CN217506478U - Dustproof telecommunication system, telecommunication frame and computing device - Google Patents

Abstract

The utility model discloses a dust-proof telecommunication system. The dustproof telecommunications system includes a chassis, several key components located within the chassis, and a filter module located within the chassis near at least some of the critical components that require cooling. For example, key components include a central processing unit, a system-on-chip, a memory module, an express peripheral component interconnect standard card, and/or a chipset. The filter module has a filter cover, a first air filter, and a second air filter, the filter cover surrounds at least a part of key components, the first air filter is located at an inlet of an airflow, and the second air filter is located at an outlet . The critical components are located in a protected space within the chassis that receives and is cooled by the airflow through the air filter.

Description

Dust-tight telecommunications systems, telecommunications frames, and computing devices

【Technical field】

The present invention generally relates to a dustproof telecommunications system, and more particularly, to a cooling pan/protective cover having a filter assembly.

【Background technique】

Telecommunications devices, such as 5G equipment, cellular network base stations, and servers, typically have compartments to hold various components, such as a Printed Circuit Board Assembly (PCBA), a central processing unit (central processing unit, CPU), a system on chip (SoC), a memory module, and an on-board chip. Since telecommunication installations are typically located in outdoor environments, components are protected from adverse environmental conditions and unauthorized access by means of a protective cover/cooling plate/die-cast heat sink (HS) covering the compartment.

In addition, telecommunications installations in severe locations face many challenges, including high levels of dust, insufficient airflow, and extreme temperatures. Outdoor environments or infrequently accessed storage closets combined with poor airflow can introduce excessive dust into the server hardware, eventually leading to failure. Generally, a cooling plate or die cast heat sink is designed with a fin structure or fins to dissipate heat generated by server hardware components.

When heat from components builds up inside server hardware, it can lead to catastrophic failure over time. Typically, electronic devices that require more power to operate generate more heat. If the ambient temperature exceeds the upper limit, the parts may fail. Even if it doesn't fail, excess heat can negatively affect the performance of the part. Furthermore, when electronic components are exposed to excessive heat over a period of time, their lifespan is shortened. As electronic devices become more powerful and printed circuit boards become smaller, cooling technology is more important than ever.

Dust has a negative effect on PCB cooling. New computers have less surface area, run faster and have more heat to dissipate in a smaller space. The result is higher temperatures, and greater sensitivity to dust and dirt trapping heat. Therefore, in computer or server hardware, a dust filter system (eg, a breathable dust filter) is necessary, as well as air intake/cooling fans and/or vents.

Some installations, such as edge servers enclosed in a cabinet or small closet, are designed as fanless products with a one-piece cover heatsink (HS) for cooling. Usually edge servers are compact because they should fit in a limited space. Such devices typically provide an Ingress Protection, IP or International Protection Rating of 50. Foreign object protection level refers to the level of protection provided by an electronic enclosure against solids and liquids. In environments where dust or water may damage electronic components, a sealed enclosure is used to prevent such intrusion and to safely house electronic equipment. For cooling purposes, a central processing unit is typically designed as an embedded SoC soldered on a motherboard, and the memory is designed as onboard memory.

For example, in a 5G server, system performance is critical, and a central processing unit should be capable of achieving higher performance in a given environment. General-purpose CPUs (such as Intel IceLake-SP, EagleStream-SP, or AMD SP3 are columns) may be equipped with an isolated CPU heatsink. Universal central processing units can be produced according to customer requirements, so that they can be assembled into a server without changing the motherboard. If a system is designed with an isolated CPU heatsink, a server should provide an air filter in front of a chassis to meet the requirements of foreign object protection class 50.

Referring to FIGS. 1A and 1B , in order to meet the foreign object protection level 50 requirement of a general server 100 , a front bezel 101 having a dust filter is attached to the front side of the server. When outside air is introduced into the server 100, the front bezel 101 with the dust filter traps dust. However, when attached to the server 100, the front bezel 101 lengthens the depth of the server chassis. For example, a short depth server 100 has a chassis with a depth of 400 mm, as illustrated in Figure 1A. When a dust filter bezel 101 having a depth of 45mm is attached to the server 100, the overall depth of the server with the filter becomes 445mm, as exemplified in FIG. 1B. However, some edge servers should be designed to have a depth of 300mm to 350mm due to the limitations of the telecom cabinet environment. In this case, the main board (MB) configuration is too crowded to hold a filter module.

The term "under memory" is used to describe, for example, when the memory components of a dynamic random access memory (DRAM) device are physically soldered to a Printed Circuit Board (PCB). This is an alternative to attaching dual in-line memory modules (DIMMs) to a system using mechanical connectors. Due to various constraints and usage models, memory under-configuration often occurs in embedded platforms.

For upper one-piece heatsinks, a storage component in a server should be placed according to the memory-under-solution method so that the storage component is in contact with the heatsink to dissipate heat. According to the memory solution method, a dynamic random access memory chip set is attached to the motherboard. Therefore, the memory down solution would require more space on the motherboard than a standard two-row memory module slot with the same memory capacity. Additionally, dual row memory modules can be replaced for different capacities and servo requirements. However, due to insufficient height space in a server, the thermal conductivity of a dual row memory module cannot effectively transfer heat to the upper heat sink. For example, a 1U server is a flat server that takes up one unit of space when assembled in a rack or stand-up server chassis. A 1U server is shaped like a pizza box and consists of a core processor, storage, memory slots, interfaces, and interfaces.

For telecom systems with dual rows of memory modules, a one-piece die-cast fin heat sink is typically provided for heat dissipation. For dual row memory module cooling, air should flow through the dual row memory modules. However, the known technology does not provide a dust-proof solution for such a die-casting fin heat sink.

Therefore, there exists a need for an improved frame/cooling plate or die cast fins to provide dust filtration for the air flowing through the dual row memory modules. Furthermore, adding an air filter to the telecommunications system should not affect the overall size of the telecommunications system. The present disclosure is directed to such a dustproof telecommunications system that provides a simple solution for dust filtering by providing a frame with replaceable/removable filter modules, a protective cover, or a cooling plate.

【Content of utility model】

The phraseology of example and similar phraseology (eg, embodiments, configurations, features, examples, and options) is intended to refer broadly to all of the subject matter of this disclosure and the scope of the claims that follow. Several statements containing such plural terms should be understood not to limit the meaning or scope of the subject matter described herein or to limit the scope of the claims below. Embodiments of the present disclosure covered herein are defined by the following claims, rather than the contents of this disclosure. This novel content is a high-level summary of the various features of the present disclosure and introduces some concepts that are more described in the implementation paragraphs below. This new content is not intended to identify the key or essential features of the subject matter of the claimed scope, nor is it intended to be used independently to determine the scope of the claimed subject matter. This subject matter should be understood by reference to the appropriate portions of the complete specification of this disclosure, any or all drawings, and the scope of each application.

According to certain aspects of the present disclosure, a dust-proof telecommunications system is disclosed. The dustproof telecommunications system includes a chassis, a central processing unit or SoC, and a filter module located in the chassis, the filtering module located in the chassis, near the central processing unit or SoC. The filter module has a filter cover and a first air filter, the filter cover at least partially surrounds the central processing unit or the system chip, and the first air filter is located at an inlet of the airflow. The central processing unit or system chip is cooled by airflow.

In some examples, the dust-proof telecommunication system further includes a cooling plate extending between the two side walls, the cooling plate and the side walls are arranged to form a protective space for protecting a plurality of computing components. In addition, a fin structure is formed on the cooling disk, and the fin structure extends outward from the protection space. Additionally, an opening is formed in the cooling pan to receive the filter module, and an upper surface of the filter cover is aligned with an upper surface of the fin configuration when the filter module is placed in the opening.

In some examples, the first air filter is located between the upper and lower surfaces of the filter cover. In some examples, the filter module further includes a second air filter located between an outlet of the airflow and the upper surface and the lower surface of the filter cover. Furthermore, the first air filter is on a first side of the filter cover, and the second air filter is on a second side of the filter cover relative to the first side.

In some examples, an opening is formed on the cooling plate to provide connection to the protective space. Furthermore, openings are formed near and/or over at least a portion of the central processing unit or system chip. Furthermore, the filter module is placed in the opening.

In some examples, the dust-proof telecommunications system further includes a memory module located in the chassis, near the central processing unit or the SoC, and the opening is formed near at least a portion of the central processing unit or the SoC and/or the central processing unit or the SoC. over at least a portion of the system chip, and over at least a portion of the memory module.

In some examples, filter modules positioned in the openings are replaceably secured to the cooling pan. In some examples, the filter module is secured by a fastening mechanism. For example, the fastening mechanism is provided by several removable screws which pass through the filter module and are received in the receiving portion of the cooling pan. The filter module is configured to prevent airborne particles from entering the protected space.

According to certain aspects of the present disclosure, a telecommunications framework is disclosed to accommodate several computing components. The telecommunications frame includes an airflow cooling device, an airflow opening, a guard space, and a replaceable filter module through which cooling air flows, the guard space configured to enclose computing components, and a replaceable filter module having a air filter. Air filters are located near the airflow openings to prevent airborne particles from entering the protected space.

In some examples, the airflow opening is formed on an upper side of the airflow cooling device such that when the filter module is removed from the airflow opening, at least one central processing unit or system chip and a memory module are visible or accessible via the airflow opening entered.

In some examples, the telecommunications frame further includes a fan array having a plurality of fans. In addition, the cooling air produced by the fan and filtered by the air filter causes the heat generated in the protected space to dissipate.

According to certain aspects of the present disclosure, a computing device is disclosed. The computing device includes a printed circuit board assembly, a central processing unit, a storage module, and a cooling disk. A plurality of computing components are mounted on the printed circuit board assembly; the central processing unit is mounted on the printed circuit board assembly; the storage module Installed on the printed circuit board assembly; the cooling disk covers the printed circuit board assembly. The cooling pan has a replaceable filter module with an air filter, at least one of the central processing unit or the storage module being accessible when the filter assembly is removed from the cooling pan.

In some examples, the computing device further includes a fan array with a plurality of fans. In addition, the cooling air generated by the fans and filtered by the air filter cools the central processing unit and the storage modules such that heat generated by the central processing unit and the storage modules is dissipated out of the computing device through the fan array or airflow exhaust. Furthermore, an overall dimension of the computing device is the same whether the filter module is placed on or removed from an opening configured to receive the filter module.

The above novelty is not intended to represent each embodiment or every feature of the present disclosure. Rather, the foregoing novel disclosures provide only examples of some of the novel features and features set forth herein. The above and other features and advantages of the present disclosure will become apparent from the following detailed description of representative embodiments and modes for carrying out the invention, when taken in conjunction with the accompanying drawings and the appended claims. Additional features of the present disclosure will be apparent to those of ordinary skill in the art in view of the detailed description of the various embodiments briefly illustrated below with reference to the accompanying drawings, the symbols provided below.

【Description of drawings】

The present disclosure and its advantages will be better understood from the following description of exemplary embodiments taken in conjunction with the accompanying drawings. The various drawings illustrate only exemplary embodiments, and are therefore not to be considered limiting of the various embodiments or the scope of the claims.

FIG. 1A is a front view of a known technology server without a bezel.

FIG. 1B is a front view of a known technology server with a bezel.

2A is an overall perspective view of a telecommunications frame without a protective cover in accordance with certain features of the present disclosure.

2B is a general perspective view of a telecommunications frame with a protective cover having a filter module mounted thereon, in accordance with certain features of the present disclosure.

2C is an overall perspective view of the telecommunications frame shown in FIG. 2B with the filter module removed from the protective cover, in accordance with certain features of the present disclosure.

3 is a general perspective view of a computing device showing components of the computing device in accordance with certain features of the present disclosure.

4A shows temperature distribution within a telecommunications system in accordance with certain features of the present disclosure.

4B illustrates a schematic diagram of airflow vectors within a telecommunications system in accordance with certain features of the present disclosure.

The present invention is susceptible to various modifications and alternative forms. Some representative embodiments have been shown by way of example in the drawings and will be described in detail herein. It should be understood, however, that the invention is not intended to be limited to the particular form disclosed. Rather, this disclosure is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of this disclosure as defined by the scope of the claims.

【Symbol Description】

100: server

101: Table frame

200: Dust-proof telecommunications system

210: Chassis

220: Central Processing Unit

230: Dual row memory module

240: Fan Array

250: Protective cover/cooling plate

260: Opening

270: Filter Module

270-1: Filter Cover

270-2: First Air Filter

270-3: Second Air Filter

270-4: Screws

300: Chassis

【Detailed ways】

The present disclosure relates to a dustproof telecommunications system or telecommunications frame having a removable filter module. The filter module should be easily replaceable periodically or based on its conditions. Furthermore, even if the filter module is fitted to a dust-tight telecommunication system or telecommunication frame, the depth should not be affected so that the dust-tight telecommunication system or telecommunication frame can be fitted where they need to be installed.

The various embodiments are described with reference to the accompanying drawings, wherein like reference characters are used to designate similar or equivalent elements throughout. The drawings are not to scale and are provided only to illustrate the features and characteristics of the present disclosure. It should be understood that numerous specific details, relationships, and methods are set forth to provide a thorough understanding. However, it will be readily apparent to one of ordinary skill in the art that various embodiments may be practiced without one or more of the specific details or in other ways. In some instances, well-known structures or operations have not been shown in detail for illustrative purposes. The various embodiments are not limited by the order in which actions or events are displayed, eg, some actions may occur in different orders and/or concurrently with other actions or events. Furthermore, not all acts or events shown are required to implement certain features and characteristics of the present disclosure.

For the purposes of this embodiment, unless expressly stated otherwise, the singular includes the plural and vice versa. The term "including" means "including but not limited to". In addition, approximate words such as "about, almost, substantially, approximately" and the like may be used herein to mean, for example, "at", "near, near at", "at 3%" "within 3-5% of", "within acceptable manufacturing tolerances", or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" are intended to additionally include "within 3-5%" of the vertical or horizontal direction, respectively. In addition, directional words such as "top," "bottom," "left," "right," "above," and "below" are intended to relate to the equivalent directions depicted in the reference drawings; understood in context, such as from the common location of an object or element; or other descriptions as such.

2A, according to various embodiments of the present disclosure, a dust-resistant telecommunications system 200 has a chassis 210 and various components located within the chassis. For example, the various components include key components such as a central processing unit (CPU) 220 or a system-on-chip (SoC). In some embodiments, the key components also include a memory module, an express peripheral component interconnect standard card, and/or a chipset. Generally, such critical components cannot be cooled by a cooling plate placed on the chassis 210 . With further reference to FIG. 2A , the dustproof telecommunications system 200 also has a dual row memory module 230 and a fan array 240. The central processing unit 220 and/or the dual row memory module 230 are cooled by an air flow. Figure 2A shows the airflow direction. Depending on the system design, the airflow direction may vary from that illustrated in Figure 2A. For example, the airflow direction is set by the fan array 240 .

Referring to FIG. 2B , the dust-proof telecommunication system 200 also has a protective cover 250 to protect components (including the central processing unit 220 and the dual-row memory module 230 ) located in a protective space of the chassis 210 . According to various embodiments of the present disclosure, the protective cover 250 is configured as a cooling pan. In some embodiments, a fin configuration is formed on the cooling pan and extends outwardly from the protective space. For example, a fin configuration includes a plurality of fins. For example, the cooling plate is a die-cast heat sink (HS). For example, die cast heat sinks are typically made of aluminum, zinc, or magnesium. As shown in FIG. 2C , an opening 260 is formed in the cooling pan/die cast heat sink 250 to receive a filter module 270 . Some components, such as the central processing unit 220 and the dual row memory module 230 are at least partially exposed through the opening 260. Therefore, the central processing unit 220 and the dual row memory module 230 can be accessed through the opening 260 for replacement or expansion. The opening 260 is sized to receive the filter module 270 and can fit snugly in the opening when the filter module is placed in the opening.

As shown in Figures 2B and 2C, when the filter module 270 is assembled into the opening 260, the filter module is located near critical components that need to be cooled. For example, critical components include the central processing unit 220 and the dual row memory module 230, and generally, these multiple components are not sufficiently cooled by the cooling plate. As illustrated in Figures 2B, 2C, and 3, the filter module 270 has a filter cover 270-1 that at least partially surrounds the central processing unit and/or other critical components that need to be cooled. That is, the filter cover 270-1 is placed around critical components that need to be cooled. For example, the filter cover 270-1 also surrounds components that cannot be cooled by a cooling plate, such as a system-on-chip (SoC), a memory module, an express peripheral component interconnect standard card, and/or a chipset. As shown in FIG. 2B , when the filter module 270 is assembled to the opening 260 , the upper surface of the filter cover 270 - 1 is aligned with an upper surface of the protective cover 250 or the fin structure of the cooling pan. Although multiple die cast heat sinks are shown in FIGS. 2B and 2C , a different kind of fin structure may be implemented for the protective cover 250 . It is worth noting that the filter module 270 is different from the known air filter, even when the filter module 270 is placed in the opening 260, while the known air filter increases the overall length or depth of the chassis when attached to the chassis. The overall size of the chassis 210 will not change.

Referring to Figure 3, the filter module 270 also has a first air filter 270-2 located at an inlet of the airflow. In some embodiments, the filter module 270 has an additional air filter (a second air filter 270-3) located at an outlet of the airflow. Both the first air filter 270-2 and the second air filter 270-3 are located between the upper side and the lower side of the filter cover 270-1. For example, the first air filter 270-2 is on a first side of the filter cover 270-1, and the second air filter 270-3 is on a second side of the filter cover 270-1 opposite the first side. Two air filters are illustrated in Figure 3. In some embodiments, the number of filters may be 1, 2, 3, or 4.

In some embodiments, the filter module 270 is pre-assembled and can be used as a single replaceable module such that the entire filter module can be used periodically, or when the used filter module is dirty or in poor condition is replaced, as exemplified in Figure 2C. In some embodiments, the filter cover 270-1 is reusable and only the first air filter 270-2 and the second air filter 270-3 are replaced. That is, the filter module 270 is removed from the opening 260, the first air filter 270-2 and the second air filter 270-3 are replaced with new air filters, followed by new first and second air filters The filter cover 270-1 of the filter is inserted back into the opening. In some embodiments, the filter module 270 placed in the opening 260 is secured to the protective cover 250 by a fastening mechanism. For example, the filter module 270 is fixed to the protective cover 250 by screws 270-4. In this case, the screw 270 - 4 passing through the filter module 270 is received in the receiving portion of the protective cover/cooling pan 250 . However, the fastening mechanism is not limited to this, and other methods may be used.

3, showing the direction of the airflow, the cooling airflow entering the airflow inlet of the chassis 210 passes through at least one of the first air filter 270-2 or the second air filter 270-3, so that airborne particles are prevented from entering the protected space . Notably, depending on the design of the dust-tight telecommunication system 200, the airflow direction may be different from that shown in FIG. 3 . The filtered cooling air passes through the central processing unit 220 heat sink and the dual row memory modules 230, thereby cooling them. In addition, the heat generated by the components is ultimately dissipated via airflow exhaust or fan array 240 consisting of multiple cooling fan units.

As shown in FIG. 3, the placement of the filter module 270 does not affect the size of the dust-tight telecommunications system 200. Therefore, the dust-proof telecommunication system 200 with the filter module 270 can be assembled in a chassis 300 without any problem in being assembled into a rack or cabinet. Thus, the dust-tight telecommunications system 200, according to various embodiments of the present disclosure, provides a way to filter cooling air introduced into the chassis very easily. That is, when used filter modules 270 need to be replaced, they can be discarded and replaced with ease. Therefore, this is very cost effective, requiring only the filter module 270, rather than a form box with a filter in known servers.

4A and 4B show the results of the thermal simulation configuration. According to the results shown in FIG. 4A , the heat dissipation of the on-board components is efficiently conducted to the upper heat sink, and the central processing unit 220 and the dual-row memory module 230 are air-cooled. For example, the inlet temperature of the central processing unit 220 is 57°C and the outlet temperature of the central processing unit 220 is 73.5°C, indicating that the cooling air takes away the heat generated by the central processing unit. Furthermore, according to the results shown in FIG. 4B , a high-speed airflow passes through the heat sink of the central processing unit 220 and the dual-row memory modules 230 , thus cooling them efficiently. The multiple results clearly indicate that the airflow is not disturbed by the first air filter 270-2 and/or the second air filter 270-3 of the filter module 270, which prevents dust particles from entering the central processing unit 220 and dual line memory The protected space where the module 230 is located.

The following are example specifications for filters used in filter module 270. The thickness of the filter is 5mm, 10mm, 15mm, or 20mm. The filter is rated for airflow of 1.5 meters per second. The filters had an average capture rate of 65%, 70%, 80%, or 90%. The initial pressure drop (Pa) of the filter was 15, 18, 20, or 25. The final pressure drop (Pascals) of the filter was 150, 180, 200, or 250. The dust holding capacity (g/m2) of the filter is 380, 400, 500, or 600. The specification of the filter is not limited to the above-mentioned values, and can be changed as required.

While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example and not limitation. Various changes may be made in accordance with the embodiments disclosed herein without departing from the spirit or scope of the disclosure. Accordingly, the breadth and scope of the present disclosure should not be limited by any of the above-described embodiments. Instead, the scope of the present disclosure should be defined by the following claims and their equivalents.

One or more elements or features or steps, or any part thereof, from any one or more of the following claims may be combined with one or more elements or features or steps, or any combination thereof, to form one or more additional embodiments and/or claims of the present disclosure.

While embodiments of the present disclosure have been shown and described with respect to one or more embodiments, equivalents and modifications will come to mind to those of ordinary skill in the art upon reading and understanding this specification and the accompanying drawings. Additionally, although a particular feature of the present disclosure may have been disclosed with respect to only one of the several embodiments, for any given or particular application, such feature may be combined with one or more of the other embodiments, as may be required and advantageous. Multiple other feature combinations.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present invention. As used herein, the singular forms "a (a, an)", and "the (the)" are intended to include the plural forms as well, unless the context clearly dictates otherwise. In addition, the terms "including, includes", "having, has, with" or variations thereof used in the embodiments and/or the scope of the patent application are intended to be similar to "including" (comprising)" is included.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as understood by one of ordinary skill in the art. In addition, terms, such as those defined in common dictionaries, should be construed to have meanings consistent with their meanings in the related art, and not in an idealized or overly formal sense unless explicitly so defined explain.

Claims (10)

1. a dust-proof telecommunication system, is characterized in that, comprises: a chassis; a central processing unit or SoC located within the chassis, the central processing unit or SoC receiving an airflow and being cooled by the airflow; and a filter module, located in the chassis, near the central processing unit or the system chip, the filter module has a filter cover, at least partially surrounding the central processing unit or the system chip, the filter module further has a first air filter, located in an inlet for the airflow. 2. The dust-proof telecommunication system according to claim 1, further comprising: a cooling plate, a fin structure is formed on the cooling plate, and the fin structure extends outward from a protection space of the case. 3 . The dust-proof telecommunication system of claim 2 , wherein an opening is formed on the cooling plate to receive the filter module, and when the filter module is placed in the opening, the filter cover has an opening. 4 . An upper surface is aligned with an upper surface of the fin structure. 4 . The dust-proof telecommunication system of claim 3 , wherein the first air filter is located between the upper surface and the lower surface of the filter cover. 5 . 5 . The dust-proof telecommunication system of claim 4 , wherein the filter module further comprises a second air filter located at an outlet of the airflow and between the upper surface and the lower surface of the filter cover. 6 . between. 6 . The dust-proof telecommunication system of claim 2 , wherein an opening is formed on the cooling plate for connecting to the protection space. 7 . 7. The dust-proof telecommunication system of claim 6, wherein the filter module is placed in the opening. 8. The dust-tight telecommunications system of claim 7, wherein the filter module disposed in the opening is replaceably secured to the cooling pan. 9. A telecommunications frame for mounting a plurality of components, characterized in that the telecommunications frame comprises: an opening through which cooling air flows; a protective space configured to enclose the plurality of components; and A replaceable filter module with an air filter located near the opening to prevent airborne particles from entering the protective space. 10. A computing device, comprising: a printed circuit board assembly on which a plurality of components are mounted; a central processing unit installed on the printed circuit board assembly; a memory module mounted on the printed circuit board assembly; and a cooling pan covering the printed circuit board assembly, the cooling pan having a replaceable filter module with an air filter, the central processing unit or the storage module when the filter module is removed from the cooling pan At least one is accessible.

Images