CN216437811U

CN216437811U - Processor for ultra-high-definition liquid crystal splicing unit

Info

Publication number: CN216437811U
Application number: CN202121765334.XU
Authority: CN
Inventors: 孟瑞国
Original assignee: Nanjing Changtuo Information Technology Co ltd
Current assignee: Nanjing Changtuo Information Technology Co ltd
Priority date: 2022-01-13
Filing date: 2022-01-13
Publication date: 2022-05-03
Anticipated expiration: 2032-01-13

Abstract

The utility model discloses a processor for an ultra-high-definition liquid crystal splicing unit, relates to the technical field of splicing unit processors, and aims to solve the problems that the existing splicing unit processor is poor in heat dissipation effect of a heat dissipation structure and influences the operation of the processor. The both sides of treater are provided with the installation component, be provided with the mounting hole on the installation component, the part is provided with the radiator-grid on the preceding terminal surface of treater, the lower extreme of radiator-grid is provided with the configuration check, be provided with the handle on the outer wall of configuration check, the lower extreme of configuration check is provided with the mounting bracket check, be provided with fixed subassembly on the mounting bracket check, be provided with fixed plectrum on the fixed subassembly, it is two sets of be provided with the installation check between the mounting bracket check, be provided with the interface on the installation check, the preceding terminal surface the latter half of treater is provided with stand-by power source interface module, one side of stand-by power source interface module is provided with switch, one side of switch is provided with power source.

Description

Processor for ultra-high-definition liquid crystal splicing unit

Technical Field

The utility model relates to the technical field of splicing unit processors, in particular to a processor for an ultra-high definition liquid crystal splicing unit.

Background

In conventional devices, as in application No.: 201420768251. X; the name is as follows: an image splicing processor of a plug-in multi-input interface. The device includes: the image splicing processing body comprises a functional unit, wherein the functional unit is arranged in the image splicing processing body and realizes the basic operation of the image splicing processor: the execution unit is installed in the image splicing processing body in a plugging mode, and the number or the positions of the execution unit interfaces can be changed. Therefore, the plugging function of the external signal socket is realized, and the external signal socket in the image splicing processor can be replaced at will according to the difference of the actually required signal types and the actually required signal quantity.

However, the splicing unit processor has the problems that the heat dissipation effect of the heat dissipation structure is poor, and the operation of the processor is influenced; therefore, the existing requirements are not met, and a processor for an ultra-high definition liquid crystal splicing unit is provided for the same.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a processor for an ultra-high-definition liquid crystal splicing unit, and aims to solve the problems that the existing splicing unit processor in the background art is poor in heat dissipation effect of a heat dissipation structure and influences the operation of the processor.

In order to achieve the purpose, the utility model provides the following technical scheme: a processor for an ultra-high-definition liquid crystal splicing unit comprises a processor, wherein mounting assemblies are arranged on two sides of the processor and are welded and connected with two sides of the processor, mounting holes are formed in the mounting assemblies, a radiating net is arranged on the upper portion of the front end face of the processor and is fixedly connected with the upper portion of the front end face of the processor, configuration grids are arranged at the lower ends of the radiating net and are connected with the processor in an embedded mode, a handle is arranged on the outer wall of each configuration grid and is fixedly connected with the outer wall of each configuration grid, mounting racks are arranged at the lower ends of the configuration grids and are connected with the processor in an embedded mode, an upper group and a lower group of the mounting racks are arranged, fixing assemblies are arranged on the mounting racks and are fixedly connected with the mounting racks, and fixing poking pieces are arranged on the fixing assemblies, and fixed plectrum and fixed subassembly hinged joint, it is two sets of be provided with the installation check between the installation frame check, be provided with the interface on the installation check, and interface and installation check electric connection, the preceding terminal surface the latter half of treater is provided with stand-by power source interface module, and stand-by power source interface module and the preceding terminal surface the latter half electric connection of treater, one side of stand-by power source interface module is provided with switch, and switch and treater electric connection, one side of switch is provided with power source, and power source and treater electric connection.

Preferably, a heat dissipation assembly is arranged below the processor.

Preferably, fixing structures are arranged on two sides of the heat dissipation assembly and fixedly connected with the two sides of the heat dissipation assembly.

Preferably, the front end face of the heat dissipation assembly is provided with heat dissipation holes, and the heat dissipation holes are fixedly connected with the heat dissipation assembly.

Preferably, the lower end of the heat dissipation assembly is provided with a connecting block, the connecting block is fixedly connected with the heat dissipation assembly, and the connecting block is provided with a supporting assembly which is fixedly connected with the connecting block.

Preferably, a heat dissipation fan is arranged inside the heat dissipation assembly.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the processor is placed on the heat dissipation assembly through the arrangement of the heat dissipation assembly, the fixing structure is used for fixing the processor on the heat dissipation assembly, then the heat dissipation assembly is started, the heat generated in the operation process of the processor is discharged through the heat dissipation holes by the heat dissipation fan, the support assembly is arranged in a triangular mode, and the triangular arrangement is adopted because the stability of the triangle is utilized, so that the problems that the operation of the processor is influenced due to the poor heat dissipation effect of the heat dissipation structure of the existing splicing unit processor are solved.

2. Through the setting of standby power source interface module, when the power source interface of treater goes wrong, influence the use, can launch the power source interface in the standby power source interface module, can not influence the use like this.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a stitching unit processor according to the present invention;

FIG. 2 is a schematic diagram of a processor partial structure of a stitching unit processor according to the present invention;

FIG. 3 is a schematic view of a heat sink assembly of the tiled cell processor of the present invention;

FIG. 4 is a schematic top view of a heat sink assembly of the tiled cell processor of the present invention;

FIG. 5 is an enlarged view of a portion of the splice unit handler of the present invention at A;

in the figure: 1. a processor; 2. mounting the component; 3. mounting holes; 4. a heat-dissipating web; 5. configuring grids; 6. a handle; 7. mounting the frame grid; 8. a fixing assembly; 9. fixing the shifting sheet; 10. installing grids; 11. An interface; 12. a backup power interface component; 13. a power switch; 14. a power interface; 15. a heat dissipating component; 16. a fixed structure; 17. heat dissipation holes; 18. connecting blocks; 19. a support assembly; 20. a heat dissipation fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-5, an embodiment of the present invention is shown: a processor for an ultra-high-definition liquid crystal splicing unit comprises a processor 1, wherein mounting assemblies 2 are arranged on two sides of the processor 1, the mounting assemblies 2 are welded with two sides of the processor 1, mounting holes 3 are formed in the mounting assemblies 2, a radiating net 4 is arranged on the upper portion of the front end face of the processor 1, the radiating net 4 is fixedly connected with the upper portion of the front end face of the processor 1, a configuration grid 5 is arranged at the lower end of the radiating net 4, the configuration grid 5 is connected with the processor 1 in an embedded mode, a handle 6 is arranged on the outer wall of the configuration grid 5, the handle 6 is fixedly connected with the outer wall of the configuration grid 5, a mounting rack grid 7 is arranged at the lower end of the configuration grid 5, the mounting rack grid 7 is connected with the processor 1 in an embedded mode, the mounting rack grids 7 are provided with an upper group and a lower group, a fixing assembly 8 is arranged on the mounting rack grid 7, the fixing assembly 8 is fixedly connected with the fixing rack 7, and a fixing shifting piece 9 is arranged on the fixing rack assembly 8, and fixed plectrum 9 and fixed subassembly 8 hinged joint, be provided with installation check 10 between two sets of installation check 7, be provided with interface 11 on the installation check 10, and interface 11 and installation check 10 electric connection, the latter half of the preceding terminal surface of treater 1 is provided with stand-by power source interface module 12, and stand-by power source interface module 12 and the former half of the preceding terminal surface of treater 1 electric connection, one side of stand-by power source interface module 12 is provided with switch 13, and switch 13 and treater 1 electric connection, one side of switch 13 is provided with power source 14, and power source 14 and treater 1 electric connection.

Further, a heat dissipation assembly 15 is disposed below the processor 1, and the heat dissipation assembly 15 provides heat dissipation for the processor 1.

Further, fixing structures 16 are disposed on two sides of the heat sink assembly 15, and the fixing structures 16 are fixedly connected to two sides of the heat sink assembly 15, where the fixing structures 16 are used to fix the processor 1 on the heat sink assembly 15.

Further, the front end face of the heat dissipation assembly 15 is provided with heat dissipation holes 17, and the heat dissipation holes 17 are fixedly connected with the heat dissipation assembly 15, and the heat dissipation holes 17 are convenient for heat dissipation of the heat dissipation assembly 15.

Further, the lower end of the heat dissipation assembly 15 is provided with a connection block 18, the connection block 18 is fixedly connected with the heat dissipation assembly 15, a support assembly 19 is arranged on the connection block 18, the support assembly 19 is fixedly connected with the connection block 18, and the support assembly 19 is used for supporting the heat dissipation assembly 15 and the processor 1 thereon.

Further, a heat dissipation fan 20 is disposed inside the heat dissipation assembly 15, and the heat dissipation fan 20 facilitates heat dissipation of the heat dissipation assembly 15.

The working principle is as follows: when in use, the processor 1 is firstly placed on the heat dissipation component 15, the processor 1 is fixed on the heat dissipation component 15 by the fixing structure 16, the heat dissipation component 15 is started, then the upper interface 11 of the processor 1 is connected, the processor 1 starts to operate, a large amount of heat can be generated in the operation process, the heat dissipation of the processor can not meet the requirement, the temperature inside the processor 1 is increased due to the accumulation of a large amount of heat, the operation efficiency of the processor 1 is reduced due to the increase of the temperature, the heat generated in the operation process of the processor 1 is discharged by the heat dissipation fan 20 through the heat dissipation holes 17, the supporting components 19 are arranged in a triangular mode, the triangular mode is adopted because the stability of the triangle is utilized, the problems that the heat dissipation effect of the heat dissipation structure is poor and the operation of the processor is influenced when the power interface 14 of the processor 1 has a problem are solved, to affect use, the power interface 14 within the backup power interface assembly 12 may be enabled to ensure proper operation of the processor 1.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A processor for an ultra-high definition liquid crystal splicing unit comprises a processor (1) and is characterized in that: the novel multifunctional electric water heater is characterized in that mounting assemblies (2) are arranged on two sides of the processor (1), the mounting assemblies (2) are welded with two sides of the processor (1), mounting holes (3) are formed in the mounting assemblies (2), a radiating net (4) is arranged on the upper portion of the front end face of the processor (1), the radiating net (4) is fixedly connected with the upper portion of the front end face of the processor (1), a configuration grid (5) is arranged at the lower end of the radiating net (4), the configuration grid (5) is connected with the processor (1) in an embedded mode, a handle (6) is arranged on the outer wall of the configuration grid (5), the handle (6) is fixedly connected with the outer wall of the configuration grid (5), a mounting rack grid (7) is arranged at the lower end of the configuration grid (5), the mounting rack grid (7) is connected with the processor (1) in an embedded mode, and the mounting rack grid (7) is arranged in an upper and lower two groups, the device is characterized in that a fixed component (8) is arranged on the mounting frame lattice (7), the fixed component (8) is fixedly connected with the mounting frame lattice (7), a fixed shifting sheet (9) is arranged on the fixed component (8), the fixed shifting sheet (9) is hinged with the fixed component (8), an installation lattice (10) is arranged between the two mounting frame lattices (7), an interface (11) is arranged on the installation lattice (10), the interface (11) is electrically connected with the installation lattice (10), a standby power supply interface component (12) is arranged on the lower half part of the front end surface of the processor (1), the standby power supply interface component (12) is electrically connected with the lower half part of the front end surface of the processor (1), a power switch (13) is arranged on one side of the standby power supply interface component (12), the power switch (13) is electrically connected with the processor (1), a power supply interface (14) is arranged on one side of the power switch (13), and the power interface (14) is electrically connected with the processor (1).

2. The processor for the ultra-high definition liquid crystal splicing unit according to claim 1, wherein: and a heat dissipation assembly (15) is arranged below the processor (1).

3. The processor for the ultra-high definition liquid crystal splicing unit according to claim 2, wherein: and fixing structures (16) are arranged on two sides of the heat dissipation assembly (15), and the fixing structures (16) are fixedly connected with two sides of the heat dissipation assembly (15).

4. The processor for the ultra-high definition liquid crystal splicing unit according to claim 2, wherein: the front end face of the heat dissipation assembly (15) is provided with heat dissipation holes (17), and the heat dissipation holes (17) are fixedly connected with the heat dissipation assembly (15).

5. The processor for the ultra-high definition liquid crystal splicing unit according to claim 2, wherein: the lower extreme of radiator unit (15) sets up connecting block (18), and connecting block (18) and radiator unit (15) fixed connection, be provided with supporting component (19) on connecting block (18), and supporting component (19) and connecting block (18) fixed connection.

6. The processor for the ultra-high definition liquid crystal splicing unit according to claim 2, wherein: and a heat dissipation fan (20) is arranged in the heat dissipation assembly (15).