specifically, the first position sensor assembly and the second position sensor assembly may be directly attached to the frame-shaped FPC board 600.

The embodiment of the application provides electronic equipment, wherein the camera module in the embodiment is arranged in the electronic equipment, and in some embodiments, the electronic equipment can be a mobile phone or a notebook computer. In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise" indicate orientations or positional relationships that are based on the orientations or positional relationships illustrated in the figures, but are used for convenience in describing the present application and to simplify the description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus, are not to be considered limiting of the present application.

It should be noted that all the directional indications in the embodiments of the present application are only used for explaining the relative position relationship, the motion condition, and the like between the components in a certain posture, and if the certain posture is changed, the directional indication is changed correspondingly. In this application, unless expressly stated or limited otherwise, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Furthermore, descriptions in this application as to "first," "second," etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. The connection structure of the flexible spring circuit board and the base is characterized in that,

including flexible spring circuit board (200) and base (120), flexible spring circuit board (200) are located on base (120), flexible spring circuit board (200) include:

the flexible circuit board (210) is fixed on the base (120), and the flexible circuit board (210) is provided with a central hollow-out part (211);

the rigid circuit board (220) is arranged in the central hollow-out portion (211) and is connected with the flexible circuit board (210) through an elastic arm (230), a supporting protruding block (121) used for supporting the rigid circuit board (220) is arranged between the rigid circuit board (220) and the base (120), and a supporting plane (1210) used for being in contact with the rigid circuit board (220) is arranged on the supporting protruding block (121).

2. The connection structure of a flexible spring circuit board and a base according to claim 1,

when there is one support projection (121), the central axis of the support projection (121) is arranged coaxially with the central axis of the hard circuit board (220).

3. The connection structure of a flexible spring circuit board and a base according to claim 1,

when the number of the supporting convex blocks (121) is two or more, the supporting convex blocks (121) are uniformly distributed between the base (120) and the hard circuit board (220).

4. The connection structure of a flexible spring circuit board and a base according to claim 2 or 3,

the base (120) includes plane (122), go up and seted up recess (1221) on plane (122), set up in recess (1221) support lug (121), support lug (121) support plane (1210) with be located the last plane (122) of recess (1221) notch department flush the setting, stereoplasm circuit board (220) pass through support lug (121) with recess (1221) sets up relatively.

5. The connecting structure of the flexible spring circuit board and the base as claimed in claim 4, wherein the upper plane (122) is provided with a limiting block (123), the limiting block (123) is distributed on the periphery of the notch of the groove (1221), wherein the limiting block (123) and the upper plane (122) form a limiting installation position, and the flexible circuit board (210) is arranged on the base (120) by being installed in the limiting installation position.

6. The connecting structure of the flexible spring circuit board and the base as claimed in claim 5, wherein the upper plane (122) is a rectangular plane, the limiting blocks (123) are disposed at four corners of the rectangular plane, and the flexible circuit board (210) is disposed on the base (120) by being disposed in an area surrounded by four limiting blocks (123).

7. A camera module comprising the flexible spring circuit board according to any one of claims 1 to 6 and a base connection structure.

8. The camera assembly according to claim 7, further comprising a housing (110), wherein the housing (110) and the base (120) enclose a receiving cavity (100), and the receiving cavity (100) receives therein:

the flexible spring circuit board (200) is fixed on the base (120);

a PCB (300) connected to the rigid circuit board (220) of the flexible spring circuit board (200);

the support (400) is fixedly arranged on the PCB (300); the support (400) and the PCB (300) are encircled to form a chip accommodating cavity (410);

the image sensor chip (500) is positioned in the chip accommodating cavity (410) and is connected to the PCB (300);

the frame-shaped FPC board (600) is fixedly arranged on the support (400) and is electrically connected with the PCB board (300);

the magnet coil assembly (700) is used for controlling the translation movement of the image sensor chip (500) in the X-axis direction and the Y-axis direction and the rotation movement around the Z axis, and comprises a magnetic part (710) and a coil (720) arranged opposite to the magnetic part (710), wherein the magnetic part (710) is fixedly arranged on the shell (110); the coil (720) is attached to the frame-shaped FPC board (600).

9. The camera assembly of claim 8, wherein the mount (400) comprises a frame-shaped support plate portion (420) and a cover portion (430) disposed at a central hollow of the frame-shaped support plate portion (420);

the chip accommodating cavity (410) is formed by surrounding the cover part (430) and the PCB (300);

be provided with mounting groove (421) on frame shape supporting plate portion (420), frame shape FPC plate (600) cover is located outside cover portion (430), just frame shape FPC plate (600) set firmly in mounting groove (421).

10. An electronic device characterized by comprising the imaging module according to any one of claims 7 to 9.

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