CN217008674U - Transparent conductive film - Google Patents
Transparent conductive film Download PDFInfo
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- CN217008674U CN217008674U CN202220613866.XU CN202220613866U CN217008674U CN 217008674 U CN217008674 U CN 217008674U CN 202220613866 U CN202220613866 U CN 202220613866U CN 217008674 U CN217008674 U CN 217008674U
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- layer
- transparent
- transparent conductive
- base film
- metal mesh
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000002834 transmittance Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model relates to the field of conductive films, in particular to a transparent conductive film which comprises a transparent base film layer, a metal grid layer and a transparent conductive layer, wherein the transparent base film layer is made of a flexible transparent film material, the transparent conductive layer is made of ITO, and the metal grid layer and the transparent conductive layer are mutually conducted. The transparent conductive film provided by the utility model can be easily obtained through the existing manufacturing process, and simultaneously realizes both conductivity and conductivity uniformity, has high integral transmittance and good conductivity, and can meet more production requirements.
Description
Technical Field
The utility model relates to the field of conductive films, in particular to a transparent conductive film.
Background
The sheet resistance of the conventional transparent conductive material ITO (Indium tin oxide) in the prior art is relatively high, usually at 100-.
The Metal Mesh transparent conductive film adopts metals with higher conductivity, such as silver, copper, aluminum and the like as conductors, and can achieve very low resistance value, generally less than 10 omega/sq, even less than 1 omega/sq. However, highly conductive metals such as silver, copper, aluminum, etc. do not transmit light by themselves like ITO materials. In order to realize transparency, the transparent glass is required to be made into a grid-shaped structure, the mesh (metal circuit) is conductive, and the grids (hollow parts) are transparent. Therefore, the two requirements of macroscopic conduction and light transmission are met, however, although the metal circuit part has very high conductivity, the hollow parts are non-conductive, so that the conduction uniformity is relatively poor, and when the area of each hollow part is larger, the overall conduction uniformity is poorer.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems, the utility model provides a transparent conductive film to solve the problem that the conductivity and the uniform conductivity of the conventional transparent conductive film product cannot be considered at the same time.
The transparent conductive film comprises a transparent base film layer, a metal grid layer and a transparent conductive layer, wherein the transparent base film layer is made of a flexible transparent film material, the transparent conductive layer is made of ITO, and the metal grid layer and the transparent conductive layer are mutually conducted. The term "mutual conduction" refers to that the metal mesh layer and the transparent conductive layer are directly connected, no other spacing layer is arranged between the metal mesh layer and the transparent conductive layer, and current can freely flow from the metal mesh layer to the transparent conductive layer; it is also possible to flow freely from the transparent conductive layer to the metal mesh layer.
In some preferred embodiments, the transparent base film layer, the metal mesh layer and the transparent conductive layer are stacked in such a sequence that the metal mesh layer is in the middle, and the transparent base film layer and the transparent conductive layer are located on two sides of the metal mesh layer; in other preferred embodiments, the transparent base film layer, the metal mesh layer and the transparent conductive layer are stacked in order that the transparent conductive layer is in the middle, and the transparent base film layer and the metal mesh layer are located on two sides of the transparent conductive layer.
In some preferred embodiments, the transparent base film layer is made of PET, PC, COP or transparent PI.
In some preferred embodiments, the metal mesh layer is made of silver, copper or aluminum, i.e. in some specific embodiments, the metal mesh layer is made of silver; in other specific embodiments, the metal mesh layer is made of copper; in other specific embodiments, the metal mesh layer is made of aluminum.
In some preferred embodiments, the thickness of the transparent base film layer is 1-1000 μm, in some specific embodiments, the thickness of the transparent base film layer is 1-500 μm, and in some specific embodiments, the thickness of the transparent base film layer is 1-200 μm.
In some preferred embodiments, the thickness of the metal mesh layer is 0.1 to 100 μm, in some specific embodiments, the thickness of the metal mesh layer is 0.1 to 10 μm, and in some specific embodiments, the thickness of the metal mesh layer is 0.1 to 1 μm.
In some preferred embodiments, the thickness of the transparent conductive layer is 0.01 to 1 μm, in some specific embodiments, the thickness of the transparent conductive layer is 0.01 to 0.5 μm, and in some specific embodiments, the thickness of the transparent conductive layer is 0.01 to 0.1 μm.
In some preferred embodiments, the metal line width of the metal mesh layer is 1 to 100 μm, and in some specific embodiments, the metal line width of the metal mesh layer is 2 to 20 μm.
In some preferred embodiments, the grid shape of the metal grid layer is an arbitrary shape. In some specific embodiments, the mesh shape of the metal mesh layer is a polygon, a curve, or the like.
The transparent conductive film provided by the utility model can be easily obtained through the existing manufacturing process, the conductivity and the conductivity uniformity are simultaneously achieved, the integral transmittance is high, the conductivity is good, and more production requirements can be met.
Drawings
Fig. 1 is another schematic structural diagram of the transparent conductive film provided by the present invention, in which the transparent conductive layer is located in the middle, and the transparent base film layer and the metal mesh layer are located on both sides of the transparent conductive layer;
fig. 2 is another schematic structural diagram of the transparent conductive film provided by the present invention, in which the metal mesh layer is located in the middle, and the transparent base film layer and the transparent conductive layer are located on both sides of the metal mesh layer;
fig. 3 is a schematic diagram of a grid shape of a metal grid of the transparent conductive film provided by the present invention as a square grid;
FIG. 4 is a schematic diagram of a metal grid of a transparent conductive film according to the present invention, wherein the grid shape is a diamond shape;
FIG. 5 is a schematic diagram of a metal mesh of the transparent conductive film according to the present invention, wherein the mesh shape is a random polygon;
FIG. 6 is a schematic diagram of a grid shape of a metal grid of the transparent conductive film provided by the present invention being a random curve;
FIG. 7 is a schematic diagram of a metal grid of a transparent conductive film according to the present invention, wherein the grid shape is a random twisted diamond shape;
in the figure: 1-a transparent base film layer; 2-a transparent conductive layer; 3-a metal mesh layer.
Detailed Description
In order to make those skilled in the art better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present embodiment provides a transparent conductive film, which includes a transparent base film layer 1, a metal mesh layer 3, and a transparent conductive layer 2, wherein the transparent base film layer 1, the metal mesh layer 3, and the transparent conductive layer 2 are stacked in such a manner that the transparent conductive layer 2 is located in the middle, and the transparent base film layer 1 and the metal mesh layer 3 are located on two sides of the transparent conductive layer 2. The transparent conductive layer 2 is made of ITO. The transparent base film layer 1 may be made of PET, PC, COP or transparent PI, and the transparent base film layer 1 of the transparent conductive film provided in the present embodiment is made of PET. The metallic mesh layer 3 may be made of silver, copper or aluminum, and the metallic mesh layer 3 provided in this embodiment is made of copper. The thickness of the transparent base film layer 1 may be any thickness between 1 and 1000 μm (inclusive), and the thickness of the transparent base film layer 1 provided in the present embodiment is 50 μm. The thickness of the metal mesh layer 3 may be any thickness between 0.1-100 μm (inclusive), and the thickness of the metal mesh layer 3 provided in this embodiment is 0.4 μm. The thickness of the transparent conductive layer 2 may be any thickness between 0.01 and 1 μm (inclusive), and the thickness of the transparent conductive layer 2 provided in this embodiment is 0.05 μm. The metal line width of the metal mesh layer 3 may be any thickness (including end point value) between 1-100 μm, and the metal line width of the metal mesh layer 3 provided in this embodiment is 5 μm. The grid shape of the metal grid layer 3 is a polygon or a curve. The mesh shape of the metal mesh layer 3 provided in this embodiment is a diamond shape (see fig. 4).
Referring to fig. 2, the present embodiment provides a transparent conductive film, which includes a transparent base film layer 1, a metal mesh layer 3, and a transparent conductive layer 2, wherein the transparent base film layer 1, the metal mesh layer 3, and the transparent conductive layer 2 are stacked in such a manner that the metal mesh layer 3 is located in the middle, and the transparent base film layer 1 and the transparent conductive layer 2 are located at two sides of the metal mesh layer 3. The transparent conductive layer 2 is made of ITO. The transparent base film layer 1 may be made of PET, PC, COP or transparent PI, and the transparent base film layer 1 of the transparent conductive film provided in the present embodiment is made of PET. The metallic mesh layer 3 may be made of silver, copper or aluminum, and the metallic mesh layer 3 provided in the present embodiment is made of silver. The thickness of the transparent base film layer 1 may be any thickness between 1 and 1000 μm (inclusive), and the thickness of the transparent base film layer 1 provided in this embodiment is 23 μm. The thickness of the metal mesh layer 3 may be any thickness between 0.1-100 μm (inclusive), and the thickness of the metal mesh layer 3 provided in this embodiment is 1 μm. The thickness of the transparent conductive layer 2 may be any thickness (inclusive) between 0.01 and 1 μm, and the thickness of the transparent conductive layer 2 provided in the present embodiment is 0.02 μm. The metal line width of the metal mesh layer 3 may be any thickness (including end points) between 1-100 μm, and the metal line width of the metal mesh layer 3 provided in this embodiment is 3 μm. The mesh shape of the metal mesh layer 3 provided in the present embodiment is a random polygon (see fig. 5).
In other embodiments, the transparent base film layer 1 may also be made of transparent PI or the like.
In other embodiments, the metal mesh layer 3 may be made of other conductive materials.
In other embodiments, the grid shape of the metal grid layer 3 may also be a random curve (see fig. 6) or a random distorted diamond shape (see fig. 7).
In other embodiments, the grid shape of the metal grid layer 3 may also be regular or irregular.
The above-mentioned embodiments are described in more detail, but the utility model is not to be construed as being limited to the scope of the utility model. It should be noted that various changes and modifications can be made by those skilled in the relevant art without departing from the spirit and scope of the utility model. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. The utility model provides a transparent conductive film, characterized in that, transparent conductive film include transparent base film layer (1), metal net layer (3) and transparent conducting layer (2), wherein transparent base film layer (1) make by flexible transparent film material, transparent conducting layer (2) make by ITO, metal net layer (3) with transparent conducting layer (2) switch on each other, transparent base film layer (1), metal net layer (3) and transparent conducting layer (2) the stack structure order be transparent conducting layer (2) in the middle of being located, transparent base film layer (1) and metal net layer (3) are located the both sides of transparent conducting layer (2).
2. The transparent conductive film according to claim 1, wherein the transparent base film layer (1), the metal mesh layer (3) and the transparent conductive layer (2) are stacked in such a manner that the metal mesh layer (3) is located in the middle and the transparent base film layer (1) and the transparent conductive layer (2) are located on both sides of the metal mesh layer (3).
3. The transparent conductive film according to claim 1, wherein the transparent base film layer (1) is made of PET, PC, COP or transparent PI.
4. The transparent conductive film according to claim 1, wherein the metal mesh layer (3) is made of silver, copper, or aluminum.
5. The transparent conductive film according to claim 1, wherein the thickness of the transparent base film layer (1) is 1 to 1000 μm.
6. The transparent conductive film according to claim 1, wherein the thickness of the metal mesh layer (3) is 0.1-100 μm.
7. The transparent conductive film according to claim 1, wherein the thickness of the transparent conductive layer (2) is 0.01 to 1 μm.
8. The transparent conductive film according to claim 1, wherein the metal line width of the metal mesh layer (3) is 1-100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220613866.XU CN217008674U (en) | 2022-03-21 | 2022-03-21 | Transparent conductive film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220613866.XU CN217008674U (en) | 2022-03-21 | 2022-03-21 | Transparent conductive film |
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| Publication Number | Publication Date |
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| CN217008674U true CN217008674U (en) | 2022-07-19 |
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| CN202220613866.XU Active CN217008674U (en) | 2022-03-21 | 2022-03-21 | Transparent conductive film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116240490A (en) * | 2023-02-28 | 2023-06-09 | 深圳豪威显示科技有限公司 | High-transmittance low-resistance conductive glass |
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2022
- 2022-03-21 CN CN202220613866.XU patent/CN217008674U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116240490A (en) * | 2023-02-28 | 2023-06-09 | 深圳豪威显示科技有限公司 | High-transmittance low-resistance conductive glass |
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