CN217156256U - Material state detection device - Google Patents
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- CN217156256U CN217156256U CN202123303185.8U CN202123303185U CN217156256U CN 217156256 U CN217156256 U CN 217156256U CN 202123303185 U CN202123303185 U CN 202123303185U CN 217156256 U CN217156256 U CN 217156256U
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Abstract
The utility model relates to a material state detection device, its state that can detect the material that awaits measuring effectively improves subsequent efficiency of software testing. This material state detection device includes: the material shuttle assembly comprises a material shuttle base station, a driving mechanism arranged on the material shuttle base station and a material shuttle disc movably arranged on the material shuttle base station, and the material shuttle disc is connected with the driving mechanism in a driving mode and used for transporting the material to be detected on the material shuttle base station; and the sensor assembly comprises a displacement sensor arranged on the material shuttle base station, the displacement sensor is positioned above the transportation path of the material shuttle disk and used for measuring the distance information of the material to be detected when the material shuttle disk is driven by the driving mechanism to transport the material to be detected to the sensing area of the displacement sensor so as to judge the state of the material to be detected on the material shuttle disk through the distance information.
Description
Technical Field
The utility model relates to an integrated circuit test selects separately technical field, especially relates to a material state detection device.
Background
The chip technology is used as the foundation and the core of the modern electronic information industry, is as small as a mobile phone, a computer and a digital camera, and is as large as 5G, a material network and cloud computing, and is a continuous breakthrough based on the chip technology. The packaging test of the chip is a very important link in the chip production process, and is a key technology for ensuring the chip quality and the production efficiency. After the chips are produced, the chips are usually tested by a sorter and a tester to determine the quality of the chips, and the shuttle is an indispensable part for transporting the chips in this process. However, the chips may warp and/or stack during the process of being sorted by the manipulator to be placed into the material shuttle, and if the chips cannot be detected and corrected, not only is the economic loss caused by crushing the chips by the tester, but also the subsequent testing efficiency and accuracy are greatly reduced.
The prior technical scheme is that a light transmission groove is usually arranged on a material shuttle, and an emitting end and a receiving end of a sensor are correspondingly arranged on the left side and the right side of the material shuttle so as to detect whether a chip loaded in the material shuttle is warped or not in the horizontal direction. For example, when the chip is not warped, the optical path in the light-transmitting groove is communicated, and the receiving end of the photoelectric switch can receive the optical signal transmitted by the transmitting end; when the chip is warped to shield the light transmission groove, the light path in the light transmission groove is not communicated, the receiving end of the photoelectric switch cannot receive the light signal transmitted by the transmitting end, namely the receiving signal of the photoelectric switch is abnormal, an alarm is sent, and the next operation is continued after manual intervention.
However, when the chip does not block the light-transmitting groove, even if the chip generates material tilting, the light path in the light-transmitting groove is still communicated, so that the receiving end of the photoelectric switch can still receive the light signal transmitted by the transmitting end, that is, the above technical scheme cannot effectively detect the material tilting at a special angle of the chip, so that economic loss is easily caused, and the subsequent testing efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
An advantage of the utility model is that a material state detection device is provided, its state that can detect the material that awaits measuring effectively improves subsequent efficiency of software testing.
The utility model discloses a material state detection device is provided to another advantage, wherein the utility model discloses an in the embodiment, material state detection device can adopt displacement sensor to detect the distance change of the material that awaits measuring in vertical direction to detect the special angle perk material of the material that awaits measuring effectively.
The utility model discloses a material state detection device is provided to another advantage, wherein the utility model discloses an in the embodiment, material state detection device can distinguish that the abnormal conditions that detects belong to the material condition of sticking up, still fold the material or lack the material condition to carry out corresponding processing, improve the treatment effeciency.
The utility model discloses a material state detection device is provided to another advantage, wherein the utility model discloses an in the embodiment, material state detection device can be under the condition that does not influence the material shuttle and carry, right this material that awaits measuring that the material shuttle is flourishing to carry out the state detection, help improving work efficiency, ensure the normal clear of follow-up procedure.
Another advantage of the present invention is to provide a material condition detecting device, wherein in order to achieve the above object, the present invention does not need to adopt expensive materials or complex structures. Therefore, the utility model discloses succeed in and provide a solution effectively, not only provide a simple material state detection device, still increased simultaneously material state detection device's practicality and reliability.
In order to realize the utility model discloses an above-mentioned at least advantage or other advantages and purpose, the utility model provides a material state detection device, include:
the material shuttle assembly comprises a material shuttle base station, a driving mechanism arranged on the material shuttle base station and a material shuttle disc movably arranged on the material shuttle base station, and the material shuttle disc is connected with the driving mechanism in a driving mode and used for transporting materials to be tested on the material shuttle base station; and
the sensor assembly comprises a displacement sensor arranged on the material shuttle base station, the displacement sensor is positioned above the transportation path of the material shuttle disc and used for measuring the distance information of the material to be detected when the material shuttle disc is driven by the driving mechanism to transport the material to be detected to the sensing area of the displacement sensor so as to judge the state of the material to be detected on the material shuttle disc through the distance information.
According to one embodiment of the application, the material shuttle disk is provided with a plurality of loading grooves for loading the material to be measured, and the plurality of loading grooves are arranged at intervals along the transportation path of the material shuttle disk.
According to an embodiment of the present application, the shuttle tray further has a reference groove corresponding to the displacement sensor, and the reference groove sequentially communicates with the plurality of loading grooves along a transport path of the shuttle tray.
According to one embodiment of the application, the reference groove of the shuttle plate is aligned with a central region of the loading groove.
According to one embodiment of the application, the material state detection device is used for determining the specific state of the material to be detected according to the distance change curve measured by the displacement sensor.
According to an embodiment of the application, the sensor assembly further comprises a correlation type photoelectric sensor arranged on the material shuttle base platform, wherein an emitting end and a receiving end of the correlation type photoelectric sensor are respectively positioned on two opposite sides of the material shuttle disk, and the material shuttle disk is provided with a light transmission groove penetrating through the containing groove.
According to one embodiment of the application, the shuttle assembly further comprises a rail mounted to the shuttle base, wherein the rail extends along a transport path of the shuttle tray, and the shuttle tray is slidably disposed on the rail.
According to one embodiment of the application, the drive mechanism of the shuttle assembly includes a drive motor and a drive pulley, wherein the drive motor is mounted to the shuttle base and the drive pulley is drivingly connected to the drive motor and the shuttle tray.
According to one embodiment of the present application, the sensor assembly further comprises a mounting mast, wherein the mounting mast is mounted to the shuttle base and spans the rail to suspend the displacement sensor above the rail.
According to an embodiment of the application, the material state detection device further comprises an alarm device, wherein the alarm device is communicably connected to the sensor assembly and is used for giving an alarm when the sensor assembly detects that the material to be detected has an abnormal state.
Drawings
Fig. 1 is a schematic perspective view of a material state detection device according to an embodiment of the present invention;
fig. 2 is a partially enlarged schematic view of the material state detection device according to the embodiment of the present invention;
fig. 3 is a schematic perspective view illustrating a material shuttle tray in the material state detection apparatus according to the above embodiment of the present invention;
figure 4 shows a schematic top view of the shuttle plate according to the above described embodiment of the invention;
figure 5 shows a schematic cross-sectional a-a view of the shuttle plate according to the above described embodiment of the invention;
fig. 6 shows a schematic B-B cross-sectional view of the shuttle plate according to the above embodiment of the present invention.
Description of the main element symbols: 1. a material state detection device; 10. a material shuttle assembly; 11. a material shuttle base station; 12. a drive mechanism; 121. a drive motor; 122. a drive pulley; 13. a material shuttle disk; 131. a loading groove; 132. a reference groove; 133. a light-transmitting groove; 14. a guide rail; 20. a sensor assembly; 21. a displacement sensor; 22. a correlation type photoelectric sensor; 221. a transmitting end; 222. a receiving end; 23. installing a portal frame; 24. mounting a base; 30. an alarm device; w, materials to be detected.
The present invention is described in further detail with reference to the drawings and the detailed description.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "mounted on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.
In the chip detection industry, a chip needs to be transported to a testing machine through a material shuttle for testing, and the chip needs to be subjected to state detection for protecting the chip, so that the problem of material warping or material stacking is avoided, and subsequent testing is not affected. The existing material state detection scheme generally arranges a transmitting end and a receiving end of a photoelectric switch oppositely in the horizontal direction so as to judge whether material tilting occurs or not by judging whether the receiving end can receive an optical signal transmitted by the transmitting end or not. However, once the chip is warped at a special angle, the receiving end still can receive the optical signal emitted by the emitting end, so that the existing material state detection scheme cannot effectively detect the warping at the special angle, the chip is easy to damage subsequently, and the test cannot be performed normally. In addition, when the receiving end cannot receive the optical signal, the existing material state detection scheme cannot distinguish the problem of material warping or material stacking; even if the receiving end can receive the optical signal, the existing material state detection scheme cannot judge whether the material shortage problem exists, and the subsequent correction processing is troublesome.
In order to solve the problem, the application provides a material state detection device, it can adopt displacement sensor to measure the distance information of the material that awaits measuring to judge the state of the material that awaits measuring through distance information, not only can detect the material problem of sticking up of special angle effectively, but also can distinguish the material of sticking up, fold the material and lack the material problem, help taking corresponding correction mode according to the concrete state of the material that awaits measuring, avoid haring this material that awaits measuring. It can be understood that the material to be tested in the present application may be implemented as, but not limited to, an integrated circuit such as a chip, and may also be implemented as other products that need to be tested and sorted, which is not described herein again.
Specifically, it is shown with reference to fig. 1 to 6 that the utility model discloses an embodiment provides a material state detection device 1, and it is suitable for the state that detects material W that awaits measuring to judge whether this material W that awaits measuring appears warping the material or fold the material problem. The material condition detection apparatus 1 may include a shuttle assembly 10 and a sensor assembly 20. The shuttle assembly 10 may include a shuttle base 11, a driving mechanism 12 disposed on the shuttle base 11, and a shuttle tray 13 movably disposed on the shuttle base 11, wherein the shuttle tray 13 is drivably connected to the driving mechanism 12 for transporting the material W to be tested on the shuttle base 11. The sensor assembly 20 may include a displacement sensor 21 disposed on the shuttle base 11, wherein the displacement sensor 21 is located above the transportation path of the shuttle tray 13, and is configured to measure distance information of the material W to be measured when the shuttle tray 13 is driven by the driving mechanism 12 to transport the material W to be measured to the sensing area of the displacement sensor 21, so as to determine the state of the material W to be measured on the shuttle tray 13 according to the distance information.
It should be noted that, since the displacement sensor 21 is located above the transportation path of the shuttle tray 13, so that the distance measured by the displacement sensor 21 is the distance between the upper surface of the material W to be detected and the displacement sensor 21, the material state detecting device 1 of the present application may set a reference value for the displacement sensor 21 according to the thickness of the material W to be detected. Thus, when the distance measured by the displacement sensor 21 in the process of measuring the material W to be measured changes, the material W to be measured is judged to be in a material tilting state; when the distance measured by the displacement sensor 21 in the process of measuring the material W to be measured does not change, but the measured distance is greater than the set reference value, it is determined that the material W to be measured may be in a starved state; and when the distance measured by the displacement sensor 21 in the process of measuring the material W to be measured does not change, but the measured distance is smaller than the set reference value, it is determined that the material W to be measured may be in a stacked state.
It can be understood that the reference value mentioned in the present application is equal to the distance between the upper surface of one material W to be measured normally carried by the material shuttle tray 13 and the displacement sensor 21, and the material state detection device 1 can adjust the reference value according to different thicknesses of the material W to be measured, so that it can detect the material W to be measured with different thicknesses, and expand the application range thereof.
In addition, when the displacement sensor 21 measures the distance of a material W to be detected, the distance measured by the displacement sensor 21 changes along with the fact that the material W to be detected is transported to different positions by the material shuttle tray 13, and then the material W to be detected is warped along the transportation path, that is, the problem of warping at a special angle, which cannot be effectively detected by the existing material state detection scheme, occurs.
Preferably, the displacement sensor 21 is located right above the transportation path of the shuttle tray 13, and when the shuttle tray 13 is driven by the driving mechanism 12 to transport the material W to be measured to the sensing area right below the displacement sensor 21, the distance measured by the displacement sensor 21 is equal to the vertical distance between the displacement sensor 21 and the upper surface of the material W to be measured. In other words, the measuring path of the displacement sensor 21 is preferably perpendicular to the transportation path of the material shuttle tray 13, so as to more accurately measure the distance information of the material W to be measured, and improve the accuracy of state judgment.
More specifically, as shown in fig. 2 and 3, the shuttle tray 13 of the shuttle assembly 10 generally has a plurality of loading slots 131 for loading the material W to be measured, and the plurality of loading slots 131 are arranged at intervals along the transportation path of the shuttle tray 13. Like this, need not to change under the position condition of displacement sensor 21, material state detection device 1 of this application can pass through actuating mechanism 12 drive material shuttle dish 13 removes to transport this material W that awaits measuring of difference in proper order to displacement sensor 21's induction zone for detect the state of a plurality of this material W that awaits measuring automatically, improve detection efficiency.
Preferably, as shown in fig. 3 and 6, the shuttle tray 13 may further have a reference groove 132 corresponding to the displacement sensor 21, wherein the reference groove 132 is sequentially communicated with a plurality of the loading grooves 131 along the transportation path of the shuttle tray 13, and the bottom surface of the reference groove 132 is flush with the bottom surface of the loading groove 131, that is, the distance between the bottom surface of the reference groove 132 measured by the displacement sensor 21 is equal to the distance between the upper surface of the material W to be measured normally carried by the shuttle tray 13 and the displacement sensor 21 minus the thickness of the material W to be measured, so that the material state detection apparatus 1 of the present application can use the distance of the bottom surface of the reference groove 132 measured by the displacement sensor 21 minus the thickness of the material W to be measured as the reference value, thus, the material condition detection device 1 does not make a false judgment due to the change of the installation height of the displacement sensor 21.
At this time, when the shuttle tray 13 is driven to move along the transportation path, the measurement point of the displacement sensor 21 moves to the different loading slots 131 through the reference slot 132 to measure the distances of the material W to be measured loaded in the different loading slots 131, respectively, so that a distance variation curve is drawn according to the distances measured by the displacement sensor 21. If the distance value measured by the displacement sensor 21 is kept unchanged, it indicates that the material W to be measured held in the holding tank 131 has a shortage problem; if the distance change occurs when the displacement sensor 21 measures the material W to be measured held in one of the holding tanks 131, it indicates that the material W to be measured held in the holding tank 131 has no shortage problem; and then, the specific state of the material W to be detected is judged by analyzing the distance change curve, namely whether the material W to be detected has the problem of material stacking or material tilting is judged.
In other words, the material state detection device 1 of the present application can accurately determine the specific state of the material W to be measured according to the distance variation curve measured by the displacement sensor 21. For example, if a flat concave section exists at a certain position on a distance curve measured by the displacement sensor 21 (that is, the measured distance becomes smaller), and the height difference is equal to the thickness of the material W to be measured, it indicates that the corresponding material W to be measured is in a normal state; if a distance curve at a certain position has a flat concave section and the thickness of the distance curve is more than or equal to twice the thickness of the material W to be measured (namely the measuring distance becomes smaller), the material stacking problem of the corresponding material W to be measured at the position is indicated; and if the distance curve at a certain position has an inclined change section, the material W to be detected corresponding to the position has a material tilting problem.
It should be noted that in other examples of the present application, the bottom surface of the reference groove 132 may be higher than the bottom surface of the loading groove 131. Preferably, a height difference between the bottom surface of the reference groove 132 and the bottom surface of the loading groove 131 is equal to a thickness of the material W to be measured, that is, a distance between the bottom surface of the reference groove 132 measured by the displacement sensor 21 and a distance between the upper surface of the material W to be measured normally loaded by the shuttle plate 13 and the displacement sensor 21, so that the material condition detecting device 1 of the present application can use the distance between the bottom surfaces of the reference grooves 132 measured by the displacement sensor 21 as the reference value, and no erroneous judgment is made due to a change in the installation height of the displacement sensor 21.
At this time, when the shuttle tray 13 is driven to move along the transportation path, the measurement point of the displacement sensor 21 moves to the different loading slots 131 through the reference slot 132 to measure the distances of the material W to be measured loaded in the different loading slots 131, respectively, so that a distance variation curve is drawn according to the distances measured by the displacement sensor 21. If the distance value measured by the displacement sensor 21 is kept unchanged, it indicates that the material W to be measured held in the holding tank 131 is in a normal state; if the distance change occurs when the displacement sensor 21 measures the material W to be measured held in the holding tank 131, it indicates that the material W to be measured held in the holding tank 131 is in an abnormal state, and further, the specific state of the material W to be measured is determined by analyzing the distance change curve, i.e., whether the material W to be measured has the problems of material shortage, material stacking or material tilting is determined. For example, if a flat convex section exists at a certain position on a distance curve measured by the displacement sensor 21 (that is, the measured distance is increased), and the height difference is equal to the thickness of the material W to be measured, it indicates that the corresponding containing groove 131 is short of material; if a certain distance curve has a flat concave section (namely the measurement distance is reduced) and the thickness of the material W to be measured is more than or equal to the thickness of the material W to be measured, the material stacking problem of the corresponding material W to be measured is shown; and if the distance curve at a certain position has an inclined change section, the material W to be detected corresponding to the position has a material tilting problem.
More preferably, the reference groove 132 is aligned with a central region of the loading groove 131, so that the displacement sensor 21 can detect distance information of the central region of the loading groove 131 to detect the state of the material W to be measured to the greatest extent.
It is noted that according to the above-described embodiments of the present application, the displacement sensor 21 may be, but is not limited to being, implemented as a laser ranging sensor. Of course, in other examples of the present application, the displacement sensor 21 may also be implemented as a sensor capable of measuring distance information, such as a TOF camera or a structured light camera, which is not described herein again.
In addition, even if the displacement sensor 21 of the material condition detection device 1 of the present application can detect an abnormal condition in most cases, there are some extreme cases where the abnormal condition cannot be detected by the displacement sensor 21. For example, as shown in fig. 3, two materials W to be measured are simultaneously loaded in one of the loading slots 131 of the material shuttle tray 13, one of the materials W to be measured is normally placed in the loading slot 131, the other material W to be measured is tilted in a direction perpendicular to the transportation path of the material shuttle tray 13, and the material W to be measured which is tilted is not sensed by the displacement sensor 21, so that the distance measured by the displacement sensor 21 is only the distance of the normally placed material W to be measured, and the material state detecting device 1 of the present application may consider that the material W to be measured is normal, and thus a false judgment may occur.
In order to avoid such extreme problems, as shown in fig. 1 and 2, the sensor assembly 20 of the material state detecting device 1 of the present application may further include a correlation type photosensor 22 disposed on the shuttle base 11, wherein a transmitting end 221 and a receiving end 222 of the correlation type photosensor 22 are respectively located on opposite sides of the shuttle tray 13, and the shuttle tray 13 is provided with a light-transmitting groove 133 penetrating through the loading groove 131. In this way, even if an abnormal state that cannot be detected by the displacement sensor 21 in the above example occurs, the material condition detection apparatus 1 of the present application can detect such an abnormal state by the correlation photoelectric sensor 22 to detect the condition of the material W to be measured in all directions, thereby ensuring that the problems of missing detection and false detection do not occur.
Preferably, as shown in fig. 3 and 4, the light-transmitting groove 133 of the shuttle tray 13 is perpendicular to the transport path of the shuttle tray 13, that is, the light-transmitting groove 133 of the shuttle tray 13 is perpendicular to the reference groove 132 of the shuttle tray 13.
It should be noted that the distance between the optical signal emitted from the emitting end 221 of the correlation photoelectric sensor 22 and the bottom surface of the loading slot 131 is greater than the thickness of the material W to be measured, so as to ensure the normal operation of the correlation photoelectric sensor 22. Optionally, the distance between the optical signal emitted from the emitting end 221 of the opposite-type photoelectric sensor 22 and the bottom surface of the containing groove 131 may also be greater than twice the thickness of the material W to be measured, because the opposite-type photoelectric sensor 22 of the present application only needs to detect whether the material warping occurs in the above-mentioned extreme state, and does not need to detect whether the material stacking problem occurs. It can be understood that, compared to the existing material detection scheme in which the distance cannot be greater than twice the thickness of the material W to be detected, the material condition detection apparatus 1 of the present application has no such strict limitation on the distance, so that the installation height of the correlation type photoelectric sensor 22 is more free, and the apparatus can also be adapted to condition detection of materials W to be detected in more thickness ranges.
In addition, this application material state detection device 1 can pass through displacement sensor 21 detects this material W's that awaits measuring state in the vertical direction, and through correlation type photoelectric sensor 22 detects this material W's that awaits measuring state in the horizontal direction, so that through displacement sensor 21 with mutual cooperation of correlation type photoelectric sensor 22 comes to detect this material W's that awaits measuring state comprehensively and accurately. It can be understood that, when the receiving end 222 of the correlation type photoelectric sensor 22 can receive the optical signal emitted by the emitting end 221, the correlation type photoelectric sensor 22 does not detect an abnormality, and does not issue an abnormality alarm, and at this time, the light-transmitting groove 133 is not blocked; and when the receiving end 222 of the correlation type photoelectric sensor 22 can not receive the optical signal emitted by the emitting end 221, the correlation type photoelectric sensor 22 detects an abnormality and sends an abnormality alarm, and at this time, the light-transmitting groove 133 should be shielded by the material W to be detected, which is not repeated herein for the detection principle of the correlation type photoelectric sensor 22.
Illustratively, when the displacement sensor 21 detects normally and the correlation type photoelectric sensor 22 detects normally, the material W to be measured held in the holding tank 131 is in a normal state; when the displacement sensor 21 detects normally and the correlation type photoelectric sensor 22 detects abnormally, the loading groove 131 loads at least two materials W to be detected, one material W to be detected is in a normal state, and the other material W to be detected is in a tilted state; when the displacement sensor 21 detects that the distance is constant and the correlation type photoelectric sensor 22 detects normal, the material shortage problem exists in the loading groove 131; when the displacement sensor 21 detects that the distance is constant and small and the correlation type photoelectric sensor 22 detects abnormality, the material W to be measured held in the holding tank 131 is in a stacked state; when the displacement sensor 21 detects that the distance gradually changes, no matter whether the detection of the correlation photoelectric sensor 22 is normal, the material W to be detected held in the holding groove 131 is in a tilted state.
According to the above-described embodiment of the present application, as shown in fig. 1 and 2, the shuttle assembly 10 of the material state detection apparatus 1 may further include a guide rail 14 mounted to the shuttle base 11, wherein the shuttle tray 13 is slidably disposed on the guide rail 14, and the guide rail 14 extends along a transport path of the shuttle tray 13, such that the shuttle tray 13 is movable along the guide rail 14 by the driving mechanism 12.
Alternatively, as shown in fig. 1, the driving mechanism 12 of the material shuttle assembly 10 may include, but is not limited to, a driving motor 121 and a driving pulley 122, wherein the driving motor 121 is mounted on the material shuttle base 11, and the driving pulley 122 is drivingly connected to the driving motor 121 and the material shuttle tray 13, for transmitting the driving force of the driving motor 121 to the material shuttle tray 13 to drive the material shuttle tray 13 to slide along the guide rail 14, so as to transport the material W to be tested to the sensing area and the testing station of the displacement sensor 21.
In one example of the present application, as shown in fig. 1 and 2, the sensor assembly 20 of the material condition detecting apparatus 1 may further include a mounting gantry 23, wherein the mounting gantry 23 is mounted to the shuttle base 11 and spans the guide rail 14 to suspend the displacement sensor 21 above the guide rail 14 for measuring the material W to be measured in a vertical direction.
Accordingly, as shown in fig. 1 and 2, the sensor assembly 20 may further include a pair of mounting bases 24 fixedly mounted to the shuttle base 11, wherein two of the mounting bases 24 are respectively located at opposite sides of the guide rail 14, and the emitting end 221 and the receiving end 222 of the correlation type photosensor 22 are respectively and correspondingly mounted to the mounting bases 24, so that the emitting end 221 and the receiving end 222 can be correspondingly located at opposite sides of the shuttle plate 13 moving along the guide rail 14, so as to facilitate detection of the material W to be detected in a horizontal direction.
It should be noted that, as shown in fig. 1, the material state detecting device 1 of the present application may further include an alarm device 30, where the alarm device 30 is communicably connected to the sensor assembly 20 and is configured to issue an alarm when the sensor assembly 20 detects that the material W to be detected has an abnormal state, so as to remind a user to correct the state of the material W to be detected in time. It is understood that the alarm device may be implemented as one or more of a three-color light, a speaker and a display screen, but is not limited thereto, so that the alarm can be generated by means of light, sound and/or pictures, which will not be described in detail herein.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. Material state detection device, its characterized in that includes:
the material shuttle assembly comprises a material shuttle base station, a driving mechanism arranged on the material shuttle base station and a material shuttle disc movably arranged on the material shuttle base station, and the material shuttle disc is connected with the driving mechanism in a driving mode and used for transporting the material to be tested on the material shuttle base station; and
the sensor assembly comprises a displacement sensor arranged on the material shuttle base station, the displacement sensor is positioned above the transportation path of the material shuttle disc and used for measuring the distance information of the material to be detected when the material shuttle disc is driven by the driving mechanism to transport the material to be detected to the sensing area of the displacement sensor so as to judge the state of the material to be detected on the material shuttle disc through the distance information.
2. The material condition detecting device according to claim 1, wherein the shuttle tray has a plurality of holding grooves for holding the material to be measured, and the plurality of holding grooves are arranged at intervals along a transport path of the shuttle tray.
3. The material condition detecting device according to claim 2, wherein the shuttle tray further has a reference groove corresponding to the displacement sensor, and the reference groove sequentially communicates with the plurality of loading grooves along a transport path of the shuttle tray.
4. The material condition detecting device according to claim 3, wherein the reference groove of the shuttle tray is aligned with a central region of the loading groove.
5. The material condition detecting device according to claim 1, wherein the material condition detecting device is configured to determine the specific condition of the material to be measured according to a distance variation curve measured by the displacement sensor.
6. The material condition detecting device according to any one of claims 2 to 4, wherein the sensor unit further includes a correlation type photo sensor provided on the shuttle base, wherein an emitting end and a receiving end of the correlation type photo sensor are respectively located on opposite sides of the shuttle tray, and the shuttle tray is provided with a light-transmitting groove penetrating the loading groove.
7. The material condition detecting device according to any one of claims 1 to 5, wherein the shuttle assembly further includes a rail mounted to the shuttle base, wherein the rail extends along a transport path of the shuttle tray, and the shuttle tray is slidably disposed on the rail.
8. The material condition detecting device according to claim 7, wherein the driving mechanism of the shuttle assembly includes a driving motor and a driving pulley, wherein the driving motor is mounted to the shuttle base, and the driving pulley is drivingly connected to the driving motor and the shuttle tray.
9. The material condition detecting device of claim 7, wherein the sensor assembly further comprises a mounting mast, wherein the mounting mast is mounted to the shuttle base and spans the guide rail to suspend the displacement sensor above the guide rail.
10. The material condition detecting device according to any one of claims 1 to 5, further comprising an alarm device, wherein the alarm device is communicably connected to the sensor assembly for issuing an alarm when the sensor assembly detects the abnormal condition of the material to be detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123303185.8U CN217156256U (en) | 2021-12-24 | 2021-12-24 | Material state detection device |
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| CN117566398A (en) * | 2023-12-21 | 2024-02-20 | 芯云半导体(诸暨)有限公司 | Chip conveying device and method |
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