CN217375054U - Wafer transporter - Google Patents
Wafer transporter Download PDFInfo
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- CN217375054U CN217375054U CN202220346175.8U CN202220346175U CN217375054U CN 217375054 U CN217375054 U CN 217375054U CN 202220346175 U CN202220346175 U CN 202220346175U CN 217375054 U CN217375054 U CN 217375054U
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- wafer
- box
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- linear module
- manipulator
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- 235000012431 wafers Nutrition 0.000 claims abstract description 169
- 238000003860 storage Methods 0.000 claims abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims description 15
- 241000252254 Catostomidae Species 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 9
- 238000012856 packing Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer conveyer contains: the wafer sorting module, the first manipulator and the wafer storage module; the wafer sorting module is arranged on one side of the first mechanical arm and used for sorting wafers; the wafer storage module is arranged on the other side of the first mechanical arm and used for storing wafers. The utility model discloses a wafer letter sorting module, first manipulator and wafer are deposited and are mutually supported between the module, have realized carrying the wafer of unidimensional not, have the characteristics that work efficiency is high, the yields is high.
Description
Technical Field
The utility model relates to a wafer processing equipment technical field, in particular to wafer conveyer.
Background
In the semiconductor industry, wafer transmission is often required in the cleaning, etching and photoresist removing processes of wafers, LED sapphire substrates and the like. The wafer handling mechanism is a core part of a wafer transmission system, and plays a significant role in the semiconductor industry. The wafer transmission mechanism runs through the whole wafer processing and manufacturing process. However, in the prior art, the wafer conveying mechanism can only convey wafers of the same size at the same time, and when an operator needs to change the size of the wafer to be conveyed, the operator needs to adjust the control parameters of the equipment and debug the equipment, which has the defect of low working efficiency.
SUMMERY OF THE UTILITY MODEL
According to the embodiment of the utility model provides a wafer carrier contains: the wafer sorting module, the first manipulator and the wafer storage module are arranged on the wafer sorting module;
the wafer sorting module is arranged on one side of the first mechanical arm and used for sorting wafers;
the wafer storage module is arranged on the other side of the first mechanical arm and used for storing wafers.
Further, the wafer sorting module comprises: the wafer box, the packaging placing box, the wafer placing tray and the second manipulator are arranged on the wafer box;
the wafer box is arranged on one side of the first manipulator and used for storing wafers with wafer pads;
the packaging placing box is arranged on one side of the first manipulator and used for storing the wafer cushion;
the wafer placing tray is arranged on one side of the first manipulator, and the packaging placing box, the wafer box and the packaging placing box are arranged in a straight line and used for containing wafers;
the second mechanical arm is arranged on one side of the wafer box, the packaging placing box and the wafer placing tray and used for sorting the wafer pads into the packaging placing box and sorting the wafers onto the wafer placing tray.
Furthermore, a first position sensor is arranged in the package placing box and electrically connected with the second manipulator, and the first position sensor is used for sensing the height of the wafer pad in the package placing box.
Further, the second robot includes: the device comprises a first linear module, a connecting piece, a second linear module, a grabbing piece and a color sensor;
the first linear module is arranged on one side of the wafer box, the packaging placing box and the wafer placing tray in parallel;
the connecting piece is arranged at the execution end of the first linear module;
the second linear module is arranged on the connecting piece;
the grabbing piece is arranged at the execution end of the second linear module;
the color sensor is arranged on the grabbing piece and electrically connected with the first linear module and used for identifying the wafer pad.
Further, the second robot further includes: and the second position sensor is arranged on the manipulator and is electrically connected with the second linear module and used for sensing the distance between the grabbing piece and the wafer and between the grabbing piece and the wafer pad.
Further, the grasping piece includes: the device comprises an execution bracket and a plurality of rows of suckers;
the execution bracket is arranged at the execution end of the second linear module;
the plurality of rows of suckers are distributed at the execution end of the execution bracket in a circular array and used for grabbing the wafer.
Further, the wafer placing tray includes: the bearing bracket and the plurality of pairs of limiting plates;
the bearing bracket is arranged on one side of the first manipulator;
the plurality of pairs of limiting plates are symmetrically arranged at the top of the bearing support, the plurality of limiting plates positioned on the same side are distributed in a ladder shape, and the distances between the plurality of pairs of limiting plates are gradually decreased for containing wafers with different sizes.
Further, the wafer storage module comprises: the feeding support and the plurality of material preparation boxes;
the feeding support is arranged on the other side of the first manipulator;
the plurality of material preparation boxes are arranged on the material loading support and used for storing wafers of different sizes.
According to the utility model discloses wafer carrier deposits mutually supporting between the module through wafer letter sorting module, first manipulator and wafer, has realized carrying the wafer of unidimensional not, has the characteristics that work efficiency is high, the yields is high.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed technology.
Drawings
Fig. 1 is a perspective view of a first viewing angle of a wafer handler according to an embodiment of the present invention;
fig. 2 is a perspective view of a second perspective view of a wafer handler in accordance with an embodiment of the present invention.
Detailed Description
The present invention will be further described with reference to the following detailed description of preferred embodiments thereof, which is to be read in connection with the accompanying drawings.
First, a wafer handler according to an embodiment of the present invention will be described with reference to fig. 1-2, which is used for handling a wafer 4 and has a wide application range.
As shown in fig. 1, a wafer handler according to an embodiment of the present invention includes: the wafer sorting module, the first manipulator 2 and the wafer storage module.
Specifically, as shown in fig. 1, a wafer sorting module is provided at one side of the first robot arm 2 for sorting the wafers 4.
Further, as shown in fig. 1, the wafer sorting module includes: a wafer box 11, a packaging placing box 12, a wafer placing tray and a second manipulator; a wafer cassette 11 is disposed at one side of the first robot 2 for storing the wafer 4 with a wafer pad (not shown); the packing and placing box 12 is arranged on one side of the first manipulator 2 and used for storing the wafer cushion; the wafer placing tray is arranged on one side of the first manipulator 2, and the packaging placing box, the wafer box 11 and the packaging placing box 12 are arranged in a straight line and used for containing wafers 4; the second mechanical arm is arranged on one side of the wafer box 11, the package placing box 12 and the wafer placing tray and used for sorting the wafer pads into the package placing box 12 and sorting the wafers 4 onto the wafer placing tray.
Further, as shown in fig. 1, a first position sensor 121 is disposed in the package storage box 12, and the first position sensor 121 is electrically connected to the second robot for sensing the height of the wafer pad in the package storage box 12, so as to avoid the occurrence of collision during the transportation process.
Further, as shown in fig. 1, the second robot includes: a first linear module 141, a connecting piece 142, a second linear module 143, a grabbing piece and a color sensor 144; the first linear module 141 is arranged in parallel at one side of the wafer box 11, the packing box 12 and the wafer placing tray; the connecting piece 142 is arranged at the executing end of the first linear module 141; the second linear module 143 is disposed on the connecting member 142; the grabbing piece is arranged at the execution end of the second linear module 143; the color sensor 144 is disposed on the grasping member, and the color sensor 144 is electrically connected to the first linear module 141 for identifying the color of the wafer pad, so as to identify whether the object to be transported is the wafer 4 or the wafer pad, and to distinguish the size of the wafer 4 corresponding to the wafer pad, thereby improving the working efficiency of the embodiment.
Further, as shown in fig. 1, the second robot further includes: second position sensor 145, second position sensor 145 set up on the manipulator, second position sensor 145 and the straight line module 143 electric connection of second for the response is grabbed the piece and is 4, the wafer pad's of wafer interval, avoids this embodiment to take place to collide the piece at the in-process of transport, has improved the yields of this embodiment.
Further, as shown in fig. 1, the grasping piece includes: an execution bracket 1461 and a plurality of rows of suckers 1462; the executing bracket 1461 is arranged at the executing end of the second linear module 143; the rows of suckers 1462 are distributed on the execution end of the execution bracket 1461 in a circular array and are used for grabbing wafers 4 with different sizes, so that the embodiment is suitable for carrying wafers 4 with different sizes, and the working efficiency of the embodiment is improved.
Further, as shown in fig. 1, the wafer placing tray includes: a bearing bracket 131 and a plurality of pairs of limiting plates 132; the carrier bracket 131 is disposed at one side of the first robot 2; a plurality of to limiting plate 132 symmetry setting at the top that bears support 131, a plurality of limiting plate 132 that lie in same one side are the echelonment and distribute, and a plurality of intervals to limiting plate 132 decrease progressively in proper order for hold not unidimensional wafer 4, make this embodiment be suitable for carrying not unidimensional wafer 4, improved the work efficiency of this embodiment.
Specifically, as shown in fig. 1 to 2, the wafer storage module is disposed at the other side of the first robot 2 for storing the wafer 4.
Further, as shown in fig. 2, the wafer storage module block includes: a loading support 31 and a plurality of material preparation boxes 32.
When the equipment is operated, a user places a plurality of wafers 4 with wafer cushions in the wafer box 11, a wafer cushion is clamped between adjacent wafers 4, firstly, the first linear module 141 drives the second linear module 143 to move to the upper part of the wafer box 11, the second linear module 143 drives the grabbing piece to descend, the second position sensor 145 senses the shortest distance between the grabbing piece and the wafer 4 or the wafer cushion, the second position sensor 145 sends feedback information to enable the grabbing piece to descend to a proper position, the color sensor 144 identifies the color of the wafer cushion, when the color sensor 144 identifies the wafer cushion, the color sensor 144 sends feedback information, the grabbing piece controls the sucker to suck the wafer cushion, the second linear module 143 returns to the initial position, the first linear module 141 drives the second linear module 143 to displace to the upper part of the packing placing box 12, the second linear module 143 drives the grabbing piece to descend, the first position sensor 121 senses the height of the wafer pad in the packing and placing box 12 and sends feedback information to enable the clamping piece for clamping the wafer pad to descend to a proper height, the clamping piece controls the suction disc to place the wafer pad in the packing and placing box 12, and the second linear module 143 drives the clamping piece to return to an initial position; when the color sensor 144 identifies the wafer 4, the color sensor 144 sends another feedback information, the grasping piece controls the chuck to suck the wafer 4, the second linear module 143 drives the grasping piece to return to the initial position, the first linear module 141 drives the second linear module 143 to move to the position above the wafer placing tray, the second linear module 143 drives the grasping piece to descend to the preset height, the grasping piece controls the chuck to place the wafer 4 on the corresponding limiting plate 132 in the packing placing box 12, and the second linear module 143 drives the grasping piece to return to the initial position; then, the first robot 2 grips the wafer 4 in the wafer placing tray and transfers the wafer 4 to the corresponding model of the cassette 32.
Above, having described with reference to fig. 1-2 and according to the utility model discloses wafer carrier deposits mutually supporting between the module piece through wafer letter sorting module, first manipulator 2 and wafer, has realized carrying not unidimensional wafer 4, has the characteristics that work efficiency is high, the yields is high.
It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
While the invention has been described in detail with reference to the preferred embodiments, it should be understood that the description is not intended to limit the invention. Various modifications and alterations to the present invention will become apparent to those skilled in the art upon a reading of the specification. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (8)
1. A wafer handler, comprising: the wafer sorting module, the first manipulator and the wafer storage module;
the wafer sorting module is arranged on one side of the first mechanical arm and used for sorting wafers;
the wafer storage module is arranged on the other side of the first mechanical arm and used for storing the wafer.
2. The wafer handler of claim 1, wherein the wafer sorting module comprises: the wafer placing device comprises a wafer box, a packaging placing box, a wafer placing tray and a second manipulator;
the wafer box is arranged on one side of the first mechanical arm and used for storing the wafer with the wafer pad;
the packaging placing box is arranged on one side of the first manipulator and used for storing the wafer cushion;
the wafer placing tray is arranged on one side of the first manipulator, and the packaging placing box, the wafer box and the packaging placing box are arranged in a straight line and used for containing the wafers;
the second mechanical arm is arranged on one side of the wafer box, the package placing box and the wafer placing tray and used for sorting the wafer pads into the package placing box and sorting the wafers onto the wafer placing tray.
3. The wafer handler of claim 2, wherein a first position sensor is disposed in the package receiving box, the first position sensor being electrically connected to the second robot for sensing a height of the wafer pad in the package receiving box.
4. The wafer handler of claim 2, wherein the second robot comprises: the device comprises a first linear module, a connecting piece, a second linear module, a grabbing piece and a color sensor;
the first linear module is arranged on one side of the wafer box, the packaging placing box and the wafer placing tray in parallel;
the connecting piece is arranged at the execution end of the first linear module;
the second linear module is arranged on the connecting piece;
the grabbing piece is arranged at the execution end of the second linear module;
the color sensor is arranged on the grabbing piece and electrically connected with the first linear module and used for identifying the wafer pad.
5. The wafer handler of claim 4, wherein the second robot further comprises: and the second position sensor is arranged on the manipulator and electrically connected with the second linear module and used for sensing the distance between the grabbing piece and the wafer and between the grabbing piece and the wafer pad.
6. The wafer handler of claim 4, wherein the grasping element comprises: the execution bracket and the plurality of rows of suckers;
the executing bracket is arranged at the executing end of the second linear module;
the plurality of rows of suckers are distributed at the execution end of the execution support in a circular array and used for grabbing the wafer.
7. The wafer handler of claim 2, wherein the wafer placement tray comprises: the bearing bracket and the plurality of pairs of limiting plates;
the bearing bracket is arranged on one side of the first manipulator;
the pair of limiting plates are symmetrically arranged at the top of the bearing support, the limiting plates positioned on the same side are distributed in a ladder shape, and the distances among the pair of limiting plates are gradually decreased in sequence and are used for containing wafers of different sizes.
8. The wafer handler of claim 1, wherein the wafer storage module comprises: the feeding support and the plurality of material preparation boxes;
the feeding support is arranged on the other side of the first manipulator;
the plurality of material preparation boxes are arranged on the feeding support and used for storing the wafers of different sizes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220346175.8U CN217375054U (en) | 2022-02-21 | 2022-02-21 | Wafer transporter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220346175.8U CN217375054U (en) | 2022-02-21 | 2022-02-21 | Wafer transporter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217375054U true CN217375054U (en) | 2022-09-06 |
Family
ID=83100888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220346175.8U Active CN217375054U (en) | 2022-02-21 | 2022-02-21 | Wafer transporter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217375054U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115621165A (en) * | 2022-10-20 | 2023-01-17 | 上海世禹精密机械有限公司 | Wafer sorting machine |
-
2022
- 2022-02-21 CN CN202220346175.8U patent/CN217375054U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115621165A (en) * | 2022-10-20 | 2023-01-17 | 上海世禹精密机械有限公司 | Wafer sorting machine |
| CN115621165B (en) * | 2022-10-20 | 2023-09-01 | 上海世禹精密设备股份有限公司 | Wafer sorting machine |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |