CN216698399U - Plasma spraying equipment, spraying equipment and solar cell manufacturing equipment - Google Patents

Abstract

The present application discloses a plasma spraying device, spraying equipment and solar cell manufacturing equipment. The plasma spraying equipment includes an ionizing spraying mechanism, a gas conveying channel and a medium conveying mechanism. The gas delivery channel communicates with the ionizing spray mechanism and is used for delivering gas to the ionizing spray mechanism, and the ionizing spray mechanism is used for ionizing the gas. The medium conveying mechanism includes a feeding channel and a screw feeder arranged in the feeding channel, the feeding channel is communicated with the ionizing spray mechanism, and the screw feeder is used to transport the medium in the feeding channel to the ionizing spray mechanism to melt and eject the medium. The plasma spraying device, spraying equipment, and solar cell manufacturing equipment provided by the embodiments of the present application can precisely control the medium spraying amount, and solve the problem of low film quality caused by the inability to precisely control the medium spraying amount.

Description

Plasma spraying equipment, spraying equipment and solar cell manufacturing equipment

technical field

The present application relates to the field of battery manufacturing equipment, in particular to a plasma spray device, spraying equipment and solar cell manufacturing equipment.

Background technique

A solar cell is a device that uses the photovoltaic effect to directly convert solar energy into electrical energy. So far, many kinds of solar cells have been developed. Including: monocrystalline silicon solar cells, polycrystalline silicon solar cells, amorphous silicon solar cells, compound semiconductor solar cells, etc.

During solar cell fabrication, thermal spray techniques are typically used to spray light energy absorbing materials onto substrates. Thermal spraying technology is a surface processing method that uses a heat source to rapidly heat the sprayed material to a molten or semi-molten state, and then sprays it onto the pretreated workpiece surface through a high-speed airflow or flame flow to accelerate the atomization to form a coating. , According to the different heat sources, thermal spraying can be divided into arc spraying, plasma spraying, explosive spraying, etc. However, the existing spray equipment cannot adjust the spray amount of the medium.

Utility model content

In view of the above problems, the present application provides a plasma spraying device, spraying equipment and solar cell manufacturing equipment, which can solve the problem that the amount of medium spraying cannot be precisely controlled.

In a first aspect, the present application provides a plasma spray device, including an ionization spray mechanism, a gas delivery channel and a medium delivery mechanism. Wherein, the gas conveying channel is communicated with the ionizing spray mechanism and is used for conveying gas to the ionizing spraying mechanism, and the ionizing spraying mechanism is used for ionizing the gas; the medium conveying mechanism includes a feeding channel and a screw feeder arranged in the feeding channel, the feeding channel and the ionizing spraying mechanism Communication, the screw feeder is used to transport the medium in the feeding channel to the ionizing spray mechanism to melt and spray the medium.

In the technical solutions of the embodiments of the present application, a gas conveying channel and a medium conveying mechanism are provided to convey the gas and medium to be ionized to the ionizing spray mechanism, and an ionizing spray mechanism is provided for spraying the medium in a molten or semi-molten state. The mechanism is used to ionize the gas conveyed by the gas delivery channel to melt and eject the medium conveyed by the feed channel. In addition, by controlling the rotation speed of the screw feeder, the amount of the medium entering the ionizing jet mechanism can be changed to adjust the jetting amount of the ionizing jetting mechanism, thereby improving the accuracy of the jetting amount and the uniformity of the jetting.

In some embodiments, the plasma jet apparatus further includes a driver connected to one end of the screw feeder. Setting the driver can realize the automatic control of the screw feeder, and improve the efficiency and accuracy of the control of the media ejection.

In some embodiments, the gas delivery channel has an inlet for connecting to a gas source and an outlet that communicates with the ionizing spray mechanism. The gas delivery channel in the above structure is used to connect the gas source and the ionization spray mechanism, and transport the gas in the gas source to the ionization spray mechanism, so that the gas is ionized and releases heat to melt the medium and spray the medium.

In some embodiments, the inlet is provided with a control valve for controlling gas flow. Setting the gas flow control valve can realize the control of the gas flow, so as to adjust the amount of gas ionization and thus control the melting temperature of the medium.

In some embodiments, the ionizing spray mechanism includes an anode gun tip and a cathode gun tip. The anode gun head is set at one end of the feeding channel and has a first cavity communicating with the feeding channel; the cathode gun head is set at one end of the anode gun head away from the feeding channel, the cathode gun head is provided with a second cavity, the second cavity is The cavity communicates with the first cavity and forms an ionization cavity for ionizing the gas. The above structure directly sets the ionization cavity in the cathode gun head and the anode gun head, which simplifies the structure of the ionization spray mechanism and improves the efficiency of the ionization reaction.

In some embodiments, the end of the cathode gun head away from the anode gun head is further connected with a spray gun head, and the spray gun head is provided with a through spray channel, and the spray channel communicates with the ionization cavity. Setting the spray channel can control the direction of the medium spray in the molten or semi-molten state, and improve the accuracy of the spray.

In some embodiments, the size of the ejection channel gradually increases along the ejection direction of the medium. Setting the jetting channel in the shape of a bell mouth increases the jetting surface of the jetting port, improves the dispersion of the medium, and improves the uniformity of the medium jetting.

In some embodiments, a spray mask is also provided on the spray port of the spray gun head. Setting a mask plate can precisely control the spraying area of powder and improve the accuracy of spraying.

In some embodiments, an insulating member is further provided between the anode gun head and the cathode gun head, and a through hole is formed on the insulating member. The cathode gun head and the anode gun head are insulated and separated by arranging insulating parts to prevent short circuit, and through holes are arranged for the medium and the ionized gas to pass smoothly.

In a second aspect, the present application provides a spraying device, which includes a base and the plasma spraying device in the above-mentioned embodiments, wherein the plasma spraying device is arranged on the base; wherein, the number of the plasma spraying device is multiple, and the multiple plasma spraying The devices are arranged on the base at intervals, and the injection ports of the plurality of plasma spraying devices face the same side of the base. A spraying equipment is equipped with a plurality of plasma spraying devices, which can spray a variety of media at the same time and improve the spraying efficiency.

In some embodiments, the spraying directions of the plasma spraying devices are arranged to intersect at a certain angle, so as to spray the medium sprayed from the plurality of plasma spraying devices to the same target location.

In some embodiments, the feeding channel is provided in the base, and the gas conveying channel is an annular pipe arranged at intervals along the circumferential direction of the feeding channel. The gas conveying channel is arranged on the outer periphery of the feeding channel, and the extending direction of the gas conveying channel and the feeding channel is the same, which can facilitate the simultaneous conveying of the gas and the medium to the spraying mechanism.

In a third aspect, the present application provides a solar cell manufacturing equipment, which includes the spraying equipment in the above embodiments.

The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present application more obvious and easy to understand , and the specific embodiments of the present application are listed below.

Description of drawings

The features, advantages and technical effects of the exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

FIG. 1 is a schematic structural diagram of a plasma spray device according to some embodiments of the present application;

Fig. 2 is a schematic structural diagram of the spraying equipment of some embodiments of the present application;

FIG. 3 is a schematic structural diagram of spraying equipment according to other embodiments of the present application.

Detailed description of reference numerals

1. Spraying equipment;

10. Plasma spray device; 101, ionization spray mechanism; 102, gas conveying channel; 103, medium conveying mechanism; 104, feeding channel; 105, screw feeder; 106, driver; 107, inlet; 108, control valve; 109, Anode gun head; 110, cathode gun head; 111, first cavity; 112, second cavity; 113, spray gun head; 114, spray channel; 115, spray mask plate; 116, feeding tube; 117, feeding hole; 118, insulating member; 119, ionization cavity;

20. Pedestal.

Detailed ways

The embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only used to illustrate the technical solutions of the present application more clearly, and are therefore only used as examples, and cannot be used to limit the protection scope of the present application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of this application; the terms used herein are for the purpose of describing specific embodiments only, and are not intended to be Limiting this application; the terms "comprising" and "having" and any variations thereof in the specification and claims of this application and the above description of the drawings are intended to cover non-exclusive inclusion.

In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and should not be understood as indicating or implying relative importance or implying the number, specificity and quantity of indicated technical features. Sequential or primary-secondary relationship. In the description of the embodiments of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

In the description of the embodiments of the present application, the term "and/or" is only an association relationship for describing associated objects, indicating that there may be three relationships, such as A and/or B, which may indicate that A exists alone, and A exists at the same time and B, there are three cases of B alone. In addition, the character "/" in this document generally indicates that the related objects are an "or" relationship.

In the description of the embodiments of the present application, the term "plurality" refers to two or more (including two), similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple sheets" refers to is more than two pieces (including two pieces).

In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "horizontal", "length", "width", "thickness", "top", "bottom", "front", "rear", "left", "right", "vertical" "Horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on those shown in the accompanying drawings The orientation or positional relationship is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as implementing the present application. example limitations.

In the description of the embodiments of the present application, unless otherwise expressly specified and limited, the technical terms "installation", "connection", "connection", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a fixed connection. The connection can be disassembled or integrated; it can also be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

Due to the advantages of high efficiency and low cost, solar cells are one of the main development directions of green energy in the future. In the prior art, the main photoelectric conversion element in a solar cell is a photoelectric conversion film layer, and the photoelectric conversion film layer is usually prepared by spraying film formation using spraying equipment. Among them, plasma spraying equipment is widely used because it can spray powder in molten state while melting the medium.

Specifically, plasma spraying equipment uses electrical energy to ionize mixed gases such as argon, hydrogen or helium into high-temperature plasma, and form a plasma gas stream. It uses high temperature and high-speed plasma gas flow to melt metal or metal oxide and metal carbide and spray it onto the surface of the workpiece to form a photoelectric conversion film layer. The plasma spraying method has fast particle spraying speed, dense coating and high bonding strength, so most of the industrial atmospheric plasma spraying equipment is inclined to choose this spraying method. Especially in solar thin film cells, plasma spraying equipment is used to melt the medium and spray it onto the substrate to form a solar light energy absorbing film.

However, in the existing plasma spraying equipment, when the medium is input and sprayed from the powder feeding pipe, the amount of the medium cannot be precisely controlled, so that the spray amount of the medium cannot be precisely controlled.

The applicant has found through research that, by arranging a screw feeder in the feeding channel, when the amount of medium conveyed in the screw feeder remains stable, and by adjusting the speed of the screw feeder to rotate and feed, the weight of the medium entering the ionization cavity can be adjusted. , which can effectively control the injection volume of the medium. Furthermore, the ejection amount of the medium can be precisely controlled, the operation is simple and the control is precise. Ensure film formation efficiency and improve the performance of solar cells.

Specifically, the plasma spraying equipment in the embodiments of the present application includes an ionizing spraying mechanism, a gas conveying channel and a medium conveying structure. The gas delivery channel communicates with the ionizing spray mechanism and is used for delivering gas to the ionizing spray mechanism, and the ionizing spray mechanism is used for ionizing the gas. The medium conveying mechanism includes a feeding channel and a screw feeder arranged in the feeding channel, the feeding channel is communicated with the ionizing spray mechanism, and the screw feeder is used for conveying the medium in the feeding channel to the ionizing spraying mechanism, so as to melt and spray the medium.

In the technical solutions of the embodiments of the present application, a gas conveying channel and a medium conveying mechanism are provided to convey the gas and medium to be ionized to the ionizing spray mechanism, and an ionizing spray mechanism is provided for spraying the medium in a molten or semi-molten state. The mechanism is used to ionize the gas delivered by the gas delivery channel 102 to melt and eject the medium delivered by the feed channel. In addition, by controlling the rotation speed of the screw feeder, the amount of the medium entering the ionizing ejection mechanism can be changed to adjust the ejection amount of the ionizing ejection mechanism to improve the accuracy of the ejection amount and the uniformity of the ejection.

The plasma spraying device and spraying equipment disclosed in the embodiments of the present application can be used for, but not limited to, the spraying of solar cell thin films, and can also be used for industrial equipment that needs to melt and spray the medium. The equipment of the present application can effectively improve the film formation of spraying efficiency and precise control of film thickness.

For the convenience of description, the following embodiments take a plasma spraying device according to an embodiment of the present application as an example for description. Please refer to FIG. 1 , which is a schematic structural diagram of a plasma spray apparatus 10 according to some embodiments of the present application.

As shown in FIG. 1 , the plasma spraying device 10 provided by the embodiment of the present application includes an ionizing spraying mechanism 101 , a gas conveying channel 102 and a medium conveying mechanism 103 . The gas delivery channel 102 communicates with the ionizing spray mechanism 101 and is used for delivering gas to the ionizing spray mechanism 101, and the ionizing spray mechanism 101 is used for ionizing the gas. The medium conveying mechanism 103 includes a feeding channel 104 and a screw feeder 105 provided in the feeding channel 104 . The feeding channel 104 is communicated with the ionizing spraying mechanism 101, and the screw feeder 105 is used to transport the medium in the feeding channel 104 to the ionizing spraying mechanism 101, so as to melt and spray the medium.

In some embodiments of the present application, the feeding channel 104 is further connected with a feeding tube 116 , and the feeding tube 116 is used to input the medium into the feeding channel 104 . The feeding tube 116 is provided with a through feeding hole 117, and the size of the feeding hole 117 gradually decreases along the conveying direction of the medium. The above-mentioned structure can facilitate the input of the medium from the feeding pipe 116 and improve the conveying efficiency of the medium.

Wherein, the screw feeder 105 includes a rotating shaft and a helical blade arranged on the rotating shaft along the circumferential direction. The rotating shaft drives the spiral blade to rotate around its own axis, and the spiral blade is used to carry the material. Therefore, the faster the rotation speed of the rotating shaft, the faster the material conveying speed of the spiral blade, and the more material conveying volume.

The ionization spray mechanism 101 is used to generate plasma, and the two ends of the ionization spray mechanism 101 are respectively connected with positive and negative charges. When the two charges meet, an ionization reaction occurs, and the surrounding gas is ionized into plasma and a large amount of heat is released at the same time. The surrounding medium melts. The plasma has a positive charge and moves to the negatively charged end under the action of the electrode, so an ion wind is generated to move the molten medium. The gas delivery channel 102 is used to deliver the gas to be ionized to the ionization jet mechanism 101. The gas delivery channel 102 can be a cylindrical cavity, which is convenient for uniform gas delivery. It should be noted that the gas delivery channel 102 can also be a square, oval shape, etc., which are not limited in this embodiment of the present application. The medium conveying mechanism 103 is spaced apart from the gas conveying channel 102 , and the medium conveying channel 103 is used for conveying the medium to be ionized into the ionizing spraying mechanism 101 .

The medium in the embodiments of the present application is used for spraying onto the substrate, and the medium is usually solid powder, and the particle size of the medium can be calculated and determined according to the material of the medium and the spray amount. Commonly used media are titanium oxide, strontium oxide, lithium oxide and tungsten oxide. The specific medium type should also be selected according to the structural design of the solar cell, which is not limited here. The gas to be ionized in the gas delivery channel 102 may be oxygen, carbon dioxide, argon, helium, ammonia, nitrogen, etc., which is not limited in the embodiment of the present application.

In the technical solution of the embodiment of the present application, a gas conveying channel 102 and a medium conveying mechanism 103 are provided to convey the gas to be ionized and the medium to the ionizing spray mechanism 101; For spraying, the ionizing spraying mechanism 101 is used for ionizing the gas delivered from the gas delivery channel 102 to melt and spray the medium delivered by the feeding channel 104 . In addition, by controlling the rotation speed of the screw feeder 105, the amount of the medium entering the ionizing ejection mechanism 101 can be changed, so as to adjust the ejection amount of the ionizing ejection mechanism 101, so as to improve the control accuracy of the ejection amount and the uniformity of the ejection. Purpose.

In some embodiments of the present application, the plasma spray device 10 further includes a driver 106 connected to one end of the screw feeder 105 . Optionally, the driver 106 may be a driving motor, which drives the screw feeder 105 to rotate by controlling the rotation of the driving motor, and controls the rotation rate of the screw feeder 105 . Setting the driver 106 can realize the automatic control of the screw feeder 105, and improve the efficiency and accuracy of the control of the medium injection.

In some embodiments of the present application, the gas delivery channel 102 has an inlet 107 and an outlet (not shown). The inlet 107 is used to connect the gas source, and the outlet communicates with the ionizing spray mechanism 101 . The gas source can be an inert gas or a readily available gas such as hydrogen, nitrogen or oxygen. The outlet and the inlet 107 are generally provided at both ends of the gas delivery channel 102 to facilitate the delivery of the gas and prevent the gas remaining in the gas delivery channel 102 from being wasted. The gas delivery channel 102 in the above structure is used to connect the gas source and the ionization spray mechanism 101, and transport the gas in the gas source to the ionization spray mechanism 101, so that the gas is ionized and releases heat to melt the medium and spray the medium.

In some embodiments of the present application, the inlet 107 is provided with a control valve 108 for controlling the flow of gas. The control valve 108 includes, but is not limited to, a pneumatic valve, an electric valve, a solenoid valve, and the like. The control valve 108 is not limited to manual manual control, but can also be connected to a controller for automatic control, or remotely controlled by a remote control device for remote operation, so as to improve operational convenience. Setting the control valve 108 can control the flow rate of the gas entering the gas delivery channel 102. The gas is used as the raw material for the plasma of the melting medium. The more the amount of gas, the more intense the ionization reaction and the higher the heat generated. Different media have different melting points, therefore, the heat of ionization can be adjusted by adjusting the flow rate of the gas, so as to control the temperature of the ionization spray mechanism 101, thereby controlling the melting temperature of the medium.

It can be understood that the larger the flow rate of the gas and the faster the flow rate of the gas, the higher the temperature in the ionization spray mechanism 101 . In the case of high temperature, it is suitable for melting medium with higher melting point, or for melting medium with more mass. The smaller the flow rate of the gas and the slower the flow rate of the gas, the lower the temperature in the ionization ejection mechanism 101 . The low temperature case is for melting media with lower melting points, or for melting media with less mass. The control valve 108 provided in the embodiment of the present application can adjust the intake air amount according to the condition of the medium, improve the quality of the melting of the medium, reduce the waste of energy, and improve the efficiency.

In some embodiments of the present application, the ionizing spray mechanism 101 includes an anode gun head 109 and a cathode gun head 110 . The anode gun head 109 is disposed at one end of the feeding channel 104 and has a first cavity 111 communicating with the feeding channel 104 . The cathode gun head 110 is disposed at one end of the anode gun head 109 away from the feeding channel 104 . The cathode gun head 110 is provided with a second cavity 112 which communicates with the first cavity 111 and forms an ionization cavity 119 for ionizing gas.

In the above structure, the anode gun head 109 has a positive charge, and the cathode gun head 110 has a negative charge, and the gas between the two electrodes is ionized to generate plasma under the action of the anode gun head 109 and the cathode gun head 110 . The plasma has a positive charge, so the cathode gun head 110 is disposed at one end away from the feeding channel 104 , which can guide the plasma to move toward the cathode gun head 110 , and then eject from the ionizing spray mechanism 101 . The ionization cavity 119 is used to accommodate the gas to be ionized and provide a space for the ionization reaction to occur.

The ionization cavity 119 provides an accommodating space for the ionization reaction of the gas. The first cavity 111 and the second cavity 112 are respectively provided on the anode gun head 109 and the cathode gun head 110, which can provide sufficient electrical energy for the occurrence of the ion reaction, and also Can facilitate production and installation.

In some embodiments of the present application, the first cavity 111 and/or the second cavity 112 are cylindrical, and the ionization reaction of the anode gun head 109 and the cathode gun head 110 generally occurs in the center of the cavity, so this application The medium-cylindrical first cavity 111 and the second cavity 112 have the same lengths from the surrounding medium when the ionization reaction occurs, so the electricity can evenly act on the gas in the ionization cavity 119, and then the gas evenly acts on the medium after ionization , in order to improve the efficiency of medium melting and reduce energy consumption at the same time. Of course, under different operating conditions, the first cavity 111 and the second cavity 112 may also be square, oval, etc., which are not limited in the embodiment of the present application.

In some embodiments of the present application, an end of the cathode gun head 110 away from the anode gun head 109 is further connected with a spray gun head 113 , and a through spray channel 114 is provided in the spray gun head 113 , and the spray channel 114 communicates with the ionization cavity 119 . Setting the spray channel 114 can effectively gather the plasma in the ionization cavity 119 , and by setting the extension direction of the spray channel 114 , the direction of the medium spraying in the molten or semi-molten state is controlled, and the spraying accuracy is improved.

In some embodiments of the present application, the size of the ejection channel 114 gradually increases along the ejection direction of the medium. The ejection channel 114 is set in the shape of a bell mouth, the ejection surface of the ejection port is enlarged, the dispersion degree of the medium is improved, and the uniformity of the medium ejection is improved.

In some embodiments of the present application, a spray mask 115 is further provided on the spray port of the spray gun head 113 . Setting the spray mask plate 115 can precisely control the spraying area of the powder and improve the spraying accuracy. Moreover, the spray mask 115 can also be designed into a specific shape according to application requirements, so as to spray the medium into a corresponding shape to meet different design requirements. For example, a square spray hole may be provided on the spray mask 115, and the medium sprayed by the spray gun head 113 passes through the square spray hole of the spray mask 115 and presents a square spray pattern on the substrate. The square jet holes can also be circular, trapezoidal or any preset shape, and the specific shape can be selected according to the needs. Alternatively, when a specific position of the substrate needs to be sprayed, the corresponding specific position on the spray mask 115 can be hollowed out, and other positions are covered, and the medium sprayed by the spray gun head 113 passes through the spray mask 115 After the injection hole is set, the pattern will only be formed in the corresponding specific position, and other positions will not be involved.

In some embodiments of the present application, an insulating member 118 is further provided between the anode gun head 109 and the cathode gun head 110 , and a through hole is formed on the insulating member 118 . The insulating member 118 can be an insulating gasket or a rubber ring, and the insulating member 118 insulates the cathode gun tip 110 and the anode gun tip 109 to prevent short circuit. Through holes are provided on the insulating member 118 for the medium and the ionized air to pass through smoothly.

According to some embodiments of the present application, the present application provides a spraying equipment 1. As shown in FIG. 2, the spraying equipment 1 includes a base 20 and the plasma spraying device 10 in any of the above-mentioned embodiments. The plasma spraying device 10 is provided with on the base 20. The number of the plasma spraying devices 10 is plural, the plurality of plasma spraying devices 10 are arranged on the base 20 at intervals, and the injection ports of the multiple plasma spraying devices 10 face the same side of the base 20 . A spraying device 1 is provided with a plurality of plasma spraying devices 10, which can spray a variety of media at the same time and improve spraying efficiency.

In the embodiment of the present application, as shown in FIG. 2 and FIG. 3 , three plasma spray apparatuses 10 may be provided. Three plasma spraying apparatuses 10 are arranged in parallel in the base 20 . It can be understood that the number of plasma spraying devices 10 is not limited to three, and can be set as required, which is not limited here. The medium conveying mechanism 103 and the gas conveying channel 102 are both disposed in the base 20 , and the control valve 108 extends through the surface of the base 20 into the plasma spray device 10 and communicates with the inlet 107 of the gas conveying passage 102 . The integration of the control valve 108 and the base 20 can be improved to facilitate the control of the conveying amount of the medium. The feeding tube 116 is arranged on the surface of the base 20 , one end of the feeding tube 116 extends into the base 20 and communicates with the medium conveying channel.

In the three plasma spraying devices 10, the gas conveying channel 102 and the medium conveying mechanism 103 are independent of each other, and can be used for spraying at least three different media, and the quality of the medium is controlled by controlling the feeding speed of the respective screw feeders 105, so as to achieve the desired effect. Control the spray ratio of different media. At the same time, by controlling the gas flow in the respective gas conveying channels 102 and controlling the melting temperature of the corresponding medium, it is possible to ensure that each medium is completely melted. In the above structure, by arranging a plurality of plasma spraying devices 10, the spraying equipment 1 can accurately control the proportion and temperature of the spraying medium, and improve the spraying quality of the film layer.

In some embodiments of the present application, the spraying directions of the plasma spraying devices 10 are set to intersect at a certain angle, so as to spray the medium sprayed from the plurality of plasma spraying devices 10 to the same target position. It can be understood that the multiple plasma spraying devices 10 may spray different media simultaneously to form a mixed medium, or spray different substrates successively to form a multi-layer coating, or spray the same type of substrates successively. The above spray modes can effectively improve the film formation efficiency of the film layer. The selection of the specific injection mode is not limited here, and can be designed according to the actual situation.

In some embodiments of the present application, the spraying angle of the plasma spraying device 10 may be calculated and determined according to the spraying distance, the spraying area and the position of the spraying point, which is not limited herein. By setting the plasma spraying devices 10 at different angles, the spraying directions of the multiple plasma spraying devices 10 are adjusted to the same target area, so as to realize spraying with multiple powders at the same time, and improve the mixing uniformity of spraying and the efficiency of spraying.

In some embodiments of the present application, please refer to FIG. 1 and FIG. 3 in conjunction with FIG. 1 and FIG. 3 , the feeding channel 104 is provided in the base 20 , and the gas conveying channel 102 is an annular pipe arranged at intervals along the circumferential direction of the feeding channel 104 . The feeding channel 104 and the gas conveying channel 102 in the embodiment of the present application are both disposed in the base 20, which improves the integration degree of the equipment. In addition, the gas delivery channel 102 is arranged on the outer periphery of the feed channel 104 and the gas delivery channel 102 and the feed channel 104 extend in the same direction, which can facilitate the simultaneous delivery of gas and medium to the spray mechanism.

According to some embodiments of the present application, the present application further provides a solar cell manufacturing equipment, including the spraying equipment 1 described in any one of the above solutions. It can be understood that the solar cell manufacturing equipment provided in this application, in addition to the spraying equipment 1 in the above-mentioned embodiment, may also include other necessary components of the solar cell manufacturing equipment, and the solar cell manufacturing equipment in this embodiment can achieve the above The technical effects of any embodiment will not be repeated here.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present application. scope, which shall be included in the scope of the claims and description of the present application. In particular, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any manner. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims (13)

1. A plasma spray apparatus, comprising

An ionizing spray mechanism;

a gas delivery channel in communication with the ionizing spray mechanism and configured to deliver a gas to the ionizing spray mechanism, the ionizing spray mechanism configured to ionize the gas; and the number of the first and second groups,

the medium conveying mechanism comprises a feeding channel and a spiral feeder arranged in the feeding channel, the feeding channel is communicated with the ionization spraying mechanism, and the spiral feeder is used for conveying the medium in the feeding channel to the ionization spraying mechanism so as to melt and spray the medium.

2. The plasma j et apparatus of claim 1, further comprising a driver connected to one end of the screw feeder.

3. The plasma j et apparatus of claim 1, wherein the gas delivery channel has an inlet for connection to a gas source and an outlet in communication with the ionizing jet mechanism.

4. The plasma j et apparatus of claim 3, wherein the inlet is provided with a control valve for controlling the flow of the gas.

5. The plasma j et apparatus of any one of claims 1 to 4, wherein the ionizing j et mechanism comprises,

the anode gun head is arranged at one end of the feeding channel and is provided with a first cavity communicated with the feeding channel;

the cathode gun head is arranged at one end, far away from the feeding channel, of the anode gun head, and is provided with a second cavity, and the second cavity is communicated with the first cavity to form an ionization cavity for ionizing the gas.

6. The plasma spraying device according to claim 5, wherein a spraying gun head is further connected to one end of the cathode gun head, which is far away from the anode gun head, a through spraying channel is arranged in the spraying gun head, and the spraying channel is communicated with the ionization cavity.

7. The plasma j et apparatus of claim 6, wherein the size of the ejection channel gradually increases in the ejection direction of the medium.

8. The plasma spraying device according to claim 6 or 7, wherein a spraying mask plate is further arranged on the spraying opening of the spraying gun head.

9. The plasma spraying device of claim 5, wherein an insulating member is further arranged between the anode gun head and the cathode gun head, and a through hole is formed in the insulating member.

10. A spray coating device, characterized by comprising

A base seat, a plurality of fixing holes and a plurality of fixing holes,

the plasma j et apparatus as claimed in any one of claims 1 to 9, which is provided to the base;

the plasma spraying device comprises a base, a plurality of plasma spraying devices and a plurality of spraying ports, wherein the number of the plasma spraying devices is multiple, the plasma spraying devices are arranged on the base at intervals, and the spraying ports of the plasma spraying devices face to the same side of the base.

11. The coating apparatus according to claim 10, wherein ejection directions of a plurality of said plasma jet means are arranged to intersect at an angle to eject said medium ejected from a plurality of said plasma jet means to a same target position.

12. A spray assembly according to claim 10 or claim 11 wherein said feed passage is provided in said base, said gas delivery passage being an annular duct circumferentially spaced around said feed passage.

13. A solar cell manufacturing apparatus, characterized by comprising the spray coating apparatus according to any one of claims 10 to 12.

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