CN216871171U

CN216871171U - High-efficiency radiator

Info

Publication number: CN216871171U
Application number: CN202220583579.9U
Authority: CN
Inventors: 黄文曲; 许育昆
Original assignee: Shenzhen Gaoxu Precision Hardware Co ltd
Current assignee: Shenzhen Gaoxu Precision Hardware Co ltd
Priority date: 2022-03-17
Filing date: 2022-03-17
Publication date: 2022-07-01
Anticipated expiration: 2032-03-17

Abstract

The utility model relates to a high-efficiency radiator in the technical field of radiators, which comprises a protective shell and a plurality of radiating assemblies arranged inside the protective shell, wherein the bottom of each radiating assembly is connected with a magnetic suction base, the inner wall of the protective shell is provided with a plurality of semiconductor refrigerating sheets for generating low temperature, the surface of the protective shell is provided with an exhaust groove for exhausting low-temperature airflow inside the protective shell, the inner surface of the exhaust groove is connected with a rotating sheet for adjusting the wind direction position, one end of the rotating sheet is connected with an adjusting device, low-temperature airflow is generated through the cold end faces of the semiconductor refrigerating sheets to reduce the temperature, and the low-temperature airflow is blown out through the radiating assemblies, so that the radiating effect is enhanced, and the cooling efficiency is accelerated; the rotating sheet is rotated to the appointed position through the adjusting device, so that low-temperature air flow is blown out along the appointed direction of the rotating sheet, the effect of fixed-point cooling is achieved, and the problem that working elements inside the electronic equipment are out of order or damaged due to untimely local heat dissipation is avoided.

Description

High-efficiency radiator

Technical Field

The utility model relates to the technical field of radiators, in particular to a high-efficiency radiator.

Background

The computer is commonly called a computer, and is a modern intelligent electronic device which is operated by program codes and used.

In the prior art, the heat radiator is needed to be used for heat dissipation of accessories of the computer or a server inside the computer, the heat radiator can timely transfer generated heat to avoid influencing the normal work of the computer, and the computer cooling system has the advantages of simple process, low cost and the like.

There is a chinese patent with reference to publication No. CN215814074U, which discloses a heat sink, including a device main body; the device main body comprises a machine body and a heat dissipation opening; the heat dissipation opening is arranged at the front end of the machine body; two ends of the device main body are provided with directional mounting mechanisms; the directional mounting mechanism comprises a connecting block, an outer connecting block, a bead connecting rod, a directional bead, a bead groove, a clamp spring, a convex block and a clamping groove; the machine connecting blocks are fixedly connected to two ends of the machine body; the external connecting block is arranged on the outer side of the device main body; the bead connecting rod is fixedly connected inside the outer connecting block; the directional beads are movably connected to the outer side of the bead connecting rod; through setting up directional installation mechanism, realized directional installation, work efficiency's function is saved to quick fixing device main part, through installation dustproof mechanism, has realized quick installation dismantlement dust screen, shelters from the dust, strengthens radiating effect's function.

However, the utility model does not have a semiconductor refrigeration sheet which can generate low temperature, thereby directly influencing the heat dissipation effect and the cooling efficiency; on the other hand, this utility model does not possess the supplementary heat dissipation wind direction of adjusting device yet, can lead to the inside working element of electronic equipment to be out of order or suffer the damage when local heat dissipation is untimely, increases user of service cost's expenditure, and for this reason, we have proposed a high-efficient radiator to solve the above-mentioned technical problem who provides.

SUMMERY OF THE UTILITY MODEL

Utility model is not enough to overcome the above condition, aims at providing a technical scheme that can solve above-mentioned problem.

The utility model provides a high-efficient radiator, set up in the inside radiator unit of protective housing including protective housing and a plurality of, radiator unit's bottom is connected with the magnetism that is used for adsorbing protective housing internal surface and inhales the base, radiator unit's inside is equipped with radiator fan, radiator fan's middle part is equipped with the pivot, the one end of pivot is connected with driving motor, a plurality of is used for producing microthermal semiconductor refrigeration piece is installed to protective housing's inner wall, protective housing's surface is equipped with the exhaust duct that is used for discharging the inside low temperature air current of protective housing, when the low temperature air current that semiconductor refrigeration piece produced, rotate the pivot through driving motor, make radiator fan discharge the low temperature air current from the exhaust duct, the internal surface of exhaust duct is connected with the rotor plate that is used for adjusting the wind direction position, the one end of rotor plate is connected with adjusting device.

Further, adjusting device is including turning round handle and axis of rotation, turns round the handle and is connected with the axis of rotation through the turning block, and the surface of axis of rotation is equipped with the connecting rod of structure symmetry, and the surface of connecting rod is equipped with a plurality of and is used for assisting the adjustment sheet to carry out the pivoted adjustment sheet, and the one end and the turning block of adjustment sheet are connected, when turning round the handle and rotating the turning block, rotate the axis of rotation through the turning block to make the adjustment sheet produce drive power and remove the turning block.

Further, the semiconductor refrigeration piece is divided into a hot end face and a cold end face, the hot end face is attached to the inner surface of the protection shell, and the cold end face faces the inside of the protection shell.

Furthermore, the surface of the heat dissipation assembly is provided with a protection separation net for protecting the heat dissipation assembly.

Further, the surface of base is inhaled to magnetism is connected with the power supply box that is used for supplying power to radiator unit, and the one end of power supply box is connected with the power cord, and the interface that charges is installed to the one end of power cord, and when the interface that charges connects external power source, the electric current spreads into the power supply box through the power cord into, and radiator unit operates through the electric energy that the power supply box provided.

Further, the surface of protective housing is equipped with the magnetism piece of inhaling that is used for adsorbing electronic equipment, and the surface of the piece is inhaled to magnetism is equipped with a plurality of and is used for assisting protective housing to carry out the connecting hole of connecting, inhales the piece through magnetism and produces magnetic force and adsorb the surface of server shell, when injecing protective housing position in electronic equipment, through the connecting hole further fixed protective housing, reduces the possibility that protective housing drops from server shell's surface.

Compared with the prior art, the utility model has the beneficial effects that: the low-temperature airflow is generated through the cold end face of the semiconductor refrigerating sheet to reduce the temperature, and the low-temperature airflow is blown out through the heat dissipation assembly, so that the heat dissipation effect is enhanced and the cooling efficiency is accelerated;

the rotating sheet is rotated to the designated position through the adjusting device, so that low-temperature air flow is blown out along the designated direction of the rotating sheet, the effect of fixed-point cooling is achieved, the problem that the working element inside the server fails or is damaged due to untimely local heat dissipation is avoided, and the expense of maintenance cost of users is increased.

Drawings

FIG. 1 is a front perspective view of an embodiment of the present invention;

FIG. 2 is an enlarged partial schematic view of A in FIG. 1 according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of the internal structure of an embodiment of the present invention;

in the figure: the device comprises a protective shell 1, a heat dissipation component 2, a magnetic suction base 3, a heat dissipation fan 4, a rotating shaft 5, a driving motor 6, a semiconductor refrigerating sheet 7, an exhaust groove 8, a rotating sheet 9, a twisting handle 10, a rotating shaft 11, a rotating block 12, a connecting rod 13, an adjusting sheet 14, a protective separation net 15, a power box 16, a power line 17, a charging interface 18, a magnetic suction sheet 19 and a connecting hole 20.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

In this embodiment, please refer to fig. 1-3, a specific embodiment of a high efficiency heat sink includes a protective housing 1 and a plurality of heat dissipation assemblies 2 disposed inside the protective housing 1, the bottom of the heat dissipation assemblies 2 is connected to a magnetic base 3 for adsorbing the inner surface of the protective housing 1, a heat dissipation fan 4 is disposed inside the heat dissipation assemblies 2, a rotation shaft 5 is disposed in the middle of the heat dissipation fan 4, one end of the rotation shaft 5 is connected to a driving motor 6, a plurality of semiconductor cooling fins 7 for generating low temperature are mounted on the inner wall of the protective housing 1, an exhaust duct 8 for exhausting the low temperature air flow inside the protective housing 1 is disposed on the surface of the protective housing 1, when the low temperature air flow is generated by the semiconductor cooling fins 7, the rotation shaft 5 is rotated by the driving motor 6, so that the heat dissipation fan 4 exhausts the low temperature air flow from the exhaust duct 8, the inner surface of the exhaust duct 8 is connected to a rotation fin 9 for adjusting the wind direction position, one end of the rotating sheet 9 is connected with an adjusting device.

Adjusting device is including turning round handle 10 and axis of rotation 11, turns round handle 10 and is connected with axis of rotation 11 through turning block 12, axis of rotation 11's surface is equipped with structure symmetry's connecting rod 13, the surface of connecting rod 13 is equipped with a plurality of and is used for assisting adjustment sheet 9 to carry out pivoted adjustment sheet 14, adjustment sheet 14's one end is connected with turning sheet 9, when turning round handle 10 rotates turning block 12, rotate axis of rotation 11 through turning block 12, thereby make adjustment sheet 14 produce drive power and remove turning sheet 9.

Semiconductor refrigeration piece 7 divide into hot terminal surface and cold junction surface, and the laminating of hot terminal surface and protective housing 1's internal surface, cold junction surface are towards protective housing 1's inside.

The surfaces of the radiating assemblies 2 are provided with protective separation nets 15 for protecting the radiating assemblies 2; the surface of the magnetic base 3 is connected with a power box 16 used for supplying power to the heat dissipation assembly 2, one end of the power box 16 is connected with a power line 17, one end of the power line 17 is provided with a charging interface 18, when the charging interface 18 is connected with an external power supply, current is transmitted into the power box 16 through the power line 17, and the heat dissipation assembly 2 operates through electric energy provided by the power box 16.

Furthermore, the surface of the protective shell 1 is provided with a magnetic attraction piece 19 for attracting electronic equipment, the surface of the magnetic attraction piece 19 is provided with a plurality of connecting holes 20 for assisting the protective shell 1 to connect, the magnetic attraction piece 19 generates magnetic force to attract the surface of the server shell, the protective shell 1 is further fixed through the connecting holes 20 while the position of the protective shell 1 in the electronic equipment is limited, and the possibility that the protective shell 1 falls from the surface of the server shell is reduced.

When the air-cooling type air-cooling device is used, the air-cooling type air-cooling device is connected with an external power supply through the charging interface 18, so that current is transmitted into the power box 16 through the power line 17, the air-cooling device 2 operates through electric energy provided by the power box 16 to perform primary cooling, and low-temperature air flow generated by the semiconductor refrigerating sheet 7 assists the air-cooling device 2 to further perform cooling.

When the turning block 12 is turned by the twisting handle 10, the turning block 12 turns the turning shaft 11, so that the adjusting sheet 14 generates a driving force to move the turning sheet 9, the turning sheet 9 turns to a specified position, and low-temperature air flow is blown out along a specified direction of the turning sheet 9, thereby achieving the effect of fixed-point cooling.

The foregoing is a more detailed description of the utility model, taken in conjunction with the specific preferred embodiments thereof, and is not intended to limit the utility model to the particular forms disclosed. For those skilled in the art to which the utility model pertains, several simple deductions or substitutions can be made without departing from the spirit of the utility model, and all shall be considered as the protection scope of the utility model.

Claims

1. The utility model provides a high-efficient radiator, sets up in the inside radiator unit of protecting casing, its characterized in that including protecting casing and a plurality of: the bottom of radiator unit is connected with magnetism and inhales the base, radiator unit's inside is equipped with radiator fan, radiator fan's middle part is equipped with the pivot, the one end of pivot is connected with driving motor, a plurality of is installed to protective housing's inner wall and is used for producing microthermal semiconductor refrigeration piece, protective housing's surface is equipped with the exhaust duct that is used for discharging the inside low temperature air current of protective housing, when the low temperature air current that semiconductor refrigeration piece produced, rotate the pivot through driving motor, make radiator fan discharge the low temperature air current from the exhaust duct, the internal surface connection of exhaust duct has the rotor plate that is used for adjusting wind direction position, the one end of rotor plate is connected with adjusting device.

2. A high efficiency heat sink as recited in claim 1, wherein: adjusting device twists the handle including turning round handle and axis of rotation, twists round the handle and is connected with the axis of rotation through the turning block, and the surface of axis of rotation is equipped with the connecting rod of structure symmetry, and the surface of connecting rod is equipped with a plurality of and is used for assisting the adjustment sheet to carry out the pivoted adjustment sheet, and the one end and the turning sheet of adjustment sheet are connected.

3. A high efficiency heat sink according to any one of claims 1-2, wherein: the semiconductor refrigeration piece is divided into a hot end face and a cold end face, the hot end face is attached to the inner surface of the protection shell, and the cold end face faces the inside of the protection shell.

4. A high efficiency heat sink according to any one of claims 1-2, wherein: and the surface of the heat dissipation assembly is provided with a protection separation net for protecting the heat dissipation assembly.

5. A high efficiency heat sink according to any one of claims 1-2, wherein: the surface of the magnetic base is connected with a power box used for supplying power to the heat dissipation assembly, one end of the power box is connected with a power line, and a charging interface is installed at one end of the power line.

6. A high efficiency heat sink according to any one of claims 1-2, wherein: the surface of the protection shell is provided with a magnetic attraction piece for attracting electronic equipment, and the surface of the magnetic attraction piece is provided with a plurality of connecting holes for assisting the protection shell to connect.