CN216718312U - a temperature control device - Google Patents

Abstract

The utility model discloses a temperature control device, which relates to the field of temperature control of chromatographic experiments and comprises a box body, a semiconductor refrigerating sheet and a radiator; the surface of the box body is provided with an air inlet and an air outlet, one side wall of the box body is provided with a cavity, and the surface of the cavity is provided with a semiconductor refrigerating sheet; the side face, far away from the cavity, of the semiconductor refrigerating sheet is provided with a radiator, and the semiconductor refrigerating sheet further comprises a partition plate and a fan assembly, wherein the fan assembly comprises a first fan and a second fan; a first fan is arranged between the partition plate and the radiator, an air channel is arranged between the first fan and the second fan, and the second fan is arranged on the inner wall of the box body. The semiconductor refrigeration piece is adopted, so that the refrigeration column temperature box can not only perform heating but also perform refrigeration, the temperature control range of the refrigeration column temperature box is wider, the column temperature can be reduced to a state below the room temperature, and the experimental operation is more convenient and faster.

Description

a temperature control device

technical field

The utility model relates to the field of temperature control of chromatographic experiments, in particular to a temperature control device.

Background technique

The liquid chromatograph is mainly composed of infusion pump, separation column, detector, column oven and other unit components. When the mobile phase and the sample run through the system, sometimes it needs to be transported and circulated through the column oven. When it comes to column ovens, those who often do liquid phase analysis should be very familiar with it. The more stable retention of chromatography, better separation efficiency and more symmetrical peak shape are inseparable from the help of column ovens. In addition to the above benefits, the system pressure can be reduced, resulting in better resolution and system sensitivity. Due to the temperature, the degree of adsorption of gases on solid surfaces or their solubility in liquids is reduced. In gas-liquid chromatography analysis, when the temperature exceeds a certain temperature, the static liquid will generally volatilize in the chromatographic column, so the separation effect is also greatly affected by the column temperature.

At present, most column ovens on the market are heated. However, the temperature of each day in every season of the year is uncontrollable. In the case of separation and detection of some samples, it is necessary to control the temperature below room temperature, and ordinary column ovens cannot be more To meet the temperature control requirements intuitively, it is necessary to use a column oven with a wider temperature control range.

Chinese patent CN209803069U discloses a temperature control system for a column temperature box of a liquid chromatograph, which relates to the technical field of chemical analysis and detection. The temperature control system of the column temperature box of the liquid chromatograph includes a liquid chromatography column, a constant temperature box and a heat exchange part. The liquid chromatography column is installed in the constant temperature box. The heat part includes at least two heat exchange devices, the heat exchange device includes a semiconductor refrigeration sheet and a radiator, one side of the semiconductor refrigeration sheet is attached to a thermostat, the other side of the semiconductor refrigeration sheet is attached to a radiator, and a temperature sensor is arranged in the thermostat. By passing the current in the reverse direction, the semiconductor refrigerating sheet can also cool the incubator, and further through the setting of the temperature sensor, the temperature in the incubator can be measured in real time. Although this patent also uses semiconductor refrigeration chips for cooling and heating, the air after the reaction is not quickly and effectively discharged, which will still affect the temperature control effect of the column oven.

Chinese patent CN106706817A discloses a thin tube liquid chromatography column temperature control device, which relates to a capillary liquid chromatography column. It is provided with a cooling fan, a hollow capillary column support cylinder, a capillary liquid chromatography column, a temperature control device and a base. The cooling fan is installed on the top of the hollow capillary column support cylinder. layer, a thread groove is engraved on the outside of the hollow capillary column support cylinder, and the thread groove is used to fix the capillary liquid chromatography column, and the capillary liquid chromatography column is spirally wound on the surface of the hollow type capillary column support cylinder; The outer periphery of the hollow capillary column support cylinder with the capillary liquid chromatographic column is covered with a temperature-sensitive resistance layer, and the temperature control device is provided with a temperature sensor and a display, and the temperature sensor is used to detect the temperature of the temperature-sensitive resistance layer. The temperature signal output terminal is connected to the display, the temperature signal of the temperature sensor is displayed by the display, and the hollow capillary column support cylinder is installed on the base. However, this patent cannot achieve the effect of cooling and heating at the same time, and will also affect the temperature control effect of the column oven.

Utility model content

In order to solve the problem in the prior art that the temperature control range is small and thus affects the separation effect in the chromatographic column, the utility model provides a temperature control device.

In order to realize the purpose of the present utility model, the technical scheme adopted by the present utility model is as follows:

A temperature control device, comprising a box body, a semiconductor refrigeration sheet and a radiator;

The surface of the box body is provided with an air inlet and an air outlet,

There is a cavity on one side wall of the box, and a semiconductor refrigeration chip is installed on the surface of the cavity;

A radiator is installed on one side of the semiconductor refrigeration sheet away from the cavity,

also includes a baffle and a fan assembly, the fan assembly including a first fan and a second fan;

A first fan is arranged between the partition plate and the radiator, an air duct is arranged between the first fan and the second fan, and the second fan is installed on the inner wall of the box.

Further, thermal conductive silicone grease is provided between the cavity and the semiconductor refrigeration sheet, and the cavity is made of a square aluminum profile and is composed of an upper cover plate and a lower cover plate.

Further, thermally conductive silica gel is arranged between the semiconductor refrigeration sheet and the heat sink.

Further, the surface of the radiator is provided with threaded holes, and the spring screws pass through the threaded holes to install the first fan on the partition board.

Further, air inlets are provided on both sides of the radiator.

Further, two ends of the air duct are provided with installation interfaces, and one end of the air duct is connected to the partition plate, and the other end of the air duct is connected to the second fan.

Further, a fan assembly hole is provided on the partition plate, and a ventilation port corresponding to the fan is provided, and a mounting hole is provided on the side plate of the box body, and the screw passes through the mounting hole to connect the partition plate and the side plate of the box body. Fixed connection.

Further, the air outlet is provided at the exhaust of the second fan.

Compared with the prior art, the beneficial effects of the present utility model are embodied in:

(1) The device adopts double-layer semiconductors, and the strong cooling power can make the temperature in the cooling chamber drop to 5°C below room temperature, and the radiator is made of copper;

(2) The device is equipped with spring screws, which can closely attach the semiconductor to the refrigeration cavity, and quickly conduct the temperature of the semiconductor;

(3) The air duct of the device can be folded to meet different assembly lengths, and two high-power cooling fans are installed on both sides of the air duct, which can quickly discharge the air;

(4) The refrigeration function of the device makes the column thermostat it is equipped with more widely applicable, and various effects can be obtained by using the column thermostat;

(5) This device proposes to add a temperature control device to the column temperature box, which can not only heat but also cool down through the semiconductor refrigeration sheet. Because of its wider temperature control range, the refrigerated column temperature box can reduce the column temperature to below room temperature state, making the experimental operation more convenient.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is the front view of Fig. 1;

Fig. 3 is the A-A view of Fig. 2;

Fig. 4 is the structural representation of air duct;

Figure 5 is an isometric side view of the utility model;

The reference numerals are as follows: 1. Cavity; 2. Semiconductor refrigerating sheet; 3. Radiator; 4. First fan; 5. Baffle plate; 6. Air duct;

Detailed ways

In order to make the purpose and technical solution of the present invention clearer, the technical solution of the present invention will be clearly and completely described below with reference to the embodiments.

Example 1

A temperature control device as shown in Fig. 1-Fig. 5, wherein the solid arrow in Fig. 5 is the air inlet direction, and the dotted line arrow is the air outlet direction, including a box body 7, a semiconductor refrigeration sheet 2 and a radiator 3; the box The surface of the body 7 is provided with an air inlet and an air outlet. There is a cavity 1 on one side wall of the box body 7, and a semiconductor refrigeration chip 2 is installed on the surface of the cavity 1. A heat-conducting silicone grease is provided; a heat sink 3 is installed on the side of the semiconductor refrigeration sheet 2 away from the cavity 1, and a heat-conducting silica gel is arranged between the semiconductor refrigeration sheet 2 and the radiator 3;

It also includes a partition 5 and a fan assembly. As shown in FIG. 1, the honeycomb structure on the side plate of the semiconductor refrigerating sheet 2 out of the box 7 is used for air intake. The fan assembly includes a first fan 4 and a second fan 8; the A first fan 4 is arranged between the partition plate 5 and the radiator 3 , an air duct 6 is arranged between the first fan 4 and the second fan 8 , and the second fan 8 is installed on the inner wall of the box 7 The two ends of the air duct 6 are provided with installation interfaces, and one end of the air duct 6 is connected to the partition plate 5, and the other end of the interface is connected to the second fan 8, and the interface can be folded. The surface of the radiator 3 is provided with threaded holes, and the spring screws pass through the threaded holes to fix the radiator 3 and the first fan 4 together. Air inlets are provided on both sides of the radiator 3 , and air outlets are provided at the exhaust of the second fan 8 .

Specifically, the working process of the temperature control device is as follows: the semiconductor refrigeration sheet 2 needs to be assembled on the surface of the refrigeration cavity 1, and both sides of the semiconductor refrigeration sheet 2 need to be coated with thermal conductive silicone grease. It should be noted that the radiator 3 needs to be connected with the semiconductor refrigeration. The sheet 2 is tightly attached. After the fan blows out, the fan assembly is assembled with the upper air duct 6 to transfer the air to the semiconductor cooling sheet 2. After the fan provides power, the cooling cavity 1 will be rapidly cooled, and strong hot air will be blown from the rear of the device.

The above is only an embodiment of the present invention, and its description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention.

Claims (8)

1. a temperature control device is characterized in that, comprises box body, semiconductor refrigeration sheet and radiator; The surface of the box body is provided with an air inlet and an air outlet, There is a cavity on one side wall of the box, and a semiconductor refrigeration chip is installed on the surface of the cavity; A radiator is installed on one side of the semiconductor refrigeration sheet away from the cavity, also includes a baffle and a fan assembly, the fan assembly including a first fan and a second fan; A first fan is arranged between the partition plate and the radiator, an air duct is arranged between the first fan and the second fan, and the second fan is installed on the inner wall of the box. 2 . A temperature control device according to claim 1 , wherein thermal conductive silicone grease is arranged between the cavity and the semiconductor refrigeration sheet, and the cavity adopts a square aluminum profile, and consists of an upper cover plate and a lower plate. 3 . Cover plate composition. 3 . The temperature control device according to claim 1 , wherein a thermally conductive silica gel is provided between the semiconductor refrigeration sheet and the radiator. 4 . 4 . The temperature control device according to claim 1 , wherein a threaded hole is formed on the surface of the radiator, and a spring screw passes through the threaded hole to install the first fan on the partition plate. 5 . 5 . The temperature control device according to claim 1 , wherein air inlets are provided on both sides of the radiator. 6 . 6 . The temperature control device according to claim 1 , wherein installation interfaces are provided at both ends of the air duct, one end of the air duct is connected to the partition plate, and the other end of the air duct is connected to the second fan. 7 . 7 . The temperature control device according to claim 1 , wherein a fan assembly hole is provided on the partition plate, and a ventilation port corresponding to the fan is provided, and the side plate of the box is provided with a fan. 8 . Mounting holes, the screws pass through the mounting holes to fix the partition plate and the side plate of the box. 8 . The temperature control device according to claim 1 , wherein the air outlet is located at the exhaust of the second fan. 9 .

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