CN217562852U

CN217562852U - Electronic equipment, card connector, card seat and card seat assembly

Info

Publication number: CN217562852U
Application number: CN202220747052.5U
Authority: CN
Inventors: 张诗豪; 胡睢宁; 苏天杰
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-12-15
Filing date: 2022-03-31
Publication date: 2022-10-11
Anticipated expiration: 2032-03-31
Also published as: CN116264359A; WO2023109144A1

Abstract

The application discloses electronic equipment, card connector, cassette and cassette subassembly. Ten elastic sheets of the card seat are arranged along a first direction from a first row of elastic sheets to a fifth row of elastic sheets, and the center distance between the second row of elastic sheets and the third row of elastic sheets and the center distance between the third row of elastic sheets and the fourth row of elastic sheets are larger than the center distance between the first row of elastic sheets and the second row of elastic sheets and the center distance between the fourth row of elastic sheets and the fifth row of elastic sheets; when the electronic equipment is inserted into the Nano SIM card, the second row of elastic sheets to the fourth row of elastic sheets are correspondingly electrically connected with six golden fingers of the Nano SIM card one by one, and the first row of elastic sheets and the fifth row of elastic sheets are abutted against the Nano SIM card; when the electronic device is inserted into the second NM card, the ten spring pieces are electrically connected with the ten golden fingers of the second NM card in a one-to-one correspondence manner. The card seat assembly of the electronic equipment can be compatible with a Nano SIM card and a second NM card, does not need to be additionally provided with a card seat assembly for separately adapting a storage card, and is favorable for lightening and thinning the electronic equipment.

Description

Electronic equipment, card connector, card seat and card seat assembly

Technical Field

The present application relates to the field of communications technologies, and in particular, to an electronic device, a card connector, a card holder, and a card holder assembly.

Background

With the development of electronic equipment products, a plurality of information cards need to be arranged in the electronic equipment so as to meet the functional requirements of the electronic equipment. Taking a mobile phone as an example, a Subscriber Identity Module (SIM) card, a memory card, and the like are usually installed in the mobile phone. All the card seat subassemblies that all need correspond of all kinds of information cards with it phase-match, consequently, need set up a plurality of card seat subassemblies usually in the electronic equipment, lead to the card seat subassembly account for the board area demand at the grow, occupy the inside space of electronic equipment, seriously restrict the development of electronic equipment frivolousization.

SUMMERY OF THE UTILITY MODEL

The application provides an electronic equipment, card connector, cassette and cassette subassembly, and electronic equipment's cassette subassembly can compatible Nano SIM card and second NM card, need not additionally to set up the cassette subassembly of independent adaptation storage card, is favorable to electronic equipment's frivolousization.

In a first aspect, the present application provides an electronic device, which includes a card socket and a card holder, wherein the card holder is detachably inserted into the card socket. The card seat assembly of the electronic equipment comprises the card seat and a card support. The card seat comprises ten elastic sheets arranged in an array, wherein the ten elastic sheets are arranged in a first row to a fifth row along a first direction; the center distance between the second row of elastic sheets and the third row of elastic sheets is greater than the center distance between the first row of elastic sheets and the second row of elastic sheets and greater than the center distance between the fourth row of elastic sheets and the fifth row of elastic sheets; the distance between the centers of the third row of elastic sheets and the fourth row of elastic sheets is greater than the distance between the centers of the first row of elastic sheets and the second row of elastic sheets and greater than the distance between the centers of the fourth row of elastic sheets and the fifth row of elastic sheets.

When the Nano SIM card is installed on the card support, the second row of elastic sheets to the fourth row of elastic sheets are correspondingly electrically connected with six golden fingers of the Nano SIM card one by one, and the first row of elastic sheets and the fifth row of elastic sheets are abutted against the Nano SIM card; when the second NM card is installed on the card support, the ten elastic sheets are correspondingly electrically connected with the ten golden fingers of the second NM card one by one, and the size of the card body of the second NM card is the same as that of the card body of the Nano SIM card.

In this application, through the mode of arranging and the centre-to-centre spacing that sets up a plurality of shell fragments for a plurality of shell fragments can form multiple combinations, and shell fragment quantity and position in the multiple combination can with the golden finger quantity and the position looks adaptation of polytype information card (for example Nano SIM card and second NM card), make card connector can realize the communication with the information card of different grade type, realize many cards compatibility, and expansibility is better. Therefore, when the card connector is applied to the card holder assembly of the electronic equipment, the electronic equipment can adapt to various information cards through the same card holder assembly, so that the number of the card holder assemblies is reduced, the occupation of the internal space of the electronic equipment is reduced, and the light and thin electronic equipment is facilitated.

In some possible implementations, the center-to-center distance between the first row of spring plates and the second row of spring plates may be in a range of 1.0mm to 3.0mm, for example, in a range of 1.0mm to 1.7 mm; the center-to-center distance between the second row of spring plates and the third row of spring plates may be in the range of 1.0mm to 3.0mm, for example, in the range of 1.5mm to 2.8 mm; the center distance between the third row of elastic sheets and the fourth row of elastic sheets is in the range of 1.5mm to 2.8 mm; the center distance between the fourth row of elastic sheets and the fifth row of elastic sheets is in the range of 1.0mm to 1.7 mm.

Because the number of the golden fingers of the Nano SIM card and the second NM card is different, the shapes of the golden fingers are different, the arrangement positions of the golden fingers and the spacing distance of the golden fingers are also different, through the unique design of the spacing between the first elastic sheet and the tenth elastic sheet, the card connector can be realized on the basis of being compatible with the Nano SIM card and the second NM card, the risk of short circuit between the golden fingers of the Nano SIM card and the elastic sheets of the card connector is effectively reduced when the Nano SIM card is arranged in the card connector, and the risk of short circuit between the golden fingers of the second NM card and the elastic sheets of the card connector is effectively reduced when the second NM card is arranged in the card connector, so that the electric connection relationship between the card connector and the Nano SIM card and the second NM card is reliable, and the Nano SIM card and the second NM card can share the same card connector in a time sharing mode.

In some possible implementations, the ten resilient tabs are arranged in a first row of resilient tabs and a second row of resilient tabs along a second direction, the second direction being perpendicular to the first direction. The first row of elastic sheets comprises a first elastic sheet, a third elastic sheet, a fifth elastic sheet, a seventh elastic sheet and a ninth elastic sheet which are arranged along a first direction, and the second row of elastic sheets comprises a second elastic sheet, a fourth elastic sheet, a sixth elastic sheet, an eighth elastic sheet and a tenth elastic sheet which are arranged along the first direction.

When the Nano SIM card is installed on the card support, the first elastic sheet and the third elastic sheet are electrically connected with the same golden finger of the Nano SIM card, and the second elastic sheet and the fourth elastic sheet are electrically connected with the same golden finger of the Nano SIM card; or the first row of elastic sheets support against the card body of the Nano SIM card; and/or when the Nano SIM card is installed on the card support, the ninth elastic sheet and the seventh elastic sheet are electrically connected with the same golden finger of the Nano SIM card, and the tenth elastic sheet and the eighth elastic sheet are electrically connected with the same golden finger of the Nano SIM card; or the fifth row of elastic sheets support against the card body of the Nano SIM card.

In some possible implementations, the electronic device further includes a processor, the processor includes an interface controller, a memory card controller, and a SIM card controller, and the interface controller is electrically connected to the memory card controller and the SIM card controller, and is electrically connected to the ten elastic pieces. When the Nano SIM card is installed on the card support, the interface controller controls the SIM card controller to communicate with the Nano SIM card; when the card holder is provided with a second NM card, the interface controller controls the memory card controller to communicate with the second NM card.

In this implementation, the electronic device can automatically identify the type of the information card through the processor, and control the controller corresponding to the information card to be connected with the card connector, so that the information card can be automatically matched with the electronic device, thereby performing communication and improving the use experience of a user.

For example, the processor may identify the type of information card connected to the card connector in a variety of ways. For example, the processor may sequentially turn on a plurality of controllers and card connectors, and identify the type of information card through the matching of the controllers and the information card. Alternatively, the processor may be provided with a detection circuit for detecting the type of the information card, and the processor may be capable of identifying the type of the information card based on a detection result of the detection circuit. The implementation mode of the application does not strictly limit the specific mode of identifying the type of the information card by the processor.

In some possible implementation manners, when the first NM card is installed on the card holder, the second row of elastic pieces to the fifth row of elastic pieces are electrically connected with the eight gold fingers of the first NM card in a one-to-one correspondence manner, the first row of elastic pieces support against the first NM card, and the size of the card body of the first NM card is the same as that of the Nano SIM card. In this implementation, the electronic device is compatible with the Nano SIM card, the first NM card, and the second NM card.

In some possible implementation manners, the ten elastic sheets are arranged along a second direction to form a first row of elastic sheets and a second row of elastic sheets, and the second direction is perpendicular to the first direction; the first row of elastic sheets comprises a first elastic sheet, a third elastic sheet, a fifth elastic sheet, a seventh elastic sheet and a ninth elastic sheet which are arranged along a first direction, and the second row of elastic sheets comprises a second elastic sheet, a fourth elastic sheet, a sixth elastic sheet, an eighth elastic sheet and a tenth elastic sheet which are arranged along the first direction. When the card holder is provided with the first NM card, the first elastic sheet and the third elastic sheet are electrically connected with the same golden finger of the first NM card, and the second elastic sheet and the fourth elastic sheet are electrically connected with the same golden finger of the first NM card; or the first row of elastic sheets abuts against the card body of the Nano SIM card.

In this implementation, the third to eighth elastic pieces of the card connector can be abutted and electrically connected to the first to sixth gold fingers of the Nano SIM card in a one-to-one correspondence, the third to tenth elastic pieces of the card connector can be abutted and electrically connected to the first to eighth gold fingers of the first NM card in a one-to-one correspondence, and the first to tenth elastic pieces of the card connector are abutted and electrically connected to the first to tenth gold fingers of the second NM card in a one-to-one correspondence, so that the card connector can be compatible with the Nano SIM card, the first NM card, and the second NM card.

The center distance between the second row of elastic sheets and the third row of elastic sheets and the center distance between the third row of elastic sheets and the fourth row of elastic sheets of the card connector are set in the range of 1.5mm to 2.8mm, the center distance between the first row of elastic sheets and the second row of elastic sheets is set in the range of 1.0mm to 1.7mm, the center distance between the fourth row of elastic sheets and the fifth row of elastic sheets is set in the range of 1.0mm to 1.7mm, so that the third elastic sheets to the eighth elastic sheets can be respectively communicated with six golden fingers of a Nano SIM card, the third elastic sheets to the tenth elastic sheets can be respectively communicated with eight golden fingers of a first NM card, and the first elastic sheets to the tenth elastic sheets can be respectively communicated with ten golden fingers of a second NM card.

The number of golden fingers of the Nano SIM card, the first NM card and the second NM card is different, the shapes of the golden fingers are different, the arrangement positions of the golden fingers and the spacing distance of the golden fingers are also different, through the unique design of the spacing between the first elastic sheet and the tenth elastic sheet, the card connector can effectively reduce the risk of short circuit between the golden fingers of the Nano SIM card and the elastic sheet of the card connector on the basis of being compatible with the Nano SIM card, the first NM card and the second NM card, when the Nano SIM card is arranged in the card connector, the risk of short circuit between the golden fingers of the Nano SIM card and the elastic sheet of the card connector is effectively reduced, when the first NM card is arranged in the card connector, the risk of short circuit between the golden fingers of the first NM card and the elastic sheet of the card connector is reliably ensured, and when the second NM card is arranged in the card connector, the electric connection relationship between the card connector and the Nano SIM card, the first NM card and the second NM card is reliable, and the Nano SIM card, the first NM card and the second NM card can share the same card in a time sharing mode.

In some possible implementations, the electronic device further includes a processor, the processor includes an interface controller, a SIM card controller, a first memory card controller, and a second memory card controller, and the interface controller is electrically connected to the SIM card controller, the first memory card controller, and the second memory card controller, and is electrically connected to the ten spring pieces. When the Nano SIM card is installed on the card support, the interface controller controls the SIM card controller to communicate with the Nano SIM card; when the card holder is provided with a first NM card, the interface controller controls the first memory card controller to communicate with the first NM card; when the card holder is provided with a second NM card, the interface controller controls the second memory card controller to communicate with the second NM card. In this implementation, the electronic device is compatible with the Nano SIM card, the first NM card, and the second NM card.

In some possible implementation manners, each elastic sheet includes a fixed end, a butting end and a movable end, the fixed end, the butting end and the movable end are sequentially arranged along the extending direction of the elastic sheet, and the extending direction of the elastic sheet is perpendicular to the first direction. The clamping seat further comprises an insulating body, the fixed end is fixed on the insulating body, the abutting end protrudes out of the surface of one side of the insulating body, and the movable end is movably installed on the insulating body.

Wherein the electrical conductor may be stamped and formed from a unitary sheet metal piece. The electric conductor comprises ten elastic sheets and ten fixing pieces, the ten elastic sheets can comprise the first elastic sheet to the tenth elastic sheet, the ten fixing pieces are connected with the ten elastic sheets in a one-to-one correspondence mode, and the fixing pieces and the elastic sheets are made of electric conduction materials. The electric conductor comprises ten conductive blocks, one corresponding fixing piece and one corresponding elastic piece are located on the same conductive block, and the ten conductive blocks are arranged at intervals. Wherein, ten mountings are inlayed and are located in insulator to fixed connection insulator, ten shell fragments are respectively through ten mountings fixed connection insulator.

In this implementation, when the card connector is connected with an information card, the abutting end abuts against the information card, the abutting end moves towards the direction close to the insulating body, the movable end displaces relative to the insulating body, the elastic sheet deforms smoothly, and the elastic force of the elastic sheet abutting against the information card is moderate, so that the information card can be connected with the card connector smoothly, the risk of damaging the information card due to the overlarge elastic force of the elastic sheet can be reduced, and the reliability is improved.

The elastic piece further comprises a first connecting section and a second connecting section, the first connecting section is connected with the fixed end and the abutting end, the second connecting section is connected with the abutting end and the movable end, and the abutting end is convex relative to the first connecting section and the second connecting section. That is, in the thickness direction of the card connector, the abutting end is located at the highest position, the first connecting section and the second connecting section are next to each other, and the fixed end and the movable end are located at the lowest position. When the elastic sheet is connected with the information card, the elastic sheet is abutted by the abutting end and is electrically connected with the information card, and the first connecting section, the fixed end, the second connecting section and the movable end are not in contact with the information card and form a gap with the information card.

The abutting end can comprise an abutting contact point arranged in a protruding mode, and the abutting contact point has a certain contact area. When the card connector is connected with the information card, the abutting contact is abutted against the golden finger of the information card, so that the card connector is electrically connected with the information card.

In some possible implementation manners, the insulation body is provided with a communication hole, the movable end is movably inserted into the communication hole, the tail end of the movable end comprises a stop block, and the stop block and the insulation body are matched to form an anti-falling structure.

In this implementation, the anti-disengaging structure can effectively prevent the movable end of the elastic sheet from being separated from the insulating body, so that the connection reliability of the elastic sheet and the insulating body is improved, and the reliability of the card connector is high.

The width of the communicating hole in the clamping direction is smaller than the width of the stop block in the clamping direction, the clamping direction can be any one direction, the size of the communicating hole in a certain direction is smaller than the size of the stop block in the same direction, and therefore the stop block and the insulating body are matched to form an anti-disengaging structure, and the stop block is prevented from penetrating through the communicating hole and causing the movable end of the elastic sheet to be disengaged from the insulating body.

In some implementations, each conductive block of the conductive body further includes a solder leg, and the solder leg is fixedly connected to the fixing member and is used for being soldered to the circuit board, so that the card connector is fixedly connected to the circuit board, and the elastic sheet is electrically connected to the circuit board. Wherein the number of the welding feet in each conductive block is at least one.

Illustratively, each conducting block's at least one leg includes first leg, and first leg is close to the stiff end setting of shell fragment. That is, the first leg is connected to the end of the fixing member near the fixing end of the elastic sheet. In the process of inserting the information card, friction force is generated between the information card and the abutting end of the elastic sheet, the elastic sheet has the trend of moving along the card inserting direction (namely the second direction) due to the friction force, and the fixed end of the elastic sheet is pulled. The conducting block is close to the first welding leg of the fixed end of the elastic sheet through the arrangement, the circuit board is welded through the first welding leg, so that the stress on the elastic sheet is transmitted to the circuit board through the first welding leg, the fixing piece of the conducting block is not easy to deform, the connecting relation between the fixing piece and the insulating body is stable, and the reliability of the card connector and the card seat assembly is improved. It will be appreciated that the first solder tail is also capable of transferring stress during the card removal process of the information card.

At least one welding leg of the partial conductive block can also comprise a second welding leg, and the second welding leg is arranged close to the movable end of the elastic sheet. That is, the second leg is connected to the end of the fixed member near the movable end of the spring plate. In the process of pulling the information card, a friction force is generated between the information card and the butt end of the elastic sheet, the elastic sheet has a trend of moving along the direction of pulling the card (namely the direction opposite to the second direction) due to the friction force, the movable end of the elastic sheet generates a pulling force on the insulating body through the anti-disengaging structure, the conductive block is provided with a second welding leg close to the movable end of the elastic sheet, the second welding leg is used for welding the circuit board, the stress on the insulating body is transmitted to the circuit board through the second welding leg, the fixing piece of the conductive block is not easy to deform, the connection relation between the fixing piece and the insulating body is stable, and the improvement of the reliability of the card connector and the card seat assembly is facilitated. It will be appreciated that the first solder tail is also capable of transferring stress during the card removal process of the information card. In the process of inserting the information card, the first welding leg and the second welding leg can transmit stress.

In a second aspect, the present application further provides a card connector, including ten resilient tabs arranged in an array, the ten resilient tabs being arranged in a first row to a fifth row along a first direction; the center distance between the second row of elastic sheets and the third row of elastic sheets is greater than the center distance between the first row of elastic sheets and the second row of elastic sheets, and is greater than the center distance between the fourth row of elastic sheets and the fifth row of elastic sheets; the distance between the centers of the third row of elastic sheets and the fourth row of elastic sheets is greater than the distance between the centers of the first row of elastic sheets and the second row of elastic sheets and greater than the distance between the centers of the fourth row of elastic sheets and the fifth row of elastic sheets. When the card connector is connected with the Nano SIM card, the second row of elastic sheets to the fourth row of elastic sheets are correspondingly electrically connected with six golden fingers of the Nano SIM card one by one, and the first row of elastic sheets and the fifth row of elastic sheets are abutted against the Nano SIM card. When the card connector is connected with the second NM card, the ten elastic sheets are correspondingly electrically connected with the ten golden fingers of the second NM card one by one, and the size of the card body of the second NM card is the same as that of the Nano SIM card.

In this application, through the mode of arranging and the centre-to-centre spacing that sets up a plurality of shell fragments for a plurality of shell fragments can form multiple combination, and shell fragment quantity and position in the multiple combination can be with the golden finger quantity and the position looks adaptation of multiple type information card (for example Nano SIM card and second NM card), make the card connector realize the communication with the information card of different grade type, realize that many cards are compatible, and expansibility is better. Therefore, when the card connector is applied to the card holder component of the electronic equipment, the electronic equipment can adapt to various types of information cards through the same card holder component, so that the number of the card holder components is reduced, the occupation of the internal space of the electronic equipment is reduced, and the light and thin electronic equipment is facilitated.

In some possible implementation manners, the ten elastic pieces are arranged along a second direction to form a first row of elastic pieces and a second row of elastic pieces, and the second direction is perpendicular to the first direction; the first row of elastic sheets comprises a first elastic sheet, a third elastic sheet, a fifth elastic sheet, a seventh elastic sheet and a ninth elastic sheet which are arranged along a first direction, and the second row of elastic sheets comprises a second elastic sheet, a fourth elastic sheet, a sixth elastic sheet, an eighth elastic sheet and a tenth elastic sheet which are arranged along the first direction.

When the card connector is connected with a Nano SIM card, the first elastic sheet and the third elastic sheet are electrically connected with the same golden finger of the Nano SIM card, and the second elastic sheet and the fourth elastic sheet are electrically connected with the same golden finger of the Nano SIM card; or the first row of elastic sheets support against the card body of the Nano SIM card; and/or when the card connector is connected with a Nano SIM card, the ninth elastic sheet and the seventh elastic sheet are electrically connected with the same golden finger of the Nano SIM card, and the tenth elastic sheet and the eighth elastic sheet are electrically connected with the same golden finger of the Nano SIM card; or the fifth row of elastic sheets support against the card body of the Nano SIM card.

In some possible implementation manners, the ten elastic pieces are arranged along a second direction to form a first row of elastic pieces and a second row of elastic pieces, and the second direction is perpendicular to the first direction; the first row of elastic sheets comprises a first elastic sheet, a third elastic sheet, a fifth elastic sheet, a seventh elastic sheet and a ninth elastic sheet which are arranged along a first direction, and the second row of elastic sheets comprises a second elastic sheet, a fourth elastic sheet, a sixth elastic sheet, an eighth elastic sheet and a tenth elastic sheet which are arranged along the first direction. When the card holder is provided with the first NM card, the first elastic sheet and the third elastic sheet are electrically connected with the same golden finger of the first NM card, and the second elastic sheet and the fourth elastic sheet are electrically connected with the same golden finger of the first NM card; or the first row of elastic sheets abuts against the card body of the Nano SIM card.

In some possible implementation manners, each elastic sheet comprises a fixed end, a butting end and a movable end, the fixed end, the butting end and the movable end are sequentially arranged along the extending direction of the elastic sheet, and the extending direction of the elastic sheet is perpendicular to the first direction; the clamping seat further comprises an insulating body, the fixed end is fixed on the insulating body, the abutting end protrudes out of the surface of one side of the insulating body, and the movable end is movably installed on the insulating body.

Wherein the electrical conductor may be stamped and formed from a unitary sheet metal piece. The electric conductor comprises ten elastic sheets and ten fixing pieces, the ten elastic sheets can comprise the first elastic sheet to the tenth elastic sheet, the ten fixing pieces are connected with the ten elastic sheets in a one-to-one correspondence mode, and the fixing pieces and the elastic sheets are made of electric conducting materials. The electric conductor comprises ten conductive blocks, one corresponding fixing piece and one corresponding elastic piece are located on the same conductive block, and the ten conductive blocks are arranged at intervals. Wherein, ten mountings are inlayed and are located in insulator to fixed connection insulator, ten shell fragments are respectively through ten mountings fixed connection insulator.

In this implementation, when the card connector is connected with an information card, the abutting end abuts against the information card, the abutting end moves towards the direction close to the insulating body, the movable end displaces relative to the insulating body, the elastic piece deforms smoothly, and the elastic force of the elastic piece abutting against the information card is moderate, so that the information card can be connected with the card connector smoothly, the risk of damaging the information card due to overlarge elastic force of the elastic piece can be reduced, and the reliability is improved.

In this implementation, can prevent effectively through anti-disengaging structure that the expansion end of shell fragment breaks away from insulator, improve the reliability of being connected of shell fragment and insulator for card connector's reliability is high.

Wherein, the width of intercommunicating pore in the screens side is less than the width of stop piece in the screens side, and the screens direction can be arbitrary one direction, and the size of intercommunicating pore in a certain side is less than the size of stop piece in same side, can be so that stop piece and insulator cooperation formation anti-disengaging structure to prevent that the stop piece from passing the intercommunicating pore, and lead to the expansion end of shell fragment to break away from insulator.

In some implementations, each conductive block of the conductive body further includes a solder leg fixedly connected to the fixing member, the solder leg is configured to be soldered to the circuit board, so that the card connector is fixedly connected to the circuit board, and the resilient piece is electrically connected to the circuit board. Wherein the number of the welding feet in each conductive block is at least one.

Illustratively, each conducting block's at least one leg includes first leg, and first leg is close to the stiff end setting of shell fragment. That is, the first leg is connected to the end of the fixing member near the fixing end of the elastic sheet. In the process of inserting the information card, friction force is generated between the information card and the abutting end of the elastic sheet, the elastic sheet has the trend of moving along the inserting direction (namely the second direction) due to the friction force, and the fixed end of the elastic sheet is pulled. The conductive block is close to the first welding leg of the fixed end of the elastic sheet through the arrangement, the first welding leg is used for welding the circuit board, so that the stress on the elastic sheet is transmitted to the circuit board through the first welding leg, the fixing part of the conductive block is not easy to deform, the connection relation between the fixing part and the insulating body is stable, and the reliability of the card connector and the reliability of the card seat assembly are improved. It will be appreciated that the first solder tail is also capable of transferring stress during the card removal process of the information card.

At least one welding leg of the partial conductive block can also comprise a second welding leg, and the second welding leg is arranged close to the movable end of the elastic sheet. That is, the second leg is connected to the end of the fixed member near the movable end of the spring plate. In the information card pulling process, a friction force is generated between the butt ends of the information card and the elastic sheet, the friction force enables the elastic sheet to have a trend of moving along the card pulling direction (namely the opposite direction of the second direction), the movable end of the elastic sheet generates a pulling force on the insulating body through the anti-disengaging structure, the conductive block is close to the second welding leg of the movable end of the elastic sheet through the arrangement, the second welding leg is used for welding the circuit board, the stress on the insulating body is transmitted to the circuit board through the second welding leg, the fixing part of the conductive block is not easy to deform, the connection relation between the fixing part and the insulating body is stable, and the improvement of the reliability of the card connector and the card seat assembly is facilitated. It will be appreciated that the first solder tail is also capable of transferring stress during the card removal process of the information card. In the process of inserting the information card, the first welding leg and the second welding leg can transmit stress.

In a third aspect, the present application further provides a card socket, including a socket body and any one of the above card connectors, where the card connector is fixedly connected to the socket body. Wherein the card socket may comprise one or more card connectors. The card holder can be compatible with various information cards with the same size.

In a fourth aspect, the present application further provides a card socket assembly, which includes a card holder and the above card socket, wherein the card holder is detachably inserted into the card socket. The card seat assembly can be compatible with various information cards with the same size.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of the cartridge assembly of FIG. 1 in some use states;

FIG. 3 is an exploded view of the cartridge of FIG. 2;

FIG. 4 is a schematic view of the card holder of FIG. 2 shown at another angle;

FIG. 5 is a schematic diagram of a card connector according to an embodiment of the present application;

FIG. 6 is a first schematic view of the card connector of FIG. 5 at another angle;

FIG. 7 is a schematic view showing the structure of the conductor of the card connector shown in FIG. 6;

fig. 8 is an internal structural view of a structure at a of the card connector shown in fig. 6;

FIG. 9 is a second structural view of the card connector shown in FIG. 5 at another angle;

Fig. 10 is a schematic block diagram of a Nano SIM card provided in an embodiment of the present application;

FIG. 11 is a schematic diagram of the structure of the Nano SIM card of FIG. 10 in some embodiments;

FIG. 12 is a schematic view of the structure of the Nano SIM card of FIG. 11 when connected to the card connector of FIG. 5;

FIG. 13 is a schematic block diagram of a first NM card provided by an embodiment of the present application;

FIG. 14 is a schematic diagram of a first NM card of FIG. 13 in some embodiments;

fig. 15 is a schematic view illustrating a structure of the first NM card of fig. 14 when connected to the card connector of fig. 5;

FIG. 16 is a schematic block diagram of a second NM card provided by an embodiment of the present application;

FIG. 17 is a schematic diagram of a second NM card of FIG. 16 in some embodiments;

fig. 18 is a schematic view illustrating a structure of the second NM card of fig. 17 when connected to the card connector of fig. 5;

FIG. 19 is a schematic block diagram of a portion of circuitry of the electronic device shown in FIG. 1 in some embodiments;

FIG. 20 is a dimensional diagram of the second NM card of FIG. 17 in some embodiments;

FIG. 21A is a size diagram of the second NM card of FIG. 16 in other embodiments;

fig. 21B is another size diagram of the second NM card shown in fig. 21A;

FIG. 22 is a dimensional diagram of the second NM card of FIG. 16 in other embodiments;

FIG. 23 is a dimensional diagram of the second NM card of FIG. 16 in other embodiments;

FIG. 24 is a schematic diagram of the second NM card of FIG. 17 in some embodiments;

FIG. 25 is a schematic diagram of a portion of circuitry of the electronic device shown in FIG. 1 in some embodiments;

FIG. 26 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 27 is a schematic diagram of the second NM card of FIG. 17 in another embodiment;

FIG. 28 is a schematic diagram of a portion of circuitry of the electronic device of FIG. 1 in further embodiments;

FIG. 29 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 30 is a schematic diagram of the second NM card of FIG. 17 in another embodiment;

FIG. 31 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 32 is a schematic diagram of a portion of circuitry of the electronic device of FIG. 1 in further embodiments;

FIG. 33 is a schematic diagram of the second NM card of FIG. 17 in another embodiment;

FIG. 34 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 35 is a schematic diagram of a portion of circuitry of the electronic device of FIG. 1 in further embodiments;

FIG. 36 is a schematic diagram of the second NM card of FIG. 17 in another embodiment;

FIG. 37 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 38 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 39 is a schematic diagram of the second NM card of FIG. 17 in another embodiment;

FIG. 40 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 41 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 42 is a schematic diagram of the second NM card of FIG. 17 in another embodiment;

FIG. 43 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device of FIG. 1;

FIG. 44 is a schematic diagram of a portion of circuitry of the electronic device of FIG. 1 in further embodiments;

FIG. 45 is a schematic diagram of a second NM card according to an embodiment of the present application in another embodiment;

FIG. 46 is a schematic diagram of a portion of circuitry in some embodiments of an electronic device provided by an embodiment of the application;

FIG. 47 is a schematic diagram of a portion of circuitry in some embodiments of an electronic device provided by embodiments of the present application;

FIG. 48 is a schematic view showing a connection structure of the second NM card of FIG. 45 with the card connector of FIG. 5;

FIG. 49 is a schematic diagram of a portion of circuitry in another embodiment of the electronic device shown in FIG. 1;

FIG. 50 is a schematic diagram of a portion of circuitry in other embodiments of the electronic device shown in FIG. 1.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings. In the description of the embodiments herein, "/" means "or" unless otherwise specified, for example, a/B may mean a or B; "and/or" in the text is only an association relationship describing an associated object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone; "at least part" in the text includes both "part" and "all"; in the text "plurality" means two or more than two, and "plurality" means two or more than two.

The terms "first", "second", and the like are used hereinafter for descriptive purposes only and are not to be construed as implying or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The directional terms used in the embodiments of the present application, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," "top," "bottom," and the like, refer only to the orientation of the figures, and thus, are used for better and clearer illustration and understanding of the embodiments of the present application, rather than to indicate or imply that the referenced device or element must be in a particular orientation, constructed and operated in a particular orientation, and therefore should not be considered as limiting the embodiments of the present application.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "disposed on … …" are to be broadly construed, e.g., "connected" may or may not be detachably connected; may be directly connected or indirectly connected through an intermediate.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure. The electronic device 100 may be an electronic product such as a mobile phone, a tablet, an intelligent wearable device, and the like, and the embodiment of the application illustrates that the electronic device 100 is a mobile phone.

In some embodiments, the electronic device 100 may include a card-holder assembly 10, a processor 20, a housing 30, a display 40, and a circuit board 50. Wherein the display screen 40 may be mounted to the housing 30, the display screen 40 being for displaying images, videos, etc. The circuit board 50 is mounted inside the housing 30, and the processor 20 may be fixed to the circuit board 50 and electrically connected to the circuit board 50. The card holder assembly 10 includes a card holder 1 and a card holder 2. The card socket 1 can be installed inside the housing 30, and the card socket 1 can also be fixedly connected with the circuit board 50 and electrically connected with the circuit board 50. The processor 20 may be electrically connected to the socket 1 through the circuit board 50. The card support 2 is detachably inserted into the card seat 1. The card holder 2 is used for mounting one or more information cards, and the card holder 2 can be inserted into the card socket 1 with the information card, so that the information card is inserted into the card socket assembly 10, and the information card is communicated with the electronic device 100.

For example, the information card may be a Nano SIM (subscriber identity module) card, a Nano memory card, or a Nano two-in-one card. The Nano SIM card is also called 4FF card, such as the SIM card of the ETSI TS 102 221V11.0.0 specification, and the size of the card body is 12.30mm in length, 8.80mm in width and 0.67mm in thickness. A user can insert a Nano SIM card into the card holder assembly 10, the Nano SIM card communicates with the processor 20, and the electronic device 100 interacts with a network through the Nano SIM card to realize functions such as communication and data communication. The Nano memory card may also be referred to as NM (Nano memory) card. The user may also insert an NM card into the card-holder assembly 10, which communicates with the processor 20 to implement the data storage function. For example, files such as music, video, etc. may be saved in the NM card. The Nano two-in-one card may include a SIM card circuit for supporting a call and data communication, and a memory card circuit for supporting a data storage function. The user can also insert a Nano two-in-one card into the card holder assembly 10, and the Nano two-in-one card is communicated with the processor 20 to realize functions of communication, data storage and the like.

In some embodiments, the electronic device 100 may further include one or more of an internal memory, a Universal Serial Bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, an earphone interface, a sensor module, a key, a motor, an indicator, a camera, and the like. In other embodiments, electronic device 100 may have more or fewer components than the above, may combine two or more components, or may have a different configuration of components. The various components described above may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and/or application specific integrated circuits.

In some embodiments, processor 20 may include one or more processing units, such as: the processor 20 may include one or more of an Application Processor (AP), a modem processor, a Graphic Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a memory, a video codec, a Digital Signal Processor (DSP), a baseband processor, a neural Network Processor (NPU), and the like, which is not strictly limited in the embodiments of the present application. Wherein the different processing units may be separate devices or may be integrated in one or more processors 20. Wherein the processor 20 may further comprise one or more interfaces, through which the processor 20 may communicate with other components of the electronic device 100.

Referring to fig. 2 to 4, fig. 2 is a schematic structural view of the card socket assembly 10 shown in fig. 1 in some use states, fig. 3 is an exploded structural view of the card socket 1 shown in fig. 2, and fig. 4 is a schematic structural view of the card holder 2 shown in fig. 2 at another angle.

In some embodiments, the card socket 1 may include a housing 12, a first card connector 13, a second card connector 14, an ejection assembly 15, and an insertion detection spring 16. The seat body 12 is substantially in the shape of a cover, the seat body 12 includes a top plate 121 and a plurality of side plates 122 connected to the top plate 121, and the top plate 121 and the plurality of side plates 122 together enclose an inner space 123 of the seat body 12. The first card connector 13 is located in the inner space 123 of the housing 12 and is fixedly connected to the housing 12, and the first card connector 13 is disposed opposite to the top plate 121. The structure of the second card connector 14 may be the same as or different from that of the first card connector 13. The second card connector 14 is located in the inner space 123 of the housing 12, the second card connector 14 is located on a side of the first card connector 13 opposite to the top plate 121, the second card connector 14 is disposed opposite to the first card connector 13, and a gap is formed between the second card connector 14 and the first card connector 13. The side plates 122 of the first card connector 13, the second card connector 14 and the base 12 together enclose the card slot 17 of the card socket 1. One end of the clamping groove 17 is open to form an opening, and the other end of the clamping groove 17 forms the bottom of the clamping groove 17.

When the card socket 1 is installed in the electronic device 100, the ends of the side plates 122 far away from the top plate 121 are fixed to the circuit board 50 of the electronic device 100. The plurality of solder tails of the first card connector 13 are fixedly attached and electrically connected to the circuit board 50 such that the first card connector 13 can be electrically connected to the processor 20 of the electronic device 100. The second card connector 14 can be fixedly connected to the circuit board 50 to be fixedly connected to the housing 12 through the circuit board 50. Alternatively, the second card connector 14 may be directly fixed to the connector housing 12. The plurality of solder tails of the second card connector 14 are fixedly attached and electrically connected to the circuit board 50 such that the second card connector 14 can be electrically connected to the processor 20 of the electronic device 100.

Wherein, card holds in palm 2 can have first mounting groove 21 and the second mounting groove 22 of back to back the setting, and the opening of first mounting groove 21 and the opening of second mounting groove 22 are located the both sides surface that the card held in the palm 2 respectively. The first mounting groove 21 and the second mounting groove 22 are used for mounting an information card. For example, in fig. 2 and 4, two information cards may be mounted in the first mounting groove 21 and the second mounting groove 22, respectively. The sizes of the grooves of the first mounting groove 21 and the second mounting groove 22 can be the same or close to each other, and the sizes of the card bodies of the two information cards mounted in the first mounting groove 21 and the second mounting groove 22 are the same. In other embodiments, the first mounting groove 21 and the second mounting groove 22 may have different slot sizes, and the two information cards mounted in the first mounting groove 21 and the second mounting groove 22 have different card bodies.

The slot sizes of the first mounting slot 21 and the second mounting slot 22 are matched with the size of the card body of the corresponding information card, for example, the slot sizes of the first mounting slot 21 and the second mounting slot 22 may be slightly larger than the size of the card body of the corresponding information card, but the size difference is not large, so that the information card can be smoothly mounted in the first mounting slot 21 and the second mounting slot 22, and the mounting position is stable.

The card holder 2 can be inserted into the card slot 17 through the opening of the card slot 17, alone or with an information card. The direction in which the card holder 2 and/or the information card is inserted into the card slot 17 (i.e., the card insertion direction) is the direction in which the opening of the card slot 17 faces the bottom of the card slot 17. The size of the card slot 17 is matched with the size of the card holder 2, for example, the size of the card slot 17 may be slightly larger than the size of the card holder 2 but the difference between the size of the card holder 2 and the size of the card holder 2 is not large, and a certain fit clearance is provided between the card holder 2 and the slot wall of the card slot 17, so that the card holder 2 can be smoothly inserted into the card slot 17 and can be stably installed in the card slot 17. When the card holder 2 carries an information card and is inserted into the card slot 17, the information card mounted on the card holder 2 is electrically connected to the first card connector 13 or the second card connector 14 to electrically connect the electronic device 100.

Wherein, the ejection assembly 15 can be mounted on the housing 12 and/or the first card connector 13. When the card support 2 is inserted into the card slot 17, a user can control the ejection assembly 15 to enable the ejection assembly 15 to eject part of the card support 2 out of the card slot 17, so that the user can take down the card support 2 conveniently. For example, the insertion detection spring 16 may be mounted to the first card connector 13 and electrically connected to the circuit board 50. The insertion detection spring 16 may be at least partially located at the bottom of the card slot 17. The insertion detection spring 16 can be used for detecting whether the card holder 2 is inserted into the card slot 17.

In other embodiments, the card holder 1 may be provided with a card connector, the card holder assembly 10 is used for mounting an information card, and the structure of the card holder 2 is adapted. In other embodiments, the card socket 1 may also be provided with three or more card connectors, so that the card socket assembly 10 can be used for mounting more than three information cards, and the structure of the card holder 2 is adapted. The number and position of the card connectors of the card holder 1, the specific structure of the card holder 2, and the like are not strictly limited in the embodiments of the present application.

In other embodiments, the card socket 1 may also be provided with an ejection assembly 15 and/or an insertion detection spring 16 which are different from the illustrated structure. In other embodiments, the card-seat assembly 10 may include more or less components than the above embodiments, and the embodiments of the present application are not limited thereto.

Referring to fig. 5 and fig. 6 in combination, fig. 5 is a schematic structural diagram of a card connector 11 according to an embodiment of the present application, and fig. 6 is a schematic structural diagram of the card connector 11 shown in fig. 5 at another angle. For example, the card connector 11 shown in fig. 5 may be applied to the card socket 1 shown in fig. 3, and used as the first card connector 13 and/or the second card connector 14.

The embodiment of the present application provides a card connector 11, where the card connector 11 can be applied to a card socket 1 of an electronic device 100, and the card connector 11 is used for connecting an information card. The card connector 11 includes a plurality of elastic pieces, and when the card connector 11 is connected to an information card, the elastic pieces support the information card.

In some embodiments, the card connector 11 includes ten spring plates arranged in an array, the ten spring plates being spaced apart from each other. The ten spring plates may be arranged in a 2 x 5 array configuration. For example, the ten elastic pieces are arranged in the first direction to form a first row of elastic pieces to a fifth row of elastic pieces, and arranged in the second direction to form a first row of elastic pieces and a second row of elastic pieces. The first row of elastic sheets comprises a first elastic sheet 11a, a third elastic sheet 11c, a fifth elastic sheet 11e, a seventh elastic sheet 11g and a ninth elastic sheet 11i which are arranged along the first direction, and the second row of elastic sheets comprises a second elastic sheet 11b, a fourth elastic sheet 11d, a sixth elastic sheet 11f, an eighth elastic sheet 11h and a tenth elastic sheet 11j which are arranged along the first direction. The first elastic sheet 11a and the second elastic sheet 11b are located on the first row of elastic sheets, the third elastic sheet 11c and the fourth elastic sheet 11d are located on the second row of elastic sheets, the fifth elastic sheet 11e and the sixth elastic sheet 11f are located on the third row of elastic sheets, the seventh elastic sheet 11g and the eighth elastic sheet 11h are located on the fourth row of elastic sheets, and the ninth elastic sheet 11i and the tenth elastic sheet 11j are located on the fifth row of elastic sheets.

When the plurality of elastic sheets are arranged in a row along the first direction, center points of the plurality of elastic sheets located in the same row (that is, center points of portions of the elastic sheets for abutting against the information card) may be aligned in the first direction, or may not be aligned but slightly staggered. When the plurality of elastic sheets are arranged in rows along the second direction, the center points of the two elastic sheets located in the same row (that is, the center points of the portions of the elastic sheets for abutting against the information card) may be aligned in the second direction, or may not be aligned but slightly staggered.

Referring to fig. 2, fig. 3, fig. 5 and fig. 6, when the card connector 11 is applied to the card socket assembly 10, the insertion direction of the information card into the card slot 17 of the card socket assembly 10 is parallel to the second direction, that is, the insertion direction of the information card connected with the card connector 11 is parallel to the second direction. During insertion of the information card, the information card first contacts the front side of the card connector 11 and then contacts the rear side of the card connector 11. When the card connector 11 is mounted to the card holder 1, the structure of the card connector 11 arranged on the front side is close to the opening of the card slot 17, and the structure of the card connector 11 arranged on the rear side is far from the opening of the card slot 17. For example, the second row of resilient pieces of the card connector 11 may be located at the rear side of the first row of resilient pieces, and the second row of resilient pieces is far away from the opening of the card slot 17 of the card holder assembly 10 relative to the first row of resilient pieces. In other embodiments, the second row of elastic pieces of the card connector 11 may also be close to the opening of the card slot 17 of the card holder assembly 10 relative to the first row of elastic pieces, which is not described in this embodiment again.

Referring to fig. 6 and 7, fig. 7 is a schematic structural diagram of the conductive body 113 of the card connector 11 shown in fig. 6.

In some embodiments, card connector 11 includes an insulative body 112 and an electrical conductor 113. The insulating body 112 may be substantially plate-shaped, and the insulating body 112 further has a plurality of hollow areas spaced apart from each other. For example, the insulation body 112 may include six first hollow-out regions 1121, a plurality of second hollow-out regions 1122, and a plurality of third hollow-out regions 1123. The six first hollow-out areas 1121 may be arranged in two rows and three rows, and include a first row of first hollow-out areas 1121 and a second row of first hollow-out areas 1121 located behind the first row of first hollow-out areas 1121. The second hollow areas 1122 may be arranged in two rows, and the two rows of second hollow areas 1122 are located at the rear side of the two rows of first hollow areas 1121 respectively. The third hollow-out regions 1123 may be arranged in a row and located at the rear side of the first hollow-out regions 1121 in the second row.

Illustratively, the electrical conductor 113 is embedded in the insulating body 112. The conductive body 113 may be formed by punching a unitary metal plate. The conductor 113 includes ten elastic pieces and ten fixing pieces 1131, the ten elastic pieces may include the first elastic piece 11a to the tenth elastic piece 11j, the ten fixing pieces 1131 are connected to the ten elastic pieces in a one-to-one correspondence, and the fixing pieces 1131 and the elastic pieces are made of a conductive material. The conductive body 113 includes ten conductive blocks, and a corresponding one of the fixing members 1131 and one of the elastic pieces are located on the same conductive block, and the ten conductive blocks are arranged at intervals. Ten fixing members 1131 are embedded in the insulating body 112 to be fixedly connected to the insulating body 112, and the ten spring pieces are respectively and fixedly connected to the insulating body 112 through the ten fixing members 1131.

For example, each spring (for simplicity, one of the springs (e.g., 11 j) is indicated in the drawings) includes a fixed end 111a, an abutting end 111b, and a movable end 111c, the fixed end 111a, the abutting end 111b, and the movable end 111c are sequentially arranged along an extending direction of the spring, and the extending direction of the spring is perpendicular to the first direction, that is, parallel to the second direction. The fixed end 111a is connected to the fixing member 1131, and the fixed end 111a is fixed to the insulating body 112 through the fixing member 1131. The abutting end 111b protrudes from a side surface of the insulating body 112 to elastically abut against the information card when the card connector 11 is connected to the information card. The movable end 111c is movably mounted to the insulating body 112, and the movable end 111c can move in a second direction relative to the insulating body 112.

In this embodiment, when the card connector 11 is connected to an information card, the abutting end 111b abuts against the information card, the abutting end 111b moves towards the direction close to the insulating body 112, the movable end 111c moves relative to the insulating body 112, the elastic piece deforms smoothly, and the elastic force of the elastic piece abutting against the information card is moderate, so that the information card can be connected to the card connector 11 smoothly, the risk of damaging the information card due to too large elastic force of the elastic piece can be reduced, and the reliability is improved.

The elastic sheet further comprises a first connecting section 111d and a second connecting section 111e, the first connecting section 111d connects the fixed end 111a and the abutting end 111b, the second connecting section 111e connects the abutting end 111b and the movable end 111c, and the abutting end 111b is convex relative to the first connecting section 111d and the second connecting section 111 e. That is, in the thickness direction (perpendicular to the first and second directions) of the card connector 11, the abutting end 111b is located highest, the first connecting section 111d and the second connecting section 111e are next to each other, and the fixed end 111a and the movable end 111c are located lowest. When the elastic sheet is connected with the information card, the elastic sheet is abutted by the abutting end 111b and electrically connected with the information card, and the first connecting section 111d, the fixed end 111a, the second connecting section 111e and the movable end 111c are not in contact with the information card and form a gap with the information card.

The abutting end 111b may include a protruding abutting contact 111f, and the abutting contact 111f has a certain contact area. When the card connector 11 is connected to the information card, the contact 111f abuts against the gold finger of the information card, so that the card connector 11 is electrically connected to the information card.

For example, the third elastic piece 11c to the eighth elastic piece 11h may be located in six first hollow areas 1121 respectively, the first elastic piece 11a may be located in the same first hollow area 1121 as the third elastic piece 11c, the second elastic piece 11b may be located in the same first hollow area 1121 as the fourth elastic piece 11d, the seventh elastic piece 11g may be located in the same first hollow area 1121 as the ninth elastic piece 11i, and the eighth elastic piece 11h may be located in the same first hollow area 1121 as the tenth elastic piece 11 j.

Each fastener 1131 surrounds or semi-surrounds a corresponding spring. The elastic sheet is separately located in one of the first hollow areas 1121, and the fixing member 1131 corresponding to the elastic sheet completely surrounds the elastic sheet. For example, the fifth elastic piece 11e is separately located in one of the first hollow areas 1121, and the fixing member 1131 connected to the fifth elastic piece 11e completely surrounds the fifth elastic piece 11e. The sixth elastic sheet 11f is separately located in one of the first hollow areas 1121, and the fixing member 1131 connected to the sixth elastic sheet 11f completely surrounds the sixth elastic sheet 11f.

The two elastic pieces sharing the same first hollow region 1121 are provided with two corresponding fixing pieces 1131 in a surrounding trend, and the two corresponding elastic pieces are included together and respectively semi-surround the corresponding elastic pieces. For example, the first elastic piece 11a and the third elastic piece 11c are located in the same first hollow region 1121, the fixing member 1131 connected to the first elastic piece 11a and the fixing member 1131 connected to the third elastic piece 11c surround the first elastic piece 11a and the third elastic piece 11c together, the fixing member 1131 connected to the first elastic piece 11a surrounds the first elastic piece 11a, and the fixing member 1131 connected to the third elastic piece 11c surrounds the third elastic piece 11c. The seventh elastic sheet 11g and the ninth elastic sheet 11i are located in the same first hollow region 1121, the fixing member 1131 connected to the seventh elastic sheet 11g and the fixing member 1131 connected to the ninth elastic sheet 11i surround the seventh elastic sheet 11g and the ninth elastic sheet 11i together, the fixing member 1131 connected to the seventh elastic sheet 11g surrounds the seventh elastic sheet 11g in a half, and the fixing member 1131 connected to the ninth elastic sheet 11i surrounds the ninth elastic sheet 11i in a half. The relationship between the second elastic sheet 11b and the fourth elastic sheet 11d and the corresponding fixing member 1131, and the relationship between the eighth elastic sheet 11h and the tenth elastic sheet 11j and the corresponding fixing member 1131 refer to the above description, and are not described herein again.

Referring to fig. 6 and 8 in combination, fig. 8 is a schematic view of the internal structure of the card connector 11 shown in fig. 6 at a position a. Fig. 8 shows a connection structure between the movable end 111c of the elastic piece and the insulating body 112. In fig. 6, the tenth elastic piece 11j is taken as an example for reference.

In some embodiments, the insulating body 112 further includes a communication hole 1124, and the communication hole 1124 communicates the adjacent first and second

hollow regions

1121 and 1122. The movable end 111c of the spring plate is inserted into the communication hole 1124, the end of the movable end 111c includes a stop block 1111, and the stop block 1111 cooperates with the insulation body 112 to form an anti-falling structure. In this embodiment, the anti-falling structure can effectively prevent the movable end 111c of the elastic sheet from separating from the insulating body 112, so as to improve the reliability of the connection between the elastic sheet and the insulating body 112, and improve the reliability of the card connector 11.

Illustratively, the fixed end 111a and the abutting end 111b of the elastic sheet are located in the first hollow region 1121, the movable end 111c of the elastic sheet is inserted into the communication hole 1124 and extends to the second hollow region 1122 through the communication hole 1124, and the stop block 1111 is at least partially located in the second hollow region 1122. The width of the communication hole 1124 in the clamping direction is smaller than the width of the stop block 1111 in the clamping direction, the clamping direction can be any one direction, the size of the communication hole 1124 in a certain direction is smaller than the size of the stop block 1111 in the same direction, that is, the stop block 1111 and the insulation body 112 are matched to form an anti-falling structure, so that the stop block 1111 is prevented from penetrating through the communication hole 1124 to cause the movable end 111c of the elastic sheet to be separated from the insulation body 112. For example, in a direction perpendicular to the extending direction of the spring plate, that is, in the first direction, the width of the stopper 1111 is larger than the width of the communication hole 1124. It is to be understood that the shape and size of the communication hole 1124 and the shape and size of the stopper 1111 are not strictly limited in the embodiments of the present application.

Referring to fig. 6 and fig. 7 again, in some embodiments, each conductive block of the conductive body 113 further includes a solder tail 1132 (a part of the solder tail 1132 is labeled for simplicity in the drawings), the solder tail 1132 is fixedly connected to the fixing member 1131, and the solder tail 1132 is used for being soldered to the circuit board 50 (see fig. 1), so that the card connector 11 is fixedly connected to the circuit board 50, and the elastic sheet is electrically connected to the circuit board 50. Wherein the number of the solder tails 1132 in each conductive block is at least one.

Illustratively, the at least one solder 1132 of each conductive block includes a first solder 1133, and the first solder 1133 is disposed near the fixed end 111a of the spring. That is, the first solder tail 1133 is connected to the end of the fixing member 1131 close to the fixed end 111a of the elastic piece. During the insertion of the information card, a friction force is generated between the information card and the abutting end 111b of the elastic piece, the friction force makes the elastic piece have a tendency to move in the insertion direction (i.e. the second direction), and the fixed end 111a of the elastic piece is pulled. The conductive block is provided with the first welding feet 1133 close to the fixed end 111a of the elastic sheet, the first welding feet 1133 are welded on the circuit board 50, so that the stress on the elastic sheet is transmitted to the circuit board 50 through the first welding feet 1133, the fixing piece 1131 of the conductive block is not easy to deform, the connection relation between the fixing piece 1131 and the insulating body 112 is stable, and the reliability of the card connector 11 and the reliability of the card seat assembly 10 are improved. It will be appreciated that the first solder fillets 1133 are also capable of transferring stress during the card removal process of the information card.

The at least one solder foot 1132 of the partial conductive block may further include a second solder foot 1134, where the second solder foot 1134 is disposed near the movable end 111c of the elastic piece. That is, the second solder tail 1134 is connected to the end of the fixing member 1131 close to the movable end 111c of the elastic piece. In the process of pulling out the information card, a friction force is generated between the information card and the abutting end 111b of the elastic sheet, the elastic sheet has a tendency of moving along the card pulling direction (i.e. the direction opposite to the second direction), the movable end 111c of the elastic sheet generates a pulling force on the insulating body 112 through the anti-falling structure, the conductive block is provided with a second welding foot 1134 close to the movable end 111c of the elastic sheet, the second welding foot 1134 is welded to the circuit board 50, so that the stress on the insulating body 112 is transmitted to the circuit board 50 from the second welding foot 1134, the fixing part 1131 of the conductive block is not easy to deform, the connection relationship between the fixing part 1131 and the insulating body 112 is stable, and the reliability of the card connector 11 and the card holder assembly 10 is improved. It will be appreciated that first solder tail 1133 is also capable of transferring stress during the card removal process of the information card. Both first and

second solder fillets

1133 and 1134 are capable of transferring stress during insertion of an information card.

In some other embodiments, the solder 1132 of the conductive pad can also be connected to other positions of the fixing member 1131, for example, a middle portion of the fixing member 1131 is connected, which is not limited in this embodiment of the present invention.

For example, a portion of the plurality of solder legs 1132 of the conductive body 113 may be located in the first hollow region 1121, and a portion of the solder legs 1132 may be located in the third hollow region 1123, and the arrangement position may refer to fig. 6. In other embodiments, the plurality of solder legs 1132 of the conductive body 113 may have other arrangements, for example, the plurality of solder legs 1132 of the conductive body 113 are all located in the first hollow-out region 1121, and the insulating body 112 may not be provided with the third hollow-out region 1123, which is not strictly limited in this embodiment of the present disclosure.

Referring to fig. 9, fig. 9 is a second schematic structural view of the card connector 11 shown in fig. 5 at another angle.

In some embodiments, the center-to-center distance S2 between the second row of resilient sheets (11 c, 11 d) and the third row of resilient sheets (11 e, 11 f) is greater than the center-to-center distance S1 between the first row of resilient sheets (11 a, 11 b) and the second row of resilient sheets (11 c, 11 d), and greater than the center-to-center distance S4 between the fourth row of resilient sheets (11 g, 11 h) and the fifth row of resilient sheets (11 i, 11 j). The center-to-center distance S3 between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) is larger than the center-to-center distance S1 between the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), and is larger than the center-to-center distance S4 between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j).

That is, the center-to-center distance S2 between the second row of elastic sheets (11 c, 11 d) and the third row of elastic sheets (11 e, 11 f), the center-to-center distance S3 between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) are larger, the center-to-center distance S1 between the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), and the center-to-center distance S4 between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j) are smaller.

When two elastic sheets in the same row are aligned, the center distance between the two rows of elastic sheets is the center distance between the two elastic sheets in the same column; the center-to-center distance between the two spring pieces is a distance between center points of portions (for example, the contact points 111 f) of the two spring pieces for abutting against the information card in the first direction. When the two elastic sheets in the same row are slightly staggered in the second direction, the center distance between the two elastic sheets in the two rows is the average value of the center distance between the two elastic sheets in the first row of elastic sheets and the center distance between the two elastic sheets in the second row of elastic sheets.

As shown in fig. 9, the center distance between the third elastic piece 11c and the fifth elastic piece 11e is greater than the center distance between the first elastic piece 11a and the third elastic piece 11c and the center distance between the seventh elastic piece 11g and the ninth elastic piece 11 i; the center distance between the fifth elastic piece 11e and the seventh elastic piece 11g is larger than the center distance between the first elastic piece 11a and the third elastic piece 11c and the center distance between the seventh elastic piece 11g and the ninth elastic piece 11 i; the center distance between the fourth elastic piece 11d and the sixth elastic piece 11f is larger than the center distance between the second elastic piece 11b and the fourth elastic piece 11d and the center distance between the eighth elastic piece 11h and the tenth elastic piece 11 j; the center distance between the sixth elastic piece 11f and the eighth elastic piece 11h is greater than the center distance between the second elastic piece 11b and the fourth elastic piece 11d and the center distance between the eighth elastic piece 11h and the tenth elastic piece 11 j.

Exemplarily, the center-to-center distance S2 between the second row of spring pieces (11 c, 11 d) and the third row of spring pieces (11 e, 11 f) may be in a range of 1.0mm to 3.0mm, for example, may be in a range of 1.5mm to 2.8mm, for example, may be 2.48mm, 2.54mm, 2.59mm, 2.63mm, and the like; and/or the centre-to-centre spacing S3 between the third row of domes (11 e, 11 f) and the fourth row of domes (11 g, 11 h) may be in the range 1.0mm to 3.0mm, for example may be in the range 1.5mm to 2.8mm, for example may be 2.48mm, 2.54mm, 2.59mm, 2.63mm, etc.; and/or the center-to-center distance S1 between the first row of spring pieces (11 a, 11 b) and the second row of spring pieces (11 c, 11 d) may be in the range of 1.0mm to 1.7mm, for example, 1.03mm, 1.07mm, 1.12mm, etc.; and/or the center-to-center distance S4 between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j) can be in the range of 1.0mm to 1.7mm, such as 1.32mm, 1.37mm, 1.41mm and the like.

The center distance S2 between the second row of elastic sheets (11 c, 11 d) and the third row of elastic sheets (11 e, 11 f) and the center distance S3 between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) may be equal or unequal, which is not strictly limited in the embodiments of the present application. The center distances between two corresponding spring plates in two adjacent rows of spring plates may be equal or unequal, and this is not strictly limited in the embodiments of the present application. For example, in the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), the center distance between the first elastic sheet 11a and the third elastic sheet 11c and the center distance between the second elastic sheet 11b and the fourth elastic sheet 11d may be equal or unequal.

In this application embodiment, through the mode of arranging and the centre-to-centre spacing that sets up a plurality of shell fragments for a plurality of shell fragments can form multiple combination, and shell fragment quantity and position in the multiple combination can with the golden finger quantity and the position looks adaptation of multiple type information card, make card connector 11 can realize the communication with the information card of different grade type, realize that many cards are compatible, and expansibility is better. Therefore, when the card connector 11 is applied to the card holder assembly 10 of the electronic device 100, the electronic device 100 can adapt to multiple types of information cards through the same card holder assembly 10, so that the number of the card holder assemblies 10 is reduced, the occupation of the internal space of the electronic device 100 is reduced, and the electronic device 100 is light and thin.

In some embodiments, the card connector 11 may communicate with a Nano SIM card having six gold fingers (also referred to as terminals, ports, metal contacts, etc.) and may also communicate with a second NM card having ten gold fingers or eight gold fingers or other number of gold fingers to be compatible with the Nano SIM card and the second NM card. Wherein the size of the second NM card body is the same as the size of the Nano SIM card body. In the present application, the same size of the card bodies of the two information cards may mean that the size of the card bodies of the two information cards is the same, or the size of the card bodies of the two information cards is very similar, and both the two information cards can be stably placed in the same mounting groove of the card holder 2 of the card seat assembly 10.

In other embodiments, the card connector 11 may communicate with a Nano SIM card having six gold fingers, with a second NM card having ten gold fingers or eight gold fingers or other numbers of gold fingers, and with a first NM card having eight gold fingers to be compatible with the Nano SIM card, the second NM card, and the first NM card. The first NM card is the first generation NM card, the second NM card is the second generation NM card, the transmission rate of the second NM card is larger than that of the first NM card. The size of the body of the first NM card may be the same as the size of the body of the Nano SIM card.

In other embodiments, the card connector 11 can communicate with a Nano SIM card having six gold fingers, and can also communicate with a two-in-one card having at least ten gold fingers to be compatible with the Nano SIM card and the two-in-one card. The size of the card body of the two-in-one card is the same as that of the Nano SIM card.

In other embodiments, the card connector 11 may also be compatible with the first NM card and/or the second NM card when compatible with the Nano SIM card and the two-in-one card, which is not strictly limited in this embodiment of the present application.

The present application provides a Nano SIM card, which can be adapted to the card connector 11, and the structure of the Nano SIM card and the connection structure of the Nano SIM card and the card connector 11 will be exemplified below.

Referring to fig. 10 to 12 in combination, fig. 10 is a schematic block diagram of a Nano SIM card 3 according to an embodiment of the present disclosure, fig. 11 is a schematic structural diagram of the Nano SIM card 3 shown in fig. 10 in some embodiments, and fig. 12 is a schematic structural diagram of the Nano SIM card 3 shown in fig. 11 when connected with the card connector 11 shown in fig. 5.

In some embodiments, as shown in fig. 10 and 11, the Nano SIM card 3 may include a card body 31 and a card interface 32. The card body 31 includes a package 311, and a control circuit 312 and a SIM circuit 313 provided in the package 311. The card interface 32 is fixed to the card body 31 and exposed relative to the card body 31, and the card interface 32 is electrically connected to the control circuit 312. The package 311 is used to package the control circuit 312, the SIM circuit 313 and electrical connection lines between the control circuit 312 and the SIM circuit 313 and the card interface 32 for protection. The package 311 is made of a dielectric material, which includes but is not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), ionomer, polyolefin (PO), silicon, thermoplastic polyurethane, and the like.

The Nano SIM card 3 has a length direction, a width direction and a thickness direction which are perpendicular to each other, the maximum size of the card body 31 of the Nano SIM card 3 in the length direction is the length thereof, the maximum size in the width direction is the width thereof, and the maximum size in the thickness direction is the thickness thereof. The dimensions of the card body 31 of the Nano SIM card 3 may be 12.30mm in length, 8.80mm in width and 0.67mm in thickness. In the embodiment of the present application, the size of the card body of the information card is the size of the outer contour of the package of the card body.

The card interface 32 of the Nano SIM card 3 in fig. 11 is arranged upward; the view angle of the Nano SIM card 3 in fig. 12 is turned upside down with respect to the view angle of the Nano SIM card 3 in fig. 11, the card interface 32 of the Nano SIM card 3 in fig. 12 is disposed downward, and the card connector 11 is located below the Nano SIM card 3.

In some embodiments, the card body 31 of the Nano SIM card 3 includes a first side 3111, a second side 3112, a third side 3113 and a fourth side 3114, the first side 3111 and the third side 3113 are disposed opposite to each other and extend along the length direction of the Nano SIM card 3, and the second side 3112 and the fourth side 3114 are disposed opposite to each other and extend along the width direction of the Nano SIM card 3. The distance between the second side 3112 and the fourth side 3114 is greater than the distance between the first side 3111 and the third side 3113. In other words, the first side 3111 and the third side 3113 are long sides, and the second side 3112 and the fourth side 3114 are short sides. Here, the first side 3111 and the third side 3113 may be disposed in parallel or approximately in parallel, and the second side 3112 and the fourth side 3114 may be disposed in parallel or approximately in parallel.

One corner of the card body 31 of the Nano SIM card 3 is a corner cut, and the corner cut is disposed between the first edge 3111 and the second edge 3112. The cut angle forms a cut edge 3115, and the cut edge 3115 forms an obtuse angle with the first edge 3111 and an obtuse angle with the second edge 3112. An arc transition structure or a chamfer transition structure may be disposed between adjacent sides (including the first side 3111, the second side 3112, the third side 3113, the fourth side 3114 and the cut edge 3115) of the card body 31 of the Nano SIM card 3. In other embodiments, the card body 31 of the Nano SIM card 3 may not be provided with the above-mentioned chamfer, and the present application is not limited thereto.

Illustratively, the card interface 32 of the Nano SIM card 3 includes at least six gold fingers, for example, a first gold finger 321, a second gold finger 322, a third gold finger 323, a fourth gold finger 324, a fifth gold finger 325 and a sixth gold finger 326 arranged in an array. The first gold finger 321 is closer to the cut edge 3115 of the card body 31 of the Nano SIM card 3 than the other gold fingers.

When the Nano SIM card 3 is installed on the card holder 2, the Nano SIM card 3 is inserted into the card holder assembly 10, and the Nano SIM card 3 is connected to the card connector 11, ten elastic pieces of the card connector 11 all support against the Nano SIM card 3, wherein the third elastic piece 11c to the eighth elastic piece 11h (i.e. the second row of elastic pieces to the fourth row of elastic pieces) of the card connector 11 support against and electrically connect the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 one-to-one, so as to electrically connect the Nano SIM card 3. In the embodiment of the present application, when the elastic sheet of the card connector 11 abuts against the gold finger of the information card, the two can be electrically connected.

In this embodiment, the card connector 11 arranges the third elastic sheet 11c to the eighth elastic sheet 11h in two rows and three rows, the third elastic sheet 11c to the eighth elastic sheet 11h can correspondingly abut against the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3, and the card connector 11 can be electrically connected with the Nano SIM card 3 to realize communication.

With reference to fig. 9 and 12, the center distance between the second row of elastic sheets (11 c, 11 d) and the third row of elastic sheets (11 e, 11 f) and the center distance between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) are set within the range of 1.5mm to 2.8mm, so that the electronic device 100 can communicate with the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 through the third elastic sheets 11c to the eighth elastic sheets 11h, and the risk of short circuit between the gold fingers of the Nano SIM card 3 can be effectively reduced, and the electrical connection relationship between the card connector 11 and the Nano SIM card 3 is reliable.

It can be understood that the shapes and sizes of the golden fingers of the Nano SIM cards 3 of different countries and different operators may be different, so as to form different golden finger arrangements. For example, the Nano SIM card 3 shown in fig. 11 is one of the gold finger arrangements defined for compliance with the specification. The card connector 11 and the card holder assembly 10 in the embodiment of the present application can be compatible with Nano SIM cards 3 of different countries and different operators.

When the Nano SIM card 3 is connected to the card connector 11, the first row of elastic sheets (11 a, 11 b) and the fifth row of elastic sheets (11 i, 11 j) of the card connector 11 abut against the Nano SIM card 3. In some embodiments, as shown in fig. 11 and 12, when the Nano SIM card 3 is connected to the card connector 11, the first elastic piece 11a and the third elastic piece 11c may abut against and electrically connect to the first gold finger 321 of the Nano SIM card 3, the second elastic piece 11b and the fourth elastic piece 11d may abut against and electrically connect to the second gold finger 322 of the Nano SIM card 3, the seventh elastic piece 11g and the ninth elastic piece 11i may abut against and electrically connect to the fifth gold finger 325 of the Nano SIM card 3, and the eighth elastic piece 11h and the tenth elastic piece 11j may abut against and electrically connect to the sixth gold finger 326 of the Nano SIM card 3. Wherein, two shrapnels abutting against the same golden finger can be conducted through the golden finger.

In other embodiments, the plurality of gold fingers of the card interface 32 of the Nano SIM card 3 may have an arrangement different from that shown in fig. 11, when the Nano SIM card 3 is connected to the card connector 11, the first row of elastic pieces (11 a, 11 b) and the fifth row of elastic pieces (11 i, 11 j) of the card connector 11 abut against the card body 31 of the Nano SIM card 3; or, the first elastic piece 11a and the third elastic piece 11c of the card connector 11 may abut against and electrically connect to the first gold finger 321 of the Nano SIM card 3, the second elastic piece 11b and the fourth elastic piece 11d may abut against and electrically connect to the second gold finger 322 of the Nano SIM card 3, and the fifth row of elastic pieces (11 i, 11 j) of the card connector 11 abuts against the card body 31 of the Nano SIM card 3; or, the seventh elastic piece 11g and the ninth elastic piece 11i may abut against and electrically connect to the fifth finger 325 of the Nano SIM card 3, the eighth elastic piece 11h and the tenth elastic piece 11j may abut against and electrically connect to the sixth finger 326 of the Nano SIM card 3, and the first row of elastic pieces (11 a, 11 b) of the card connector 11 abuts against the card body 31 of the Nano SIM card 3. When the first row of elastic sheets (11 a, 11 b) and/or the fifth row of elastic sheets (11 i, 11 j) of the card connector 11 abut against the card body 31 of the Nano SIM card 3, the first row of elastic sheets (11 a, 11 b) and/or the fifth row of elastic sheets (11 i, 11 j) are not in contact with the golden finger of the Nano SIM card 3, and no electrical connection relationship exists between the first row of elastic sheets (11 a, 11 b) and/or the fifth row of elastic sheets. The embodiment of the present application does not strictly limit the specific connection structure between the first row of resilient tabs (11 a, 11 b) and the fifth row of resilient tabs (11 i, 11 j) of the card connector 11 and the Nano SIM card 3.

For example, six gold fingers of the Nano SIM card 3 may be used to transmit a DATA signal (DATA), a clock signal (CLK), a programming voltage/input signal (VPP), a Reset Signal (RST), a ground signal (GND), and a power signal (VCC), respectively. Wherein, the DATA signal (DATA), also called I/O signal, is used to realize DATA transmission communication; the programming voltage/input signal (VPP) is used to program the Nano SIM card 3, and may also be used to communicate on a Near Field Communication (NFC) enabled card.

As shown in table 1 below, table 1 is a table of correspondence between a plurality of elastic pieces of the card connector 11 and a plurality of gold fingers of the Nano SIM card 3 and their transmission signals. Illustratively, the third elastic piece 11c of the card connector 11 is electrically connected to the first golden finger 321 of the Nano SIM card 3, and the first golden finger 321 is used for transmitting DATA signals (DATA); the fourth elastic sheet 11d is electrically connected with the second golden finger 322 of the Nano SIM card 3, and the second golden finger 322 is used for transmitting a clock signal (CLK); the fifth elastic sheet 11e is electrically connected with a third golden finger 323 of the Nano SIM card 3, and the third golden finger 323 is used for programming a voltage/input signal (VPP); the sixth elastic piece 11f is electrically connected to the fourth gold finger 324 of the Nano SIM card 3, and the fourth gold finger 324 is used for transmitting a Reset Signal (RST); the seventh elastic sheet 11g is electrically connected with a fifth finger 325 of the Nano SIM card 3, and the fifth finger 325 is used for transmitting a ground signal (GND); the eighth elastic piece 11h is electrically connected to the sixth golden finger 326 of the Nano SIM card 3, and the sixth golden finger 326 is used for transmitting a power supply signal (VCC).

TABLE 1

In other embodiments, the six gold fingers of the Nano SIM card 3 may have other corresponding relationships with the six signals, and the six gold fingers of the Nano SIM card 3 may also be used to transmit other combined signals, for example, the Nano SIM card 3 may not transmit a programming voltage/input signal (VPP), the third gold finger 323 is set in a floating manner, and correspondingly, the fifth elastic piece 11e corresponding to the third gold finger 323 may not provide the programming voltage/input signal (VPP). The examples of the present application are not limited thereto. In the embodiment of the present application, the gold finger is suspended, that is, the gold finger is not used for transmitting signals and is not used for providing a signal port for the information card.

The present application provides a first NM card that can be fitted to the card connector 11, and the structure of the first NM card and the connection structure of the first NM card and the card connector 11 will be exemplified below.

Referring to fig. 13, 14 and 15 in combination, fig. 13 is a schematic block diagram of a first NM card 4 according to an embodiment of the present disclosure, fig. 14 is a schematic structural diagram of the first NM card 4 shown in fig. 13 in some embodiments, and fig. 15 is a schematic structural diagram of the first NM card 4 shown in fig. 14 when connected with the card connector 11 shown in fig. 5.

In some embodiments, as shown in fig. 13 and 14, the first NM card 4 includes a card body 41 and a card interface 42. The card body 41 includes a package 411, and a control circuit 412 and a storage circuit 413 provided in the package 411. The card interface 42 is fixed to the card body 41 and exposed relative to the card body 41, and the card interface 42 is electrically connected to the control circuit 412. The package 411 is used to package the control circuit 412, the storage circuit 413, and the electrical connection lines between the control circuit 412, the storage circuit 413 and the card interface 42 for protection. The package 411 is made of a dielectric material, which includes but is not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), ionomer, polyolefin (PO), silicon, thermoplastic polyurethane, and the like.

Therein, the size of the card body 41 of the first NM card 4 may be the same as the size of the card body 31 of the Nano SIM card 3. The first NM card 4 has a length direction, a width direction, and a thickness direction perpendicular to each other, and the maximum dimension of the card body 41 of the first NM card 4 in the length direction is its length, the maximum dimension in the width direction is its width, and the maximum dimension in the thickness direction is its thickness. For example, the size of the card body 41 of the first NM card 4 may be 12.30mm in length, 8.80mm in width, and 0.67mm in thickness.

Wherein the card interface 42 of the first NM card 4 in fig. 14 is disposed upward; the first NM card 4 in fig. 15 is positioned at a viewing angle that is turned upside down with respect to the first NM card 4 in fig. 14, the card interface 42 of the first NM card 4 in fig. 15 is positioned downward, and the card connector 11 is positioned below the first NM card 4.

In some embodiments, the card body 41 of the first NM card 4 includes a first side 4111, a second side 4112, a third side 4113, and a fourth side 4114, wherein the first side 4111 and the third side 4113 are disposed opposite to each other and extend along a length direction of the first NM card 4, and the second side 4112 and the fourth side 4114 are disposed opposite to each other and extend along a width direction of the first NM card 4. The distance between the second side 4112 and the fourth side 4114 is greater than the distance between the first side 4111 and the third side 4113. In other words, the first side 4111 and the third side 4113 are long sides, and the second side 4112 and the fourth side 4114 are short sides. In this case, the first side 4111 and the third side 4113 may be disposed in parallel or approximately in parallel, and the second side 4112 and the fourth side 4114 may be disposed in parallel or approximately in parallel.

One corner of the card body 41 of the first NM card 4 is a tangent corner, and the tangent corner is disposed between the first edge 4111 and the second edge 4112. The cut angle forms a cut edge 4115, and cut edge 4115 forms an obtuse angle with first edge 4111 and an obtuse angle with second edge 4112. An arc transition structure or a chamfer transition structure may be disposed between adjacent sides (including the first side 4111, the second side 4112, the third side 4113, the fourth side 4114, and the trimming side 4115) of the card body 41 of the first NM card 4. In other embodiments, the card body 41 of the first NM card 4 may not be provided with the above-mentioned chamfer, and the present application is not limited thereto. Here, when the size of the corner cut of the card body 41 of the first NM card 4 is the same as or different from the size of the corner cut of the card body 31 of the Nano SIM card 3, and when the two are different, the size of the card body 41 of the first NM card 4 is considered to be the same as the size of the card body 31 of the Nano SIM card 3.

Illustratively, the card interface 42 of the first NM card 4 includes at least eight gold fingers, for example, the first gold finger 421, the second gold finger 422, the third gold finger 423, the fourth gold finger 424, the fifth gold finger 425, the sixth gold finger 426, the seventh gold finger 427, and the eighth gold finger 428 may be arranged in an array, and the first gold finger 421 is closer to the trimming 4115 of the card body 41 than the other gold fingers.

When the first NM card 4 is mounted on the card holder 2, the first NM card 4 is inserted into the card holder assembly 10, and the first NM card 4 is connected to the card connector 11, the ten spring pieces of the card connector 11 all support against the first NM card 4, wherein the third to tenth spring pieces 11c to 11j (i.e., the second to fourth row of spring pieces) of the card connector 11 support against the first to eighth gold fingers 421 to 428 of the first NM card 4 in a one-to-one correspondence manner to electrically connect the first NM card 4.

In this embodiment, the card connector 11 arranges the third elastic sheet 11c to the tenth elastic sheet 11j into two rows and two columns, and the center distance between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j) is smaller than the center distance between the second row of elastic sheets (11 c, 11 d) and the third row of elastic sheets (11 e, 11 f) and the center distance between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h), so that the third elastic sheet 11c to the eighth elastic sheet 11h of the card connector 11 can be electrically connected with six golden fingers of the Nano SIM card 3 in a one-to-one correspondence manner, and the third elastic sheet 11c to the tenth elastic sheet 11j can be electrically connected with eight golden fingers of the first NM card 4 in a one-to-one correspondence manner, so that the card connector 11 can be compatible with the Nano SIM card 3 and the first NM card 4.

With reference to fig. 9, 12 and 15, because the number of the Nano SIM card 3 and the first NM card 4 is different, the shapes of the golden fingers are different, the sizes of the golden fingers are different, the arrangement positions of the golden fingers and the spacing distance between the golden fingers are also different, the center distance between the second row of the elastic pieces (11 c, 11 d) and the third row of the elastic pieces (11 e, 11 f), and the center distance between the third row of the elastic pieces (11 e, 11 f) and the fourth row of the elastic pieces (11 g, 11 h) are set in the range of 1.5mm to 2.8mm, the center distance between the fourth row of the elastic pieces (11 g, 11 h) and the fifth row of the elastic pieces (11 i, 11 j) is set in the range of 1.0mm to 1.7mm, so that the third elastic piece 11c to the eighth elastic piece 11h can respectively communicate with six golden fingers of the Nano SIM card 3, and the third elastic piece 11c to the tenth elastic piece (11 j) can respectively communicate with the first NM 4, the NM 4 and the NM 4 can respectively communicate with the first NM 4, and the third elastic piece, and the third elastic pieces can be electrically connected to the Nano SIM card, and the first card, when the first card are electrically connected, and the first card, the first and the third elastic pieces, the third elastic pieces can be electrically connected to the first card, and the third elastic pieces, which are electrically.

Although the seventh gold finger 427 and the eighth gold finger 428 of the first NM card 4 are L-shaped as shown in fig. 15, since the elastic sheet of the card connector 11 is abutted to the gold finger of the information card through the abutting contact thereof, and gaps are formed between the rest of the elastic sheet and the gold finger, the ninth elastic sheet 11i is electrically connected to the seventh gold finger 427, the seventh elastic sheet 11g is not in contact with the seventh gold finger 427, and there is no electrical connection therebetween, the tenth elastic sheet 11j is electrically connected to the eighth gold finger 428, and the eighth elastic sheet 11h is not in contact with the eighth gold finger 428, and there is no electrical connection therebetween.

When the first NM card 4 is connected to the card connector 11, the first row of spring pieces (11 a, 11 b) of the card connector 11 abuts against the first NM card 4. In some embodiments, the first elastic piece 11a and the third elastic piece 11c abut against and are electrically connected to the first gold finger 421 of the first NM card 4, and the second elastic piece 11b and the fourth elastic piece 11d abut against and are electrically connected to the second gold finger 422 of the first NM card 4; in other embodiments, the first row of spring pieces (11 a, 11 b) abuts against the card body 41 of the first NM card 4, and at this time, there is no electrical connection between the first row of spring pieces (11 a, 11 b) and the first NM card 4. The embodiment of the present application does not strictly limit the specific connection structure between the first row of resilient pieces (11 a, 11 b) of the card connector 11 and the first NM card 4.

Illustratively, the first NM card 4 may employ an Embedded Multimedia Memory Card (EMMC) interface protocol. Of the eight fingers of the first NM card 4, there may be four fingers for transmitting DATA signals (DATA 0, DATA1, DATA2, DATA 3), one for transmitting a clock signal (CLK), one for transmitting command and response signals (CMD), one for transmitting a ground signal (GND), and one for transmitting a power signal (VCC). The DATA signals (DATA 0, DATA1, DATA2, DATA 3) are used to implement DATA transmission communication. The command and response signal (CMD) may issue a command from the external device to the memory card, or be a response for the memory card to a command from the external device.

As shown in table 2 below, table 2 is a table of correspondence between a plurality of resilient sheets of the card connector 11, a plurality of gold fingers of the Nano SIM card 3 and the first NM card 4, and their transmission signals. When the first NM card 4 is connected to the card connector 11, the third to tenth resilient sheets 11c to 11j of the card connector 11 correspondingly abut against and electrically connect the first to eighth gold fingers 421 to 428 of the first NM card 4. In the present application, when two gold fingers on two information cards are connected to the card connector 11 of the electronic device 100, the two gold fingers are abutted against and electrically connected to the same elastic sheet, and the positions of the two gold fingers are considered to correspond. For example, the first to sixth gold fingers 421 to 426 of the first NM card 4 correspond to the first to sixth gold fingers 321 to 326 of the Nano SIM card 3 in a one-to-one correspondence. When the positions of the two gold fingers of the two information cards correspond to each other, the shapes, sizes and specific positions of the two gold fingers on the card body of the information card may be the same or different, and this is not strictly limited in the embodiment of the present application.

Illustratively, the first gold finger 421, the fourth gold finger 424, the seventh gold finger 427, and the eighth gold finger 428 of the first NM card 4 may be used to transmit data signals; for example, the first gold finger 421 is used to transmit a DATA signal (DATA 1), the fourth gold finger 424 is used to transmit a DATA signal (DATA 0), the seventh gold finger 427 is used to transmit a DATA signal (DATA 3), and the eighth gold finger 428 is used to transmit a DATA signal (DATA 2), and the signals transmitted by the first gold finger 421, the fourth gold finger 424, the seventh gold finger 427, and the eighth gold finger 428 may be exchanged with each other in other embodiments, which is not described herein again. The second gold finger 422 of the first NM card 4 is used to transmit a clock signal (CLK), the third gold finger 423 is used to transmit a command and response signal (CMD), the fifth gold finger 425 is used to transmit a ground signal (GND), and the sixth gold finger 426 is used to transmit a power supply signal (VCC).

TABLE 2

In other embodiments, the eight gold fingers of the first NM card 4 may have other corresponding relations with the eight signals, and the eight gold fingers of the first NM card 4 may also be used to transmit other combined signals, which is not limited in this embodiment of the present application.

For example, the first gold finger 421, the fourth gold finger 424, and the eighth gold finger 428 of the first NM card 4 may be electrically connected to a high voltage resistant circuit or a protection switch, so as to prevent the circuit of the first NM card 4 from being burned out when the third elastic sheet 11c to the fifth elastic sheet 11e and the eighth elastic sheet 11h provide high voltage. Wherein the high voltage tolerant circuits or protection switches are located within the package 411 of the first NM card 4. In other embodiments, this may be achieved by providing high impedance protection circuitry within the electronic device, such as by adding protection circuitry within the interface controller.

The application also provides a second NM card, which is a storage card, and the structure of the card interface is changed by properly cutting and adapting the high-speed protocol, so that the high-speed protocol can be applied to the second NM card, the transmission rate of the second NM card is improved, and the transmission rate of the second NM card is greater than that of the first NM card. By increasing the transmission rate of the second NM card, the electronic device 100 plugged with the second NM card can better support the use scenes and requirements of 5G, wifi, 8K high-definition videos, games and the like, so as to improve the use experience of the user.

For example, the transfer rate of the first NM card is typically less than 100MB/s. For example, the first NM card 4 may adopt an EMMC interface protocol, the card interface 42 has eight gold fingers, and the transmission rate of the first NM card 4 may reach 90MB/s. The second NM card may be adapted by using a different interface protocol, the card interface having ten or eight or another number of gold fingers, so that the transfer rate is typically higher than 100MB/s, even up to 1GB/s. For example, the second NM card may adopt an interface protocol such as a Universal Flash Storage (UFS) interface protocol, a peripheral component interconnect express (PCIe) interface protocol, a Secure Digital (SD) interface protocol, a Non-Volatile Memory (NVMe) interface protocol, and the like, and the transmission rate of the second NM card is generally in a range from 200MB/s to 800 MB/s. In some embodiments, the second NM card may also use an EMMC interface protocol to increase the transmission rate by frequency conversion.

Referring to fig. 16, 17 and 18 in combination, fig. 16 is a schematic block diagram of a second NM card 5 according to an embodiment of the present disclosure, fig. 17 is a schematic structural diagram of the second NM card 5 shown in fig. 16 in some embodiments, and fig. 18 is a schematic structural diagram of the second NM card 5 shown in fig. 17 when connected with the card connector 11 shown in fig. 5.

In some embodiments, as shown in fig. 16 and 17, second NM card 5 includes a card body 51 and a card interface 52. The card body 51 includes an enclosure 511, and a control circuit 512 and a memory circuit 513 provided in the enclosure 511. The card interface 52 is fixed to the card body 51 and is exposed to one side of the card body 51, and the card interface 52 is electrically connected to the control circuit 512. The package 511 is used to package the control circuit 512, the memory circuit 513, and the electrical connection lines between the control circuit 512 and the memory circuit 513 and between the card interface 52 for protection. The package 511 is made of a dielectric material, which includes but is not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (PVB), ionomer, polyolefin (PO), silicon, thermoplastic polyurethane, and the like.

Wherein the size of the card body 51 of the second NM card 5 may be the same as the size of the card body 31 of the Nano SIM card 3. The second NM card 5 has a length direction, a width direction, and a thickness direction perpendicular to each other, and the maximum dimension of the card body 51 of the second NM card 5 in the length direction is the length thereof, the maximum dimension in the width direction is the width thereof, and the maximum dimension in the thickness direction is the thickness thereof. For example, the size of the card body 51 of the second NM card 5 may be 12.30mm in length, 8.80mm in width, and 0.67mm in thickness.

Wherein the card interface 52 of the second NM card 5 in fig. 17 is disposed upward; the second NM card 5 in fig. 18 is positioned at a view angle that is turned upside down with respect to the view angle of the second NM card 5 in fig. 17, the card interface 52 of the second NM card 5 in fig. 18 is positioned downward, and the card connector 11 is positioned below the second NM card 5.

In some embodiments, the card body 51 of the second NM card 5 includes a first edge 5111, a second edge 5112, a third edge 5113, and a fourth edge 5114, the first edge 5111 and the third edge 5113 are disposed opposite to each other and extend in a length direction of the second NM card 5, and the second edge 5112 and the fourth edge 5114 are disposed opposite to each other and extend in a width direction of the second NM card 5. The distance between the second side 5112 and the fourth side 5114 is greater than the distance between the first side 5111 and the third side 5113. In other words, the first side 5111 and the third side 5113 are long sides, and the second side 5112 and the fourth side 5114 are short sides. Here, the first side 5111 and the third side 5113 may be disposed in parallel or approximately in parallel, and the second side 5112 and the fourth side 5114 may be disposed in parallel or approximately in parallel.

One corner of the card body 51 of the second NM card 5 is a corner cut, and the corner cut is disposed between the first edge 5111 and the second edge 5112. The cut angle forms a cut edge 5115, and the cut edge 5115 forms an obtuse angle with the first edge 5111 and an obtuse angle with the second edge 5112. An arc transition structure or a chamfer transition structure may be disposed between adjacent edges (including the first edge 5111, the second edge 5112, the third edge 5113, the fourth edge 5114 and the cut edge 5115) of the card body 51. In other embodiments, the card body 51 of the second NM card 5 may not have the above-mentioned chamfer, and the present application is not limited thereto. Here, when the size of the corner cut of the card body 51 of the second NM card 5 is the same as or different from the size of the corner cut of the card body 31 of the Nano SIM card 3, and when the two are different, the size of the card body 51 of the second NM card 5 is considered to be the same as the size of the card body 31 of the Nano SIM card 3.

Illustratively, the card interface 52 of the second NM card 5 includes a plurality of gold fingers exposed on the same side of the card body 51. The number of the gold fingers of the second NM card 5 is at least ten, and the plurality of gold fingers may include, for example, a first gold finger 521, a second gold finger 522, a third gold finger 523, a fourth gold finger 524, a fifth gold finger 525, a sixth gold finger 526, a seventh gold finger 527, an eighth gold finger 528, a ninth gold finger 529, and a tenth gold finger 5210. The first gold finger 521, the third gold finger 523, the fifth gold finger 525, the seventh gold finger 527, and the ninth gold finger 529 of the second NM card 5 are arranged in a first row of gold fingers along the width direction of the second NM card 5, the second gold finger 522, the fourth gold finger 524, the sixth gold finger 526, the eighth gold finger 528, and the tenth gold finger 5210 are arranged in a second row of gold fingers along the width direction of the second NM card 5, the first row of gold fingers and the second row of gold fingers are arranged in the length direction of the second NM card 5, five gold fingers of the first row of gold fingers (521, 523, 525, 527, 529) and five gold fingers of the second row of gold fingers (524, 526, 528, 5210) are arranged in a one-to-one correspondence and in a row-by-two manner, that is, ten gold fingers are arranged in the width direction of the second NM card 5 in a first row of gold fingers (521, 522), a second row of gold fingers (524 ), a third row of gold fingers (525, 526), a fourth row of gold fingers (527), a row (522), a fifth row of gold fingers (529), and a fifth row of gold fingers (10) along the width direction of the second NM card 5). At this time, the first gold fingers 321 to the tenth gold fingers 5210 are arranged in two rows and five rows.

The first row of golden fingers (521, 523, 525, 527, 529) is located between the second side 5112 and the second row of golden fingers (522, 524, 526, 528, 5210), that is, the first row of golden fingers (521, 523, 525, 527, 529) are arranged close to the second side 5112, and the second row of golden fingers (522, 524, 526, 528, 5210) are arranged close to the fourth side 5114.

The first golden finger 521 is located between the first edge 5111 and the third golden finger 523, and the second golden finger 522 is located between the first edge 5111 and the fourth golden finger 514. That is, the first row of goldfingers (521, 522) is arranged adjacent to the first side 5111 and the fifth row of goldfingers (529, 5210) is arranged adjacent to the third side 5113.

The first golden finger 521 may have an oblique side to form a right trapezoid, the oblique side of the first golden finger 521 is disposed facing the cut edge 5115 of the card body 51, and a distance between the two is greater than or equal to 0.1mm, for example, may be 0.2mm; the second through tenth gold fingers 522 through 5210 may be rectangular. In other embodiments, the first gold finger 521 may also have a rectangular shape.

The distance between the centers of the second row of golden fingers (523, 524) and the third row of golden fingers (525, 526) is greater than the distance between the centers of the first row of golden fingers (521, 522) and the second row of golden fingers (523, 524), and is greater than the distance between the centers of the fourth row of golden fingers (527, 528) and the centers of the fifth row of golden fingers (529, 5210). The center distance between the third row of golden fingers (525, 526) and the fourth row of golden fingers (527, 528) is larger than the center distance between the first row of golden fingers (521, 522) and the second row of golden fingers (523, 524), and is larger than the center distance between the fourth row of golden fingers (527, 528) and the fifth row of golden fingers (529, 5210).

When the second NM card 5 is connected to the card connector 11, the width direction of the second NM card 5 is parallel to the first direction of the card connector 11, the length direction is parallel to the second direction of the card connector 11, and ten spring pieces of the card connector 11 all abut against the second NM card 5. When the second NM card 5 is mounted on the card holder 2, the second NM card 5 is inserted into the card holder assembly 10, and the second NM card 5 is connected to the card connector 11, ten spring pieces of the card connector 11 correspondingly abut against ten gold fingers of the second NM card 5 one by one, and the first to tenth spring pieces 11a to 11j correspondingly abut against the first to tenth gold fingers 521 to 5210 of the second NM card 5 one by one.

In this embodiment, the first to tenth elastic pieces 11a to 11j of the card connector 11 are arranged in two rows and five rows, and the center distance between the second row of elastic pieces (11 c, 11 d) and the third row of elastic pieces (11 e, 11 f) and the center distance between the third row of elastic pieces (11 e, 11 f) and the fourth row of elastic pieces (11 g, 11 h) are both greater than the center distance between the first row of elastic pieces (11 a, 11 b) and the second row of elastic pieces (11 c, 11 d) and the center distance between the fourth row of elastic pieces (11 g, 11 h) and the fifth row of elastic pieces (11 i, 11 j), so that the third to eighth elastic pieces 11c to 11h of the card connector 11 can be abutted against and electrically connected to the first to sixth golden fingers 321 to 326 of the Nano card 3 one by one to one, the third to tenth elastic pieces 11j of the card connector 11 can be abutted against and electrically connected to the first to eighth golden fingers NM 421 to 326 of the Nano card 4 one by one to one, and the third to tenth elastic pieces 11j of the first to 10 are compatible with each other. In other embodiments, the card connector 11 may also be designed to be compatible with the Nano SIM card 3 and the second NM card 5.

For example, referring to fig. 9, 12, 15 and 18, the center distance between the second row of elastic pieces (11 c, 11 d) and the third row of elastic pieces (11 e, 11 f) of the card connector 11 and the center distance between the third row of elastic pieces (11 e, 11 f) and the fourth row of elastic pieces (11 g, 11 h) are set within the range of 1.5mm to 2.8mm, the center distance between the first row of elastic pieces (11 a, 11 b) and the second row of elastic pieces (11 c, 11 d) is set within the range of 1.0mm to 1.7mm, the center distance between the fourth row of elastic pieces (11 g, 11 h) and the fifth row of elastic pieces (11 i, 11 j) is set within the range of 1.0mm to 1.7mm, so that the third elastic pieces 11c to the eighth elastic pieces 11h can respectively communicate with six golden fingers of the Nano SIM card 3, and the third elastic pieces (11 c) to the tenth elastic pieces can respectively communicate with the NM 4, and the eighth elastic pieces can respectively communicate with ten

golden fingers

11a, 5 to ten golden cards.

Because the numbers of the three types of golden fingers of the Nano SIM card 3, the first NM card 4 and the second NM card 5 are different, the shapes of the golden fingers are different, the arrangement positions of the golden fingers and the spacing distance of the golden fingers are also different, the risk that the golden fingers of the Nano SIM card 3 and the elastic sheet of the card connector 11 are short-circuited when the Nano SIM card 3 is arranged on the card connector 11 can be effectively reduced through the unique design of the spacing distance from the first elastic sheet 11a to the tenth elastic sheet 11j on the basis of being compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 5, the risk that the golden fingers of the Nano SIM card 3 and the elastic sheet of the card connector 11 are short-circuited when the first NM card 4 is arranged on the card connector 11, and the risk that the golden fingers of the second NM card 5 and the elastic sheet of the card connector 11 are short-circuited when the second NM card 5 is arranged on the card connector 11, so that the card connector 11 and the Nano SIM card 3, the first NM card 4 and the second NM 5 can share the same time. It is understood that in other embodiments, the card connector 11 may be designed to be compatible with the Nano SIM card 3 and the second NM card 5.

Referring to fig. 19, fig. 19 is a schematic block diagram of a portion of circuitry of the electronic device 100 shown in fig. 1 in some embodiments.

In some embodiments, the processor 20 of the electronic device 100 includes an interface controller 201, one or more memory card controllers 202, and a SIM card controller 203. The interface controller 201 is electrically connected to one or more memory card controllers 202 and the SIM card controller 203, and the interface controller 201 is also electrically connected to a plurality of clips of the card connector 11. The memory card controller 202 is used for controlling the operation of the memory card, and the SIM card controller 203 is used for controlling the operation of the Nano SIM card 3. When a different information card is inserted into the card holder assembly 10 of the electronic device 100 to be electrically connected to the card connector 11, the interface controller 201 can control the memory card controller 202 or the SIM card controller 203 to communicate with the information card via the card connector 11. For example, when the Nano SIM card 3 is installed on the card holder 2 and the Nano SIM card 3 is inserted into the card socket assembly 10, the interface controller 201 controls the SIM card controller 203 to communicate with the Nano SIM card 3 through the card connector 11; when the second NM card 5 is mounted on the card holder 2 and the second NM card 5 is inserted into the card socket assembly 10, the interface controller 201 controls the memory card controller 202 to communicate with the second NM card 5 via the card connector 11.

In this embodiment, the electronic device 100 can automatically identify the type of the information card through the processor 20, and control the controller corresponding to the information card to be connected to the card connector 11, so that the information card can be automatically matched with the electronic device 100, thereby performing communication and improving the user experience.

The plurality of controllers of the processor 20 may be independent components, may be combined by an integrated component, or may be split into a plurality of components by one controller, which is not strictly limited in this embodiment of the present application. The interface controller 201 may include a plurality of switches and may further include a conducting wire, and the plurality of switches may be separately arranged or may be collectively arranged, which is not strictly limited in this embodiment of the present application.

For example, the processor 20 may identify the type of information card connected to the card connector 11 in various ways. For example, the processor 20 may turn on a plurality of controllers and the card connector 11 in sequence, and identify the type of the information card by matching the controllers with the information card. Alternatively, the processor 20 may be provided with a detection circuit for detecting the type of the information card, and the processor 20 may be capable of identifying the type of the information card according to the detection result of the detection circuit. The specific way in which the processor 20 identifies the type of information card is not strictly limited in the embodiments of the present application.

In some embodiments, when the card-holder assembly 10 of the electronic apparatus 100 is compatible with the first NM card 4 and the second NM card 5, the memory card controller 202 may include a first memory card controller for controlling the operation of the first NM card 4 and a second memory card controller for controlling the operation of the second NM card 5. When the first NM card 4 is mounted on the card holder 2 and the first NM card 4 is inserted into the card socket assembly 10, the interface controller 201 controls the first memory card controller to communicate with the first NM card 4 via the card connector 11. When the second NM card 5 is mounted on the card holder 2 and the second NM card 5 is inserted into the card socket assembly 10, the interface controller 201 controls the second memory card controller to communicate with the second NM card 5 via the card connector 11.

In the present application, there are various implementations of the card interface of the second NM card 5, and the second NM card 5 in the following embodiments can be connected to the card connector 11 shown in fig. 5, by way of example.

Illustratively, the ten gold fingers of the second NM card 5 are arranged in two and five rows, the ten gold fingers of the second NM card 5 are arranged in a first row (521, 522) to a fifth row (529, 5210) in the width direction, and the ten gold fingers of the second NM card 5 are arranged in a first row (521, 523, 525, 527, 529) and a second row (522, 524, 526, 528, 5210) in the length direction.

In the width direction, the center distance between the second row of golden fingers (523, 524) and the third row of golden fingers (525, 526) and the center distance between the third row of golden fingers (525, 526) and the fourth row of golden fingers (527, 528) are larger than the center distance between the first row of golden fingers (521, 522) and the second row of golden fingers (523, 524) and larger than the center distance between the fourth row of golden fingers (527, 528) and the fifth row of golden fingers (529, 5210).

For example, the center-to-center spacing between the second row of gold fingers (523, 524) and the third row of gold fingers (525, 526) may be in the range of 1.5mm to 2.8mm, the center-to-center spacing between the third row of gold fingers (525, 526) and the fourth row of gold fingers (527, 528) may be in the range of 1.5mm to 2.8mm, the center-to-center spacing between the first row of gold fingers (521, 522) and the second row of gold fingers (523, 524) may be in the range of 1.0mm to 1.7mm, and the center-to-center spacing between the fourth row of gold fingers (527, 528) and the fifth row of gold fingers (529, 5210) may be in the range of 1.0mm to 1.7 mm.

Referring to fig. 20, fig. 20 is a size diagram of the second NM card 5 of fig. 17 in some embodiments.

In some embodiments, the ten gold fingers of the second NM card 5 are arranged in two rows and five rows, the first row of gold fingers (521, 523, 525, 527, 529) is arranged near the second edge 5112, the second row of gold fingers (522, 524, 526, 528, 5210) is arranged near the fourth edge 5114, each row of gold fingers is arranged in alignment in the width direction, the first row of gold fingers (521, 522) is arranged near the first edge 5111, the fifth row of gold fingers (529, 5210) is arranged near the third edge 5113, and each row of gold fingers is arranged in alignment in the length direction. The first golden finger 521 may have an oblique side to form a right trapezoid, the oblique side of the first golden finger 521 is disposed facing the cut edge 5115 of the card body 51, and the distance between the two may be 0.2mm; the second through tenth gold fingers 522 through 5210 may be rectangular.

Illustratively, the distance between the center of the second row of gold fingers (523, 524) and the first side 5111 may be 1.95mm, the distance between the center of the third row of gold fingers (525, 526) and the first side 5111 may be 4.25mm, the distance between the center of the third row of gold fingers (525, 526) and the third side 5113 may be 4.55mm, and the distance between the center of the fourth row of gold fingers (527, 528) and the third side 5113 may be 1.95mm in the width direction. In the width direction, the distance between the first row of golden fingers (521, 522) and the second row of golden fingers (523, 524) can be 0.25mm, and the distance between the first row of golden fingers (521, 522) and the first edge 5111 can be 0.2mm. In the width direction, the distance between the fourth row of golden fingers (527, 528) and the fifth row of golden fingers (529, 5210) can be 0.25mm, and the distance between the fifth row of golden fingers (529, 5210) and the third edge 5113 can be 0.2mm. In the length direction, the distance between the first row of golden fingers (521, 523, 525, 527, 529) and the second side 5112 may be 1.1mm, and the distance between the second row of golden fingers (522, 524, 526, 528, 5210) and the fourth side 5114 may be 1.1mm.

Wherein, the length of each golden finger can be 3.2mm, and the width can be 1.0mm. The length of the first gold finger 521 is the size of the bottom side thereof, and the width of the first gold finger 521 is the size of the height thereof.

Wherein the tolerance of the shape dimension and the spacing dimension is +/-0.1 mm.

Referring to fig. 21A and 21B in combination, fig. 21A is a size diagram of the second NM card 5 shown in fig. 16 in other embodiments, and fig. 21B is another size diagram of the second NM card 5 shown in fig. 21A.

In some embodiments, the ten golden fingers of the second NM card 5 are arranged in two columns, the first column (521, 523, 525, 527, 529) is arranged near the second side 5112, and the second column (522, 524, 526, 528, 5210) is arranged near the fourth side 5114. The first gold fingers 521 to the sixth gold fingers 526 are arranged in two rows and three rows, each row of gold fingers is arranged in an aligned manner in the width direction, the first row of gold fingers (521, 522) is arranged close to the first edge 5111, and each row of gold fingers is arranged in an aligned manner in the length direction. The fourth row of gold fingers (527, 528) is aligned lengthwise. The first golden finger 521 may have an oblique side to form a right trapezoid, the oblique side of the first golden finger 521 is disposed facing the cut edge 5115 of the card body 51, and the distance between the two may be 0.2mm; the second through eighth gold fingers 522 through 528 may be rectangular. The ninth gold finger 529 and the tenth gold finger 5210 may be L-shaped. The ninth gold finger 529 half-encloses the seventh gold finger 527. The ninth gold finger 529 includes a first portion 5291 and a second portion, the first portion 5291 extending in the length direction and the second portion 5292 extending in the width direction. The first portion 5291 of the ninth gold finger 529 is positioned between the seventh gold finger 527 and the third side 5113, and the second portion 5292 of the ninth gold finger 529 is connected to the first portion 5291 and positioned between the seventh gold finger 527 and the second side 5112. The tenth gold finger 5210 includes a first portion 52101 and a second portion 52102, the first portion 52101 extending in the length direction and the second portion 52102 extending in the width direction. The first portion 52101 of the tenth gold finger 5210 is located between the eighth gold finger 528 and the third edge 5113, and the second portion 52102 of the tenth gold finger 5210 is connected to the first portion 5291 and located between the eighth gold finger 528 and the second edge 5112. As described above, the ninth gold finger 529 and the tenth gold finger 5210 may be understood as a fifth row of gold fingers (529, 5210).

Illustratively, the distance between the center of the second row of gold fingers (523, 524) and the first side 5111 may be 1.95mm, the distance between the center of the third row of gold fingers (525, 526) and the first side 5111 may be 4.25mm, the distance between the center of the third row of gold fingers (525, 526) and the third side 5113 may be 4.55mm, and the distance between the center of the fourth row of gold fingers (527, 528) and the third side 5113 may be 1.95mm in the width direction. In the width direction, the distance between the first row of golden fingers (521, 522) and the second row of golden fingers (523, 524) can be 0.25mm, and the distance between the first row of golden fingers (521, 522) and the first edge 5111 can be 0.2mm. In the width direction, the distance between the fourth row of gold fingers (527, 528) and the fifth row of gold fingers (529, 5210) can be 0.25mm, and the distance between the fifth row of gold fingers (529, 5210) and the third edge 5113 can be 0.2mm. That is, in the width direction, the ninth gold finger 529 may be spaced from the third side 5113 by 0.2mm, and the first portion 5291 of the ninth gold finger 529 may be spaced from the seventh gold finger 527 by 0.25mm; the distance between the tenth gold finger 5210 and the third edge 5113 may be 0.2mm, and the distance between the first portion 52101 of the tenth gold finger 5210 and the eighth gold finger 528 may be 0.25mm. Wherein a top edge of the second portion 5292 of the ninth gold finger 529 proximate to the first edge 5111 may be flush with a top edge of the seventh gold finger 527 proximate to the first edge 5111; the top edge of the second portion 52102 of the tenth gold finger 5210 near the first edge 5111 may be flush with the top edge of the eighth gold finger 528 near the first edge 5111. In the width direction, the widths of the first part 5291 of the first to eighth gold fingers 521 to 528 and the ninth gold finger 529 and the first part 52101 of the tenth gold finger 5210 may be 1.0mm.

For example, in the length direction, the distance between the first gold finger 521, the third gold finger 523 and the fifth gold finger 525 and the second side 5112 may be 1.1mm, and the distance between the second gold finger 522, the fourth gold finger 524 and the sixth gold finger 526 and the fourth side 5114 may be 1.1mm. In the length direction, both the side of the seventh gold finger 527 close to the fourth side 5114 and the side of the first portion 5291 of the ninth gold finger 529 close to the fourth side 5114 may be flush with the side of the fifth gold finger 525 close to the fourth side 5114; the seventh gold finger 527 may be spaced 0.2mm from the second portion 5292 of the ninth gold finger 529, and the ninth gold finger 529 may be spaced 0.5mm from the second edge 5112; the width of the second portion 5292 of the ninth gold finger 529 may be 0.9mm. In the length direction, both the side edge of the eighth gold finger 528 close to the second edge 5112 and the side edge of the first portion 52101 of the tenth gold finger 5210 close to the second edge 5112 may be flush with the side edge of the sixth gold finger 526 close to the second edge 5112; the distance between the eighth gold finger 528 and the second portion 52102 of the tenth gold finger 5210 may be 0.2mm, and the distance between the tenth gold finger 5210 and the fourth edge 5114 may be 0.5mm; the width of the second portion 52102 of the tenth gold finger 5210 can be 0.9mm.

Referring to fig. 22, fig. 22 is a size diagram of the second NM card 5 shown in fig. 16 in other embodiments.

In some embodiments, the first through tenth gold fingers 521 through 5210 of the second NM card 5 are arranged in two and five rows, the first row of gold fingers (521, 523, 525, 527, 529) is arranged near the second edge 5112, and the second row of gold fingers (522, 524, 526, 528, 5210) is arranged near the fourth edge 5114; the first row of gold fingers (521, 522) is arranged near the first edge 5111, the fifth row of gold fingers (529, 5210) is arranged near the third edge 5113, and each row of gold fingers are aligned in the length direction. The second NM card 5 further includes an eleventh gold finger 5220 and a twelfth gold finger 5230, the eleventh gold finger 5220 and the twelfth gold finger 5230 are arranged in a fourth row of gold fingers (527, 528, 5220, 5230), the eleventh gold finger 5220 is located between the second edge 5112 and the seventh gold finger 527, and the twelfth gold finger 5230 is located between the fourth edge 5114 and the eighth gold finger 528. The first golden finger 521 may have an oblique side to form a right trapezoid, the oblique side of the first golden finger 521 is disposed facing the cut edge 5115 of the card body 51, and the distance between the two may be 0.2mm; the second through twelfth gold fingers 522 through 5230 may be rectangular.

Illustratively, the distance between the center of the second row of gold fingers (523, 524) and the first side 5111 may be 1.95mm, the distance between the center of the third row of gold fingers (525, 526) and the first side 5111 may be 4.25mm, the distance between the center of the third row of gold fingers (525, 526) and the third side 5113 may be 4.55mm, and the distance between the center of the fourth row of gold fingers (527, 528, 5220, 5230) and the third side 5113 may be 1.95mm in the width direction. In the width direction, the distance between the first row of golden fingers (521, 522) and the second row of golden fingers (523, 524) can be 0.25mm, and the distance between the first row of golden fingers (521, 522) and the first edge 5111 can be 0.2mm. In the width direction, the distance between the fourth row of gold fingers (527, 528, 5220, 5230) and the fifth row of gold fingers (529, 5210) can be 0.25mm, and the distance between the fifth row of gold fingers (529, 5210) and the third edge 5113 can be 0.2mm. In the width direction, the widths of the first gold finger 521 to the twelfth gold finger 5230 may be all 1.0mm.

For example, in the length direction, the first gold finger 521, the third gold finger 523 and the fifth gold finger 525 may be spaced from the second edge 5112 by 1.1mm, and the second gold finger 522, the fourth gold finger 524 and the sixth gold finger 526 may be spaced from the fourth edge 5114 by 1.1mm. In the length direction, both the side edge of the seventh gold finger 527 close to the fourth edge 5114 and the side edge of the ninth gold finger 529 close to the fourth edge 5114 may be flush with the side edge of the fifth gold finger 525 close to the fourth edge 5114; the side of the eleventh gold finger 5220 adjacent to the second edge 5112 is flush with the side of the ninth gold finger 529 adjacent to the second edge 5112; the seventh gold finger 527 may be spaced apart from the eleventh gold finger 5220 by 0.2mm, the eleventh gold finger 5220 may be spaced apart from the second edge 5112 by 0.5mm, and the eleventh gold finger 5220 may have a length of 0.9mm. In the length direction, both the side edge of the eighth gold finger 528 close to the second edge 5112 and the side edge of the tenth gold finger 5210 close to the second edge 5112 may be flush with the side edge of the sixth gold finger 526 close to the second edge 5112; the side of the twelfth golden finger 5230 adjacent to the fourth side 5114 is flush with the side of the tenth golden finger 5210 adjacent to the fourth side 5114; the distance between the eighth gold finger 528 and the twelfth gold finger 5230 may be 0.2mm, the distance between the twelfth gold finger 5230 and the fourth edge 5114 may be 0.5mm, and the length of the twelfth gold finger 5230 may be 0.9mm.

Referring to FIG. 23, FIG. 23 is a dimensional diagram of a second NM card 5 of FIG. 16 in other embodiments.

In some embodiments, the first 521 to tenth 5210 gold fingers of the second NM card 5 are arranged in two or five rows, the first row of gold fingers (521, 523, 525, 527, 529) is arranged near the second edge 5112, the second row of gold fingers (522, 524, 526, 528, 5210) is arranged near the fourth edge 5114, and each row of gold fingers is aligned in the width direction; the first row of golden fingers (521, 522) is arranged close to the first edge 5111, the fifth row of golden fingers (529, 5210) is arranged close to the third edge 5113, and each row of golden fingers is aligned in the length direction. The first through tenth gold fingers 521 through 5210 may be rectangular. Among them, the first gold finger 521 may be closer to the cut edge 5115 of the card body 51 than the other gold fingers.

Illustratively, the distance between the center of the second row of gold fingers (523, 524) and the first side 5111 may be 1.86mm, the distance between the center of the third row of gold fingers (525, 526) and the first side 5111 may be 4.4mm, the distance between the center of the third row of gold fingers (525, 526) and the third side 5113 may be 4.4mm, and the distance between the center of the fourth row of gold fingers (527, 528) and the third side 5113 may be 1.86mm in the width direction. The distance between the first row of gold fingers (521, 522) and the first edge 5111 may be 0.2mm, and the distance between the fifth row of gold fingers (529, 5210) and the third edge 5113 may be 0.2mm.

Illustratively, the distance between the center of the first row of golden fingers (521, 523, 525, 527, 529) and the second side 5112 may be 2.68mm, and the distance between the center of the second row of golden fingers (522, 524, 526, 528, 5210) and the fourth side 5114 may be 2.0mm in the length direction. Wherein the length of the card body 51 of the second NM card 5 may be 12.3mm.

It is understood that the structural dimensions of the second NM card 5 shown in fig. 20 to 23 are some examples of the second NM card 5, the card interface 52 of the second NM card 5 may have more arrangement and dimensions of gold fingers, and the card interface 52 of the second NM card 5 at least includes the first gold finger 521 to the tenth gold finger 5210, which is not strictly limited in this embodiment of the present application.

The following respectively illustrates the solutions of the UFS interface protocol, the PCIe interface protocol, and the SD interface protocol adopted by the second NM card, and also illustrates a part of circuits of the electronic device that is compatible with the Nano SIM card and the second NM card. The UFS interface protocol, the PCIe interface protocol, and the SD interface protocol can be applied to a second NM card having first to tenth golden fingers, such as the second NM card 5 shown in fig. 17 and fig. 20 to 23 and a second NM card having other card interface structures, and the following embodiments are illustrated by taking the second NM card 5 having the card interface 52 shown in fig. 17 as an example.

In some embodiments, the second NM card 5 employs the UFS interface protocol. The UFS protocol is a standard established by the Joint Electron Device Engineering Council (JEDEC) association for defining electrical interfaces of UFS universal flash memory and UFS storage devices. The UFS defines a complete protocol stack, which is an application layer, a transport layer, and an interconnection layer in sequence from top to bottom. The UFS defines a unique UFS feature set, and uses the feature set of the eMMC standard as a subset, using the MIPI (Mobile Industry Processor 20 Interface) alliance UniPro (Interface) as a data link Layer and MIPI M-PHY (serial Interface) as a physical Layer, which are collectively referred to as an InterConnect Layer (UFS InterConnect Layer). The UFS protocol released version 1.0 since 2011, and then released version 1.1, version 2.0, version 2.1, and version 3.0 in 2012, 2013, 2016, and 2018, respectively, with each version updated with an increase in speed. The UFS protocol is a concatenation after the eMMC protocol version 4.5. The main improvement of the UFS protocol lies in a transmission layer, the UFS protocol adopts differential serial transmission on data signal transmission to support simultaneous reading and writing of data, and meanwhile, because the differential signal has strong anti-interference capability and can provide wider bandwidth, and the eMMC is parallel data transmission, compared with the prior generation protocol standard eMMC, the UFS protocol has the characteristics of high speed and low power consumption. Therefore, the UFS protocol has the characteristics of high speed and low power consumption, and is suitable for electronic equipment such as mobile phones.

Exemplarily, the second NM card 5 comprises at least ten gold fingers, for example, a first gold finger 521 to a tenth gold finger 5210. Among the first through tenth gold fingers 521 through 5210, four gold fingers are used to transmit data signals (RX +, RX-, TX +, TX-), one gold finger is used to transmit a reference clock signal (RCLK, which may also be named REF _ CLK), one gold finger is used to transmit a first power signal (VCC), one gold finger is used to transmit a ground signal (VSS), and one gold finger is used to transmit a second power signal (VCCQ). At this time, the second NM card 5 can support UFS protocol, achieving the basic performance of high-speed card.

Wherein the data signal (RX +) and the data signal (RX-) are input differential signals; the data signal (TX +) and the data signal (TX-) are output differential signals; the first power supply signal (VCC) is responsible for the power supply of the flash particles (i.e. the memory circuit 513) of the second NM card 5; the second power supply signal (VCCQ) is responsible for the power supply of the control circuit 512 of the second NM card 5. Therein, in some embodiments, the second power supply signal (VCCQ) may also be responsible for powering the M-PHY interface, flash memory input output and other internal low voltage circuits of the second NM card 5. Wherein the voltage of the first power supply signal (VCC) may be in a range of 1.7V to 1.95V, or in a range of 2.7V to 3.6V. The voltage of the second power supply signal (VCCQ) may be in a range of 1.1V to 1.3V.

Among the first gold finger 521 to the tenth gold finger 5210, the remaining two gold fingers may be all suspended; or one of the two remaining golden fingers is arranged in a suspended mode, and the other golden finger is used for transmitting a detection signal (C/D); or one of the remaining two golden fingers is used for transmitting a detection signal (C/D), and the other golden finger is used for transmitting other signals; alternatively, the remaining two gold fingers are used to transmit the detection signal (C/D). Wherein, the detection signal (C/D) may be a special data signal, and when the information card is electrically connected to the card connector and communicates with the electronic device, the electronic device may identify whether the inserted information card is the second NM card 5 by the detection signal (C/D); in some embodiments, the electronic device may further identify the version of the inserted second NM card 5 by the detection signal (C/D), or identify the interface protocol of the inserted second NM card 5. The second NM card 5 can reduce the difficulty of the electronic device recognizing the second NM card 5 by transmitting the detection signal (C/D) through at least one of the gold fingers. In other embodiments, one or two of the remaining two gold fingers 521 through 5210 may also be used to transmit other signals.

A first signal arrangement of the second NM card 5 using the UFS interface protocol is exemplified below.

Referring to fig. 24, fig. 24 is a diagram of second NM card 5 of fig. 17 in some embodiments.

Illustratively, the first 521, third 523, ninth 529 and tenth 5210 gold fingers of the second NM card 5 are used to transmit data signals (RX +, RX-, TX +, TX-). The following embodiment is described by taking as an example that the first gold finger 521 is used for transmitting the data signal (RX +), the third gold finger 523 is used for transmitting the data signal (RX-), the ninth gold finger 529 is used for transmitting the data signal (TX +), and the tenth gold finger 5210 is used for transmitting the data signal (TX-). In other embodiments, the data signals transmitted by the first gold finger 521, the third gold finger 523, the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged. For example, the data signals transmitted by the first gold finger 521 and the third gold finger 523 are exchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 are exchanged, which is not described herein again in other embodiments.

Wherein, the second gold finger 522 is used for transmitting a second power signal (VCCQ); the fourth gold finger 524 is used to transmit a reference clock signal (RCLK); the seventh gold finger 527 is used for transmitting a ground signal (VSS); the eighth gold finger 528 is used to transmit the first power supply signal (VCC). Wherein the fifth finger 525 may be used to transmit a detection signal (C/D). Wherein, the sixth gold finger 526 is disposed in the air.

As shown in table 3 below, table 3 is a first table of correspondence between a plurality of resilient sheets of the card connector 11 and a plurality of gold fingers and transmission signals of the Nano SIM card 3, the first NM card 4, and the second NM card 5. When the second NM card 5 is connected to the card connector 11, the first to tenth elastic pieces 11a to 11j of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 521 to 5210 of the second NM card 5, and the third to eighth gold fingers 523 to 528 of the second NM card 5 correspondingly correspond to the first to sixth gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold finger 523 to the tenth gold finger 5210 of the second NM card 5 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 3

In this embodiment, the second NM card 5 arranges the second power signal (VCCQ) required by the UFS protocol on the second gold finger 522, and since the second gold finger 522 of the second NM card 5 has no position corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the second gold finger 522 of the second NM card 5 does not need to share the same spring piece with the Nano SIM card 3 and the first NM card 4 multiplexing card connector 11, so as to avoid the risk that the second power signal (VCCQ) is burned by the second power signal (VCCQ) when the Nano SIM card 3 and the first NM card 4 are inserted into the electronic device 100 and the connecting card connector 11, and the electronic device 100 is highly reliable in compatibility with the Nano SIM card 3, the first NM card 4, and the second NM card 5. In addition, the first NM card 4 and the Nano SIM card 3 do not need to be provided with a high voltage tolerant design for avoiding the circuit from being burned out by the second power supply signal (VCCQ), which can reduce the cost.

The second NM card 5 arranges one of the high-speed data signals (for example, RX +) in the first gold finger 521, and since the first gold finger 521 of the second NM card 5 has no position corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the first elastic sheet 11a is connected to the high-speed data interface of the processor 20 of the electronic device 100, and does not need to be connected to the low-speed data interface, and the processor 20 does not need to switch the interface electrically connected to the first elastic sheet 11a no matter whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, so that the difficulty of switching between the high-speed data interface and the low-speed data interface can be reduced, the circuit of the processor 20 is simplified, and the design difficulty and the cost are reduced.

In addition, since the seventh gold finger 527 of the second NM card 5 corresponds to the position of the fifth finger 325 of the Nano SIM card 3 and corresponds to the position of the fifth finger 425 of the first NM card 4, and is abutted against and electrically connected to the seventh elastic sheet 11g of the card connector 11 when the electronic device 100 is inserted, and the seventh gold finger 527 of the second NM card 5, the fifth finger 325 of the Nano SIM card 3, and the fifth finger 425 of the first NM card 4 are all used for transmitting ground signals (VSS/GND), the processor 20 of the electronic device 100 can be electrically connected to the seventh elastic sheet 11g of the card connector 11 through the same ground interface, and no matter whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the seventh elastic sheet 11g, so that the circuit of the processor 20 can be simplified, and the design difficulty and cost can be reduced.

The eighth gold finger 528 of the second NM card 5 corresponds to the sixth gold finger 326 of the Nano SIM card 3 and corresponds to the sixth gold finger 426 of the first NM card 4, and is abutted against and electrically connected to the eighth elastic piece 11h of the card connector 11 when the electronic device 100 is inserted, and the eighth gold finger 528 of the second NM card 5, the sixth gold finger 326 of the Nano SIM card 3, and the sixth gold finger 426 of the first NM card 4 are all used for transmitting power signals (VCC/VCC, respectively), so that the processor 20 of the electronic device 100 can be electrically connected to the eighth elastic piece 11h of the card connector 11 through the same power interface, and no matter whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the eighth elastic piece 11h, thereby simplifying the circuit of the processor 20 and reducing design difficulty and cost.

The fourth golden finger 524 of the second NM card 5 corresponds to the second golden finger 322 of the Nano SIM card 3 and corresponds to the second golden finger 422 of the first NM card 4, and is abutted against and electrically connected to the fourth elastic piece 11d of the card connector 11 when the electronic device 100 is inserted, the fourth golden finger 524 of the second NM card 5 is used for transmitting a reference clock signal (RCLK), the second golden finger 322 of the Nano SIM card 3 is used for transmitting a clock signal (CLK), the second golden finger 422 of the first NM card 4 is used for transmitting a clock signal (CLK), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 can time-share the fourth elastic piece 11d. The processor 20 can provide clock signals with different frequencies through the fourth elastic sheet 11d without switching data interface signals, thereby simplifying the circuit of the processor 20 and reducing the design complexity and cost. In some scenarios, when the first NM card 4, the second NM card 5, and the Nano SIM card 3 have clock signals with the same frequency, the processor 20 may provide the same clock signals for the three cards, and no switching is required, which further simplifies the design difficulty of the processor 20, for example, the clock frequency is unified to 20 MHz.

The third gold finger 523 of the second NM card 5 corresponds to the first gold finger 321 of the Nano SIM card 3 and corresponds to the first gold finger 421 of the first NM card 4, and is abutted against and electrically connected to the third elastic piece 11c of the card connector 11 when the electronic device 100 is inserted, the third gold finger 523 of the second NM card 5 is used for transmitting a DATA signal (e.g., RX-), the first gold finger 321 of the Nano SIM card 3 is used for a DATA signal (DATA), the first gold finger 421 of the first NM card 4 is used for transmitting a DATA signal (e.g., DATA 1), and the second NM card 5, the Nano SIM card 3, and the first NM card may time-share the third elastic piece 11c.

The fifth finger 525 of the second NM card 5 corresponds to the third finger 323 of the Nano SIM card 3 and corresponds to the third finger 423 of the first NM card 4, and is abutted against and electrically connected to the fifth elastic piece 11e of the card connector 11 when the electronic device 100 is inserted, the fifth finger 525 of the second NM card 5 is used for transmitting a detection signal (C/D), the third finger 323 of the Nano SIM card 3 is used for transmitting a programming voltage/input signal (VPP), the third finger 423 of the first NM card 4 is used for transmitting a command and a response signal (CMD), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 can time-share the fifth elastic piece 11e. Optionally, the programming voltage/input signal (VPP) signal of the Nano SIM card 3 may not be supported, so as to reduce the design difficulty of the processor 20.

The ninth gold finger 529 of the second NM card 5 corresponds to the seventh gold finger 427 of the first NM card 4, and both abut against and are electrically connected to the ninth elastic piece 11i of the card connector 11 when the electronic device 100 is inserted, the ninth gold finger 529 of the second NM card 5 is used for transmitting DATA signals (for example, TX +), the seventh gold finger 427 of the first NM card 4 is used for transmitting DATA signals (for example, DATA 3), and the second NM card 5 and the first NM card 4 can time-division multiplex the ninth elastic piece 11i.

The tenth gold finger 5210 of the second NM card 5 corresponds to the eighth gold finger 428 of the first NM card 4, and both abut against and are electrically connected to the tenth elastic piece 11j of the card connector 11 when the electronic device 100 is inserted, the tenth gold finger 5210 of the second NM card 5 is used for transmitting DATA signals (e.g., TX-), the eighth gold finger 428 of the first NM card 4 is used for transmitting DATA signals (e.g., DATA 2), and the second NM card 5 and the first NM card 4 can multiplex the tenth elastic piece 11j in a time-sharing manner.

When the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5 and not compatible with the first NM card 4, the ninth elastic piece 11i and the tenth elastic piece 11j of the card connector 11 may also be unique elastic pieces of the second NM card 5, the ninth elastic piece 11i and the tenth elastic piece 11j are both connected to the high-speed data interface, and no matter whether the information card inserted into the electronic device 100 is the second NM card 5 or the Nano SIM card 3, the processor 20 does not need to switch the interface electrically connected with the ninth elastic piece 11i and the tenth elastic piece 11j, so that the circuit of the processor 20 can be simplified, and the design difficulty and cost are reduced.

For example, the fourth gold finger 524 and the tenth gold finger 5210 of the second NM card 5 may be electrically connected to a high voltage resistant circuit or a protection switch for preventing the circuit from being burned out when the card interface 52 of the second NM card 5 is short-circuited. Wherein the high voltage tolerant circuitry or the protection switch is located within the package 511 of the second NM card 5. In other embodiments, burning out of the circuitry of the second NM card 5 may also be avoided by providing a high impedance protection circuit within the electronic device, for example by adding a protection circuit within an interface controller of the electronic device.

The time-division multiplexing of a spring piece in the embodiment of the present application may include providing different signals when different information cards are inserted, for example, providing a spring piece, providing a signal corresponding to a gold finger of the first NM card 4 when the first NM card 4 is inserted, providing a signal corresponding to a gold finger of the second NM card 5 when the second NM card 5 is inserted, which is an example scenario of time-division multiplexing.

In other embodiments, the fifth gold finger 525 may be disposed in a floating manner, and the sixth gold finger 526 is used for transmitting C/D signals; alternatively, the fifth gold finger 525 and the sixth gold finger 526 are both suspended.

Referring to fig. 25, fig. 25 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in some embodiments.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the signal arrangement of the card interface 52 of the second NM card 5 is as shown in fig. 24. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, and a second memory card controller 2022, the interface controller 201 is electrically connected to the SIM card controller 203 and the second memory card controller 2022, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 includes a DATA interface for transmitting a DATA signal (DATA), a clock interface for transmitting a clock signal (CLK), a programming voltage/input interface for transmitting a programming voltage/input signal (VPP), and a reset interface for transmitting a Reset Signal (RST). Optionally, the programming voltage/input interface may not be supported, reducing the design difficulty of the processor 20. In fig. 25 and in the subsequent figures and the associated description of the content of the embodiments, the various interfaces of the SIM card controller 203 are illustrated with their transmitted signals being identified.

The second memory card controller 2022 supports the UFS protocol. The second memory card controller 2022 includes four data interfaces for transmitting data signals (RX +, RX-, TX +, TX-), a reference clock interface for transmitting a reference clock signal (RCLK), a second power interface for transmitting a second power signal (VCCQ), and a detection interface for transmitting a detection signal (C/D). In fig. 25 and in the subsequent figures and the associated description of the content of the embodiments, the plurality of interfaces of the second memory card controller 2022 are indicated by the signals it transmits. In other embodiments, the second power interface may be independent from the second memory card controller 2022, which is not strictly limited in this embodiment.

The processor 20 further includes a power interface for transmitting a power signal (VCC) or a first power signal (VCC), and a ground interface for transmitting a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface may be independent of the SIM card controller 203 and the second memory card controller 2022, or may be integrated in the SIM card controller 203 and the second memory card controller 2022 after being separated from each other, which is not limited in this embodiment of the present application. In fig. 25 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 203 and the second memory card controller 2022, and are respectively identified as power and ground.

Illustratively, the interface controller 201 is used to conduct the SIM card controller 203 with the card connector 11, or conduct the second memory card controller 2022 with the card connector 11. The interface controller 201 may include a plurality of switches and wires.

In some embodiments, the interface controller 201 includes a first switch 2011, a second switch 2012, and a third switch 2013.

The first switch 2011 is connected to a DATA interface (e.g., RX-) of the second memory card controller 2022 and a DATA interface (DATA) of the SIM card controller 203, the first switch 2011 is further connected to the third elastic piece 11c of the card connector 11, and the first switch 2011 is configured to connect the third elastic piece 11c to the DATA interface (e.g., RX-) of the second memory card controller 2022 or connect the third elastic piece 11c to the DATA interface (DATA) of the SIM card controller 203.

The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022 and the clock interface (CLK) of the SIM card controller 203, the second switch 2012 is further connected to the fourth spring 11d of the card connector 11, and the second switch 2012 is used for connecting the fourth spring 11d to the reference clock interface (RCLK) of the second memory card controller 2022 or connecting the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

The third switch 2013 is connected to the detection interface (C/D) of the second memory card controller 2022 and the programming voltage/input interface (VPP) of the SIM card controller 203, the third switch 2013 is further connected to the fifth elastic piece 11e of the card connector 11, and the third switch 2013 is used for connecting the fifth elastic piece 11e to the detection interface (C/D) of the second memory card controller 2022 or connecting the fifth elastic piece 11e to the programming voltage/input interface (VPP) of the SIM card controller 203.

The other data interface (e.g., RX +) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11 through the interface controller 201. The second power interface (VCCQ) of the second memory card controller 2022 is electrically connected to the second resilient piece 11b of the card connector 11 through the interface controller 201. The other data interface (e.g., TX +) of the second memory card controller 2022 is electrically connected to the ninth elastic piece 11i of the card connector 11 through the interface controller 201. The other data interface (e.g., TX-) of the second memory card controller 2022 is electrically connected to the tenth elastic piece 11j of the card connector 11 through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201. The reset interface (RST) of the SIM card controller 203 is electrically connected to the sixth elastic piece 11f of the card connector 11 through the interface controller 201.

The interface controller 201 may be connected by a wire to maintain a conducting state between the data interface (e.g., RX +) of the second memory card controller 2022 and the first elastic piece 11a, between the second power interface (VCCQ) of the second memory card controller 2022 and the second elastic piece 11b, between the data interface (e.g., TX +) of the second memory card controller 2022 and the ninth elastic piece 11i, between the data interface (e.g., TX-) of the second memory card controller 2022 and the tenth elastic piece 11j, between the power interface of the processor 20 and the eighth elastic piece 11h, and between the ground interface and the seventh elastic piece 11g, and the interface controller 201 may also be connected in series with a switch to switch between the conducting state and the disconnecting state.

In this embodiment, when the Nano SIM card 3 is inserted into the card socket assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector 11, the interface controller 201 conducts the SIM card controller 203 and the card connector 11, the SIM card controller 203 transmits the DATA signal (DATA), the clock signal (CLK), the transmission programming voltage/input signal (VPP) and the Reset Signal (RST) to the Nano SIM card 3 through the third elastic piece 11c to the sixth elastic piece 11f of the card connector 11, the processor 20 of the electronic device 100 transmits the power signal (VCC) and the ground signal (GND) to the Nano SIM card 3 through the eighth elastic piece 11h and the seventh elastic piece 11g of the card connector 11, and the Nano SIM card 3 communicates with the electronic device 100.

When the second NM card 5 is inserted into the card holder assembly 10 of the electronic device 100 and the second NM card 5 is electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 and the card connector 11, the second memory card controller 2022 transmits the data signal (RX +, RX-, TX +, TX-) and the reference clock signal (RCLK), the second power signal (VCCQ), and the detection signal (C/D) to the second NM card 5 through the first to fifth elastic pieces 11a to 11e, the ninth elastic piece 11i, and the tenth elastic piece 11j of the card connector 11, and the processor 20 of the electronic device 100 transmits the first power signal (VCC) and the ground signal (VSS) to the second NM card 5 through the eighth elastic piece 11h and the seventh elastic piece 11g of the card connector 11, so that the second NM card 5 communicates with the electronic device 100. Thus, the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5.

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the interface controller 201 may not include the third switch 2013, and the detection interface (C/D) of the second memory card controller 2022 is electrically connected to the fifth elastic piece 11e of the card connector 11 through the interface controller 201.

It is understood that when the fifth finger 525 of the second NM card 5 is suspended and the sixth finger 526 is used for transmitting the detection signal (C/D), the interface controller 201 is adapted, for example, the interface controller 201 includes a fourth switch 2014, the third switch 2013 may be omitted, the detection interface (C/D) of the second memory card controller 2022 is connected to the fourth switch 2014, and the interface controller 201 is further configured to turn on the detection interface (C/D) of the second memory card controller 2022 and the sixth resilient tab 11f when the second NM card 5 is inserted into the electronic device 100. When the fifth finger 525 and the sixth finger 526 of the second NM card 5 are both set in the air, the second memory card controller 2022 does not need to set a detection interface, and the interface controller 201 performs adaptive adjustment, for example, the fourth switch 2014 may not be set.

Referring to fig. 26, fig. 26 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in another embodiment.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 24. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021 and a second memory card controller 2022, the SIM card controller 203, the first memory card controller 2021 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 and the second memory card controller 2022 may refer to the related description of the corresponding embodiment in fig. 25, and are not described herein again. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexing interface. The four DATA interfaces are used for transmitting DATA signals (DATA 0, DATA1, DATA2, DATA 3), the clock interface is used for transmitting a clock signal (CLK), and the command and response multiplexing interface is used for transmitting command and response signals (CMD). In fig. 26 and in the subsequent figures and the associated description of the contents of the embodiments, the plurality of interfaces of the first memory card controller 2021 are indicated by signals transmitted by them. Wherein, after the power interface and the ground interface are separated, they can also be integrated into the first memory card controller 2021.

Illustratively, the interface controller 201 is used to conduct the SIM card controller 203 with the card connector 11, or conduct the first memory card controller 2021 with the card connector 11, or conduct the second memory card controller 2022 with the card connector 11. The interface controller 201 may include a plurality of switches and wires.

In some embodiments, interface controller 201 includes a first switch 2011, a second switch 2012, a third switch 2013, a fourth switch 2014, a fifth switch 2015, and a sixth switch 2016.

The first switch 2011 is connected to a DATA interface (e.g., RX-) of the second memory card controller 2022, a DATA interface (e.g., DATA 1) of the first memory card controller 2021, and a DATA interface (DATA) of the SIM card controller 203, the first switch 2011 is further connected to the third elastic piece 11c of the card connector 11, and the first switch 2011 is configured to conduct the third elastic piece 11c and the DATA interface (e.g., RX-) of the second memory card controller 2022, or conduct the third elastic piece 11c and the DATA interface (e.g., DATA 1) of the first memory card controller 2021, or conduct the third elastic piece 11c and the DATA interface (DATA) of the SIM card controller 203.

The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022, the clock interface (CLK) of the first memory card controller 2021, and the clock interface (CLK) of the SIM card controller 203, the second switch 2012 is further connected to the fourth spring 11d of the card connector 11, and the second switch 2012 is used for conducting the fourth spring 11d and the reference clock interface (RCLK) of the second memory card controller 2022, or conducting the third spring 11c and the clock interface (CLK) of the first memory card controller 2021, or conducting the fourth spring 11d and the clock interface (CLK) of the SIM card controller 203.

The third switch 2013 is connected to the detection interface (C/D) of the second memory card controller 2022, the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the programming voltage/input interface (VPP) of the SIM card controller 203, the third switch 2013 is further connected to the fifth elastic piece 11e of the card connector 11, and the third switch 2013 is configured to connect the fifth elastic piece 11e to the detection interface (C/D) of the second memory card controller 2022, or connect the fifth elastic piece 11e to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or connect the fifth elastic piece 11e to the programming voltage/input interface (VPP) of the SIM card controller 203. Optionally, the detection interface (C/D) or the programming voltage/input interface (VPP) may or may not be supported, so as to reduce the difficulty of designing the processor 20.

The fourth switch 2014 is connected to the other DATA interface (e.g., DATA 0) of the first memory card controller 2021 and the reset interface (RST) of the SIM card controller 203, the fourth switch 2014 is further connected to the sixth flip chip 11f of the card connector 11, and the fourth switch 2014 is used for conducting the sixth flip chip 11f and the DATA interface (e.g., DATA 0) of the first memory card controller 2021 or conducting the sixth flip chip 11f and the reset interface (RST) of the SIM card controller 203.

The fifth switch 2015 is connected to another DATA interface (e.g., TX +) of the second memory card controller 2022 and another DATA interface (e.g., DATA 3) of the first memory card controller 2021, the fifth switch 2015 is further connected to a ninth elastic piece 11i of the card connector 11, and the fifth switch 2015 is configured to conduct the ninth elastic piece 11i and the DATA interface (e.g., TX +) of the second memory card controller 2022 or conduct the ninth elastic piece 11i and the DATA interface (e.g., DATA 3) of the first memory card controller 2021.

The sixth switch 2016 is connected to another DATA interface (e.g., TX-) of the second memory card controller 2022 and another DATA interface (e.g., DATA 2) of the first memory card controller 2021, the sixth switch 2016 is further connected to a tenth spring 11j of the card connector 11, and the sixth switch 2016 is configured to conduct the tenth spring 11j to the DATA interface (e.g., TX-) of the second memory card controller 2022 or to conduct the tenth spring 11j to the DATA interface (e.g., DATA 2) of the first memory card controller 2021.

Another data interface (e.g., RX +) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11 through the interface controller 201. The second power interface (VCCQ) of the second memory card controller 2022 is electrically connected to the second resilient piece 11b of the card connector 11 through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201. The interface controller 201 may be connected by setting a conducting wire between the data interface (e.g., RX +) of the second memory card controller 2022 and the first elastic sheet 11a, between the second power interface (VCCQ) and the second elastic sheet 11b, between the power interface of the processor 20 and the eighth elastic sheet 11h, and between the ground interface and the seventh elastic sheet 11g, so as to maintain a conducting state, and the interface controller 201 may also be connected in series with a switch, so as to switch between the conducting state and the disconnecting state through the switch, which is not strictly limited in this embodiment of the present application.

When the first NM card 4 is inserted into the card holder assembly 10 of the electronic apparatus 100 and the first NM card 4 is electrically connected to the card connector 11, the interface controller 201 conducts the first memory card controller 2021 and the card connector 11, the first memory card controller 2021 transmits the DATA signals (DATA 0, DATA1, DATA2, and DATA 3), the clock signal (CLK), and the command and response signal (CMD) to the first NM card 4 through the third, sixth, ninth, and tenth

resilient sheets

11c, 11i, and 11j of the card connector 11, the processor 20 of the electronic apparatus 100 transmits the power signal (VCC) and the ground signal (GND) to the first NM card 4 through the eighth and seventh

resilient sheets

11h, 11g of the card connector 11, and the first NM card 4 communicates with the electronic apparatus 100.

When the second NM card 5 is inserted into the card holder assembly 10 of the electronic device 100 and the second NM card 5 is electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 and the card connector 11, the second memory card controller 2022 transmits the data signal (RX +, RX-, TX +, TX-) and the reference clock signal (RCLK), the second power signal (VCCQ), and the detection signal (C/D) to the second NM card 5 through the first to fifth elastic pieces 11a to 11e, the ninth elastic piece 11i, and the tenth elastic piece 11j of the card connector 11, and the processor 20 of the electronic device 100 transmits the first power signal (VCC) and the ground signal (VSS) to the second NM card 5 through the eighth elastic piece 11h and the seventh elastic piece 11g of the card connector 11, so that the second NM card 5 communicates with the electronic device 100. Thus, the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 5.

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the third switch 2013 is connected to the detection interface (C/D) of the second memory card controller 2022 and the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the third switch 2013 is further connected to the fifth elastic piece 11e of the card connector 11.

It is understood that when the fifth finger 525 of the second NM card 5 is suspended and the sixth finger 526 is used for transmitting the detection signal (C/D), the interface controller 201 is adapted, for example, the detection interface (C/D) of the second memory card controller 2022 is connected to the fourth switch 2014, and the interface controller 201 is further configured to conduct the detection interface (C/D) of the second memory card controller 2022 and the sixth spring 11f when the second NM card 5 is inserted into the electronic device 100. When the fifth finger 525 and the sixth finger 526 of the second NM card 5 are both set in the air, the second memory card controller 2022 does not need to set a detection interface, and the interface controller 201 performs adaptive adjustment.

A second signal arrangement of the second NM card 5 using the UFS interface protocol is exemplified below.

Referring to FIG. 27, FIG. 27 is a diagram of a second NM card 5 of FIG. 17 in another embodiment.

Illustratively, the first gold finger 521, the fifth gold finger 525, the ninth gold finger 529, and the tenth gold finger 5210 of the second NM card 5 are used to transmit data signals. The following embodiment is described by taking as an example that the first gold finger 521 is used to transmit a data signal (RX +), the fifth gold finger 525 is used to transmit a data signal (RX-), the ninth gold finger 529 is used to transmit a data signal (TX +), and the tenth gold finger 5210 is used to transmit a data signal (TX-). In other embodiments, the data signals transmitted by the first gold finger 521, the fifth gold finger 525, the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged with one another. For example, the data signals transmitted by the first gold finger 521 and the fifth gold finger 525 are exchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 are exchanged, which is not described herein again in other embodiments.

Wherein the second gold finger 522 is used for transmitting a second power signal (VCCQ); the fourth gold finger 524 is used to transmit a reference clock signal (RCLK); the seventh gold finger 527 is used for transmitting a ground signal (VSS); the eighth gold finger 528 is used to transmit the first power supply signal (VCC). The third gold finger 523 and the sixth gold finger 526 are arranged in the air.

As shown in table 4 below, table 4 is a second table of correspondence between a plurality of resilient sheets of the card connector 11 and a plurality of golden fingers and transmission signals of the Nano SIM card 3, the first NM card 4, and the second NM card 5. When the second NM card 5 is connected to the card connector 11, the first to tenth elastic pieces 11a to 11j of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 521 to 5210 of the second NM card 5, and the third to eighth gold fingers 523 to 528 of the second NM card 5 correspondingly correspond to the first to sixth gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold finger 523 to the tenth gold finger 5210 of the second NM card 5 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 4

The fifth finger 525 of the second NM card 5 corresponds to the third finger 323 of the Nano SIM card 3 and corresponds to the third finger 423 of the first NM card 4, and is abutted against and electrically connected to the fifth elastic piece 11e of the card connector 11 when the electronic device 100 is inserted, the fifth finger 525 of the second NM card 5 is used for transmitting a data signal (e.g., RX-), the third finger 323 of the Nano SIM card 3 is used for transmitting a programming voltage/input signal (VPP), the third finger 423 of the first NM card 4 is used for transmitting a command and a response signal (CMD), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 may time-share the fifth elastic piece 11e. The high-speed data signal of the fifth finger 525 of the second NM card 5 and the command and response signal (CMD) of the third gold finger 423 of the first NM card 4 multiplex the same elastic piece, and do not multiplex the same elastic piece with the low-speed data signal of the first NM card 4. Optionally, the programming voltage/input signal (VPP) may not be supported to reduce the design difficulty of the processor 20.

In other embodiments, one of the third gold finger 523 and the sixth gold finger 526 may be used for transmitting a detection signal (C/D), and the other may be set in the air or used for transmitting other signals; alternatively, the third gold finger 523 and the sixth gold finger 526 are both used to transmit the detection signal (C/D). The second NM card 5 transmits the detection signal (C/D) through at least one gold finger, which can reduce the difficulty of the electronic apparatus 100 in identifying the second NM card 5. When the third gold finger 523 or the sixth gold finger 526 is used to transmit the detection signal (C/D), the second NM card 5, the Nano SIM card 3, and the first NM card 4 may be correspondingly time-division multiplexed with the third elastic sheet 11C or the sixth elastic sheet 11f.

Referring to fig. 28, fig. 28 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in another embodiment.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 27. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, and a second memory card controller 2022, the SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 includes a DATA interface for transmitting a DATA signal (DATA), a clock interface for transmitting a clock signal (CLK), a programming voltage/input interface for transmitting a programming voltage/input signal (VPP), and a reset interface for transmitting a Reset Signal (RST). In fig. 28 and in subsequent figures and associated description of the content of the embodiments, the various interfaces of the SIM card controller 203 are illustrated with their transmitted signals being identified.

The second memory card controller 2022 includes four data interfaces for transmitting data signals (RX +, RX-, TX +, TX-), a reference clock interface for transmitting a reference clock signal (RCLK), and a second power interface for transmitting a second power signal (VCCQ). In fig. 28 and in subsequent figures and associated description of the contents of the embodiments, the plurality of interfaces of the second memory card controller 2022 are illustrated with their transmitted signals being labeled. In other embodiments, the second power interface may be independent from the second memory card controller 2022, which is not strictly limited in this embodiment.

The processor 20 further includes a power interface for transmitting a power signal (VCC) or a first power signal (VCC), and a ground interface for transmitting a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface may be independent of the SIM card controller 203 and the second memory card controller 2022, or may be integrated in the SIM card controller 203 and the second memory card controller 2022 after being separated from each other, which is not limited in this embodiment of the present application. In fig. 28 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 203 and the second memory card controller 2022, and are respectively identified as power and ground.

In some embodiments, the interface controller 201 includes a first switch 2011 and a second switch 2012.

The first switch 2011 is connected to the reference clock interface (RCLK) of the second memory card controller 2022 and the clock interface (CLK) of the SIM card controller 203, the first switch 2011 is further connected to the fourth elastic piece 11d of the card connector 11, and the first switch 2011 is configured to conduct the fourth elastic piece 11d and the reference clock interface (RCLK) of the second memory card controller 2022, or conduct the fourth elastic piece 11d and the clock interface (CLK) of the SIM card controller 203.

The second switch 2012 is connected to a data interface (e.g., RX-) of the second memory card controller 2022 and a programming voltage/input interface (VPP) of the SIM card controller 203, the second switch 2012 is further connected to a fifth spring 11e of the card connector 11, and the second switch 2012 is used for connecting the fifth spring 11e to the data interface (e.g., RX-) of the second memory card controller 2022 or connecting the fifth spring 11e to the programming voltage/input interface (VPP) of the SIM card controller 203. Optionally, the programming voltage/input interface (VPP) may or may not be supported to reduce the design difficulty of the processor 20.

The other data interface (e.g., RX +) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11 through the interface controller 201. The second power interface (VCCQ) of the second memory card controller 2022 is electrically connected to the second resilient piece 11b of the card connector 11 through the interface controller 201. The other data interface (e.g., TX +) of the second memory card controller 2022 is electrically connected to the ninth elastic piece 11i of the card connector 11 through the interface controller 201. The other data interface (e.g., TX-) of the second memory card controller 2022 is electrically connected to the tenth elastic piece 11j of the card connector 11 through the interface controller 201. The DATA interface (DATA) of the SIM card controller 203 is electrically connected to the third elastic piece 11c of the card connector 11 through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201. The reset interface (RST) of the SIM card controller 203 is electrically connected to the sixth elastic piece 11f of the card connector 11 through the interface controller 201.

The interface controller 201 may be connected by a wire to maintain a conducting state, and the interface controller 201 may also be connected in series with a switch to switch between the conducting state and the disconnecting state through the switch, where the DATA interface (e.g., RX +) of the second memory card controller 2022 and the first elastic sheet 11a, the second power interface (VCCQ) of the second memory card controller 2022 and the second elastic sheet 11b, the DATA interface (e.g., TX +) of the second memory card controller 2022 and the ninth elastic sheet 11i, the DATA interface (e.g., TX-) of the second memory card controller 2022 and the tenth elastic sheet 11j, the DATA interface (DATA) of the SIM card controller 203 and the third elastic sheet 11c, the power interface of the processor 20 and the eighth elastic sheet 11h, and the ground interface and the seventh elastic sheet 11g are not limited in this embodiment of the application.

When the second NM card 5 is inserted into the card holder assembly 10 of the electronic device 100 and the second NM card 5 is electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 and the card connector 11, the second memory card controller 2022 transmits the data signal (RX +, RX-, TX +, TX-), the reference clock signal (RCLK), and the second power signal (VCCQ) to the second NM card 5 through the first, second, fourth, fifth, ninth, and tenth

resilient sheets

11a, 11b, 11d, 11e, 11i, and 11j of the card connector 11, the processor 20 of the electronic device 100 transmits the first power signal (VCC) and the ground signal (VSS) to the second NM card 5 through the eighth and seventh

resilient sheets

11h and 11g of the card connector 11, and the second NM card 5 communicates with the electronic device 100. Thus, the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5.

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the interface controller 201 may not include the second switch 2012, and a data interface (e.g., RX-) of the second memory card controller 2022 is electrically connected to the fifth elastic piece 11e of the card connector 11 through the interface controller 201.

Referring to fig. 29, fig. 29 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in another embodiment.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 27. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021 and a second memory card controller 2022, the SIM card controller 203, the first memory card controller 2021 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 and the second memory card controller 2022 may refer to the related description of the corresponding embodiment in fig. 28, and are not described herein again. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexing interface. The four DATA interfaces are used for transmitting DATA signals (DATA 0, DATA1, DATA2, DATA 3), the clock interface is used for transmitting a clock signal (CLK), and the command and response multiplexing interface is used for transmitting command and response signals (CMD). In fig. 29 and in subsequent figures and associated description of the contents of the embodiments, the plurality of interfaces of the first memory card controller 2021 are illustrated with signals transmitted by them. Wherein, after the power interface and the ground interface are separated, they can also be integrated into the first memory card controller 2021.

The first switch 2011 is connected to the reference clock interface (RCLK) of the second memory card controller 2022, the clock interface (CLK) of the first memory card controller 2021, and the clock interface (CLK) of the SIM card controller 203, the first switch 2011 is further connected to the fourth elastic piece 11d of the card connector 11, and the first switch 2011 is configured to conduct the fourth elastic piece 11d and the reference clock interface (RCLK) of the second memory card controller 2022, or conduct the third elastic piece 11c and the clock interface (CLK) of the first memory card controller 2021, or conduct the fourth elastic piece 11d and the clock interface (CLK) of the SIM card controller 203.

The second switch 2012 is connected to a data interface (e.g., RX-), a command and response multiplexing interface (CMD) of the second memory card controller 2022, and a programming voltage/input interface (VPP) of the SIM card controller 203 of the second memory card controller 2022, the second switch 2012 is further connected to a fifth spring 11e of the card connector 11, and the second switch 2012 is used to conduct the fifth spring 11e and the data interface (e.g., RX-) of the second memory card controller 2022, or conduct the command and response multiplexing interface (CMD) of the fifth spring 11e and the first memory card controller 2021, or conduct the fifth spring 11e and the programming voltage/input interface (VPP) of the SIM card controller 203.

The third switch 2013 is connected to a DATA interface (e.g., DATA 1) of the first memory card controller 2021 and a DATA interface (DATA) of the SIM card controller 203, the third switch 2013 is further connected to a third elastic piece 11c of the card connector 11, and the third switch 2013 is used for conducting the third elastic piece 11c and the DATA interface (e.g., DATA 1) of the first memory card controller 2021 or conducting the third elastic piece 11c and the DATA interface (DATA) of the SIM card controller 203.

resilient sheets

11h and 11g of the card connector 11, and the second NM card 5 communicates with the electronic device 100. Thus, the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 5.

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the second switch 2012 is connected to a data interface (e.g., RX-) of the second memory card controller 2022 and a command and response multiplexing interface (CMD) of the first memory card controller 2021, and the second switch 2012 is further connected to the fifth spring 11e of the card connector 11.

It is understood that, when the third gold finger 523 or the sixth gold finger 526 of the second NM card 5 is used to transmit the detection signal (C/D), in the electronic device 100 compatible with the second NM card 5, the second memory card controller 2022 further includes a detection interface, the detection interface is used to transmit the detection signal (C/D), and the interface controller 201 is further used to conduct the detection interface and the corresponding third elastic sheet 11C or sixth elastic sheet 11f when the second NM card 5 is inserted into the electronic device 100. The interface controller 201 is connected to the third elastic piece 11c or the sixth elastic piece 11f through a switch, and the switch is further connected to the detection interface of the second memory card controller 2022.

A third signal arrangement of the second NM card 5 using the UFS interface protocol is exemplified below.

Referring to fig. 30, fig. 30 is a schematic diagram of the second NM card 5 of fig. 17 in another embodiment.

Wherein the second gold finger 522 is used for transmitting a second power signal (VCCQ); the sixth gold finger 526 is used to transmit the reference clock signal (RCLK); the seventh gold finger 527 is used for transmitting a ground signal (VSS); the eighth gold finger 528 is used to transmit the first power supply signal (VCC). The third gold finger 523 and the fourth gold finger 524 are disposed in the air.

As shown in table 5 below, table 5 is a third table of correspondence between a plurality of elastic pieces of the card connector 11 and a plurality of golden fingers and transmission signals of the Nano SIM card 3, the first NM card 4, and the second NM card 5. When the second NM card 5 is connected to the card connector 11, the first to tenth elastic pieces 11a to 11j of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 521 to 5210 of the second NM card 5, and the third to eighth gold fingers 523 to 528 of the second NM card 5 correspondingly correspond to the first to sixth gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold finger 523 to the tenth gold finger 5210 of the second NM card 5 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 5

The fifth finger 525 of the second NM card 5 corresponds to the third finger 323 of the Nano SIM card 3 and corresponds to the third finger 423 of the first NM card 4, and is abutted against and electrically connected to the fifth elastic piece 11e of the card connector 11 when the electronic device 100 is inserted, the fifth finger 525 of the second NM card 5 is used for transmitting a data signal (e.g., RX-), the third finger 323 of the Nano SIM card 3 is used for transmitting a programming voltage/input signal (VPP), the first finger 421 of the first NM card 4 is used for transmitting a command and a response signal (CMD), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 may time-share the fifth elastic piece 11e.

The sixth gold finger 526 of the second NM card 5 corresponds to the fourth gold finger 324 of the Nano SIM card 3 and corresponds to the fourth gold finger 424 of the first NM card 4, and is abutted against and electrically connected to the sixth elastic piece 11f of the card connector 11 when the electronic device 100 is inserted, the sixth gold finger 526 of the second NM card 5 is used for transmitting a reference clock signal (RCLK), the fourth gold finger 324 of the Nano SIM card 3 is used for transmitting a Reset Signal (RST), the fourth gold finger 424 of the first NM card 4 is used for transmitting a DATA signal (e.g., DATA 0), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 can time-share the sixth elastic piece 11f.

For example, the fourth gold finger 524 and the tenth gold finger 5210 of the second NM card 5 may be electrically connected to a high voltage resistant circuit or a protection switch for preventing the circuit from being burned out when the card interface 52 of the second NM card 5 is short-circuited. Wherein the high voltage tolerant circuitry or the protection switch is located within the package 511 of the second NM card 5. When the fourth gold finger 524 is disposed in the air, and the interface of the second NM card 5 is not formed, the fourth gold finger 524 may not be electrically connected to the high voltage tolerant circuit or the protection switch. In other embodiments, burning out of the circuitry of the second NM card 5 may also be avoided by providing a high impedance protection circuit within the electronic device, for example by adding a protection circuit within an interface controller of the electronic device.

In this embodiment, when the third gold finger 523 and the fourth gold finger 524 of the second NM card 5 are suspended, the interface connection circuits corresponding to the third elastic piece 11c and the fourth elastic piece 11d of the electrical connector are simplified, so that the electronic device 100 is more easily compatible with the Nano SIM card 3 and the second NM card 5. In other embodiments, one of the third gold finger 523 and the fourth gold finger 524 may be used for transmitting a detection signal (C/D), and the other may be set in the air or used for transmitting other signals; alternatively, the third gold finger 523 and the fourth gold finger 524 are both used to transmit the detection signal (C/D). The second NM card 5 transmits the detection signal (C/D) through at least one gold finger, which can reduce the difficulty of the electronic apparatus 100 in identifying the second NM card 5. When the third gold finger 523 or the fourth gold finger 524 is used to transmit the detection signal (C/D), the second NM card 5, the Nano SIM card 3, and the first NM card 4 may be correspondingly time-division multiplexed with the third elastic sheet 11C or the fourth elastic sheet 11D.

Referring to fig. 31, fig. 31 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in other embodiments.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 30. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, and a second memory card controller 2022, the SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 includes a DATA interface for transmitting a DATA signal (DATA), a clock interface for transmitting a clock signal (CLK), a programming voltage/input interface for transmitting a programming voltage/input signal (VPP), and a reset interface for transmitting a Reset Signal (RST). In fig. 31 and in the subsequent figures and the associated description of the contents of the embodiments, the multiple interfaces of the SIM card controller 203 are illustrated with their transmitted signals being identified.

The second memory card controller 2022 includes four data interfaces for transmitting data signals (RX +, RX-, TX +, TX-), a reference clock interface for transmitting a reference clock signal (RCLK), and a second power interface for transmitting a second power signal (VCCQ). In fig. 31 and in the subsequent figures and the associated description of the contents of the embodiments, the plurality of interfaces of the second memory card controller 2022 are indicated by signals transmitted by them. In other embodiments, the second power interface may be independent from the second memory card controller 2022, which is not strictly limited in this embodiment.

The processor 20 further includes a power interface for transmitting a power signal (VCC) or a first power signal (VCC), and a ground interface for transmitting a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface may be independent of the SIM card controller 203 and the second memory card controller 2022, or may be integrated in the SIM card controller 203 and the second memory card controller 2022 after being separated from each other, which is not limited in this embodiment of the present application. In fig. 31 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 203 and the second memory card controller 2022, and are respectively identified as power and ground.

The first switch 2011 is connected to a data interface (e.g., RX-) of the second memory card controller 2022 and a programming voltage/input interface (VPP) of the SIM card controller 203, the first switch 2011 is further connected to the fifth elastic piece 11e of the card connector 11, and the first switch 2011 is used for conducting the fifth elastic piece 11e and the data interface (e.g., RX-) of the second memory card controller 2022 or conducting the fifth elastic piece 11e and the programming voltage/input interface (VPP) of the SIM card controller 203.

The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022 and the reset interface (RST) of the SIM card controller 203, the second switch 2012 is further connected to the sixth spring 11f of the card connector 11, and the second switch 2012 is used for conducting the sixth spring 11f and the reference clock interface (RCLK) of the second memory card controller 2022 or conducting the sixth spring 11f and the reset interface (RST) of the SIM card controller 203.

The other data interface (e.g., RX +) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11 through the interface controller 201. The second power interface (VCCQ) of the second memory card controller 2022 is electrically connected to the second resilient piece 11b of the card connector 11 through the interface controller 201. The other data interface (e.g., TX +) of the second memory card controller 2022 is electrically connected to the ninth elastic piece 11i of the card connector 11 through the interface controller 201. The other data interface (e.g., TX-) of the second memory card controller 2022 is electrically connected to the tenth elastic piece 11j of the card connector 11 through the interface controller 201. The DATA interface (DATA) of the SIM card controller 203 is electrically connected to the third elastic piece 11c of the card connector 11 through the interface controller 201. The clock interface (CLK) of the SIM card controller 203 is electrically connected to the fourth elastic piece 11d of the card connector 11 through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201.

The interface controller 201 may be connected by a wire to maintain a conducting state, and the interface controller 201 may also be connected in series with a switch to realize switching between a conducting state and a disconnecting state through the switch, between the DATA interface (e.g., RX +) of the second memory card controller 2022 and the first elastic sheet 11a, between the second power interface (VCCQ) of the second memory card controller 2022 and the second elastic sheet 11b, between the DATA interface (e.g., TX +) of the second memory card controller 2022 and the ninth elastic sheet 11i, between the DATA interface (e.g., TX-) of the second memory card controller 2022 and the tenth elastic sheet 11j, between the DATA interface (DATA) of the SIM card controller 203 and the third elastic sheet 11c, between the clock interface (CLK) of the SIM card controller 203 and the fourth elastic sheet 11d, between the power interface of the processor 20 and the eighth elastic sheet 11h, and between the ground interface and the seventh elastic sheet 11 g.

When the second NM card 5 is inserted into the card holder assembly 10 of the electronic device 100 and the second NM card 5 is electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 and the card connector 11, the second memory card controller 2022 transmits the data signal (RX +, RX-, TX +, TX-), the reference clock signal (RCLK), and the second power signal (VCCQ) to the second NM card 5 through the first, second, fifth, sixth, ninth, and tenth

resilient sheets

11a, 11b, 11e, 11f, 11i, and 11j of the card connector 11, the processor 20 of the electronic device 100 transmits the first power signal (VCC) and the ground signal (VSS) to the second NM card 5 through the eighth and seventh

resilient sheets

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the interface controller 201 may not include the first switch 2011, and a data interface (e.g., RX-) of the second memory card controller 2022 is connected to the fifth elastic piece 11e of the card connector 11 through the interface controller 201.

Referring to fig. 32, fig. 32 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in another embodiment.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 30. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021 and a second memory card controller 2022, the SIM card controller 203, the first memory card controller 2021 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 and the second memory card controller 2022 may refer to the related description of the corresponding embodiment in fig. 31, and are not repeated herein. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexing interface. The four DATA interfaces are used for transmitting DATA signals (DATA 0, DATA1, DATA2, DATA 3), the clock interface is used for transmitting a clock signal (CLK), and the command and response multiplexing interface is used for transmitting command and response signals (CMD). In fig. 31 and in the subsequent figures and the associated description of the contents of the embodiments, the plurality of interfaces of the first memory card controller 2021 are indicated by signals transmitted by them. Wherein, after the power interface and the ground interface are separated, they can also be integrated into the first memory card controller 2021.

The first switch 2011 is connected to a data interface (e.g., RX-), a command and response multiplexing interface (CMD) of the second memory card controller 2022, and a programming voltage/input interface (VPP) of the SIM card controller 203 of the second memory card controller 2022, the first switch 2011 is further connected to the fifth elastic piece 11e of the card connector 11, and the first switch 2011 is used to connect the fifth elastic piece 11e to the data interface (e.g., RX-) of the second memory card controller 2022, or connect the fifth elastic piece 11e to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or connect the fifth elastic piece 11e to the programming voltage/input interface (VPP) of the SIM card controller 203.

The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022, a DATA interface (e.g., DATA 0) of the first memory card controller 2021, and the reset interface (RST) of the SIM card controller 203, the second switch 2012 is further connected to the sixth elastic piece 11f of the card connector 11, and the second switch 2012 is used for conducting the sixth elastic piece 11f and the reference clock interface (RCLK) of the second memory card controller 2022, or conducting the sixth elastic piece 11f and the DATA interface (e.g., DATA 0) of the first memory card controller 2021, or conducting the sixth elastic piece 11f and the reset interface (RST) of the SIM card controller 203.

The third switch 2013 is connected to another DATA interface (e.g., DATA 1) of the first memory card controller 2021 and the DATA interface (DATA) of the SIM card controller 203, the third switch 2013 is further connected to the third elastic piece 11c of the card connector 11, and the third switch 2013 is used for conducting the third elastic piece 11c and the DATA interface (e.g., DATA 1) of the first memory card controller 2021 or conducting the third elastic piece 11c and the DATA interface (DATA) of the SIM card controller 203.

The fourth switch 2014 is connected to the clock interface (CLK) of the first memory card controller 2021 and the clock interface (CLK) of the SIM card controller 203, the fourth switch 2014 is further connected to the fourth spring 11d of the card connector 11, and the fourth switch 2014 is used for conducting the fourth spring 11d to the clock interface (CLK) of the first memory card controller 2021 or conducting the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

resilient sheets

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the first switch 2011 is connected to a data interface (e.g., RX-) of the second memory card controller 2022 and a command and response multiplexing interface (CMD) of the first memory card controller 2021, and the first switch 2011 is also connected to the fifth elastic piece 11e of the card connector 11.

It can be understood that, when the third gold finger 523 or the fourth gold finger 524 of the second NM card 5 is used for transmitting the detection signal (C/D), in the electronic device 100 compatible with the second NM card 5, the second memory card controller 2022 further includes a detection interface, the detection interface is used for transmitting the detection signal (C/D), and the interface controller 201 is further used for conducting the detection interface and the corresponding third elastic piece 11C or sixth elastic piece 11f when the second NM card 5 is inserted into the electronic device 100. The interface controller 201 is connected to the third elastic piece 11c or the fourth elastic piece 11d through a switch, and the switch is further connected to the detection interface of the second memory card controller 2022.

In some embodiments, the second NM card employs a PCIe interface protocol. PCIe, also known as PCI Express, is a layered protocol consisting of a transaction layer, a data link layer, and a physical layer. Its main advantages are high data transmission rate, high anti-interference power, long transmission distance and low power consumption. The transmission mode of the PCI Express is changed from parallel to serial of the PCI, and differential transmission is used. The transmission mode transmits the same content through a positive mirror and a negative mirror to improve the efficiency of finding and correcting the interference, and the PCI Express can adopt full duplex, so that the transmission efficiency of the PCI Express is greatly improved compared with that of the PCI. Since 2001, PCI Express was updated from version 1.0 to version 5.0 in 20 years and will be formally updated to version 6.0 in 2021, certainly PCI Express is a popular transport bus standard. For PCIe1.0, the bandwidth is nearly twice that of PCI, while PCI express6.0, which is planned to be released in 2021, has a bandwidth up to 256GB/s. In 2018, SD Association formally announced that SD (Secure Digital) cards are compatible with PCI Express channels, which is a reality compatible with mobile memory cards, and for NM cards, PCI Express has the advantage of providing large bandwidth.

Exemplarily, the second NM card 5 includes at least ten gold fingers, for example, the first to tenth gold fingers 521 to 5210. Among the first through tenth gold fingers 521 through 5210, four gold fingers are used to transmit data signals (RX +, RX-, TX +, TX-), two gold fingers are used to transmit clock signals (CLK +, CLK-), one gold finger is used to transmit a first power signal (VDD 1), one gold finger is used to transmit a ground signal (VSS), and one gold finger is used to transmit a second power signal (VDD 2). Among the first gold finger 521 to the tenth gold finger 5210, one of the gold fingers may be suspended. At this time, the second NM card 5 can support the PCIe interface protocol, realizing the basic performance of the high-speed card.

Wherein the data signal (RX +) and the data signal (RX-) are input differential signals; the data signal (TX +) and the data signal (TX-) are output differential signals; the clock signal (CLK +) and the clock signal (CLK-) are differential low voltage clock signals. The first power supply signal (VDD 1) is responsible for the power supply of the memory circuit 513 of the second NM card 5; the second power supply signal (VDD 2) is responsible for the power supply of the control circuit 512 of the second NM card 5. Wherein the voltage of the first power supply signal (VDD 1) is higher than the voltage of the second power supply signal (VDD 2). For example, the voltage of the first power signal (VDD 1) may be in the range of 2.7V to 3.6V, and the voltage of the second power signal (VDD 2) may be in the range of 1.70V to 1.95V.

In other embodiments, one of the first through tenth gold fingers 521 through 5210 is not suspended for transmitting the detection signal (C/D). Wherein, the detection signal (C/D) may be a special data signal, and when the information card is electrically connected to the card connector 11 and communicates with the electronic apparatus 100, the electronic apparatus 100 may identify whether the inserted information card is the second NM card 5 by the detection signal (C/D); in some embodiments, the electronic device 100 may further identify the version of the inserted second NM card 5 by the detection signal (C/D), or identify an interface protocol of the inserted second NM card 5. The second NM card 5 transmits the detection signal (C/D) through one of the gold fingers, which can reduce the difficulty of the electronic apparatus 100 in identifying the second NM card 5.

The following illustrates a first signal arrangement of the second NM card 5 using the PCIe interface protocol.

Referring to fig. 33, fig. 33 is a schematic diagram of the second NM card 5 shown in fig. 17 in other embodiments.

Illustratively, the third gold finger 523, the sixth gold finger 526, the ninth gold finger 529, and the tenth gold finger 5210 of the second NM card 5 are used to transmit data signals. The following embodiment is described by taking as an example that the third gold finger 523 is used for transmitting the data signal (RX-), the sixth gold finger 526 is used for transmitting the data signal (RX +), the ninth gold finger 529 is used for transmitting the data signal (TX +), and the tenth gold finger 5210 is used for transmitting the data signal (TX-). In other embodiments, the data signals transmitted by the third gold finger 523, the sixth gold finger 526, the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged with each other. For example, the data signals transmitted by the third gold finger 523 and the sixth gold finger 526 are exchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 are exchanged, which is not described herein again in other embodiments.

The second gold finger 522 and the fifth gold finger 525 are used for transmitting clock signals. The following embodiments are described by taking the second gold finger 522 for transmitting the clock signal (CLK-) and the fifth gold finger 525 for transmitting the clock signal (CLK +). In other embodiments, the clock signals transmitted by the second gold finger 522 and the fifth gold finger 525 can be interchanged.

The first gold finger 521 is used for transmitting a second power signal (VDD 2); the seventh gold finger 527 is used for transmitting a ground signal (VSS); the eighth gold finger 528 is used to transmit the first power signal (VDD 1). The fourth gold finger 524 is disposed in the air.

As shown in table 6 below, table 6 is a table four of correspondence between the plurality of resilient sheets of the card connector 11 and the plurality of gold fingers and transmission signals of the Nano SIM card 3, the first NM card 4, and the second NM card 5. When the second NM card 5 is connected to the card connector 11, the first to tenth elastic pieces 11a to 11j of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 521 to 5210 of the second NM card 5, and the third to eighth gold fingers 523 to 528 of the second NM card 5 correspondingly correspond to the first to sixth gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold finger 523 to the tenth gold finger 5210 of the second NM card 5 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 6

In this embodiment, the second NM card 5 arranges the second power signal (VDD 2) required by the PCIe protocol in the first gold finger 521, because the first gold finger 521 of the second NM card 5 has no position corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the first gold finger 521 of the second NM card 5 does not need to share the same spring piece with the multiplexing card connector 11 of the Nano SIM card 3 and the first NM card 4, so as to avoid the risk that the second power signal (VDD 2) and the data signals of the Nano SIM card 3 and the first NM card 4 share the same spring piece, so as to reduce the risk of being burned by the second power signal (VDD 2) when the Nano SIM card 3 and the first NM card 4 are inserted into the electronic device 100 and connected to the card connector 11, and the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4, and the second NM card 5 and has higher reliability. In addition, the first NM card 4 and the Nano SIM card 3 do not need to be provided with a high voltage tolerant design for avoiding the circuit from being burned out by the second power signal (VDD 2), which can reduce the cost.

The second NM card 5 arranges one of the clock signals (e.g., CLK-) in the second gold finger 522, and since the second gold finger 522 of the second NM card 5 has no position corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the processor 20 does not need to switch the interface electrically connected with the first elastic piece 11a no matter whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3 or the first NM card 4, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

The eighth gold finger 528 of the second NM card 5 corresponds to the sixth gold finger 326 of the Nano SIM card 3 and corresponds to the sixth gold finger 426 of the first NM card 4, and is abutted against and electrically connected to the eighth elastic piece 11h of the card connector 11 when the electronic device 100 is inserted, and the eighth gold finger 528 of the second NM card 5, the sixth gold finger 326 of the Nano SIM card 3, and the sixth gold finger 426 of the first NM card 4 are all used for transmitting power signals (VDD 1/VCC, respectively), so that the processor 20 of the electronic device 100 can be electrically connected to the eighth elastic piece 11h of the card connector 11 through the same power interface, and no matter whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the eighth elastic piece 11h, thereby simplifying the circuit of the processor 20 and reducing design difficulty and cost.

The third gold finger 523 of the second NM card 5 corresponds to the first gold finger 321 of the Nano SIM card 3 and corresponds to the first gold finger 421 of the first NM card 4, and is abutted against and electrically connected to the third elastic piece 11c of the card connector 11 when the electronic device 100 is inserted, the third gold finger 523 of the second NM card 5 is used for transmitting a DATA signal (e.g., RX-), the first gold finger 321 of the Nano SIM card 3 is used for a DATA signal (DATA), the first gold finger 421 of the first NM card 4 is used for transmitting a DATA signal (e.g., DATA 1), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 may time-share the third elastic piece 11c.

The fifth finger 525 of the second NM card 5 corresponds to the third finger 323 of the Nano SIM card 3 and corresponds to the third finger 423 of the first NM card 4, and is abutted against and electrically connected to the fifth elastic piece 11e of the card connector 11 when the electronic device 100 is inserted, the fifth finger 525 of the second NM card 5 is used to transmit another clock signal (e.g., CLK +), the third finger 323 of the Nano SIM card 3 is used to transmit a programming voltage/input signal (VPP), the first finger 421 of the first NM card 4 is used to transmit a command and a response signal (CMD), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 may time-share the fifth elastic piece 11e.

The sixth gold finger 526 of the second NM card 5 corresponds to the fourth gold finger 324 of the Nano SIM card 3 and corresponds to the fourth gold finger 424 of the first NM card 4, and is abutted against and electrically connected to the sixth elastic piece 11f of the card connector 11 when the electronic device 100 is inserted, the sixth gold finger 526 of the second NM card 5 is used for transmitting another DATA signal (e.g., RX +), the fourth gold finger 324 of the Nano SIM card 3 is used for transmitting a Reset Signal (RST), the fourth gold finger 424 of the first NM card 4 is used for transmitting a DATA signal (e.g., DATA 0), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 may time-share the sixth elastic piece 11f.

For example, the third gold finger 523 and the tenth gold finger 5210 of the second NM card 5 may be electrically connected to a high voltage resistant circuit or a protection switch for avoiding burning out the circuit when the card interface 52 of the second NM card 5 is short-circuited. Wherein the high voltage tolerant circuitry or the protection switch is located within the package 511 of the second NM card 5. In other embodiments, burning out of the circuitry of the second NM card 5 may also be avoided by providing a high impedance protection circuit within the electronic device, for example by adding a protection circuit within an interface controller of the electronic device.

In some other embodiments, the fourth gold finger 524 may not be disposed in the air for transmitting the detection signal (C/D).

In other embodiments, the second gold finger 522 of the second NM card 5 is floating or used to transmit the detection signal (C/D), and the fourth gold finger 524 is used to transmit the clock signal (e.g., CLK-). The clock signals transmitted by the fourth gold finger 524 and the fifth gold finger 525 may be interchanged.

Referring to fig. 34, fig. 34 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in another embodiment.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 33. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, and a second memory card controller 2022, the SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 includes a DATA interface for transmitting a DATA signal (DATA), a clock interface for transmitting a clock signal (CLK), a programming voltage/input interface for transmitting a programming voltage/input signal (VPP), and a reset interface for transmitting a Reset Signal (RST). In fig. 34 and in the subsequent figures and the associated description of the content of the embodiments, the multiple interfaces of the SIM card controller 203 are illustrated with their transmitted signals being identified.

The second memory card controller 2022 comprises four data interfaces for transmitting data signals (RX +, RX-, TX +, TX-), two clock interfaces for transmitting clock signals (CLK +, CLK-), and a second power interface for transmitting a second power signal (VDD 2). In fig. 34 and in subsequent figures and associated description of the contents of the embodiments, the plurality of interfaces of the second memory card controller 2022 are illustrated by signals transmitted by them. In other embodiments, the second power interface may be independent from the second memory card controller 2022, which is not strictly limited in this embodiment.

The processor 20 further includes a power interface for transmitting a power signal (VCC) or a first power signal (VDD 1), and a ground interface for transmitting a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface may be independent of the SIM card controller 203 and the second memory card controller 2022, or may be integrated in the SIM card controller 203 and the second memory card controller 2022 after being separated from each other, which is not limited in this embodiment of the present application. In fig. 34 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 203 and the second memory card controller 2022, and are respectively identified as power and ground.

The first switch 2011 is connected to a DATA interface (e.g., RX-) of the second memory card controller 2022 and a DATA interface (DATA) of the SIM card controller 203, the first switch 2011 is further connected to the third elastic piece 11c of the card connector 11, and the first switch 2011 is configured to conduct the third elastic piece 11c and the DATA interface (e.g., RX-) of the second memory card controller 2022, or conduct the third elastic piece 11c and the DATA interface (DATA) of the SIM card controller 203.

The second switch 2012 is connected to one of the clock interfaces (e.g., CLK +) of the second memory card controller 2022 and the programming voltage/input interface (VPP) of the SIM card controller 203, the second switch 2012 is further connected to the fifth spring 11e of the card connector 11, and the second switch 2012 is used for connecting the fifth spring 11e to the clock interface (e.g., CLK +) of the second memory card controller 2022 or connecting the fifth spring 11e to the programming voltage/input interface (VPP) of the SIM card controller 203.

The third switch 2013 is connected to another data interface (e.g., RX +) of the second memory card controller 2022 and the reset interface (RST) of the SIM card controller 203, the third switch 2013 is further connected to the sixth elastic piece 11f of the card connector 11, and the third switch 2013 is used for conducting the sixth elastic piece 11f and the data interface (e.g., RX +) of the second memory card controller 2022 or conducting the sixth elastic piece 11f and the reset interface (RST) of the SIM card controller 203.

The second power interface (VDD 2) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11 through the interface controller 201. The other clock interface (e.g., CLK-) of the second memory card controller 2022 is electrically connected to the second elastic piece 11b of the card connector 11 through the interface controller 201. The other data interface (e.g., TX +) of the second memory card controller 2022 is electrically connected to the ninth elastic piece 11i of the card connector 11 through the interface controller 201. The other data interface (e.g., TX-) of the second memory card controller 2022 is electrically connected to the tenth elastic piece 11j of the card connector 11 through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201. The clock interface (CLK) of the SIM card controller 203 is electrically connected to the fourth elastic piece 11d of the card connector 11 through the interface controller 201.

The interface controller 201 may be connected by a wire to maintain a conducting state, and the interface controller 201 may also be connected in series with a switch to switch between the conducting state and the disconnecting state through the switch, where the embodiment of the present application is not limited strictly to this embodiment, and the interface controller 201 may be connected in series with a switch to realize the switching between the conducting state and the disconnecting state between the second power interface (VDD 2) of the second memory card controller 2022 and the first elastic piece 11a, between the clock interface (e.g. CLK-) of the second memory card controller 2022 and the second elastic piece 11b, between the clock interface (CLK) of the SIM card controller 203 and the fourth elastic piece 11d, between the data interface (e.g. TX +) of the second memory card controller 2022 and the ninth elastic piece 11i, between the data interface (e.g. TX-) of the second memory card controller 2022 and the tenth elastic piece 11j, between the power interface of the processor 20 and the eighth elastic piece 11h, and between the ground interface and the seventh elastic piece 11 g.

When the second NM card 5 is inserted into the card holder assembly 10 of the electronic device 100 and the second NM card 5 is electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 and the card connector 11, the second memory card controller 2022 transmits the data signal (RX +, RX-, TX +, TX-), the clock signal (CLK +, CLK-), and the second power signal (VDD 2) to the second NM card 5 through the first to third, fifth, and sixth, ninth, and tenth spring strips 11a to 11f, 11i, and 11j of the card connector 11, and the processor 20 of the electronic device 100 transmits the first power signal (VDD 1) and the ground signal (VSS) to the second NM card 5 through the eighth and seventh spring strips 11h and 11g of the card connector 11, and the second NM card 5 communicates with the electronic device 100. Thus, the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5.

It can be understood that, when the fourth gold finger 524 of the second NM card 5 is used for transmitting the detection signal (C/D), the interface controller 201 is adapted, and the interface controller 201 is further configured to conduct the detection interface (C/D) of the second memory card controller 2022 and the fourth elastic sheet 11D when the second NM card 5 is inserted into the electronic device 100.

In some other embodiments, when the second gold finger 522 of the second NM card 5 is suspended and the fourth gold finger 524 is used for transmitting a clock signal (e.g., CLK-), the interface controller 201 performs an adaptive adjustment, and the interface controller 201 is further configured to turn on the clock interface (e.g., CLK-) of the second memory card controller 2022 and the fourth spring 11d when the second NM card 5 is inserted into the electronic device 100.

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the interface controller 201 may not include the second switch 2012, and a clock interface (e.g., CLK +) of the second memory card controller 2022 is electrically connected to the fifth elastic piece 11e of the card connector 11 through the interface controller 201.

Referring to fig. 35, fig. 35 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in other embodiments.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 33. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021 and a second memory card controller 2022, the SIM card controller 203, the first memory card controller 2021 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 and the second memory card controller 2022 may refer to the related description of the embodiment shown in fig. 34, and are not repeated herein. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexing interface. The four DATA interfaces are used for transmitting DATA signals (DATA 0, DATA1, DATA2, DATA 3), the clock interface is used for transmitting a clock signal (CLK), and the command and response multiplexing interface is used for transmitting command and response signals (CMD). In fig. 35 and in the subsequent figures and the associated description of the contents of the embodiments, the plurality of interfaces of the first memory card controller 2021 are indicated by signals transmitted by them. Wherein, after the power interface and the ground interface are separated, they can also be integrated into the first memory card controller 2021.

The second switch 2012 is connected to one of the clock interface (CLK +) of the second memory card controller 2022, the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the programming voltage/input interface (VPP) of the SIM card controller 203, the second switch 2012 is further connected to the fifth spring 11e of the card connector 11, and the second switch 2012 is used to connect the fifth spring 11e to the clock interface (CLK +) of the second memory card controller 2022, or connect the fifth spring 11e to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or connect the fifth spring 11e to the programming voltage/input interface (VPP) of the SIM card controller 203.

The third switch 2013 is connected to another DATA interface (e.g., RX +) of the second memory card controller 2022, another DATA interface (e.g., DATA 0) of the first memory card controller 2021, and a reset interface (RST) of the SIM card controller 203, the third switch 2013 is further connected to a sixth elastic piece 11f of the card connector 11, and the third switch 2013 is configured to conduct the sixth elastic piece 11f and the DATA interface (e.g., RX +) of the second memory card controller 2022, or conduct the sixth elastic piece 11f and the DATA interface (e.g., DATA 0) of the first memory card controller 2021, or conduct the sixth elastic piece 11f and the reset interface (RST) of the SIM card controller 203.

The fourth switch 2014 is connected to the clock interface (CLK) of the first memory card controller 2021 and the clock interface (CLK) of the SIM card controller 203, the fourth switch 2014 is further connected to the fourth spring 11d of the card connector 11, and the fourth switch 2014 is used for conducting the third spring 11c to the clock interface (CLK) of the first memory card controller 2021 or conducting the fourth spring 11d to the clock interface (CLK) of the SIM card controller 203.

The second power interface (VDD 2) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11 through the interface controller 201. The other clock interface (e.g., CLK-) of the second memory card controller 2022 is electrically connected to the second elastic piece 11b of the card connector 11 through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201. The interface controller 201 may be connected to the first elastic piece 11a through a wire between the second power interface (VDD 2) of the second memory card controller 2022 and the first elastic piece 11a, between the clock interface (e.g., CLK-) of the second memory card controller 2022 and the second elastic piece 11b, between the power interface of the processor 20 and the eighth elastic piece 11h, and between the ground interface of the processor 20 and the seventh elastic piece 11g, so as to maintain a conducting state, and the interface controller 201 may also be connected in series with a switch, so as to switch between the conducting state and the disconnecting state through the switch.

resilient sheets

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the second switch 2012 is connected to one of the clock interfaces (CLK +) of the second memory card controller 2022 and the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the second switch 2012 is further connected to the fifth spring 11e of the card connector 11.

A second signal arrangement of the second NM card 5 using the PCIe interface protocol is exemplified below.

Referring to fig. 36-38 in combination, fig. 36 is a schematic diagram of second NM card 5 shown in fig. 17 in other embodiments, fig. 37 is a schematic diagram of a portion of circuit of electronic apparatus 100 shown in fig. 1 in other embodiments, and fig. 38 is a schematic diagram of a portion of circuit of electronic apparatus 100 shown in fig. 1 in other embodiments.

The second NM card 5 shown in fig. 36 is mainly different from the second NM card 5 shown in fig. 33 in that the first gold finger 521 of the second NM card 5 is used to transmit a clock signal (e.g., CLK-), and the second gold finger 522 is used to transmit a second power supply signal (VDD 2). That is, signals transmitted by the first gold finger 521 and the second gold finger 522 of the second NM card 5 shown in fig. 36 and the second NM card 5 shown in fig. 33 are interchanged. The clock signals transmitted by the first gold finger 521 and the fifth gold finger 525 can be exchanged with each other. Other aspects of the second NM card 5 shown in fig. 36 can refer to the related description of the second NM card 5 shown in fig. 33, and are not repeated herein.

In the second NM card 5 shown in fig. 36, when the fourth gold finger 524 adjacent to the second gold finger 522 is disposed in the air, since the fourth gold finger 524 does not perform signal transmission, the fourth gold finger 524 does not short-circuit with the second gold finger 522, which may cause the second NM card 5 circuit to be burned, thereby improving the reliability of the second NM card 5, and the fourth gold finger 524 of the second NM card 5 does not need to be disposed with an electrically connected high voltage tolerant circuit or a protection switch, which results in a lower cost of the second NM card 5. In other embodiments, the first gold finger 521 may be floating, and the fourth gold finger 524 may be used for transmitting a clock signal (e.g., CLK-).

The main difference between the electronic device 100 shown in fig. 37 and the electronic device 100 shown in fig. 34 is that the second power interface (VDD 2) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11, and one of the clock interfaces (e.g., CLK-) is electrically connected to the second elastic piece 11b of the card connector 11. For other contents of the electronic device 100 shown in fig. 37, reference may be made to the description of the electronic device 100 shown in fig. 34, and details are not repeated here.

The main difference between the electronic device 100 shown in fig. 38 and the electronic device 100 shown in fig. 35 is that the second power interface (VDD 2) of the second memory card controller 2022 is electrically connected to the first resilient piece 11a of the card connector 11, and one of the clock interfaces (e.g., CLK-) is electrically connected to the second resilient piece 11b of the card connector 11. For other contents of the electronic device 100 shown in fig. 38, reference may be made to the description of the electronic device 100 shown in fig. 35, and details are not repeated here.

A third signal arrangement of the second NM card 5 using the PCIe interface protocol is exemplified below.

Referring to FIG. 39, FIG. 39 is a diagram of a second NM card 5 of FIG. 17 in another embodiment.

Illustratively, the second gold finger 522, the sixth gold finger 526, the ninth gold finger 529, and the tenth gold finger 5210 of the second NM card 5 are used to transmit data signals. The following embodiment is described by taking as an example that the second gold finger 522 is used to transmit the data signal (RX-), the sixth gold finger 526 is used to transmit the data signal (RX +), the ninth gold finger 529 is used to transmit the data signal (TX +), and the tenth gold finger 5210 is used to transmit the data signal (TX-). In other embodiments, the data signals transmitted by the second gold finger 522, the sixth gold finger 526, the ninth gold finger 529 and the tenth gold finger 5210 can be interchanged. For example, the data signals transmitted by the second gold finger 522 and the sixth gold finger 526 are exchanged, and the data signals transmitted by the ninth gold finger 529 and the tenth gold finger 5210 are exchanged, which is not described herein again in other embodiments.

The fourth golden finger 524 and the fifth golden finger 525 are used for transmitting clock signals. The following embodiments are described by taking the fourth gold finger 524 for transmitting the clock signal (CLK-), and the fifth gold finger 525 for transmitting the clock signal (CLK +). In other embodiments, the clock signals transmitted by the fourth gold finger 524 and the fifth gold finger 525 can be interchanged.

The first gold finger 521 is used for transmitting a second power signal (VDD 2); the seventh gold finger 527 is used for transmitting a ground signal (VSS); the eighth gold finger 528 is used to transmit the first power signal (VDD 1). Wherein, the third gold finger 523 is suspended.

As shown in table 7 below, table 7 is a table five of correspondence between the plurality of resilient sheets of the card connector 11 and the plurality of gold fingers and transmission signals of the Nano SIM card 3, the first NM card 4, and the second NM card 5. When the second NM card 5 is connected to the card connector 11, the first to tenth elastic pieces 11a to 11j of the card connector 11 correspondingly abut against and electrically connect the first to tenth gold fingers 521 to 5210 of the second NM card 5, and the third to eighth gold fingers 523 to 528 of the second NM card 5 correspondingly correspond to the first to sixth gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the third gold finger 523 to the tenth gold finger 5210 of the second NM card 5 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 7

The second NM card 5 arranges one of the high-speed data signals (for example, RX-) in the second gold finger 522, and since the second gold finger 522 of the second NM card 5 has no position corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, the second elastic sheet 11b is connected to the high-speed data interface of the processor 20 of the electronic device 100, and does not need to be connected to the low-speed data interface, and the processor 20 does not need to switch the interface electrically connected to the second elastic sheet 11b no matter whether the information card inserted into the electronic device 100 is the second NM card 5, the Nano SIM card 3, or the first NM card 4, so that the difficulty of switching between the high-speed data interface and the low-speed data interface can be reduced, the circuit of the processor 20 is simplified, and the design difficulty and the cost are reduced.

The fourth golden finger 524 of the second NM card 5 corresponds to the second golden finger 322 of the Nano SIM card 3 and corresponds to the second golden finger 422 of the first NM card 4, and is abutted against and electrically connected to the fourth elastic piece 11d of the card connector 11 when the electronic device 100 is inserted, the fourth golden finger 524 of the second NM card 5 is used for transmitting a clock signal (e.g., CLK-), the second golden finger 322 of the Nano SIM card 3 is used for transmitting a clock signal (CLK), the second golden finger 422 of the first NM card 4 is used for transmitting a clock signal (CLK), and the second NM card 5, the Nano SIM card 3, and the first NM card 4 may time-share the fourth elastic piece 11d. The processor 20 can provide clock signals with different frequencies through the fourth elastic sheet 11d without switching data interface signals, thereby simplifying the circuit of the processor 20 and reducing the design complexity and cost. In some scenarios, when the first NM card 4, the second NM card 5, and the Nano SIM card 3 have clock signals with the same frequency, the processor 20 may provide the same clock signals for the three cards, and no switching is required, which further simplifies the design difficulty of the processor 20, for example, the clock frequency is unified to 20 MHz.

Since the third gold finger 523 adjacent to the first gold finger 521 may be disposed in a suspended manner without signal transmission, the second NM card 5 circuit is not burned due to a short circuit with the first gold finger 521, so that the reliability of the second NM card 5 is improved, and the third gold finger 523 of the second NM card 5 does not need to be provided with an electrically connected high voltage resistant circuit or a protection switch, so that the cost of the second NM card 5 is low.

Illustratively, the tenth gold finger 5210 may be electrically connected to a high voltage tolerant circuit or a protection switch for avoiding burning out the circuit when the card interface 52 of the second NM card 5 is short-circuited. In other embodiments, the third gold finger 523 may also be used to transmit a detection signal (C/D). At this time, the third gold finger 523 may also be electrically connected to a high voltage tolerant circuit or a protection switch for avoiding the circuit from being burned out when the card interface 52 of the second NM card 5 is short-circuited. Wherein the high voltage tolerant circuitry or the protection switch is located within the package 511 of the second NM card 5. In other embodiments, burning out of the circuitry of the second NM card 5 may also be avoided by providing a high impedance protection circuit within the electronic device, for example by adding a protection circuit within an interface controller of the electronic device.

In other embodiments, the third gold finger 523 of the second NM card 5 may also be used to transmit a clock signal (e.g., CLK-), and the fourth gold finger 524 may be set floating or used to transmit a detection signal (C/D). At this time, the third gold finger 523 may be electrically connected to the high voltage tolerant circuit or the protection switch to prevent the second NM card 5 circuit from being burned down due to the short circuit of the elastic sheet of the third gold finger 523, thereby improving the reliability of the second NM card 5. In other embodiments, burning out of the circuitry of the second NM card 5 may also be avoided by providing a high impedance protection circuit within the electronic device, for example by adding a protection circuit within an interface controller of the electronic device.

Referring to fig. 40, fig. 40 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in other embodiments.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 39. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, and a second memory card controller 2022, the SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 includes a DATA interface for transmitting a DATA signal (DATA), a clock interface for transmitting a clock signal (CLK), a programming voltage/input interface for transmitting a programming voltage/input signal (VPP), and a reset interface for transmitting a Reset Signal (RST). In fig. 40 and in subsequent figures and associated description of the contents of the embodiments, the various interfaces of the SIM card controller 203 are illustrated with their transmitted signals being identified.

The second memory card controller 2022 comprises four data interfaces for transmitting data signals (RX +, RX-, TX +, TX-), two clock interfaces for transmitting clock signals (CLK +, CLK-), and a second power interface for transmitting a second power signal (VDD 2). In fig. 40 and in subsequent figures and associated description of the contents of the embodiments, the plurality of interfaces of the second memory card controller 2022 are illustrated with their transmitted signals being labeled. In other embodiments, the second power interface may be independent from the second memory card controller 2022, which is not strictly limited in this embodiment.

The processor 20 further includes a power interface for transmitting a power signal (VCC) or a first power signal (VDD 1), and a ground interface for transmitting a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface may be independent of the SIM card controller 203 and the second memory card controller 2022, or may be integrated in the SIM card controller 203 and the second memory card controller 2022 after being separated from each other, which is not limited in this embodiment of the present application. In fig. 40 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 203 and the second memory card controller 2022, and are respectively identified as power and ground.

The first switch 2011 is connected to a clock interface (e.g., CLK-) of the second memory card controller 2022 and a clock interface (CLK) of the SIM card controller 203, the first switch 2011 is further connected to the fourth elastic piece 11d of the card connector 11, and the first switch 2011 is configured to conduct the fourth elastic piece 11d and the clock interface (e.g., CLK-) of the second memory card controller 2022, or conduct the fourth elastic piece 11d and the clock interface (CLK) of the SIM card controller 203.

The second switch 2012 is connected to another clock interface (e.g., CLK +) of the second memory card controller 2022 and a programming voltage/input interface (VPP) of the SIM card controller 203, the second switch 2012 is further connected to the fifth spring 11e of the card connector 11, and the second switch 2012 is used for connecting the fifth spring 11e to the clock interface (e.g., CLK +) of the second memory card controller 2022 or connecting the fifth spring 11e to the programming voltage/input interface (VPP) of the SIM card controller 203.

The third switch 2013 is connected to a data interface (e.g., RX +) of the second memory card controller 2022 and a reset interface (RST) of the SIM card controller 203, the third switch 2013 is further connected to a sixth elastic piece 11f of the card connector 11, and the third switch 2013 is configured to connect the sixth elastic piece 11f to the data interface (e.g., RX +) of the second memory card controller 2022 or connect the sixth elastic piece 11f to the reset interface (RST) of the SIM card controller 203.

The second power interface (VDD 2) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11 through the interface controller 201. The other data interface (e.g., RX-) of the second memory card controller 2022 is electrically connected to the second elastic piece 11b of the card connector 11 through the interface controller 201. The other data interface (e.g., TX +) of the second memory card controller 2022 is electrically connected to the ninth elastic piece 11i of the card connector 11 through the interface controller 201. The other data interface (e.g., TX-) of the second memory card controller 2022 is electrically connected to the tenth elastic piece 11j of the card connector 11 through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201. The DATA interface (DATA) of the SIM card controller 203 is electrically connected to the third elastic piece 11c of the card connector 11 through the interface controller 201.

The interface controller 201 may be connected by a wire to maintain a conducting state, and the interface controller 201 may also be connected in series with a switch to switch between the conducting state and the disconnecting state through the switch, where the embodiment of the present application is not limited strictly to this embodiment, and the interface controller 201 may be connected in series with a switch to realize the switching between the conducting state and the disconnecting state between the second power interface (VDD 2) of the second memory card controller 2022 and the first elastic piece 11a, between the clock interface (e.g., CLK-) of the second memory card controller 2022 and the second elastic piece 11b, between the DATA interface (DATA) of the SIM card controller 203 and the third elastic piece 11c, between the DATA interface (e.g., TX +) of the second memory card controller 2022 and the ninth elastic piece 11i, between the DATA interface (e.g., TX-) of the second memory card controller 2022 and the tenth elastic piece 11j, between the power interface of the processor 20 and the eighth elastic piece 11h, and between the ground interface and the seventh elastic piece 11 g.

When the second NM card 5 is inserted into the card holder assembly 10 of the electronic device 100 and the second NM card 5 is electrically connected to the card connector 11, the interface controller 201 connects the second memory card controller 2022 and the card connector 11, the second memory card controller 2022 transmits the data signal (RX +, RX-, TX +, TX-), the clock signal (CLK +, CLK-), and the second power signal (VDD 2) to the second NM card 5 through the first, second, third, sixth, ninth, and tenth

resilient sheets

11a, 11b, 11c to 11f, 11i, and 11j of the card connector 11, the processor 20 of the electronic device 100 transmits the first power signal (VDD 1) and the ground signal (VSS) to the second NM card 5 through the eighth and seventh

resilient sheets

It can be understood that, when the third gold finger 523 of the second NM card 5 is used for transmitting the detection signal (C/D), the interface controller 201 performs adaptation, and the interface controller 201 is further used for conducting the detection interface (C/D) and the third elastic sheet 11C of the second memory card controller 2022 when the second NM card 5 is inserted into the electronic device 100.

In some other embodiments, the interface controller 201 adapts when the third gold finger 523 of the second NM card 5 is used for transmitting a clock signal (e.g. CLK-) and the fourth gold finger 524 is set floating, and the interface controller 201 is further configured to conduct the clock interface (e.g. CLK-) of the second memory card controller 2022 and the third spring 11c when the second NM card 5 is inserted into the electronic apparatus 100.

In other embodiments, the programming voltage/input signal (VPP) may not be supported to reduce the difficulty of designing the processor 20. At this time, the SIM card controller 203 may not include a programming voltage/input interface (VPP), the interface controller 201 may not include the second switch 2012, and another clock interface (e.g., CLK +) of the second memory card controller 2022 is electrically connected to the fifth elastic piece 11e of the card connector 11 through the interface controller 201.

Referring to fig. 41, fig. 41 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in other embodiments.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 5, and the card interface 52 of the second NM card 5 is arranged as shown in fig. 39. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021 and a second memory card controller 2022, the SIM card controller 203, the first memory card controller 2021 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

The SIM card controller 203 and the second memory card controller 2022 may refer to the related description of the corresponding embodiment in fig. 40, and are not described herein again. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexing interface. The four DATA interfaces are used for transmitting DATA signals (DATA 0, DATA1, DATA2, DATA 3), the clock interface is used for transmitting a clock signal (CLK), and the command and response multiplexing interface is used for transmitting command and response signals (CMD). In fig. 41 and in the subsequent figures and the associated description of the content of the embodiments, the plurality of interfaces of the first memory card controller 2021 are indicated by signals transmitted by them. Wherein, after the power interface and the ground interface are separated, they can also be integrated into the first memory card controller 2021.

The first switch 2011 is connected to the clock interface (CLK) of the first memory card controller 2021, the clock interface (CLK) of the SIM card controller 203, and one of the clock interfaces (e.g., CLK-) of the second memory card controller 2022, the fourth switch 2014 is further connected to the fourth elastic piece 11d of the card connector 11, and the fourth switch 2014 is used to conduct the third elastic piece 11c to the clock interface (CLK) of the first memory card controller 2021, or conduct the fourth elastic piece 11d to the clock interface (CLK) of the SIM card controller 203, or conduct the fourth elastic piece 11d to the clock interface (e.g., CLK-) of the second memory card controller 2022.

The second switch 2012 is connected to another clock interface (CLK +) of the second memory card controller 2022, the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the programming voltage/input interface (VPP) of the SIM card controller 203, the second switch 2012 is further connected to the fifth spring 11e of the card connector 11, and the second switch 2012 is used to connect the fifth spring 11e to the clock interface (CLK +) of the second memory card controller 2022, or to connect the fifth spring 11e to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or to connect the fifth spring 11e to the programming voltage/input interface (VPP) of the SIM card controller 203.

The third switch 2013 is connected to a DATA interface (e.g., RX +) of the second memory card controller 2022, another DATA interface (e.g., DATA 0) of the first memory card controller 2021, and a reset interface (RST) of the SIM card controller 203, the third switch 2013 is further connected to a sixth elastic piece 11f of the card connector 11, and the third switch 2013 is configured to conduct the sixth elastic piece 11f and the DATA interface (e.g., RX +) of the second memory card controller 2022, or conduct the sixth elastic piece 11f and the DATA interface (e.g., DATA 0) of the first memory card controller 2021, or conduct the sixth elastic piece 11f and the reset interface (RST) of the SIM card controller 203.

The fourth switch 2014 is connected to a DATA interface (e.g., DATA 1) of the first memory card controller 2021 and a DATA interface (DATA) of the SIM card controller 203, the first switch 2011 is further connected to the third elastic piece 11c of the card connector 11, and the first switch 2011 is configured to conduct the third elastic piece 11c and the DATA interface (e.g., DATA 1) of the first memory card controller 2021 or conduct the third elastic piece 11c and the DATA interface (DATA) of the SIM card controller 203.

The second power interface (VDD 2) of the second memory card controller 2022 is electrically connected to the first elastic piece 11a of the card connector 11 through the interface controller 201. The other data interface (e.g., RX-) of the second memory card controller 2022 is electrically connected to the second elastic piece 11b of the card connector 11 through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201. The interface controller 201 may be connected to maintain a conducting state by setting a conducting wire between the second power interface (VDD 2) of the second memory card controller 2022 and the first elastic sheet 11a, between the data interface (e.g., RX-) of the second memory card controller 2022 and the second elastic sheet 11b, between the power interface of the processor 20 and the eighth elastic sheet 11h, and between the ground interface of the processor 20 and the seventh elastic sheet 11g, and the interface controller 201 may also be connected in series to a switch, so as to switch between the conducting state and the disconnecting state through the switch.

resilient sheets

A fourth signal arrangement of the second NM card 5 using the PCIe interface protocol is exemplified below.

Referring to fig. 42-44 in combination, fig. 42 is a schematic diagram of second NM card 5 shown in fig. 17 in other embodiments, fig. 43 is a schematic diagram of a portion of circuit of electronic apparatus 100 shown in fig. 1 in other embodiments, and fig. 44 is a schematic diagram of a portion of circuit of electronic apparatus 100 shown in fig. 1 in other embodiments.

The second NM card 5 shown in fig. 42 is mainly different from the second NM card 5 shown in fig. 39 in that the first gold finger 521 of the second NM card 5 is used to transmit a data signal (e.g., RX-), and the second gold finger 522 is used to transmit a second power signal (VDD 2). That is, signals transmitted by the first gold finger 521 and the second gold finger 522 of the second NM card 5 shown in fig. 42 and the second NM card 5 shown in fig. 39 are interchanged. The data signals transmitted by the first gold finger 521, the sixth gold finger 526, the ninth gold finger 529 and the tenth gold finger 5210 can be exchanged with each other. Other aspects of the second NM card 5 shown in fig. 42 can refer to the related description of the second NM card 5 shown in fig. 39, and are not repeated herein.

The main difference between the electronic device 100 shown in fig. 43 and the electronic device 100 shown in fig. 40 is that one of the data interfaces (e.g., RX-) is electrically connected to the first elastic piece 11a of the card connector 11, and the second power interface (VDD 2) of the second memory card controller 2022 is electrically connected to the second elastic piece 11b of the card connector 11. For other contents of the electronic device 100 shown in fig. 43, reference may be made to the description of the electronic device 100 shown in fig. 40, and details are not repeated here.

The main difference between the electronic device 100 shown in fig. 44 and the electronic device 100 shown in fig. 41 is that one of the data interfaces (e.g., RX-) is electrically connected to the first elastic piece 11a of the card connector 11, and the second power interface (VDD 2) of the second memory card controller 2022 is electrically connected to the second elastic piece 11b of the card connector 11. For other contents of the electronic device 100 shown in fig. 44, reference may be made to the description of the electronic device 100 shown in fig. 41, and details are not repeated here.

In other embodiments, the second NM card 5 may also employ the SD interface protocol. The second NM card 5 using the SD interface protocol is different from the second NM card 5 using the PCIe interface protocol in that data signals transmitted by the second NM card 5 are D0+, D0-, D1+, and D1-. For other contents of the second NM card 5 adopting the SD interface protocol, reference is made to the related description of the second NM card 5 adopting the PCIe interface protocol, and details are not described herein again. In addition, the electronic device 100 compatible with the second NM card 5 using PCIe interface protocol can also support the second NM card 5 using SD interface protocol, and the data interface of the second memory card controller 2022 is adaptively changed.

The present application further provides a second NM card comprising at least eight gold fingers, the second NM card may employ the UFS protocol. The related description of the UFS protocol may refer to the foregoing embodiments, and will not be described herein. The card interface of the second NM card may have the same or similar structure as the card interface 42 of the first NM card 4, and the second NM card may be connected to a card connector (e.g., the card connector 11 shown in fig. 5) into which the first NM card 4 can be inserted. The following examples are given.

Referring to fig. 45, fig. 45 is a schematic structural diagram of a second NM card according to another embodiment of the present application.

The second NM card 6 of the present embodiment may include most of the technical features of the second NM card 5 shown in fig. 17 and other figures, and the differences between the two will be mainly described as follows:

in some embodiments, the card body 61 of the second NM card 6 comprises a first side 6111, a second side 6112, a third side 6113, and a fourth side 6114, the first side 6111 and the third side 6113 are disposed opposite to each other and extend along the length direction of the second NM card 6, and the second side 6112 and the fourth side 6114 are disposed opposite to each other and extend along the width direction of the second NM card 6. The distance between the second side 6112 and the fourth side 6114 is greater than the distance between the first side 6111 and the third side 6113. In other words, the first side 6111 and the third side 6113 are long sides, and the second side 6112 and the fourth side 6114 are short sides. The first side 6111 and the third side 6113 may be disposed in parallel or approximately in parallel, and the second side 6112 and the fourth side 6114 may be disposed in parallel or approximately in parallel.

One corner of the card body 61 of the second NM card 6 is a corner cut, and the corner cut is disposed between the first edge 6111 and the second edge 6112. The cut angle forms a cut edge 6115, and an obtuse angle is formed between the cut edge 6115 and the first edge 6111, and an obtuse angle is formed between the cut edge 6115 and the second edge 6112. An arc transition structure or a chamfer transition structure may be disposed between adjacent edges (including the first edge 6111, the second edge 6112, the third edge 6113, the fourth edge 6114, and the cut edge 6115) of the card body 61. In other embodiments, the card body 61 of the second NM card 6 may not have the above-mentioned chamfer, and the present application is not limited thereto.

Illustratively, the card interface 62 of the second NM card 6 includes at least eight gold fingers, for example, including first to eighth gold fingers 621 to 628, the first to eighth gold fingers 621 to 628 are arranged in an array, the first to eighth gold fingers 621 to 628 are arranged along the length direction of the second NM card 6 to form a first row of gold fingers and a second row of gold fingers, the first row of gold fingers includes first to seventh gold fingers 621, a third to fifth gold fingers 623, a fifth to

seventh gold fingers

625 and 627 arranged along the width direction of the second NM card 6, and the second row of gold fingers includes second to

eighth gold fingers

622, 624, a sixth to 626 and 628 arranged along the width direction of the second NM card 6. The four golden fingers of the first row of golden fingers (621, 623, 625, 627) are in one-to-one correspondence with the four golden fingers of the second row of golden fingers (622, 624, 626, 628), and are arranged in pairs in rows, that is, the four golden fingers are arranged in the first row of golden fingers (621, 622), the second row of golden fingers (623, 624), the third row of golden fingers (625, 626), and the fourth row of golden fingers (627, 628). That is, the first gold fingers 621 to the eighth gold fingers 628 are arranged in two rows and four columns.

The first row of golden fingers (621, 623, 625, 627) is located between the second side 6112 and the second row of golden fingers (622, 624, 626, 628), that is, the first row of golden fingers (621, 623, 625, 627) is arranged near the second side 6112, and the second row of golden fingers (622, 624, 626, 628) is arranged near the fourth side 6114.

The first golden finger 621 is located between the first edge 6111 and the third golden finger 623, and the second golden finger 622 is located between the first edge 6111 and the fourth golden finger 614. That is, the first row of golden fingers (621, 622) is arranged near the first edge 6111, and the fourth row of golden fingers (627, 628) is arranged near the third edge 6113. At this time, the first gold finger 621 is closer to the trimming edge 6115 of the card body 61 than the other gold fingers.

The center distance between the first row of golden fingers (621, 622) and the second row of golden fingers (623, 624) is larger than the center distance between the third row of golden fingers (625, 626) and the fourth row of golden fingers (627, 628). The center-to-center distance between the second row of gold fingers (623, 624) and the third row of gold fingers (625, 626) is greater than the center-to-center distance between the third row of gold fingers (625, 626) and the fourth row of gold fingers (627, 628).

For example, the center-to-center distance between the first row of gold fingers (621, 622) and the second row of gold fingers (623, 624) and the third row of gold fingers (625, 626) may be in the range of 1.5mm to 2.8mm, and the center-to-center distance between the third row of gold fingers (625, 626) and the fourth row of gold fingers (627, 628) may be in the range of 1.0mm to 1.7 mm. The size of the card body 61 of the second NM card 6 may be the same as the size of the card body 31 of the Nano SIM card 3.

Of the first through eighth gold fingers 621 through 628 of the second NM card 6, four gold fingers are used to transmit data signals (RX +, RX-, TX +, TX-), one gold finger is used to transmit a reference clock signal (RCLK), one gold finger is used to transmit a first power signal (VCC), one gold finger is used to transmit a ground signal (VSS), and one gold finger is used to transmit a second power signal (VCCQ). At this time, the second NM card 6 can support the UFS protocol, achieving the basic performance of a high-speed card. Other aspects of the second NM card 6 of this embodiment can refer to the related descriptions of the second NM card 5 shown in fig. 17 and other figures, and are not described herein again.

In this embodiment, since the golden finger arrangement structure of the second NM card 6 is the same as or similar to the golden finger arrangement structure of the first NM card 4, the second NM card 6 can be structurally and electrically connected to the card connector compatible with the first NM card 4, thereby reducing the wiring change of the circuit line of the electronic device 100 and reducing the change difficulty and cost.

Illustratively, the first 621, fourth 624, seventh 627 and eighth 628 fingers of the second NM card 6 are used to transmit data signals (RX +, RX-, TX +, TX-). The following embodiment is described by taking the first gold finger 621 for transmitting the data signal (RX-), the fourth gold finger 624 for transmitting the data signal (RX +), the seventh gold finger 627 for transmitting the data signal (TX +), and the eighth gold finger 628 for transmitting the data signal (TX-), as an example. In other embodiments, the data signals transmitted by the first gold finger 621, the fourth gold finger 624, the seventh gold finger 627 and the eighth gold finger 628 can be interchanged with each other. For example, the data signals transmitted by the first gold finger 621 and the fourth gold finger 624 are exchanged, and the data signals transmitted by the seventh gold finger 627 and the eighth gold finger 628 are exchanged, which is not described herein again in other embodiments. Wherein, the second gold finger 622 is used for transmitting a reference clock signal (RCLK); the third gold finger 623 is used for transmitting a second power signal (VCCQ); fifth finger 625 for transmitting ground signal (VSS); the sixth gold finger 626 is used to transmit the first power supply signal (VCC).

In some embodiments, please refer to table 8, which shows a first correspondence table between a plurality of resilient pieces of another card connector and a plurality of gold fingers of the Nano SIM card 3, the first NM card 4, and the second NM card 6 and their transmission signals. When the second NM card 6 is connected to a card connector compatible with the first NM card 4 and having eight elastic pieces, the eight elastic pieces of the card connector correspondingly abut against and electrically connect the first gold finger 621 to the eighth gold finger 628 of the second NM card 6, and the first gold finger 621 to the sixth gold finger 626 of the second NM card 6 correspondingly correspond to the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3. The first to eighth resilient sheets of the card connector with eight resilient sheets may correspond to the third to tenth resilient sheets of the card connector shown in fig. 5 in a one-to-one correspondence manner. In some embodiments, the first gold finger 621 to the eighth gold finger 628 of the second NM card 6 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 8

In this embodiment, the fifth finger 625 of the second NM card 6 corresponds to the fifth finger 325 of the Nano SIM card 3 and corresponds to the fifth finger 425 of the first NM card 4, and is all abutted against and electrically connected to the seventh elastic sheet of the card connector when the electronic device 100 is inserted, and the fifth finger 625 of the second NM card 6, the fifth finger 325 of the Nano SIM card 3, and the fifth finger 425 of the first NM card 4 are all used for transmitting ground signals (VSS/GND, respectively), so that the processor 20 of the electronic device 100 can electrically connect the fifth elastic sheet of the card connector through the same ground interface, and no matter whether the information card inserted into the electronic device 100 is the second NM card 6, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the fifth elastic sheet, thereby simplifying the circuit of the processor 20 and reducing the design difficulty and cost.

The sixth gold finger 626 of the second NM card 6 corresponds to the sixth gold finger 326 of the Nano SIM card 3 and corresponds to the sixth gold finger 426 of the first NM card 4, and is all abutted against and electrically connected to the sixth elastic sheet of the card connector when the electronic device 100 is inserted, and the sixth gold finger 626 of the second NM card 6, the sixth gold finger 326 of the Nano SIM card 3, and the sixth gold finger 426 of the first NM card 4 are all used for transmitting power signals (VCC/VCC, respectively), so that the processor 20 of the electronic device 100 can be electrically connected to the sixth elastic sheet of the card connector through the same power interface, and no matter whether the information card inserted into the electronic device 100 is the second NM card 6, the Nano SIM card 3, or the first NM card 4, the processor 20 does not need to switch the interface electrically connected to the sixth elastic sheet, so that the circuit of the processor 20 can be simplified, and the design difficulty and cost can be reduced.

The first golden finger 621 of the second NM card 6 corresponds to the first golden finger 321 of the Nano SIM card 3 and corresponds to the first golden finger 421 of the first NM card 4, and is abutted against and electrically connected to the first elastic piece of the card connector when the electronic device 100 is inserted, the first golden finger 621 of the second NM card 6 is used for transmitting a DATA signal (e.g., RX-), the first golden finger 321 of the Nano SIM card 3 is used for DATA signal (DATA), the first golden finger 421 of the first NM card 4 is used for transmitting a DATA signal (e.g., DATA 1), and the second NM card 6, the Nano SIM card 3, and the first NM card 4 may time-share the first elastic piece.

The second gold finger 622 of the second NM card 6 corresponds to the second gold finger 322 of the Nano SIM card 3 and corresponds to the second gold finger 422 of the first NM card 4, and is abutted against and electrically connected to the second elastic piece of the card connector when the electronic device 100 is inserted, the second gold finger 622 of the second NM card 6 is used for transmitting a reference clock signal (RCLK), the second gold finger 322 of the Nano SIM card 3 is used for transmitting a clock signal (CLK), the second gold finger 422 of the first NM card 4 is used for transmitting a clock signal (CLK), and the second NM card 6, the Nano SIM card 3, and the first NM card 4 can multiplex the second elastic piece in a time-sharing manner.

The third gold finger 623 of the second NM card 6 corresponds to the third gold finger 323 of the Nano SIM card 3 and corresponds to the third gold finger 423 of the first NM card 4, and is abutted against and electrically connected to the third elastic piece of the card connector when the electronic device 100 is inserted, the third gold finger 623 of the second NM card 6 is used for transmitting a second power signal (VCCQ), the third gold finger 323 of the Nano SIM card 3 is used for transmitting a programming voltage/input signal (VPP), the first gold finger 421 of the first NM card 4 is used for transmitting a command and a response signal (CMD), and the second NM card 6, the Nano SIM card 3, and the first NM card 4 can multiplex the third elastic piece in a time-sharing manner.

The seventh gold finger 627 of the second NM card 6 corresponds to the seventh gold finger 427 of the first NM card 4, and both of them are abutted against and electrically connected to the seventh spring plate of the card connector when the electronic device 100 is inserted, the seventh gold finger 627 of the second NM card 6 is used for transmitting DATA signals (e.g., TX +), the seventh gold finger 427 of the first NM card 4 is used for transmitting DATA signals (e.g., DATA 3), and the second NM card 6 and the first NM card 4 can multiplex the seventh spring plate in a time-sharing manner.

The eighth gold finger 628 of the second NM card 6 corresponds to the eighth gold finger 428 of the first NM card 4, and both of them are abutted against and electrically connected to the eighth elastic piece of the card connector when the electronic device 100 is inserted, the eighth gold finger 628 of the second NM card 6 is used for transmitting DATA signals (e.g., TX-), the eighth gold finger 428 of the first NM card 4 is used for transmitting DATA signals (e.g., DATA 2), and the second NM card 6 and the first NM card 4 can multiplex the eighth elastic piece in time division.

For example, the eighth gold finger 628 of the second NM card 6 may be electrically connected to a high voltage resistant circuit or a protection switch for preventing the circuit from being burned out when the card interface 62 of the second NM card 6 is short-circuited. Wherein the high voltage tolerant circuits or protection switches are located within the package 611 of the second NM card 6. In other embodiments, burning out of the circuitry of the second NM card 6 may also be avoided by providing a high impedance protection circuit within the electronic device, for example by adding a protection circuit within an interface controller of the electronic device.

It can be understood that, since the third gold finger 623 of the second NM card 6, the third gold finger 323 of the Nano SIM card 3, and the third gold finger 423 of the first NM card 4 time-division multiplex the third elastic sheet, and the third elastic sheet transmits the second power signal (VCCQ) of the second NM card 6 in some usage scenarios, the third gold finger 323 of the Nano SIM card 3 and the third gold finger 423 of the first NM card 4 may be electrically connected with a high voltage tolerant circuit or a protection switch, so as to avoid burning out the circuit, so as to improve the reliability of the Nano SIM card 3 and the first NM card 4. In other embodiments, the Nano SIM card 3 can be prevented from being burned out by providing a high impedance protection circuit in the electronic device, for example, by adding a protection circuit in an interface controller of the electronic device.

Referring to fig. 46, fig. 46 is a schematic diagram of a portion of a circuit of an electronic device 100 according to some embodiments of the present disclosure.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 6, and the card interface 62 of the second NM card 6 is arranged as shown in fig. 45. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, and a second memory card controller 2022, the SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first to eighth elastic pieces of the card connector of the card socket assembly 10.

The SIM card controller 203 includes a DATA interface for transmitting a DATA signal (DATA), a clock interface for transmitting a clock signal (CLK), a programming voltage/input interface for transmitting a programming voltage/input signal (VPP), and a reset interface for transmitting a Reset Signal (RST). In fig. 46 and in subsequent figures and associated description of the contents of the embodiments, the various interfaces of the SIM card controller 203 are illustrated with their transmitted signals being identified.

The second memory card controller 2022 includes four data interfaces for transmitting data signals (RX +, RX-, TX +, TX-), a reference clock interface for transmitting a reference clock signal (RCLK), and a second power interface for transmitting a second power signal (VCCQ). In fig. 46 and in subsequent figures and associated description of the contents of the embodiments, the plurality of interfaces of the second memory card controller 2022 are illustrated with their transmitted signals being labeled. In other embodiments, the second power interface may be independent from the second memory card controller 2022, which is not strictly limited in this embodiment.

The processor 20 further includes a power interface for transmitting a power signal (VCC) or a first power signal (VCC), and a ground interface for transmitting a ground signal (GND) or a ground signal (VSS). The power interface and the ground interface may be independent of the SIM card controller 203 and the second memory card controller 2022, or may be integrated in the SIM card controller 203 and the second memory card controller 2022 after being separated from each other, which is not limited in this embodiment of the present application. In fig. 46 and subsequent figures, the power interface and the ground interface are illustrated as being independent from the SIM card controller 203 and the second memory card controller 2022, and are respectively identified as power and ground.

Illustratively, the interface controller 201 is used to conduct the SIM card controller 203 with the card connector, or conduct the second memory card controller 2022 with the card connector. The interface controller 201 may include a plurality of switches and wires.

In some embodiments, interface controller 201 includes a first switch 2011, a second switch 2012, a third switch 2013, and a fourth switch 2014.

The first switch 2011 is connected to a DATA interface (e.g., RX-) of the second memory card controller 2022 and a DATA interface (DATA) of the SIM card controller 203, the first switch 2011 is further connected to a first elastic piece of the card connector, and the first switch 2011 is configured to conduct the first elastic piece and the DATA interface (e.g., RX-) of the second memory card controller 2022 or conduct the first elastic piece and the DATA interface (DATA) of the SIM card controller 203.

The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022 and the clock interface (CLK) of the SIM card controller 203, the second switch 2012 is further connected to the second spring of the card connector, and the second switch 2012 is used for connecting the second spring to the reference clock interface (RCLK) of the second memory card controller 2022 or connecting the second spring to the clock interface (CLK) of the SIM card controller 203.

The third switch 2013 is connected to the second power interface (VCCQ) of the second memory card controller 2022 and the programming voltage/input interface (VPP) of the SIM card controller 203, the third switch 2013 is further connected to the third elastic piece of the card connector, and the third switch 2013 is configured to connect the third elastic piece to the second power interface (VCCQ) of the second memory card controller 2022 or connect the third elastic piece to the programming voltage/input interface (VPP) of the SIM card controller 203.

The fourth switch 2014 is connected to the other data interface (e.g., RX +) of the second memory card controller 2022 and the reset interface (RST) of the SIM card controller 203, the fourth switch 2014 is further connected to the fourth spring of the card connector, and the fourth switch 2014 is used for conducting the fourth spring to the data interface (e.g., RX +) of the second memory card controller 2022 or conducting the fourth spring to the reset interface (RST) of the SIM card controller 203.

The other data interface (e.g., TX +) of the second memory card controller 2022 is electrically connected to the ninth elastic piece of the card connector through the interface controller 201. The other data interface (e.g., TX-) of the second memory card controller 2022 is electrically connected to the tenth spring of the card connector through the interface controller 201. The power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector through the interface controller 201. The ground interface of the processor 20 is electrically connected to the seventh elastic piece of the card connector through the interface controller 201. The interface controller 201 may be connected to the data interface (e.g., TX +) of the second memory card controller 2022 and the ninth elastic piece, the data interface (e.g., TX-) of the second memory card controller 2022 and the tenth elastic piece, the power interface of the processor 20 and the eighth elastic piece, and the ground interface and the seventh elastic piece by setting a conducting wire to maintain a conducting state, and the interface controller 201 may also be connected to a switch in series to switch between the conducting state and the disconnecting state.

In this embodiment, when the Nano SIM card 3 is inserted into the card holder assembly 10 of the electronic device 100 and the Nano SIM card 3 is electrically connected to the card connector, the interface controller 201 connects the SIM card controller 203 and the card connector, the SIM card controller 203 transmits the DATA signal (DATA), the clock signal (CLK), the programming voltage/input signal (VPP) and the Reset Signal (RST) to the Nano SIM card 3 through the first to fourth elastic pieces of the card connector, the processor 20 of the electronic device 100 transmits the power signal (VCC) and the ground signal (GND) to the Nano SIM card 3 through the sixth and fifth elastic pieces of the card connector, and the Nano SIM card 3 communicates with the electronic device 100.

When the second NM card 6 is inserted into the card holder assembly 10 of the electronic device 100 and the second NM card 6 is electrically connected to the card connector, the interface controller 201 connects the second memory card controller 2022 and the card connector, the second memory card controller 2022 transmits the data signal (RX +, RX-, TX +, TX-) and the reference clock signal (RCLK) and the second power signal (VCCQ) to the second NM card 6 through the first to fourth, seventh and eighth resilient pieces of the card connector, the processor 20 of the electronic device 100 transmits the first power signal (VCC) and the ground signal (VSS) to the second NM card 6 through the sixth and fifth resilient pieces of the card connector, and the second NM card 6 communicates with the electronic device 100. Thus, the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 6.

Referring to fig. 47, fig. 47 is a schematic diagram of a portion of a circuit of an electronic device 100 according to some embodiments of the present disclosure.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 6, and the card interface 62 of the second NM card 6 is arranged as shown in fig. 45. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, and a second memory card controller 2022, the SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the first to eighth elastic pieces of the card connector of the card socket assembly 10.

The SIM card controller 203 and the second memory card controller 2022 may refer to the related description of the corresponding embodiment in fig. 46, and are not repeated herein. The first memory card controller 2021 includes four data interfaces, a clock interface, and a command and response multiplexing interface. The four DATA interfaces are used for transmitting DATA signals (DATA 0, DATA1, DATA2, DATA 3), the clock interface is used for transmitting a clock signal (CLK), and the command and response multiplexing interface is used for transmitting command and response signals (CMD). In fig. 47 and in subsequent figures and associated description of the contents of the embodiments, the plurality of interfaces of the first memory card controller 2021 are illustrated with their transmitted signals being labeled. Wherein, after the power interface and the ground interface are separated, they can also be integrated into the first memory card controller 2021.

Illustratively, the interface controller 201 is used to connect the SIM card controller 203 with the card connector, or connect the first memory card controller 2021 with the card connector, or connect the second memory card controller 2022 with the card connector. The interface controller 201 may include a plurality of switches and wires.

The first switch 2011 is connected to a DATA interface (e.g., RX-) of the second memory card controller 2022, a DATA interface (e.g., DATA 1) of the first memory card controller 2021, and a DATA interface (DATA) of the SIM card controller 203, the first switch 2011 is further connected to a first elastic piece of the card connector, and the first switch 2011 is configured to conduct the first elastic piece and the DATA interface (e.g., RX-) of the second memory card controller 2022, or conduct the first elastic piece and the DATA interface (e.g., DATA 1) of the first memory card controller 2021, or conduct the first elastic piece and the DATA interface (DATA) of the SIM card controller 203.

The second switch 2012 is connected to the reference clock interface (RCLK) of the second memory card controller 2022, the clock interface (CLK) of the first memory card controller 2021, and the clock interface (CLK) of the SIM card controller 203, the second switch 2012 is further connected to the second spring of the card connector, and the second switch 2012 is used to connect the second spring to the reference clock interface (RCLK) of the second memory card controller 2022, or to connect the second spring to the clock interface (CLK) of the first memory card controller 2021, or to connect the second spring to the clock interface (CLK) of the SIM card controller 203.

The third switch 2013 is connected to the second power interface (VCCQ) of the second memory card controller 2022, the command and response multiplexing interface (CMD) of the first memory card controller 2021, and the programming voltage/input interface (VPP) of the SIM card controller 203, the third switch 2013 is further connected to the third elastic piece of the card connector, and the third switch 2013 is configured to connect the third elastic piece to the second power interface (VCCQ) of the second memory card controller 2022, or connect the third elastic piece to the command and response multiplexing interface (CMD) of the first memory card controller 2021, or connect the third elastic piece to the programming voltage/input interface (VPP) of the SIM card controller 203.

The fourth switch 2014 is connected to the other DATA interface (e.g., RX +) of the second memory card controller 2022, the other DATA interface (e.g., DATA 0) of the first memory card controller 2021, and the reset interface (RST) of the SIM card controller 203, the fourth switch 2014 is further connected to the fourth spring of the card connector, and the fourth switch 2014 is used to conduct the fourth spring to the DATA interface (e.g., RX +) of the second memory card controller 2022, or to conduct the fourth spring to the DATA interface (e.g., DATA 0) of the first memory card controller 2021, or to conduct the fourth spring to the reset interface (RST) of the SIM card controller 203.

The fifth switch 2015 is connected to another DATA interface (e.g., TX +) of the second memory card controller 2022 and another DATA interface (e.g., DATA 3) of the first memory card controller 2021, the fifth switch 2015 is further connected to a seventh elastic piece of the card connector, and the fifth switch 2015 is configured to conduct the seventh elastic piece to the DATA interface (e.g., TX +) of the second memory card controller 2022 or to conduct the seventh elastic piece to the DATA interface (e.g., DATA 3) of the first memory card controller 2021.

The sixth switch 2016 is connected to another DATA interface (e.g., TX-) of the second memory card controller 2022 and another DATA interface (e.g., DATA 2) of the first memory card controller 2021, the sixth switch 2016 is further connected to an eighth spring of the card connector, and the sixth switch 2016 is configured to conduct the eighth spring to the DATA interface (e.g., TX-) of the second memory card controller 2022 or to conduct the eighth spring to the DATA interface (e.g., DATA 2) of the first memory card controller 2021.

The power interface of the processor 20 is electrically connected to the sixth elastic piece of the card connector through the interface controller 201. The ground interface of the processor 20 is electrically connected to the fifth elastic piece of the card connector through the interface controller 201. The interface controller 201 may be connected to the sixth elastic sheet and the ground interface of the processor 20 to the fifth elastic sheet by setting a conducting wire, so as to maintain a conducting state, and the interface controller 201 may also be connected in series with a switch, so as to switch between the conducting state and the disconnecting state through the switch.

When the first NM card 4 is inserted into the card holder assembly 10 of the electronic device 100 and the first NM card 4 is electrically connected to the card connector, the interface controller 201 connects the first memory card controller 2021 and the card connector, the first memory card controller 2021 transmits the DATA signals (DATA 0, DATA1, DATA2, and DATA 3), the clock signal (CLK), and the command and response signal (CMD) to the first NM card 4 through the first to fourth, seventh, and eighth clips of the card connector, the processor 20 of the electronic device 100 transmits the power signal (VCC) and the ground signal (GND) to the first NM card 4 through the sixth and fifth clips of the card connector, and the first NM card 4 communicates with the electronic device 100.

Based on the description of the above embodiments, in some other embodiments of the present application, when the first gold finger, the second gold finger, and the eighth gold finger of the second NM card are used as data interfaces, the first gold finger, the second gold finger, and the eighth gold finger of the second NM card may also be electrically connected to a high voltage tolerant circuit or a protection switch, so as to avoid that the circuit is burned out due to a short circuit of the spring plate when the first spring plate of the card connector outputs a high voltage data signal of the SIM card controller 203, the second spring plate outputs a high voltage clock signal of the SIM card controller 203, and the sixth spring plate outputs a high voltage power signal, so as to improve the reliability of the second NM card. Wherein the high voltage tolerant circuit or the protection switch is located within the package of the second NM card.

Referring to fig. 48, fig. 48 is a schematic view illustrating a connection structure of second NM card 6 shown in fig. 45 and card connector 11 shown in fig. 5.

In other embodiments, the second NM card 6 may also be plugged into the electronic device 100 having the card connector 11 shown in fig. 5. When the second NM card 6 is connected to the card connector 11 shown in fig. 5, the ten elastic pieces of the card connector 11 all support against the second NM card 6, wherein the third to tenth elastic pieces 11c to 11j of the card connector 11 support against the first to eighth gold fingers 621 to 628 of the second NM card 6 in a one-to-one correspondence manner to electrically connect the second NM card 6. The first elastic piece 11a of the card connector 11 can abut against the third elastic piece 11c and is electrically connected to the first gold finger 621 of the second NM card, and the second elastic piece 11b can abut against the fourth elastic piece 11d and is electrically connected to the second gold finger 622 of the second NM card 6; alternatively, the first row of spring pieces (11 a, 11 b) abuts against the card body 51 of the second NM card 6.

Referring to table 9, table 9 is a second table of correspondence between a plurality of resilient sheets of the card connector 11 shown in fig. 5 and a plurality of golden fingers and transmission signals of the Nano SIM card 3, the first NM card 4, and the second NM card 6. When the second NM card 6 is connected to the card connector 11, the third to tenth elastic pieces 11c to 11j of the card connector 11 correspondingly abut against and electrically connect the first to eighth gold fingers 621 to 628 of the second NM card 6, and the first to sixth gold fingers 621 to 626 of the second NM card 6 correspondingly correspond to the first to sixth gold fingers 321 to 326 of the Nano SIM card 3. In some embodiments, the first gold finger 621 to the eighth gold finger 628 of the second NM card 6 correspond to the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 in a one-to-one correspondence.

TABLE 9

Referring to fig. 49, fig. 49 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in another embodiment.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3 and the second NM card 6, and the card interface 62 of the second NM card 6 is arranged as shown in fig. 45. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, and a second memory card controller 2022, the SIM card controller 203 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the third elastic piece 11c to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

This embodiment may include most of the technical features of the embodiment shown in fig. 46. The main difference between the two is the connection relationship between the interface controller 201 and the elastic sheet of the card connector 11. For example, in the present embodiment, the first switch 2011 to the fourth switch 2014 are electrically connected to the third elastic piece 11c to the sixth elastic piece 11f of the card connector 11, respectively, the power interface is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201, the ground interface is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201, and the two data interfaces (e.g., RX +, RX-) of the second memory card controller 2022 are electrically connected to the ninth elastic piece 11i and the tenth elastic piece 11j through the interface controller 201, respectively. In this embodiment, the contents of the SIM card controller 203, the second memory card controller 2022, the power interface, the ground interface, and other aspects of the interface controller 201 may refer to the related description of the corresponding embodiment in fig. 46, and are not repeated herein.

Referring to fig. 50, fig. 50 is a schematic diagram of a portion of a circuit of the electronic device 100 shown in fig. 1 in other embodiments.

In some embodiments, the card holder assembly 10 of the electronic device 100 is compatible with the Nano SIM card 3, the first NM card 4 and the second NM card 6, and the card interface 62 of the second NM card 6 is arranged as shown in fig. 45. The processor 20 of the electronic device 100 includes an interface controller 201, a SIM card controller 203, a first memory card controller 2021 and a second memory card controller 2022, the SIM card controller 203, the first memory card controller 2021 and the second memory card controller 2022 are electrically connected to the interface controller 201, and the interface controller 201 is electrically connected to the third elastic piece 11c to the tenth elastic piece 11j of the card connector 11 of the card socket assembly 10.

This embodiment may include most of the technical features of the embodiment shown in fig. 47. The main difference between the two is the connection relationship between the interface controller 201 and the elastic sheet of the card connector 11. For example, in the present embodiment, the first switch 2011 to the fourth switch 2014 are electrically connected to the third elastic piece 11c to the sixth elastic piece 11f of the card connector 11, respectively, the power interface is electrically connected to the eighth elastic piece 11h of the card connector 11 through the interface controller 201, the ground interface is electrically connected to the seventh elastic piece 11g of the card connector 11 through the interface controller 201, and the fifth switch 2015 and the sixth switch 2016 are electrically connected to the ninth elastic piece 11i and the tenth elastic piece 11j, respectively. In this embodiment, other contents of the SIM card controller 203, the second memory card controller 2022, the power interface, the ground interface, and the interface controller 201 may refer to the related description of the embodiment corresponding to fig. 47, and are not described herein again.

The electronic device can identify the type of the information card inserted into the electronic device through an information card identification method.

In some embodiments, the information card identification method can identify whether the information card is a Nano SIM card or a second NM card, and the information card identification method can be applied to an electronic device compatible with the Nano SIM card and the second NM card.

The information card identification method comprises the following steps:

step 001: executing a first initialization process;

step 002: if the first reply instruction is received, judging that the inserted information card is the first card; if the first reply instruction is not received, judging that the inserted information card is not the first card, and executing a second initialization process;

step 003: if a second reply instruction is received, the inserted information card is judged to be a second card; and if the second reply instruction is not received, judging that the inserted information card is not the second card.

In this embodiment, the electronic device executes the initialization process of the information card, and if a specific reply signal is received, it can determine that the information card is the information card corresponding to the initialization process, and if the specific reply signal is not received, it determines that the information card is not the information card corresponding to the initialization process, and executes the next initialization process, and determines whether the information card is the information card corresponding to the next initialization process.

In some embodiments, the first initialization process may be a SIM card initialization process, and the first card is a Nano SIM card; the second initialization process may be a second NM card initialization process, and the second card is a second NM card. Alternatively, the first initialization process may be a second NM card initialization process, and the first card is a second NM card; the second initialization process may be an SIM card initialization process, and the second card is a Nano SIM card.

In some embodiments, the SIM card initialization procedure may include: the control interface controller conducts the SIM card controller and the card connector. The third elastic sheet of the card connector transmits a DATA signal (DATA), the fourth elastic sheet transmits a clock signal (CLK), the fifth elastic sheet transmits a programming voltage/input signal (VPP), the sixth elastic sheet transmits a Reset Signal (RST), the seventh elastic sheet transmits a ground signal (GND), and the eighth elastic sheet transmits a power signal (VCC).

In some embodiments, the initialization procedure of the second NM card may include: the control interface controller conducts the second NM card controller and the card connector.

Illustratively, when the information card identification method is applied to an electronic device compatible with the second NM card shown in fig. 24, the first, third, ninth, and tenth domes of the card connector transmit data signals (RX +, RX-, TX +, TX-), the second dome transmits a second power signal (VCCQ), the fourth dome transmits a reference clock signal (RCLK), the fifth dome transmits a detection signal (C/D), the seventh dome transmits a ground signal (VSS), and the eighth dome transmits a first power signal (VCC). The second NM card controller may send a detection signal (C/D) to the information card through a fifth elastic piece of the card connector, and may identify the information card as the second NM card if a response signal returned from the correct information card is received.

Illustratively, when the information card recognition method is applied to an electronic device compatible with the second NM card shown in fig. 27, the first, fifth, ninth, and tenth domes of the card connector transmit data signals (RX +, RX-, TX +, TX-), the second dome transmits a second power signal (VCCQ), the fourth dome transmits a reference clock signal (RCLK), the seventh dome transmits a ground signal (VSS), and the eighth dome transmits a first power signal (VCC). When the third gold finger or the sixth gold finger of the second NM card is used for transmitting the detection signal (C/D), the corresponding third elastic piece or the sixth elastic piece of the card connector is used for transmitting the detection signal (C/D).

Illustratively, when the information card recognition method is applied to an electronic device compatible with the second NM card shown in fig. 30, the first, fifth, ninth, and tenth domes of the card connector transmit data signals (RX +, RX-, TX +, TX-), the second dome transmits a second power signal (VCCQ), the sixth dome transmits a reference clock signal (RCLK), the seventh dome transmits a ground signal (VSS), and the eighth dome transmits a first power signal (VCC).

Illustratively, when the information card identification method is applied to an electronic device compatible with the second NM card shown in fig. 33, the third, sixth, ninth, and tenth domes of the card connector transmit data signals (RX +, RX-, TX +, TX-), the first dome transmits a second power signal (VDD 2), the second and fifth domes transmit clock signals (CLK +, CLK-), the seventh dome transmits a ground signal (VSS), and the eighth dome transmits a first power signal (VDD 1).

Illustratively, when the information card identification method is applied to an electronic device compatible with the second NM card shown in fig. 36, the third, sixth, ninth, and tenth domes of the card connector transmit data signals (RX +, RX-, TX +, TX-), the first and fifth domes transmit clock signals (CLK +, CLK-), the second dome transmits a second power signal (VDD 2), the seventh dome transmits a ground signal (VSS), and the eighth dome transmits a first power signal (VDD 1).

Illustratively, when the information card identification method is applied to an electronic device compatible with the second NM card shown in fig. 39, the second, sixth, ninth, and tenth domes of the card connector transmit data signals (RX +, RX-, TX +, TX-), the first dome transmits a second power signal (VDD 2), the fourth and fifth domes transmit clock signals (CLK +, CLK-), the seventh dome transmits a ground signal (VSS), and the eighth dome transmits a first power signal (VDD 1).

Illustratively, when the information card identification method is applied to an electronic device compatible with the second NM card shown in fig. 42, the first, sixth, ninth, and tenth domes of the card connector transmit data signals (RX +, RX-, TX +, TX-), the second dome transmits a second power signal (VDD 2), the fourth and fifth domes transmit clock signals (CLK +, CLK-), the seventh dome transmits a ground signal (VSS), and the eighth dome transmits a first power signal (VDD 1).

Exemplarily, when the information card identification method is applied to an electronic device compatible with the second NM card shown in fig. 45 (e.g., fig. 49 and 50 correspond to the embodiment), the third, sixth, ninth, and tenth domes of the card connector transmit data signals (RX +, RX-, TX +, TX-), the fifth dome transmits a second power signal (VCCQ), the fourth dome transmits a reference clock signal (RCLK), the seventh dome transmits a ground signal (VSS), and the eighth dome transmits a first power signal (VCC);

when the information card identification method is applied to an electronic device compatible with the second NM card shown in fig. 45 (for example, fig. 46 and 47 correspond to the embodiment), the first, fourth, seventh, and eighth clips of the card connector transmit data signals (RX +, RX-, TX +, and TX-), the third clip transmits a second power signal (VCCQ), the second clip transmits a reference clock signal (RCLK), the fifth clip transmits a ground signal (VSS), and the sixth clip transmits a first power signal (VCC).

In some embodiments, when the information card identification method is applied to an electronic device compatible with the second NM card shown in fig. 45, in the initialization process of the second NM card, the third clip of the control card connector does not transmit the second power signal (VCCQ). For example, the third clip of the control card connector may not transmit a signal; or, the third elastic sheet of the control card connector transmits an identification signal, and the identification signal is used for identifying or assisting in identifying whether the information card is the second NM card. After the information card is judged to be the second NM card, the third elastic sheet of the control card connector transmits a second power signal (VCCQ).

In some embodiments, when the information card identification method is applied to an electronic device compatible with the second NM card and the Nano SIM card shown in fig. 45, the first initialization process may be a SIM card initialization process, where the first card is the Nano SIM card; the second initialization process may be a second NM card initialization process, and the second card is a second NM card.

In some embodiments, the information card identification method is in response to a power-on of the electronic device or a reboot of the electronic device. The first initialization process may be an SIM card initialization process. In this embodiment, when the electronic device is turned on or restarted, the information card identification method first performs an SIM card initialization procedure to determine whether the information card is a Nano SIM card, so as to enter a networking state first. Of course, in some other embodiments, when the information card identification method responds to the start-up of the electronic device or the restart of the electronic device, the information card identification method may also perform the initialization process of the non-Nano SIM card first, which is not strictly limited in this embodiment of the present application.

In some embodiments, the information card identification method switches from the disengaged state to the inserted state in response to detecting that the card-holding state is switched from the disengaged state to the inserted state, that is: when the state of the card holder is detected to be switched from the off state to the on state, a first initialization process is executed. Referring to fig. 3, the electronic device can detect whether the card holder is in the disengaged state or the inserted state through the insertion detection spring piece in the card holder assembly.

In other embodiments, the information card identification method may be capable of identifying whether the information card is a Nano SIM card, a first NM card or a second NM card, and the information card identification method may be applied to an electronic device compatible with the Nano SIM card, the first NM card and the second NM card.

The information card identification method comprises the following steps:

step 001: executing a first initialization process;

step 003: if a second reply instruction is received, the inserted information card is judged to be a second card; if the second reply instruction is not received, judging that the inserted information card is not the second card, and executing a third initialization process;

step 004: if a third reply instruction is received, the inserted information card is judged to be a third card; and if the third reply instruction is not received, judging that the inserted information card is not the third card.

The main difference between the information card identification method of this embodiment and the information card identification method of the previous embodiment is that in step 003, when the inserted information card is determined not to be the second card, the information card identification method then performs a third initialization procedure to determine whether the information card is the third card.

In some embodiments, one of the first initialization procedure, the second initialization procedure, and the third initialization procedure is a SIM card initialization procedure, the other is a first NM card initialization procedure, and the other is a second NM card initialization procedure. Correspondingly, among the first, second and third cards, one is a Nano SIM card, the other is a first NM card, and the other is a second NM card.

In some embodiments, the SIM card initialization process and the second NM card initialization process may refer to the related descriptions of the information card identification method in the previous embodiments. In some embodiments, the initialization procedure of the first NM card may include: the control interface controller conducts the first NM card controller and the card connector. The third elastic sheet, the sixth elastic sheet, the ninth elastic sheet and the tenth elastic sheet of the card connector transmit DATA signals (DATA 0, DATA1, DATA2 and DATA 3), the fourth elastic sheet transmits a clock signal (CLK), the fifth elastic sheet transmits a command and response signal (CMD), the seventh elastic sheet transmits a ground signal (GND), and the eighth elastic sheet transmits a first power signal (VCC).

In some embodiments, when the information card identification method is applied to an electronic device compatible with the second NM card, the first NM card, and the Nano SIM card shown in fig. 45, the third initialization process may be a second NM card initialization process, and the third card is the second NM card. The first initialization process may be a SIM card initialization process or a first NM card initialization process.

Other contents of the information card identification method in this embodiment can refer to the related description of the information card identification method in the previous embodiment, and are not described herein again.

The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device (100) is characterized by comprising a card holder (1) and a card holder (2), wherein the card holder (2) is detachably inserted into the card holder (1);

the card seat (1) comprises ten elastic sheets arranged in an array, and the ten elastic sheets are arranged in a first row of elastic sheets (11 a, 11 b) to a fifth row of elastic sheets (11 i, 11 j) along a first direction; the center distance between the second row of elastic sheets (11 c and 11 d) and the third row of elastic sheets (11 e and 11 f) is larger than the center distance between the first row of elastic sheets (11 a and 11 b) and the second row of elastic sheets (11 c and 11 d), and is larger than the center distance between the fourth row of elastic sheets (11 g and 11 h) and the fifth row of elastic sheets (11 i and 11 j); the center distance between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) is larger than the center distance between the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), and is larger than the center distance between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j);

The center distance between the second row of elastic sheets (11 c and 11 d) and the third row of elastic sheets (11 e and 11 f) is in the range of 1.0mm to 3.0mm, and the center distance between the third row of elastic sheets (11 e and 11 f) and the fourth row of elastic sheets (11 g and 11 h) is in the range of 1.0mm to 3.0 mm;

when the Nano SIM card (3) is installed on the card support (2), the second row of spring pieces (11 c, 11 d) to the fourth row of spring pieces (11 g, 11 h) are correspondingly electrically connected with six golden fingers of the Nano SIM card (3) one by one, and the first row of spring pieces (11 a, 11 b) and the fifth row of spring pieces (11 i, 11 j) are abutted against the Nano SIM card (3);

when the card support (2) is provided with a second NM card (5), ten spring pieces are correspondingly electrically connected with ten golden fingers of the second NM card (5), and the size of the card body (51) of the second NM card (5) is the same as that of the card body (31) of the Nano SIM card (3).

2. The electronic device (100) of claim 1, wherein the first row of domes (11 a, 11 b) is spaced from the second row of domes (11 c, 11 d) by a distance in the range of 1.0mm to 1.7 mm;

the center distance between the second row of elastic sheets (11 c and 11 d) and the third row of elastic sheets (11 e and 11 f) is in the range of 1.5mm to 2.8 mm;

The center distance between the third row of elastic sheets (11 e and 11 f) and the fourth row of elastic sheets (11 g and 11 h) is in the range of 1.5mm to 2.8 mm;

the center-to-center distance between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j) is in the range of 1.0mm to 1.7 mm.

3. The electronic device (100) according to claim 1 or 2, wherein ten of the clips are arranged in a first row of clips and a second row of clips along a second direction, the second direction being perpendicular to the first direction;

the first row of elastic sheets comprise a first elastic sheet (11 a), a third elastic sheet (11 c), a fifth elastic sheet (11 e), a seventh elastic sheet (11 g) and a ninth elastic sheet (11 i) which are arranged along the first direction, and the second row of elastic sheets comprise a second elastic sheet (11 b), a fourth elastic sheet (11 d), a sixth elastic sheet (11 f), an eighth elastic sheet (11 h) and a tenth elastic sheet (11 j) which are arranged along the first direction;

when the Nano SIM card (3) is installed on the card holder (2), the first elastic sheet (11 a) and the third elastic sheet (11 c) are electrically connected with the same golden finger of the Nano SIM card (3), and the second elastic sheet (11 b) and the fourth elastic sheet (11 d) are electrically connected with the same golden finger of the Nano SIM card (3); or the first row of elastic sheets (11 a, 11 b) abuts against a card body (31) of the Nano SIM card (3);

And/or when the Nano SIM card (3) is installed on the card holder (2), the ninth elastic sheet (11 i) and the seventh elastic sheet (11 g) are electrically connected with the same golden finger of the Nano SIM card (3), and the tenth elastic sheet (11 j) and the eighth elastic sheet (11 h) are electrically connected with the same golden finger of the Nano SIM card (3); or the fifth row of elastic sheets (11 i, 11 j) support against the card body (31) of the Nano SIM card (3).

4. The electronic device (100) according to any of claims 1 to 3, wherein the electronic device (100) further comprises a processor (20), the processor (20) comprises an interface controller (201), a memory card controller (202) and a SIM card controller (203), the interface controller (201) electrically connects the memory card controller (202) and the SIM card controller (203) and electrically connects ten of the clips;

when the Nano SIM card (3) is installed on the card holder (2), the interface controller (201) controls the SIM card controller (203) to communicate with the Nano SIM card (3);

when a second NM card (5) is installed in the card tray (2), the interface controller (201) controls the memory card controller (202) to communicate with the second NM card (5).

5. The electronic device (100) according to claim 1 or 2, wherein when a first NM card is installed on the card holder (2), the second row of resilient tabs (11 c, 11 d) to the fifth row of resilient tabs (11 i, 11 j) are electrically connected to eight gold fingers of the first NM card in a one-to-one correspondence, the first row of resilient tabs (11 a, 11 b) abuts against the first NM card, and a card body (51) of the first NM card has the same size as a card body (31) of the Nano SIM card (3).

6. The electronic device (100) of claim 5, wherein ten of the clips are arranged in a first row of clips and a second row of clips along a second direction, the second direction being perpendicular to the first direction;

when the card holder (2) is provided with a first NM card, the first elastic sheet (11 a) and the third elastic sheet (11 c) are electrically connected with the same golden finger of the first NM card, and the second elastic sheet (11 b) and the fourth elastic sheet (11 d) are electrically connected with the same golden finger of the first NM card; or the first row of elastic sheets (11 a, 11 b) are abutted against the card body (31) of the Nano SIM card (3).

7. The electronic device (100) of claim 6, wherein the electronic device (100) further comprises a processor (20), the processor (20) comprises an interface controller (201), a SIM card controller (203), a first memory card controller (2021), and a second memory card controller (2022), the interface controller (201) is electrically connected to the SIM card controller (203), the first memory card controller (2021), and the second memory card controller (2022), and is electrically connected to ten of the spring pieces;

when the card holder (2) is provided with a first NM card, the interface controller (201) controls the first memory card controller (2021) to communicate with the first NM card;

when the card tray (2) is installed with a second NM card (5), the interface controller (201) controls the second memory card controller (2022) to communicate with the second NM card (5).

8. The electronic device (100) according to any one of claims 1 to 7, wherein each of the resilient pieces comprises a fixed end (111 a), an abutting end (111 b), and a movable end (111 c), the fixed end (111 a), the abutting end (111 b), and the movable end (111 c) are sequentially arranged along an extending direction of the resilient piece, and the extending direction of the resilient piece is perpendicular to the first direction;

the card holder (1) further comprises an insulating body (112), the fixed end (111 a) is fixed on the insulating body (112), the abutting end (111 b) protrudes out of one side surface of the insulating body (112), and the movable end (111 c) is movably mounted on the insulating body (112).

9. The electronic device (100) of claim 8, wherein the insulating body (112) is provided with a communication hole (1124), the movable end (111 c) is movably inserted into the communication hole (1124), the end of the movable end (111 c) comprises a stop block (1111), and the stop block (1111) and the insulating body (112) cooperate to form an anti-falling structure.

10. A card connector (11) comprising ten spring plates arranged in an array, the ten spring plates being arranged in a first direction from a first row of spring plates (11 a, 11 b) to a fifth row of spring plates (11 i, 11 j); the center distance between the second row of elastic sheets (11 c and 11 d) and the third row of elastic sheets (11 e and 11 f) is larger than the center distance between the first row of elastic sheets (11 a and 11 b) and the second row of elastic sheets (11 c and 11 d), and is larger than the center distance between the fourth row of elastic sheets (11 g and 11 h) and the fifth row of elastic sheets (11 i and 11 j); the center distance between the third row of elastic sheets (11 e, 11 f) and the fourth row of elastic sheets (11 g, 11 h) is larger than the center distance between the first row of elastic sheets (11 a, 11 b) and the second row of elastic sheets (11 c, 11 d), and is larger than the center distance between the fourth row of elastic sheets (11 g, 11 h) and the fifth row of elastic sheets (11 i, 11 j);

when the card connector (11) is connected with a Nano SIM card (3), the second row of spring pieces (11 c, 11 d) to the fourth row of spring pieces (11 g, 11 h) are correspondingly and electrically connected with six golden fingers of the Nano SIM card (3), and the first row of spring pieces (11 a, 11 b) and the fifth row of spring pieces (11 i, 11 j) are abutted against the Nano SIM card (3);

When the card connector (11) is connected with a second NM card (5), ten spring pieces are correspondingly electrically connected with ten golden fingers of the second NM card (5), and the size of a card body (51) of the second NM card (5) is the same as that of a card body (31) of the Nano SIM card (3).

11. The card connector (11) according to claim 10, wherein the first row of resilient pieces (11 a, 11 b) is spaced from the second row of resilient pieces (11 c, 11 d) by a center-to-center distance in a range of 1.0mm to 1.7 mm;

12. The card connector (11) according to claim 10 or 11, wherein ten said resilient pieces are arranged in a first row of resilient pieces and a second row of resilient pieces along a second direction, said second direction being perpendicular to said first direction;

When the card connector (11) is connected with a Nano SIM card (3), the first elastic sheet (11 a) and the third elastic sheet (11 c) are electrically connected with the same golden finger of the Nano SIM card (3), and the second elastic sheet (11 b) and the fourth elastic sheet (11 d) are electrically connected with the same golden finger of the Nano SIM card (3); or the first row of elastic sheets (11 a, 11 b) abuts against a card body (31) of the Nano SIM card (3);

and/or when the card connector (11) is connected with a Nano SIM card (3), the ninth elastic sheet (11 i) and the seventh elastic sheet (11 g) are electrically connected with the same golden finger of the Nano SIM card (3), and the tenth elastic sheet (11 j) and the eighth elastic sheet (11 h) are electrically connected with the same golden finger of the Nano SIM card (3); or the fifth row of elastic sheets (11 i, 11 j) support against the card body (31) of the Nano SIM card (3).

13. The card connector (11) according to claim 10 or 11, wherein when a first NM card is mounted on the card holder (2), the second row of resilient pieces (11 c, 11 d) to the fifth row of resilient pieces (11 i, 11 j) electrically connect eight gold fingers of the first NM card in a one-to-one correspondence, the first row of resilient pieces (11 a, 11 b) abuts against the first NM card, and a card body (51) of the first NM card has the same size as a card body (31) of the Nano SIM card (3).

14. The card connector (11) according to claim 13, wherein ten of the resilient pieces are arranged in a first row of resilient pieces and a second row of resilient pieces along a second direction, the second direction being perpendicular to the first direction;

15. The card connector (11) according to any one of claims 10 to 14, wherein each of the resilient pieces comprises a fixed end (111 a), an abutting end (111 b), and a movable end (111 c), the fixed end (111 a), the abutting end (111 b), and the movable end (111 c) are arranged in sequence along an extending direction of the resilient piece, the extending direction of the resilient piece being perpendicular to the first direction;

16. The card connector (11) according to claim 15, wherein the insulating body (112) is provided with a communication hole (1124), the movable end (111 c) is movably inserted into the communication hole (1124), the end of the movable end (111 c) comprises a stop block (1111), and the stop block (1111) cooperates with the insulating body (112) to form an anti-falling structure.

17. A card holder (1) comprising a holder body (12) and the card connector (11) of any one of claims 10 to 16, the card connector (11) being fixedly connected to the holder body (12).

18. A cartridge assembly (10) comprising a cartridge holder (2) and the cartridge (1) of claim 17, the cartridge holder (2) being removably insertable into the cartridge (1).