CN216600607U - Double-deck heat abstractor of mainboard and electronic equipment - Google Patents

Abstract

The application discloses double-deck heat abstractor of mainboard and electronic equipment, wherein the double-deck heat abstractor of mainboard includes: a first heat exchange base; the heat radiation fan is arranged on the first heat exchange seat; the heat conducting fin is used for being matched with the first surface of the main board to be radiated in a heat exchange way; the heat pipe heat dissipation structure is used for heat exchange matching with a heating device arranged on a second surface of the main board to be dissipated, and the first surface and the second surface are two surfaces opposite to the main board to be dissipated; the heat pipe radiating structure and the heat conducting fins are in heat exchange fit with the first heat exchange seat. Treat that heat dissipation mainboard first face and second face set up conducting strip and heat pipe heat radiation structure respectively, mutually support between the bilayer, with on the heat transmits first heat exchange seat earlier, the inside air of first heat exchange seat is with heat transfer to rethread first heat exchange seat, blow off the organism with the hot-air by radiator fan, can effectively reduce the temperature of heat dissipation mainboard and the device that generates heat, improve the radiating efficiency.

Description

Double-deck heat abstractor of mainboard and electronic equipment

Technical Field

The utility model relates to the field of electronic equipment heat dissipation, in particular to a mainboard double-layer heat dissipation device and electronic equipment.

Background

With the rapid development of information technology, electronic devices are widely used in daily life, and especially electronic products such as notebook computers are developed to be light, thin and small in order to meet the requirement of users on portability.

However, the functional requirements of users on the electronic devices are increasing, so that the functions carried by the electronic chips on the main board of the electronic devices are increasing, and thus, huge power consumption is also caused, and the consumption causes the temperature of the electronic chips to rise. The electronic chip is the main piece that generates heat on the mainboard, and its high temperature not only can influence electronic chip's work efficiency, also can influence life. For the heat dissipation problem of the heat generating component on the motherboard, in the prior art, a heat dissipation device, such as a heat pipe, is generally designed on one side of the motherboard on which the heat generating component is placed, and the heat generated by the main heat generating component is exhausted outside the system to ensure that the temperature of the heat generating component is normal, but the heat generating component is mainly welded on the motherboard by using Surface Mount Technology (SMT), the heat of the heat generating component is conducted to the front side and the back side, one side of the heat generating component is conducted to the heat dissipation device, and the other side of the heat generating component is conducted to the attached motherboard, and the heat dissipation capability of the motherboard is poor, so that the heat is accumulated on the motherboard to cause local overheating, and the heat dissipation of the heat generating component is adversely affected by the local overheating area, so that the heat generating component may collide with a temperature threshold in advance, and the working efficiency is reduced.

Therefore, how to improve the heat dissipation efficiency of the motherboard without increasing too many heat dissipation devices is a problem that needs to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The application expects to provide a double-deck heat abstractor of mainboard and electronic equipment for solve the problem that electronic equipment mainboard radiating efficiency is low among the prior art.

In a first aspect, the present invention provides a motherboard dual-layer heat dissipation device, including: a first heat exchange base; the heat radiation fan is arranged on the first heat exchange seat; the heat conducting fin is used for being matched with the first surface of the main board to be radiated in a heat exchange way; the heat pipe heat dissipation structure is used for heat exchange matching with a heating device arranged on a second surface of the main board to be dissipated, and the first surface and the second surface are two surfaces opposite to the main board to be dissipated; the heat pipe radiating structure and the heat conducting fins are in heat exchange fit with the first heat exchange seat.

Furthermore, the position of the heat conducting sheet close to the edge is in heat exchange fit with the first heat exchange seat.

Furthermore, a notch for preventing the edge of the heat conducting sheet from being broken is arranged on the heat conducting sheet, and the notch is positioned close to the position where the heat conducting sheet is matched with the first heat exchange seat in a heat exchange mode.

Furthermore, the heat conducting fin is in heat exchange fit with the first heat exchange seat through a heat conducting bonding piece.

Further, the heat conducting sheet is any one of a graphite sheet, a copper foil and an aluminum foil.

Furthermore, the first heat exchange base comprises a first base body and a second base body which are buckled with each other, a fan installation space is formed by the first base body and the second base body in a surrounding mode, and the cooling fan is arranged in the fan installation space.

Furthermore, the wall surface of the first seat body and/or the second seat body facing the fan installation space is provided with heat dissipation fins.

Further, the heat conducting fin is in heat transfer fit with the second seat body, and the heat pipe heat dissipation structure is in heat transfer fit with the first seat body.

Further, the heat pipe heat dissipation structure includes a second heat exchange base and a heat pipe; the second heat exchange seat is used for being in heat exchange fit with the heating device, the evaporation part of the heat pipe is in heat exchange fit with the second heat exchange seat, and the condensation part of the heat pipe is in heat transfer fit with the first seat body.

In a second aspect, the present invention provides an electronic device, including the above motherboard dual-layer heat dissipation apparatus.

Above-mentioned scheme treats that heat dissipation mainboard first face and second face set up conducting strip and heat pipe heat radiation structure respectively, mutually supports between the bilayer, with on the heat transmits first heat exchange seat earlier, the inside air of first heat exchange seat is transmitted with the heat to the first heat exchange seat of rethread, blows off the organism with the hot-air by radiator fan, can effectively reduce the temperature of mainboard and the device that generates heat, has improved the radiating efficiency. The temperature of the heating device on the mainboard is reduced, and the influence on the work of the heating device due to overhigh temperature of the mainboard is avoided. Through adopting this kind of double-deck heat abstractor's of mainboard electronic equipment, the radiating rate of the device that generates heat and mainboard has been accelerated greatly, has guaranteed electronic equipment's normal operating efficiency, has also played protection device and mainboard that generates heat simultaneously, increases electronic equipment service life's effect.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

fig. 1 is an exploded schematic view of a motherboard dual-layer heat dissipation device according to an embodiment of the present invention;

fig. 2 is a partially enlarged view of a connection portion between an edge of a heat conducting fin and a second seat according to an embodiment of the present invention;

1-a mainboard to be radiated; 2-heat conducting fins; 3-a heat dissipation fan; 4-a first heat exchange seat; 5-a second heat exchange seat; 6-radiating fins; 7-a first seat body; 8-a second seat body; 9-a heat pipe; 10 notches.

Detailed Description

The present application will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

As shown in fig. 1, the dual-layer heat dissipation device for a motherboard provided by the embodiment of the present invention includes: the first heat exchange base 4 and the first heat exchange base 4 are made of a material with high heat conduction efficiency, for example, but not limited to, the first heat exchange base 4 is a heat exchange base made of aluminum or copper, and the specific structure is not limited herein, and the structural form may be determined according to the specific use environment, as long as the first heat exchange base can perform heat exchange with the heat conduction sheet 2 and the heat pipe heat dissipation structure described below.

The first heat exchange base 4 is connected with the heat radiation fans 3, the heat radiation fans 3 can be fixed on the first heat exchange base 4 through clamping, screw connection and other modes, the number of the heat radiation fans 3 can be set according to heat radiation requirements, and in the example, each first heat exchange base 4 is connected with one heat radiation fan 3. The cooling fan 3 may be a fan rotating at a constant speed, or a fan with a variable rotation speed controlled by a PWM (pulse width Modulation) method.

The first heat exchange seat 4 is further connected with the heat conduction sheet 2 in a heat exchange fit, and the heat exchange fit is referred to herein as a heat exchange fit, in which two interconnected components can perform heat exchange, and the two interconnected components can be directly connected or connected through other components, for example, a heat conduction silicone grease or the like is arranged between the two interconnected components to improve heat transfer efficiency. This conducting strip 2 can be connected in the first face of treating heat dissipation mainboard 1 for with the first face heat exchange cooperation of treating heat dissipation mainboard 1, also promptly, be used for absorbing the heat from the first face of treating heat dissipation mainboard 1, treat the temperature of heat dissipation mainboard 1 with the reduction.

The first heat exchanging base 4 is further connected with a heat pipe heat dissipating structure in a heat exchanging fit manner, the heat pipe heat dissipating structure is used for heat exchanging fit with a heating device arranged on the second surface of the main board 1 to be dissipated, and the second surface of the main board 1 to be dissipated can be provided with a plurality of heating devices, such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and the like. The heat pipe heat radiation structure is connected with the heating device and used for absorbing heat from the heating device arranged on the second surface of the mainboard 1 to be radiated so as to reduce the temperature of the heating device. The first surface and the second surface are two surfaces of the mainboard to be cooled, which are opposite to each other.

Through this kind of design, conducting strip 2 can be with treating the heat transfer of the first face of heat dissipation mainboard 1 for first heat exchange seat 4, and heat pipe heat radiation structure can be with treating the heat transfer of the device that generates heat on the heat dissipation mainboard second face for first heat exchange seat 4, and rethread radiator fan 3 cools down first heat exchange seat 4. The heat dissipation capacity of the mainboard to be dissipated is improved, the heat accumulation of the mainboard to be dissipated is reduced, the problem that the local temperature of the mainboard to be dissipated is too high is solved, and the adverse effect on the work of a heating device due to the fact that the temperature of the mainboard to be dissipated is too high is avoided.

Further, the heat-conducting plate 2 is connected to the first heat exchange base 4 at a position near the edge. Generally, the heat conducting sheet 2 is made of a material with good heat conducting property, such as, but not limited to, aluminum, copper, graphite, etc. When in use, the heat conducting fin 2 is attached to a position to be radiated, such as the first surface of the mainboard 1 to be radiated, so as to facilitate the transmission of the temperature on the mainboard 1 to be radiated to the outside, it is necessary to conduct the heat on the heat-conducting strip 2 to the surroundings, to connect the first heat exchange seat 4 to the position of the heat-conducting strip 2 near the edge, so that the heat conducted from the heat-conducting fin 2 to the periphery can be smoothly transferred to the first heat exchange seat 4, and then forced air cooling is carried out through the heat-dissipating fan arranged on the first heat exchange seat 4, so that the temperature on the mainboard 1 to be radiated can be smoothly radiated to the external space, the temperature is prevented from being gathered on the mainboard 1 to be radiated, therefore, the temperature of the mainboard 1 to be radiated is reduced, the radiating efficiency is improved, and the phenomenon that the radiating of the heating device is affected due to the overhigh temperature of the mainboard 1 to be radiated, so that the heating device reaches the overheat protection temperature too early to reduce the frequency is avoided.

Further, the heat conducting strip 2 is provided with a notch 10 capable of preventing fracture in the assembling process, and the notch 10 is located at a position close to the heat exchange matching position of the heat conducting strip 2 and the first heat exchange seat 4. Because the heights of the first heat exchange seat 4 and the connecting surface of the heat dissipation main board 1 and the heat conducting strip 2 are not uniform in the fixing process, the heat conducting strip 2 can be bent and easily broken in the assembling process. By adding the notch 10, the heat conducting sheet 2 can be prevented from being broken in the assembling process, and the flexibility of the position where the heat conducting sheet 2 is in heat exchange fit with the first heat exchange seat 4 is increased.

Further, the heat conducting plate 2 and the first heat exchange seat 4 are in heat exchange fit through a heat conducting bonding piece. The heat conductive adhesive member may be a double-sided tape, but is not limited thereto, and one side of the heat conductive adhesive member is installed to face the first heat exchange base, and is adhered to the first heat exchange base 4, and the other side is adhered to the heat conductive sheet 2. Through the design, the heat-conducting bonding piece is arranged to fix the heat-conducting fin 2 and the first heat exchange seat 4, so that the heat exchange matching of the heat-conducting fin 2 and the first heat exchange seat 4 is realized; moreover, the heat conducting sheet 2 and the first heat exchange seat 4 are insulated from each other and the heat conducting sheet 2 is prevented from being punctured.

Furthermore, the heat conducting sheet 2 is any one of a graphite sheet, a copper foil and an aluminum foil, and the materials have good heat conductivity, so that the heat dissipation performance of the mainboard 1 to be dissipated can be guaranteed, meanwhile, the material price is low, and the manufacturing cost and the processing cost are low.

Further, the first heat exchanging base 4 includes a first base 7 and a second base 8 that are buckled with each other, the first base 7 and the second base 8 enclose an installation space in which the heat dissipating fan 3 is formed, and the heat dissipating fan 3 is disposed in the installation space. So that the wind blown by the fan can have higher wind pressure and contact with the first heat exchange seat 4 with larger area to improve the heat dissipation capability. In addition, the heat conducting fins 2 and the heat pipe heat dissipation structure which are respectively arranged on the two opposite sides of the main board 1 to be dissipated are also beneficial to being connected with the first heat exchange seat 4.

Further, the side wall of the second seat 8 away from the installation space of the cooling fan 3 is provided with cooling fins 6. Through setting up heat radiation fins 6, improved heat radiating area, when radiator fan 3 blows the air and dispels the heat, can have more heats to be taken to the external world, play and accelerate the radiating effect of treating heat dissipation mainboard 1.

Further, the heat pipe heat dissipation structure comprises a second heat exchange seat 5 and a heat pipe 9; second heat exchange seat 5 can be connected with the device contact that generates heat for absorb the heat from the device that generates heat, its material can use heat conductivility such as graphite flake, copper sheet and aluminum sheet stronger, then connects on the evaporation portion of heat pipe 9, and the evaporation portion of heat pipe 9 absorbs the heat through the evaporation effect of its inside liquid material, and the gas after the evaporation removes the condensation portion of heat pipe 9 another, and rethread condensation effect gives first heat exchange seat 4 heat transfer. Through the design, the heat pipe heat dissipation structure can quickly absorb heat from the heating device and transmit the heat to the first heat exchange seat 4, so that the purpose of quickly cooling the heating device is achieved.

In a second aspect, an embodiment of the present invention further provides an electronic device, including the motherboard dual-layer heat dissipation apparatus.

Such as, but not limited to, a notebook computer, a personal digital terminal, a tablet computer, a desktop computer, etc.

The heat dissipation speed of the heating device and the mainboard 1 to be dissipated is greatly accelerated through the mainboard double-layer heat dissipation mode, and the normal operation efficiency of the electronic equipment is ensured; meanwhile, the temperature of the heating device and the temperature of the mainboard 1 to be cooled are controlled, the heating device and the mainboard 1 to be cooled are protected, and the service life of the electronic equipment is prolonged.

It will be understood that any orientation or positional relationship indicated above with respect to the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., is based on the orientation or positional relationship shown in the drawings and is for convenience in describing and simplifying the utility model, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be considered limiting of the utility model. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the utility model herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of features described above or equivalents thereof without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (10)

1. The utility model provides a double-deck heat abstractor of mainboard which characterized in that includes:

a first heat exchange base;

the heat radiation fan is arranged on the first heat exchange seat;

the heat conducting fin is used for being matched with the first surface of the main board to be radiated in a heat exchange way;

the heat pipe heat dissipation structure is used for heat exchange matching with a heating device arranged on a second surface of the main board to be dissipated, and the first surface and the second surface are two surfaces opposite to the main board to be dissipated;

the heat pipe radiating structure and the heat conducting fins are in heat exchange fit with the first heat exchange seat.

2. A motherboard double deck heat sink as recited in claim 1 wherein said heat conducting fins are heat exchanging fitted to said first heat exchanging seats at positions close to the edges.

3. A motherboard bilayer heat sink as claimed in claim 2 wherein the heat conducting strip is provided with a notch for preventing the edge of the heat conducting strip from breaking, the notch is located near the position where the heat conducting strip is in heat exchange engagement with the first heat exchange base.

4. A motherboard double-deck heat dissipation device as defined in any one of claims 1 to 3, wherein said heat-conducting strip is heat-exchanged with said first heat-exchanging seat by a heat-conducting adhesive member.

5. A motherboard double-deck heat dissipating device as defined in claim 4, wherein said heat conducting sheet is any one of a graphite sheet, a copper foil and an aluminum foil.

6. A double-deck heat sink for main boards as claimed in claim 4, wherein the first heat-exchanging base comprises a first base and a second base which are fastened to each other, the first base and the second base enclosing a fan-mounting space, and the heat-dissipating fan is disposed in the fan-mounting space.

7. A motherboard double-deck heat sink as recited in claim 6, wherein the side of said second housing away from said fan mounting space is provided with heat dissipating fins.

8. A motherboard bilayer heat sink as claimed in claim 6 wherein the heat conducting strip is in heat transfer engagement with the second housing and the heat pipe heat sink is in heat transfer engagement with the first housing.

9. A motherboard double deck heat dissipation device as recited in claim 8, wherein said heat pipe heat dissipation structure comprises a second heat exchange base and a heat pipe; the second heat exchange seat is used for being in heat exchange fit with the heating device, the evaporation part of the heat pipe is in heat exchange fit with the second heat exchange seat, and the condensation part of the heat pipe is in heat transfer fit with the first seat body.

10. An electronic device comprising the motherboard double-layer heat sink as recited in any one of claims 1 to 9.

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