CN216600615U - Heat sink and electrical apparatus - Google Patents
Heat sink and electrical apparatus Download PDFInfo
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- CN216600615U CN216600615U CN202123174415.5U CN202123174415U CN216600615U CN 216600615 U CN216600615 U CN 216600615U CN 202123174415 U CN202123174415 U CN 202123174415U CN 216600615 U CN216600615 U CN 216600615U
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Abstract
The utility model discloses a radiator and electrical equipment, the radiator includes: the heat dissipation structure comprises a heat dissipation substrate, a heat dissipation assembly and a heat conduction connecting part, wherein the heat conduction connecting part is positioned between the heat dissipation substrate and the heat dissipation assembly; the thermal expansion coefficient of the heat dissipation substrate and the thermal expansion coefficient of the heat dissipation assembly are different, and both the thermal expansion coefficient of the heat dissipation substrate and the thermal expansion coefficient of the heat dissipation assembly are smaller than the thermal expansion coefficient of the heat conduction connecting part. When the temperature of the radiator is greatly changed, the heat conduction connecting part can dilute the pulling stress generated by the heat dissipation substrate and the heat dissipation assembly due to different thermal expansion coefficients, so that the deformation of a heat dissipation surface of the heat dissipation assembly, which is used for being in contact with a heating device, is effectively reduced, the flatness of the heat dissipation surface is improved, the heat dissipation thermal resistance of the heat dissipation assembly is reduced, and the reliability of the radiator is improved.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electrical equipment, in particular to a heat radiator and electrical equipment.
Background
With the increase of the integration degree of the parts, the loss and the heat flux density of the core device in the electrical equipment are continuously increased. For the heat dissipation problem of heat generating components with large heat or high heat flow density, a heat sink is generally provided, which mainly comprises: the heat dissipation device comprises a heat dissipation substrate, heat dissipation fins arranged on one side of the heat dissipation substrate and a heat dissipation assembly arranged on the other side of the heat dissipation substrate, wherein the heat dissipation assembly is in contact with a heating device to dissipate heat, and the heat dissipation substrate and the heat dissipation assembly are made of different materials.
In the working process of the electrical equipment, the temperature of the radiator is higher; after the electrical equipment stops working, the temperature of the radiator is lower. Therefore, the temperature of the heat sink changes greatly, that is, the temperature of the heat dissipation substrate and the heat dissipation assembly changes greatly, and due to the difference in the materials and the difference in the thermal expansion coefficients of the heat dissipation substrate and the heat dissipation assembly, the thermal deformation amounts of the heat dissipation substrate and the heat dissipation assembly are different, so that the pulling stress exists between the heat dissipation substrate and the heat dissipation assembly, and the heat dissipation surface of the heat dissipation assembly, which is in contact with the heating device, deforms, so that the flatness of the heat dissipation surface is larger, the heat dissipation thermal resistance of the heat dissipation assembly is larger, and the reliability of the heat sink is poorer.
In summary, how to design a heat sink to improve the reliability of the heat sink is a problem to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a heat sink to improve the heat dissipation effect and reliability of the heat sink. Another object of the present invention is to provide an electric apparatus including the heat sink described above.
In order to achieve the purpose, the utility model provides the following technical scheme:
a heat sink, comprising: the heat dissipation device comprises a heat dissipation substrate, a heat dissipation assembly and a heat conduction connecting part, wherein the heat conduction connecting part is positioned between the heat dissipation substrate and the heat dissipation assembly; the thermal expansion coefficient of the heat dissipation substrate and the thermal expansion coefficient of the heat dissipation assembly are different, and both the thermal expansion coefficient of the heat dissipation substrate and the thermal expansion coefficient of the heat dissipation assembly are smaller than the thermal expansion coefficient of the heat conduction connecting part.
Optionally, the thermally conductive connection comprises a thermally conductive connection plate and/or a thermally conductive connection layer;
if the heat conduction connecting part comprises a heat conduction connecting plate and a heat conduction connecting layer, the heat conduction connecting layer is positioned between the heat conduction connecting plate and the heat dissipation assembly, and/or the heat conduction connecting layer is positioned between the heat conduction connecting plate and the heat dissipation substrate.
Optionally, the heat-conducting connecting plate is a metal plate.
Optionally, the thermally conductive connecting layer is an interface material layer.
Optionally, the interface material layer is a heat-conducting silicone layer or a silicone cushion layer.
Optionally, if the heat-conducting connecting portion includes a heat-conducting connecting plate, one side of the heat-conducting connecting plate is welded to the heat-dissipating substrate, and the other side of the heat-conducting connecting plate is welded to the heat-dissipating component.
Optionally, the heat dissipation substrate, the heat conduction connecting portion, and the heat dissipation assembly are fixedly connected by a fastener.
Optionally, the fastener is a threaded connection.
Optionally, the heat-dissipating substrate is free of nickel plating.
Optionally, the heat dissipation assembly and the heat conduction connection portion correspond to each other one to one.
Optionally, the heat dissipation substrate is provided with a mounting groove, the heat dissipation assembly is located in the mounting groove, and a stress relief groove is formed in the groove bottom of the mounting groove so that the groove bottom of the mounting groove has an island structure;
and/or the heat dissipation substrate is provided with a first positioning part, and the heat conduction connecting part and the heat dissipation assembly are both provided with a second positioning part matched with the first positioning part in a positioning manner.
Based on the radiator, the utility model further provides electrical equipment which comprises the radiator, wherein the radiator is any one of the radiators.
In the radiator provided by the utility model, the heat conduction connecting part is arranged between the radiating assembly and the radiating substrate, and because the thermal expansion coefficient of the heat conduction connecting part is greater than that of the radiating assembly and the thermal expansion coefficient of the heat conduction connecting part is greater than that of the radiating assembly, when the temperature of the radiator is greatly changed, the heat conduction connecting part can dilute the pulling stress generated by the radiating substrate and the radiating assembly due to unequal thermal expansion coefficients, thereby effectively reducing the deformation of a radiating surface of the radiating assembly, which is used for being in contact with a heating device, improving the flatness of the radiating surface, reducing the radiating thermal resistance of the radiating assembly and further improving the reliability of the radiator.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is an exploded view of a heat sink according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of the heat sink shown in FIG. 1;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is an exploded view of another heat sink provided in accordance with an embodiment of the present invention;
FIG. 5 is a cross-sectional view of the heat sink shown in FIG. 4;
fig. 6 is an enlarged schematic view of a portion B in fig. 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 6, a heat sink provided by an embodiment of the present invention includes: the heat dissipation device comprises a heat dissipation substrate 1, a heat dissipation assembly 4 and a heat conduction connecting part positioned between the heat dissipation substrate 1 and the heat dissipation assembly 4; the thermal expansion coefficient of the heat dissipation substrate 1 is different from the thermal expansion coefficient of the heat dissipation assembly 4, and both the thermal expansion coefficient of the heat dissipation substrate 1 and the thermal expansion coefficient of the heat dissipation assembly 4 are smaller than the thermal expansion coefficient of the heat conduction connecting part.
Specifically, the thermal expansion coefficient of the heat dissipation substrate 1 is greater than the thermal expansion coefficient of the heat dissipation element 4, or the thermal expansion coefficient of the heat dissipation substrate 1 is smaller than the thermal expansion coefficient of the heat dissipation element 4. The difference between the thermal expansion coefficient of the thermal conductive connection portion and the thermal expansion coefficient of the heat dissipation substrate 1, and the difference between the thermal expansion coefficient of the thermal conductive connection portion and the thermal expansion coefficient of the heat dissipation assembly 4 are selected according to actual needs, and this embodiment is not limited thereto. In practical applications, the larger the thermal expansion system of the thermal connection portion is, the better the thermal expansion coefficient of the thermal connection portion is, the stronger the dilution effect on the pulling stress generated by the heat dissipation substrate 1 and the heat dissipation assembly 4 due to the unequal thermal expansion coefficients is.
In the heat sink provided in the above embodiment, the heat dissipation assembly 4 and the heat dissipation substrate 1 are not in direct contact with each other by providing the heat conductive connection portion between the heat dissipation assembly 4 and the heat dissipation substrate 1; because the thermal expansion coefficient of the heat-conducting connecting part is greater than that of the heat-radiating substrate 1, and the thermal expansion coefficient of the heat-conducting connecting part is greater than that of the heat-radiating component 4, when the temperature of the radiator is greatly changed, the heat-conducting connecting part can dilute the pulling stress generated by the heat-radiating substrate 1 and the heat-radiating component 4 due to the unequal thermal expansion coefficients, so that the deformation of the heat-radiating surface 41 of the heat-radiating component 4, which is used for being in contact with a heating device, is effectively reduced, the flatness of the heat-radiating surface 41 is improved, the heat-radiating thermal resistance of the heat-radiating component 4 is reduced, and the reliability of the radiator is improved.
Meanwhile, in the radiator, the heat conduction connecting part also enhances the transverse heat conduction capability and enhances the heat dissipation effect.
The specific type of the heat-conducting connecting part is selected according to actual needs. Specifically, the heat-conducting connecting portion includes the heat-conducting connecting plate 3, or the heat-conducting connecting portion includes the heat-conducting connecting layer 8, or the heat-conducting connecting portion includes the heat-conducting connecting plate 3 and the heat-conducting connecting layer 8. In order to improve the effect, the heat-conducting connecting part may optionally comprise a heat-conducting connecting plate 3 and a heat-conducting connecting layer 8.
If the heat-conducting connecting portion includes the heat-conducting connecting plate 3 and the heat-conducting connecting layer 8, the heat-conducting connecting layer 8 is located between the heat-conducting connecting plate 3 and the heat dissipation assembly 4, and/or the heat-conducting connecting layer 8 is located between the heat-conducting connecting plate 3 and the heat dissipation substrate 1. In order to improve the effect of the heat-conducting connecting portion, it is preferable that the heat-conducting connecting layer 8 is located between the heat-conducting connecting plate 3 and the heat dissipation assembly 4, and the heat-conducting connecting layer 8 is located between the heat-conducting connecting plate 3 and the heat dissipation substrate 1.
As for the type of the heat conductive connecting plate 3, it is selected according to actual needs, for example, the heat conductive connecting plate 3 is a metal plate or a plastic plate. In order to improve the effect of the heat conducting connection part, the metal plate may be a copper plate.
For the type of the heat conducting connection layer 8, it is selected according to actual needs, for example, the heat conducting connection layer 8 is an interface material layer, and the interface material layer may be a heat conducting silicone layer or a silicone cushion layer, which has a certain deformation capability, and this embodiment does not limit this.
If the heat-conducting connecting part comprises the interface material layer, the interface material layer ensures that the heat-radiating substrate 1 and the heat-radiating component 4 are tightly combined, so that the contact thermal resistance is reduced, and the heat-radiating effect is improved; if the heat-conducting connecting part comprises the heat-conducting connecting plate 3 and the interface material layer, the interface material layer ensures that the heat-radiating substrate 1 and the heat-conducting connecting plate 3 are tightly combined and/or the heat-radiating assembly 4 and the heat-conducting connecting plate 3 are tightly combined, so that the contact thermal resistance is reduced, and the heat-radiating effect is improved.
The heat conducting connecting part, the heat dissipation substrate 1 and the heat dissipation assembly 4 are fixedly connected, and the fixed connection mode is selected according to actual needs. If the heat-conducting connecting part comprises the heat-conducting connecting plate 3, one surface of the heat-conducting connecting plate 3 can be selected to be welded with the heat-radiating substrate 1, and the other surface of the heat-conducting connecting plate 3 can be selected to be welded with the heat-radiating component 4, as shown in fig. 1-3. Of course, the heat conduction connection portion, the fixing connection manner of the heat dissipation substrate 1 and the heat dissipation assembly 4 may be selected to be other, and are not limited to the above embodiment.
Alternatively, the heat dissipating substrate 1, the heat conductive connecting portion, and the heat dissipating module 4 are fixedly connected by a fastener 7, as shown in fig. 4 to 6. At this time, the heat conductive connection portion includes the heat conductive connection plate 3 and/or the heat conductive connection layer 8. In order to ensure the heat dissipation effect, the heat-conducting connecting portion may be selected to include the heat-conducting connecting plate 3 and the heat-conducting connecting layer 8, or the heat-conducting connecting portion may include the heat-conducting connecting layer 8.
In the radiator, welding is not adopted, and the pulling stress generated by the heat dissipation substrate 1 and the heat dissipation assembly 4 due to different thermal expansion coefficients is further reduced. Moreover, the tin soldering cost is saved, and the cost is reduced. Furthermore, the heat dissipation substrate 1 is not plated with nickel, so that the cost of the whole heat sink is reduced.
For the convenience of disassembly and assembly, the heat dissipation substrate 1, the heat conduction connecting part and the heat dissipation assembly 4 can be detachably and fixedly connected through the fastener 7. Thus, the maintainability is improved, and the overall utilization rate of the radiator is higher.
The type of the fastening member 7 is selected according to actual needs, for example, the fastening member 7 is a bolt or a screw, and the embodiment is not limited thereto.
In the heat sink, the size, shape and number of the heat conducting connecting parts are selected according to actual needs, for example, the heat sink 4 is arranged. In order to improve the effect of the heat conducting connection portions, the heat dissipation assemblies 4 correspond to the heat conducting connection portions one to one. Of course, the number of the heat-conducting connecting parts may be smaller than the number of the heat dissipation assemblies 4, or the number of the heat-conducting connecting parts may be larger than the number of the heat dissipation assemblies 4, and is not limited to the above embodiments.
In practical application, the pulling stress generated by the heat dissipation substrate 1 and the heat dissipation assembly 4 due to the unequal thermal expansion coefficients can be reduced by other means. Specifically, the heat dissipation substrate 1 is provided with a mounting groove 11, the heat dissipation assembly 4 is located in the mounting groove 11, and a stress relief groove 12 is provided at the bottom of the mounting groove 11 so that the bottom of the mounting groove 11 has an island structure 13. Thus, the pulling stress of the heat dissipation substrate 1 on the heat dissipation assembly 4 is reduced.
For the convenience of installation, the heat dissipation substrate 1 is provided with a first positioning portion 5, and the heat conduction connecting portion and the heat dissipation assembly 4 are both provided with a second positioning portion 6 in positioning fit with the first positioning portion 5. Specifically, the first positioning portion 5 is a positioning column or a positioning protrusion, and the second positioning portion 7 is a positioning hole. Of course, the first positioning portion 5 may be a positioning hole, and the second positioning portion 7 may be a positioning column or a positioning protrusion.
Based on the heat sink provided by the above embodiment, the present embodiment further provides an electrical device, which includes the heat sink, where the heat sink is the heat sink in the above embodiment.
Since the heat sink provided by the above embodiment has the above technical effects, and the electrical device includes the above heat sink, the electrical device also has corresponding technical effects, and details are not described herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (12)
1. A heat sink, comprising: the heat dissipation device comprises a heat dissipation substrate (1), a heat dissipation assembly (4) and a heat conduction connecting part located between the heat dissipation substrate (1) and the heat dissipation assembly (4); the thermal expansion coefficient of the heat dissipation substrate (1) is different from that of the heat dissipation assembly (4), and the thermal expansion coefficient of the heat dissipation substrate (1) and that of the heat dissipation assembly (4) are both smaller than that of the heat conduction connecting part.
2. A heat sink according to claim 1, wherein the thermally conductive connection comprises a thermally conductive connection plate (3) and/or a thermally conductive connection layer (8);
if heat conduction connecting portion include heat conduction connecting plate (3) and heat conduction articulamentum (8), heat conduction articulamentum (8) are located heat conduction connecting plate (3) with between radiator unit (4), and/or heat conduction articulamentum (8) are located heat conduction connecting plate (3) with between radiating basal plate (1).
3. A radiator according to claim 2, characterised in that the thermally conductive connection plate (3) is a metal plate.
4. A heat sink according to claim 2, characterised in that the thermally conductive connection layer (8) is a layer of interface material.
5. The heat sink of claim 4, wherein the interface material layer is a thermally conductive silicone layer or a silicone cushion layer.
6. The heat sink according to claim 2, wherein if the heat conducting connecting portion comprises a heat conducting connecting plate (3), one surface of the heat conducting connecting plate (3) is welded to the heat dissipating substrate (1), and the other surface of the heat conducting connecting plate (3) is welded to the heat dissipating assembly (4).
7. The heat sink according to claim 1, wherein the heat-dissipating substrate (1), the thermally conductive connection and the heat-dissipating component (4) are fixedly connected by a fastener (7).
8. A heat sink according to claim 7, characterised in that the fastening member (7) is a threaded connection.
9. The heat sink according to claim 7, wherein the heat-dissipating substrate (1) is free of nickel plating.
10. A heat sink according to claim 1, wherein the heat dissipating components (4) and the thermally conductive connections are in one-to-one correspondence.
11. The heat sink according to any one of claims 1-10,
the heat dissipation substrate (1) is provided with a mounting groove (11), the heat dissipation assembly (4) is located in the mounting groove (11), and a stress release groove (12) is formed in the bottom of the mounting groove (11) so that an island structure (13) is formed in the bottom of the mounting groove (11);
and/or the heat dissipation substrate (1) is provided with a first positioning part (5), and the heat conduction connecting part and the heat dissipation assembly (4) are both provided with a second positioning part (6) which is matched with the first positioning part (5) in a positioning way.
12. An electrical device comprising a heat sink, characterized in that the heat sink is a heat sink according to any one of claims 1-11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123174415.5U CN216600615U (en) | 2021-12-16 | 2021-12-16 | Heat sink and electrical apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123174415.5U CN216600615U (en) | 2021-12-16 | 2021-12-16 | Heat sink and electrical apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600615U true CN216600615U (en) | 2022-05-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123174415.5U Active CN216600615U (en) | 2021-12-16 | 2021-12-16 | Heat sink and electrical apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216600615U (en) |
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2021
- 2021-12-16 CN CN202123174415.5U patent/CN216600615U/en active Active
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