CN217215176U - Conductive terminal - Google Patents
Conductive terminal Download PDFInfo
- Publication number
- CN217215176U CN217215176U CN202021907670.9U CN202021907670U CN217215176U CN 217215176 U CN217215176 U CN 217215176U CN 202021907670 U CN202021907670 U CN 202021907670U CN 217215176 U CN217215176 U CN 217215176U
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- Prior art keywords
- layer
- platinum
- conductive terminal
- alloy layer
- alloy
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910001260 Pt alloy Inorganic materials 0.000 claims abstract description 36
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims description 46
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910000929 Ru alloy Inorganic materials 0.000 claims description 10
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 10
- 229910052707 ruthenium Inorganic materials 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- 229910001020 Au alloy Inorganic materials 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 5
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 5
- 239000003353 gold alloy Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052703 rhodium Inorganic materials 0.000 claims description 5
- 239000010948 rhodium Substances 0.000 claims description 5
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 5
- 229910000629 Rh alloy Inorganic materials 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 22
- 238000005260 corrosion Methods 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 16
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 133
- 239000002987 primer (paints) Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model discloses a conductive terminal, which comprises a contact part; the contact part is provided with a plurality of structural layers and comprises a substrate, a platinum alloy layer, an intermediate layer and a platinum or platinum alloy layer which are arranged from inside to outside. The contact part of the conductive terminal is electroplated with two platinum material coatings, wherein the platinum alloy is beneficial to enhancing the hardness of the coatings, the corrosion resistance of the conductive terminal can be improved, and meanwhile, the electroplating cost of the conductive terminal is also reduced.
Description
Technical Field
The present invention relates to a conductive terminal, and more particularly to a conductive terminal with better corrosion resistance.
Background
The electric connector plays a role in lifting weight in the existing electronic equipment and has the functions of charging the electronic equipment and transmitting data; however, when water or other substances enter the electronic device, the electronic device may be damaged, and in severe cases, the electronic device may not be used normally. With the change and innovation of science and technology, the existing electronic equipment can achieve a certain waterproof effect, and has a new trend of waterproof property, and the development of the waterproof electric connector also tends to be standardized. Although the electric connector can be designed into a waterproof structure in the existing scheme and can prevent the electronic equipment from contacting with the outside, when corrosive media are adhered to the electric connector, the electric connector can corrode a conductive terminal of the electric connector, so that the electric connector is subjected to a condition of function attenuation or failure after being used for a period of time, and the use of the electric connector is influenced.
Therefore, it is necessary to provide a new conductive terminal to overcome the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a higher conductive terminal of rigidity has better corrosion resistance.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a conductive terminal includes a contact portion; the contact part is provided with a plurality of structural layers and comprises a substrate, a platinum alloy layer, an intermediate layer and a platinum or platinum alloy layer which are arranged from inside to outside.
In a preferred embodiment, the sum of the thicknesses of the platinum alloy layer and the platinum or platinum alloy layer is 5-80u ".
In a preferred embodiment, the intermediate layer is of one or more layer construction and the thickness of the intermediate layer is not less than 0.5u ".
In a preferred embodiment, the intermediate layer is a gold or gold alloy layer.
In a preferred embodiment, the intermediate layer is at least one of a palladium or palladium alloy layer, a silver or silver alloy layer.
In a preferred embodiment, the intermediate layer is a ruthenium or ruthenium alloy layer.
In a preferred embodiment, the contact portion includes a primer layer between the substrate and the platinum alloy layer, and the primer layer has a first primer layer and a second primer layer formed on the first primer layer.
In a preferred embodiment, the first base plating layer is a nickel or nickel alloy layer, and the thickness of the first base plating layer is 40 to 300u ″.
In a preferred embodiment, the second primer layer is of one or more layer configuration, and the thickness of the second primer layer is not less than 0.5u ″.
In a preferred embodiment, the contact portion further comprises an outer metal layer plated on an outer side of the platinum or platinum alloy layer, the outer metal layer has a thickness of not less than 0.5u ″, and the outer metal layer comprises at least one of rhodium or rhodium alloy layer, ruthenium or ruthenium alloy layer.
Compared with the prior art, the utility model discloses following beneficial effect has: the contact part is provided with a plurality of structural layers and comprises a substrate, a platinum alloy layer, an intermediate layer and a platinum or platinum alloy layer which are arranged from inside to outside. The contact part of the conductive terminal is electroplated with two platinum material coating layers, and the platinum coating layers have better corrosion resistance and lower cost, so that the corrosion resistance of the conductive terminal can be improved under the consideration of low cost, and the surface hardness of the coating layers of the conductive terminal is also improved by taking the platinum material coating layers as the corrosion resistance.
Drawings
Fig. 1 is a schematic structural view of a first embodiment of a contact portion of a conductive terminal according to the present invention.
Fig. 2 is a schematic structural view of a second embodiment of a contact portion of a conductive terminal according to the present invention.
Fig. 3 is a schematic structural view of a third embodiment of a contact portion of a conductive terminal according to the present invention.
Fig. 4 is a schematic structural view of a fourth embodiment of a contact portion of a conductive terminal according to the present invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the terms "first," "second," and the like as used in the description and in the claims, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Similarly, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one; "plurality" means two or more than two. Unless otherwise indicated, "front," "back," "lower," and/or "upper," and the like are for convenience of description, and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed after "comprises" or "comprising" is inclusive of the element or item listed after "comprising" or "comprises", and the equivalent thereof, and does not exclude additional elements or items.
Referring to fig. 1, a first embodiment of the present invention discloses a conductive terminal (not shown) for use in a USB Type-C electrical connector. The conductive terminal comprises a contact part for butting with a butting connector (not shown), the contact part is provided with a plurality of structural layers, and the contact part comprises a substrate A0, a platinum alloy layer A1, an intermediate layer A2 and a platinum or platinum alloy layer A3 which are sequentially arranged from inside to outside. The contact base a0 is made of copper or a copper alloy. The intermediate layer A2 is one or more layers, and the intermediate layer is at least one of a gold or gold alloy layer, a palladium or palladium alloy layer, a silver or silver alloy layer, a ruthenium or ruthenium alloy layer; that is, the material of the intermediate layer a2 is one or a combination of gold or a gold alloy, palladium or a palladium alloy, silver or a silver alloy, and ruthenium or a ruthenium alloy.
The platinum alloy layer A1 and the platinum or platinum alloy layer A3 have good corrosion resistance, and the platinum plating layer has better corrosion resistance and lower cost, so that the corrosion resistance of the conductive terminal can be improved under the consideration of low cost, and the surface hardness of the plating layer of the conductive terminal is also improved by taking the platinum plating material plating layer as the corrosion resistance. The sum of the thicknesses of the platinum alloy layer A1 and the platinum or platinum alloy layer A3 is 5-80u ' ("u ' is English unit and is commonly used in electroplating industry, and 1 mu m is approximately equal to 40u '); the intermediate layer A2 is a corrosion-resistant layer, the thickness of the intermediate layer is not less than 0.5u ', and 2-60 u' is selected in the embodiment. Experiments prove that on the premise that the sum of the thicknesses of the two platinum material plating layers (the platinum alloy layer A1 and the platinum or platinum alloy layer A3) is equal to the thickness of one platinum material plating layer, the electrolytic corrosion resistance of the conductive terminal plated with the two platinum material plating layers is superior to that of the conductive terminal plated with only one platinum material plating layer; the filling of the intermediate layer A2 ensures that two platinum material plating layers are kept more compact, plays a role in mutual filling, simultaneously prevents external corrosive substances from entering, and further ensures that the corrosion resistance of the conductive terminal is better.
Referring to fig. 2, a second embodiment of the present invention discloses a conductive terminal (not shown), which is different from the first embodiment in that the contact portion includes an undercoating layer between a substrate a0 and a platinum alloy layer a 1. The primer coating has a first primer coating a4 and a second primer coating a5 formed on the first primer coating a 4. The first bottom plating layer a4 is a nickel or nickel alloy layer, and the nickel or nickel alloy layer has good acid resistance. The second bottom plating layer a5 is of one or more layer configuration, and the second bottom plating layer a5 is at least one of a gold or gold alloy layer, a palladium or palladium alloy layer, a silver or silver alloy layer, and a ruthenium or ruthenium alloy layer. The second bottom plating layer a5 is used for increasing the bonding force between the first bottom plating layer a4 and the platinum alloy layer a1 and reducing the internal stress inside the first bottom plating layer a4 and the platinum alloy layer a 1. The material of the second bottom plating layer A5 has good stability and corrosion resistance, thereby effectively protecting the substrate A0. Meanwhile, the thickness of the first bottom plating layer A4 is 40-300 u ', and the thickness of the second bottom plating layer A5 is not less than 0.5 u'.
The contact portion may further include a copper plating layer (not shown) between the substrate a0 and the first bottom plating layer a4, the copper plating layer is made of copper or a copper alloy, and copper is selected in this embodiment. The copper plating layer is electroplated on the outer side of the substrate A0, which is beneficial to improving the flatness of the surface of the substrate so as to reduce the internal stress of the subsequent electroplating layer caused by uneven distribution.
Referring to fig. 3, a third embodiment of the present invention discloses a conductive terminal (not shown), which is different from the first embodiment in that the contact portion includes an outer metal layer a6, and the outer metal layer a6 is plated on an outer side of a platinum or platinum alloy layer A3. The outer metal layer a6 includes at least one of rhodium or a rhodium alloy layer, ruthenium or a ruthenium alloy layer, that is, the material of the outer metal layer a6 is one or a combination of rhodium or a rhodium alloy, ruthenium or a ruthenium alloy; in the embodiment, rhodium ruthenium alloy is selected; the outer metal layer A6 can block the corrosion of the substrate A0 from the outside. Meanwhile, the thickness of the outer metal layer A6 is not less than 0.5u ', 2-60 u' is selected in this embodiment.
Referring to fig. 4, a fourth embodiment of the present invention discloses a conductive terminal (not shown), which is different from the first embodiment in that the contact portion includes a bottom plating layer and an outer metal layer a6, the bottom plating layer is located between a substrate a0 and a platinum alloy layer a1, and the outer metal layer a6 is plated on the outer side of the platinum or platinum alloy layer A3. The bottom plating layer has a first bottom plating layer a4 and a second bottom plating layer a5 formed on the first bottom plating layer a 4. The first bottom plating layer a4 is a nickel or nickel alloy layer having good acid resistance. The second bottom plating layer a5 is one or more layers, and is used for increasing the bonding force between the first bottom plating layer a4 and the platinum alloy layer a1 and reducing the internal stress inside. The material of the second bottom plating layer A5 has good stability and corrosion resistance, thereby effectively protecting the substrate A0. The outer metal layer A6 can prevent the corrosion of the substrate A0 from the outside.
It should be noted that, for each of the above plating layers, the larger the thickness of the plating layer is, the better the parameters of the conductive terminal, such as mechanical properties, electrical properties, chemical properties, etc., but at the same time, rhodium, ruthenium, palladium, gold, silver in each plating layer are all expensive metals, so that the manufacturing cost and performance of the conductive terminal need to be balanced in practical production.
The utility model discloses a contact site includes basement A0, platinum alloy layer A1, intermediate level A2 and platinum or platinum alloy layer A3 from inside to outside setting. The platinum alloy layer A1 and the platinum or platinum alloy layer A3 have good corrosion resistance and high hardness, and the filling of the intermediate layer A2 enables the two platinum material plating layers to be more compact, plays a role in mutual filling, simultaneously blocks the entry of external corrosive substances, and further enables the corrosion resistance of the conductive terminal to be better. The contact part of the conductive terminal is electroplated with two platinum material plating layers, and the platinum plating layers have better corrosion resistance and lower cost, so that the corrosion resistance of the conductive terminal can be improved under the consideration of low cost, and the surface hardness of the plating layers of the conductive terminal is also improved by taking the platinum material plating layers as the corrosion resistance, and the manufacturing cost of the electric connector is reduced.
In summary, the above is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made according to the claims and the content of the specification should still belong to the scope covered by the present invention.
Claims (9)
1. A conductive terminal includes a contact portion; the method is characterized in that: the contact part is provided with a plurality of structural layers and comprises a substrate, a platinum alloy layer, an intermediate layer and a platinum or platinum alloy layer which are arranged from inside to outside, wherein the sum of the thicknesses of the platinum alloy layer and the platinum or platinum alloy layer is 5-80 u'.
2. An electrically conductive terminal as claimed in claim 1, wherein: the intermediate layer is of one-layer or multi-layer construction, and the thickness of the intermediate layer is not less than 0.5u ″.
3. An electrically conductive terminal as claimed in claim 2, wherein: the intermediate layer is a gold or gold alloy layer.
4. An electrically conductive terminal as claimed in claim 2, wherein: the intermediate layer is at least one of palladium or a palladium alloy layer and silver or a silver alloy layer.
5. An electrically conductive terminal as claimed in claim 2, wherein: the intermediate layer is a ruthenium or ruthenium alloy layer.
6. An electrically conductive terminal as claimed in claim 1, wherein: the contact portion includes a primer layer, the primer layer is located between the substrate and the platinum alloy layer, and the primer layer has a first primer layer and a second primer layer formed on the first primer layer.
7. An electrically conductive terminal as claimed in claim 6, wherein: the first bottom plating layer is a nickel or nickel alloy layer, and the thickness of the first bottom plating layer is 40-300 u ″.
8. An electrically conductive terminal as claimed in claim 6, wherein: the second bottom plating layer is of one-layer or multi-layer structure, and the thickness of the second bottom plating layer is not less than 0.5u ″.
9. An electrically conductive terminal as claimed in claim 1, wherein: the contact part also comprises an outer metal layer plated on the outer side of the platinum or platinum alloy layer, the thickness of the outer metal layer is not less than 0.5 u', and the outer metal layer comprises at least one of rhodium or rhodium alloy layer and ruthenium or ruthenium alloy layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021907670.9U CN217215176U (en) | 2020-09-03 | 2020-09-03 | Conductive terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021907670.9U CN217215176U (en) | 2020-09-03 | 2020-09-03 | Conductive terminal |
Publications (1)
Publication Number | Publication Date |
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CN217215176U true CN217215176U (en) | 2022-08-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202021907670.9U Active CN217215176U (en) | 2020-09-03 | 2020-09-03 | Conductive terminal |
Country Status (1)
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CN (1) | CN217215176U (en) |
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2020
- 2020-09-03 CN CN202021907670.9U patent/CN217215176U/en active Active
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