CN216391574U - Odd layer circuit board - Google Patents

Abstract

The utility model provides a circuit board with odd layers, which relates to the circuit board technology.

Description

Odd layer circuit board

Technical Field

The utility model relates to a circuit board technology, in particular to an odd-layer circuit board.

Background

According to the traditional multilayer circuit, the layers are added through a mode of pressing PP and copper foils on two sides on the basis of a double-layer board, the multilayer boards with even layers are finally added, if the multilayer boards with odd layers can be obtained through an asymmetric pressing mode, the problem of serious warping of the multilayer boards is caused, and the mode has no practical application scene and significance.

Patent cn201410246593.x provides a thought, and the method is that copper foils are simultaneously pressed in a low-temperature vacuum mode on the upper surface and the lower surface of a PP (prepreg) to form a double-sided board, then the copper foils of a PP machine are pressed in a low-temperature vacuum mode on one surface of the double-sided board to form a three-layer board, and finally the three-layer board is pressed in a high-temperature mode once to thoroughly solidify the PP, so that the three-layer board has a drilling and copper plating process suitable for a PCB manufacturing process, and the warping problem can be solved to a certain extent.

However, the method needs to be matched with n-1 times of low-temperature vacuum pressing process and 1 time of high-temperature vacuum pressing process, the processes are complicated, and because drilling and interlayer metallization conduction can be carried out after PP of the whole multilayer board is completely cured, only top-to-bottom conduction can be realized, and multilayer boards with interconnected layers cannot be obtained.

Disclosure of Invention

The embodiment of the utility model provides an odd-layer circuit board which can realize interconnection of any layer and has a simple process.

An embodiment of the present invention provides an odd layer circuit board, including:

the conductive layer is provided with a circuit pattern;

the PP layer is pressed on the conductor layer;

the copper foil layer is pressed on the outer side of the PP layer;

the conductor layer is communicated with the copper foil layer through a channel, and metal is filled in the channel.

Optionally, in a possible implementation manner, the outer side of the copper foil layer is provided with a solder resist layer.

Optionally, in a possible implementation manner, a protective layer is arranged at a position, where no solder mask layer is arranged, outside the copper foil layer.

Optionally, in one possible implementation, the protective layer is one of a nickel-gold layer, a nickel-palladium-gold layer, a nickel-silver layer, an OSP layer, or a tin layer.

Optionally, in one possible implementation, the conductor layer is a metal layer or a ceramic layer.

Optionally, in one possible implementation, the conductor layer has a thickness of 30 μm to 200 μm.

Optionally, in a possible implementation manner, the outer sides of the copper foil layers are provided with solder resists.

Optionally, in one possible implementation, the solder resist layer is a solder resist ink layer.

Optionally, in a possible implementation manner, a protective layer is arranged at a position, where no solder mask layer is arranged, outside the copper foil layer.

Optionally, in one possible implementation, the protective layer is one of a nickel-gold layer, a nickel-palladium-gold layer, a nickel-silver layer, an OSP layer, or a tin layer.

The odd-layer circuit board provided by the utility model adopts a conductor material as an inner layer material, then the PP layer and the copper foil layer are respectively pressed on two sides of the material, only one high-temperature vacuum pressing is needed to form a three-layer board, the process is simple and efficient, then the PP layer and the copper foil layer can be directly pressed on two sides of the three-layer board simultaneously, then the multilayer boards which are communicated with each other by arranging channels and can be connected with each other at will can be obtained by circulating and reciprocating, the method can not only completely solve the warping problem of multilayer boards with odd number layers and obtain better smoothness and rigidity, but also can realize the functions of forming a shielding layer, a heat dissipation layer, embedding a device and the like on the inner layer, and simultaneously, because the middle layer can directly realize the conduction of the outer layer circuit, therefore, the layout of the outer layer circuit is more compact, and a solution is provided for high-precision sealing.

Drawings

Fig. 1 is a schematic structural diagram for embodying a conductor layer in the present embodiment;

FIG. 2 is a schematic structural diagram of a tool hole embodying the present embodiment;

FIG. 3 is a schematic structural diagram of a circuit on a conductor layer according to the present embodiment;

FIG. 4 is a schematic structural view of a copper foil layer according to the present embodiment;

fig. 5 is a schematic structural diagram for embodying a solder resist layer in the present embodiment;

fig. 6 is a schematic structural diagram for embodying the protection layer in the present embodiment.

In the figure, 1, a conductor layer; 2. a PP layer; 3. a copper foil layer; 4. a solder resist layer; 5. a protective layer; 6. a channel.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

A circuit board with odd layers is shown in figures 1-6 and comprises a conductor layer 1, a PP layer 2 and a copper foil layer 3, wherein the PP layer 2 is pressed on the conductor layer 1 and combined with the conductor layer 1, and the copper foil layer 3 is pressed on the outer side of the PP layer 2 and combined with the PP layer 2 to form a three-layer circuit board.

It is understood that the conductor layer 1 is provided with a wiring pattern, and the conductor layer 1 may be a metal layer or a ceramic layer, for example, a copper foil, which is a good conductor material having electricity and heat.

In practical applications, the thickness of the conductor layer 1 is 30 μm to 200 μm, for example, 30 μm, or 100 μm or 200 μm.

The conductor layer 1 is communicated with the copper foil layer 3 through a channel 6, and the channel 6 is filled with metal. The filling of metal can be realized by copper deposition electroplating or copper deposition hole filling which is commonly used in the PCB industry. In some embodiments, the sidewalls of the channel 6 or the entire channel 6 may be filled with metal.

It can be understood that this scheme forms a slice three-layer board through the pressfitting of conductor layer 1, PP layer 2 and copper foil layer 3, and in a similar way, can continue loading PP layer 2 and copper foil layer 3 on the basis of three-layer board, form the multiply wood, just then can drill and the metallization between the layer, realize arbitrary layer interconnection.

In order to perform the solder resist process, the solder resist layer 4 is disposed on the outer side of the copper foil layer 3, the solder resist layer 4 may be solder resist ink, and it should be noted that, when performing the solder resist process, pads required to be used by a packaging factory and an assembly factory need to be leaked out, which is convenient for packaging or assembly.

In practical application, a protective layer 5 is arranged at a position without the solder resist layer 4 on the outer side of the copper foil layer 3, namely, a protective layer 5 is plated at the leaked pad, and the protective layer 5 can be one of a nickel-gold layer, a nickel-palladium-gold layer, a nickel-silver layer, an OSP layer or a tin layer.

The embodiment also provides a manufacturing method of the odd-layer circuit board, which includes steps S1-S6, and specifically includes the following steps:

s1, forming a circuit pattern on the conductor layer 1.

In practical applications, before step S1, the method further includes drilling identification holes and tool holes in the conductor layer 1 to facilitate subsequent packaging or assembly.

S2, sequentially paving a PP layer 2 and a copper foil layer 3 on two sides of the conductor layer 1, and performing high-temperature vacuum pressing treatment.

It can be understood that according to the scheme, the PP layer 2 and the copper foil layer 3 are respectively pressed on two sides of the material, and only one high-temperature vacuum pressing is needed to form a three-layer plate.

S3, holes are punched in the copper foil layer 3 and the conductor layer 1 to form the vias 6 connecting the copper foil layer 3 and the conductor layer 1.

The channel 6 can be formed by laser or mechanical methods, the copper foil layer 3 and the conductor layer 1 can be conducted after metal materials are filled in the channel, and metal filling can be achieved by copper deposition electroplating or copper deposition hole filling which is commonly used in the PCB industry.

S4, filling the side wall of the channel 6 or the whole channel 6 with metal;

s5, forming a circuit pattern on the copper foil layer 3 to form a circuit board;

and S6, protecting the circuit board.

Specifically, the protection treatment may be to provide a solder resist layer 4 on the outer side of the copper foil layer 3, and to leak out a pad that is needed to be used in a packaging factory and an assembly factory, and provide a protection layer 5 on the outer side of the copper foil layer 3 where the solder resist layer 4 is not provided.

Wherein, the protection treatment can protect the solder resist treatment and the protection layer 5 treatment, and specifically comprises the following steps:

the solder mask treatment is to arrange a solder mask layer 4 on the outer side of the copper foil layer 3, the solder mask layer 4 can be solder mask ink, and it should be noted that when the solder mask treatment is performed, pads required to be used by a packaging factory and an assembly factory need to be leaked out, so that the packaging or the assembly is facilitated.

The protective layer 5 treatment is to arrange the protective layer 5 at the position without the solder mask layer 4 on the outer side of the copper foil layer 3, namely, a protective layer 5 is plated at the leaked bonding pad, and the protective layer 5 can be one of a nickel-gold layer, a nickel-palladium-gold layer, a nickel-silver layer, an OSP layer or a tin layer.

In practical application, the method can further include repeatedly performing steps S2-S5, that is, the PP layer 2 and the copper foil layer 3 can be directly and continuously pressed on both sides of the three-layer board, and the multi-layer board with any odd-numbered layers and any interconnection can be obtained by repeating the steps.

The odd-layer circuit board provided by the embodiment adopts a conductor material as an inner layer material, then the PP layer 2 and the copper foil layer 3 are respectively pressed on two sides of the material, only one high-temperature vacuum pressing is needed to form a three-layer board, the process is simple and efficient, then the PP and the copper foils can be directly pressed on two sides of the three-layer board, any odd-layer board can be obtained through cyclic reciprocation, and any interconnected multilayer board can be obtained.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A odd-layer wiring board, comprising:

the conductive layer (1), there are circuit patterns on the said conductive layer (1);

the PP layer (2) is pressed on the conductor layer (1);

the copper foil layer (3) is pressed on the outer side of the PP layer (2);

the conductor layer (1) is communicated with the copper foil layer (3) through a channel (6), and the channel (6) is filled with metal.

2. Odd-layer circuit board according to claim 1, characterized in that the copper foil layer (3) is provided with a solder mask (4) on its outer side.

3. A odd-layer wiring board according to claim 2, characterized in that a protective layer (5) is provided outside the copper foil layer (3) where no solder resist layer (4) is provided.

4. A peculiar layer circuit board according to claim 3, characterized in that said protection layer (5) is one of a nickel-gold layer, a nickel-palladium-gold layer, a nickel-silver layer, an OSP layer or a tin layer.

5. A pixilated circuit board according to claim 1, characterized in that said conductor layer (1) is a metal or ceramic layer.

6. A pixilated circuit board according to claim 1 or 5, characterized in that said conductor layer (1) has a thickness of 30 μm to 200 μm.

7. Odd-layer circuit board according to claim 1, characterized in that the copper foil layer (3) is provided with a solder mask (4) on its outer side.

8. A odd-layer wiring board according to claim 7, characterized in that the solder mask layer (4) is a solder mask ink layer.

9. A laminated circuit board according to claim 7 or 8, wherein a protective layer (5) is provided on the outside of the copper foil layer (3) at a position where the solder resist layer (4) is not provided.

10. A pixilated circuit board according to claim 9, characterized in that said protective layer (5) is one of a nickel-gold layer, a nickel-palladium-gold layer, a nickel-silver layer, an OSP layer or a tin layer.

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