CN216387279U - A high-temperature reverse bias test device for a crimped IGBT module - Google Patents

Abstract

The utility model discloses a high temperature reverse bias testing device of a crimping type IGBT module. The high temperature reverse bias test device of the crimping IGBT module includes: a supporting frame. The upper heating plate is connected to the support frame through the upper pressure assembly. The lower heating plate is connected to the supporting frame through the lower pressure assembly. The control unit is electrically connected to the upper heating plate and the lower heating plate respectively. The control unit is suitable for controlling the upper heating plate and the lower heating plate to respectively press the IGBT module to be tested from both sides, and to heat or cool the IGBT module to be tested. And the control unit is suitable for being electrically connected to the IGBT module to be tested. Both the upper and lower heating plates are exposed to air. The high-temperature reverse bias testing device of the crimping IGBT module of the utility model uses a heating plate to directly heat the IGBT module to be tested, so that the junction temperature is easy to control, and is applicable to the high-temperature reverse biasing test of the crimping IGBT module.

Description

A high-temperature reverse bias test device for a crimped IGBT module

technical field

The utility model relates to the field of power device testing, in particular to a high-temperature reverse bias testing device of a crimping type IGBT module.

Background technique

The national standard IEC60747-9 requires one of the must-test items for IGBT device reliability - high temperature reverse bias (HTRB) test, which stipulates that the IGBT needs to withstand 80% of the rated voltage for 1000 hours at the highest working junction temperature. Due to the large number of parallel chips in the crimp IGBT module, the leakage current is very large at high temperature, and a loss of about 180W will be generated in the 3000A module. For crimp-type IBGT modules, it is difficult to control the junction temperature of the IGBT module under high temperature by the heating method of the oven, which may cause thermal burnout of the IGBT module. And because the crimping IGBT module has two parallel heat dissipation channels, the difference in packaging leads to different thermal resistances on the upper and lower sides. In addition to the self-heating of the module itself, the test is carried out by oven heating. During the temperature adjustment, the IGBT The junction temperature of the module fluctuates greatly, which easily affects the experimental results.

Utility model content

In view of the above problems, the present invention provides a high-temperature reverse bias testing device for a crimping IGBT module to solve the problem that the oven heating method is difficult to apply to the high-temperature reverse biasing test of the crimping IGBT module.

The utility model provides a high-temperature reverse bias testing device of a crimping type IGBT module, comprising: a supporting frame. The upper heating plate is connected to the support frame through the upper pressure assembly. The lower heating plate is connected to the supporting frame through the lower pressure assembly. The control unit is electrically connected to the upper heating plate and the lower heating plate respectively. The control unit is suitable for controlling the upper heating plate and the lower heating plate to respectively press the IGBT module under test from both sides, and heat or cool the IGBT module under test. And the control unit is suitable for being electrically connected to the IGBT module to be tested. Both the upper and lower heating plates are exposed to air.

Optionally, the upper pressure component includes a pressure sensor and a spring mechanism; the pressure sensor is electrically connected to the control unit. The lower pressure component includes a top pressure mechanism and a pressurizing oil cylinder; the pressurizing oil cylinder is electrically connected to the control unit.

Optionally, the high temperature reverse bias test device for the crimp IGBT module further includes: a heat dissipation component. The heat dissipation assembly includes multiple sets of heat dissipation fins, multiple heat dissipation air duct shells and multiple heat dissipation fans. A plurality of groups of heat dissipation fins are respectively arranged on the side of the upper heating plate or the side of the lower heating plate, and are connected with the upper heating plate or the lower heating plate. A plurality of cooling air duct shells are respectively arranged on the side of the upper heating plate or the side of the lower heating plate, and are respectively connected with the upper heating plate or the lower heating plate, and each cooling air duct shell is respectively connected with the side or the lower heating plate of the upper heating plate. The side portion of the heating plate forms a surrounding space, and each group of heat dissipation fins is respectively accommodated therein. A plurality of cooling fans are respectively arranged in each cooling air duct shell, and each cooling air duct shell is provided with at least one cooling fan. Each cooling fan is electrically connected to the control unit respectively.

Optionally, there are four sets of heat dissipation fins, which are respectively disposed on the left and right sides of the upper heating plate and the left and right sides of the lower heating plate. There are four heat-dissipating air duct shells, each of which surrounds and accommodates a set of heat-dissipating fins. There are four cooling fans, which are respectively arranged in the four cooling air duct shells, and each cooling air duct shell has a cooling fan.

Optionally, the high temperature reverse bias testing device for the crimp IGBT module further includes: a temperature measuring component. The temperature measuring component is arranged between the upper heating plate and the lower heating plate. The temperature measuring component is suitable for monitoring the temperature of the IGBT module to be measured in real time. The temperature measuring component is electrically connected to the control unit.

Optionally, the temperature measuring component is an infrared temperature measuring probe.

Optionally, there are two temperature measuring components, which are respectively disposed on the lower side of the upper heating plate and the upper side of the lower heating plate.

Optionally, the two temperature measuring components are arranged diagonally with respect to the center of the space between the upper heating plate and the lower heating plate.

Optionally, the high-temperature reverse bias test device of the crimp IGBT module further includes: an upper adapter plate, which is a heat-conducting flat plate and has a horizontal lower surface; the upper adapter plate is arranged on the lower surface of the upper heating plate; The lower adapter plate is a heat-conducting flat plate with a horizontal upper surface; the lower adapter plate is arranged on the upper side surface of the lower heating plate.

Optionally, the high temperature reverse bias test device of the crimping IGBT module further includes: an upper insulating heat shield, which is arranged on the upper side surface of the upper heating plate and is connected to the upper pressure component. The lower insulation and heat insulation board is arranged on the lower side surface of the lower heating plate and is connected to the lower pressure component.

The beneficial effects of the present utility model are:

1. The high temperature reverse bias test device of the crimping type IGBT module of the present utility model can heat or cool the IGBT module to be tested by the upper heating plate and the lower heating plate, and simultaneously can be applied to the IGBT module to be tested by the upper pressure assembly and the lower pressure assembly. The pressure simulates the crimping environment, so that the conditions for high-temperature reverse bias testing of crimp-type IGBT modules can be realized. At the same time, the upper heating plate and the lower heating plate are exposed to the air, and there is no need to use an oven for temperature control. Compared with the oven, the heating plate has a more uniform temperature distribution, and it is easier to control the junction temperature of the IGBT module to be tested during the test.

2. In the high-temperature reverse bias test device of the crimping type IGBT module of the present invention, the tester can obtain the pressure data through the pressure sensor electrically connected to the control unit, so as to facilitate the implementation control in the test; pressure to provide test pressure conditions; through the top pressure mechanism and pressurized oil cylinder in the lower pressure assembly, the IGBT module to be tested is supported, and at the same time, suitable test pressure conditions are provided.

3. The high temperature reverse bias testing device of the crimping type IGBT module of the present utility model can cool the heating plate by setting the heat dissipation component. Specifically, the multiple sets of heat dissipation fins arranged on the sides of the upper heating plate and the lower heating plate can dissipate and cool down the upper heating plate and the lower heating plate without affecting the temperature distribution of the heating plate itself; The setting of the shell and the cooling fan can control the heat dissipation rate of the heating plate through the fan, so as to realize the stable control of the temperature of the heating plate, so that it can be stably maintained at a suitable temperature, or heated or cooled at a suitable rate.

4. The high-temperature reverse bias testing device of the crimping type IGBT module of the present invention can perform real-time temperature monitoring of the IGBT module to be measured through the setting of the temperature measuring components, so as to grasp the implementation data and facilitate the real-time control and adjustment of the test conditions.

5. The high-temperature reverse bias test device of the crimping type IGBT module of the present utility model, the center of the intermediate space between the heating plate above and the lower heating plate of the two temperature measuring components is set diagonally, and the pressure of the IGBT module to be measured can be monitored at the same time. The diagonal temperature data makes the control of real-time temperature more comprehensive and specific, so as to facilitate real-time control and adjustment of test conditions.

6. The high temperature reverse bias test device of the crimping IGBT module of the present invention, through the arrangement of the upper adapter plate and the lower adapter plate, makes the pressure distribution on the upper and lower sides of the IGBT module to be tested more uniform.

7. The high temperature reverse bias test device of the crimping type IGBT module of the present invention can separate the heating plate from the pressure component through the setting of the upper insulating heat shield and the lower insulating heat shield, so as to prevent the pressure component from being heated and accelerated fatigue for a long time. At the same time, the exposed part of the heating plate is reduced, which can also effectively reduce the probability of scalding for testers during operation.

Description of drawings

In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the specific embodiments or the prior art. Obviously, the following descriptions The accompanying drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

1 is a schematic structural diagram of a high-temperature reverse bias testing device for a crimp-type IGBT module according to an embodiment of the present invention;

FIG. 2 is a partial cross-sectional structural schematic diagram of a high-temperature reverse bias test device for a crimp-type IGBT module according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of the circuit connection relationship of some components when the high-temperature reverse bias test device of the crimp-type IGBT module is applied according to an embodiment of the utility model.

Detailed ways

The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner" and "outer" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, with a specific orientation. Therefore, it should not be construed as a limitation on the present invention.

In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as there is no conflict with each other.

Example 1

Referring to FIG. 1 to FIG. 3 , this embodiment provides a high-temperature reverse bias test device for a crimp-type IGBT module, including:

Support frame 1.

Upper heating plate 31. The upper heating plate 31 is connected to the support frame 1 through the upper pressure assembly.

Lower heating plate 32. The lower heating plate 32 is connected to the supporting frame 1 through a lower pressure assembly.

A control unit (not shown in FIG. 1 and FIG. 2 ), the control unit is electrically connected to the upper heating plate 31 and the lower heating plate 32 respectively.

The control unit is adapted to control the upper heating plate 31 and the lower heating plate 32 to respectively press the IGBT module 2 under test from both sides, and heat or cool the IGBT module 2 under test. And the control unit is adapted to be electrically connected to the IGBT module 2 to be tested.

Wherein, both the upper heating plate and the lower heating plate are exposed to the air.

In the high-temperature reverse bias test device of the crimp type IGBT module in this embodiment, the IGBT module 2 to be tested can be heated or cooled through the upper heating plate 31 and the lower heating plate 32, and the IGBT module to be tested can be heated or cooled through the upper pressure assembly and the lower pressure assembly. 2. Apply pressure to simulate the crimping environment, so as to realize the conditions for the high-temperature reverse bias test of the crimp-type IGBT module 2. At the same time, the upper heating plate 31 and the lower heating plate 32 are exposed to the air, and there is no need to use an oven for temperature control. Compared with the oven, the heating plate has a more uniform temperature distribution, and it is easier to control the junction temperature of the IGBT module 2 to be tested during the test.

Specifically, the upper pressure assembly includes a pressure sensor 42 and a spring mechanism 41 . The pressure sensor 42 is electrically connected to the control unit. The downforce assembly includes a top pressing mechanism 51 and a pressurizing oil cylinder 52 . The pressurized oil cylinder 52 is electrically connected to the control unit.

In the high-temperature reverse bias test device of the crimp type IGBT module in this embodiment, the tester can obtain the pressure data through the pressure sensor 42 electrically connected to the control unit, so as to facilitate the implementation control in the test; Apply pressure to provide test pressure conditions; through the top pressure mechanism 51 and the pressurizing oil cylinder 52 in the lower pressure assembly, the IGBT module 2 to be tested is supported, and at the same time, suitable test pressure conditions are provided.

Further, the high temperature reverse bias testing device for the crimp type IGBT module further includes a heat dissipation component 6 . The heat dissipation assembly 6 includes multiple sets of heat dissipation fins 62 , multiple heat dissipation air duct shells 63 and multiple heat dissipation fans 61 .

The plurality of sets of heat dissipation fins 62 are respectively disposed on the side of the upper heating plate 31 or the side of the lower heating plate 32 , and are connected to the upper heating plate 31 or the lower heating plate 32 .

The plurality of heat dissipation air duct shells 63 are respectively disposed on the side of the upper heating plate 31 or the side of the lower heating plate 32 , and are respectively connected to the upper heating plate 31 or the lower heating plate 32 . Each heat-dissipating air duct shell 63 forms a surrounding space with the side of the upper heating plate 31 or the side of the lower heating plate 32 , respectively accommodating each group of heat-dissipating fins 62 therein.

A plurality of cooling fans 61 are respectively disposed in each cooling air duct shell 63 , and each cooling air duct shell 63 is provided with at least one cooling fan 61 . Each cooling fan 61 is electrically connected to the control unit, respectively.

Specifically, in this embodiment, there are four sets of heat dissipation fins 62 , which are respectively disposed on the left and right sides of the upper heating plate 31 and the left and right sides of the lower heating plate 32 . There are four heat-dissipating air duct shells 63 , each of which surrounds and accommodates a set of heat-dissipating fins 62 . There are four cooling fans 61 , which are respectively disposed in the four cooling air duct shells 63 , and each cooling air duct shell 63 has one cooling fan 61 .

In the high-temperature reverse bias test device of the crimp-type IGBT module in this embodiment, the heating plate can be cooled by the disposition of the heat dissipation component 6 . Specifically, the plurality of sets of heat dissipation fins 62 disposed on the sides of the upper heating plate 31 and the lower heating plate 32 can dissipate and cool down the upper heating plate 31 and the lower heating plate 32 without affecting the temperature distribution of the heating plates themselves as much as possible. . Through the setting of the heat dissipation air duct shell 63 and the heat dissipation fan 61, the heat dissipation rate of the heating plate can be controlled by the fan, so that the stable control of the temperature of the heating plate can be realized, so that it can be stably maintained at a suitable temperature, or heated at a suitable rate. or cool down.

Further, the high temperature reverse bias testing device of the crimp IGBT module further includes: a temperature measuring component 7 . The temperature measuring member 7 is arranged between the upper heating plate 31 and the lower heating plate 32 . The temperature measuring component 7 is suitable for monitoring the temperature of the IGBT module 2 to be measured in real time. The temperature measuring component 7 is electrically connected to the control unit.

Specifically, in this embodiment, the temperature measuring component 7 is an infrared temperature measuring probe.

In the high-temperature reverse bias test device of the crimp type IGBT module in this embodiment, the temperature measurement component 7 can be set to monitor the temperature of the IGBT module 2 to be tested in real time, so as to grasp the implementation data and facilitate real-time control and adjustment of the test conditions.

In this embodiment, there are two temperature measuring components 7 , which are respectively disposed on the lower side of the upper heating plate 31 and the upper side of the lower heating plate 32 .

Further, the two temperature measuring components 7 are disposed diagonally relative to the center of the space between the upper heating plate 31 and the lower heating plate 32 (one is located at the upper right corner and the other is located at the lower left corner in FIG. 1 ).

In the high-temperature reverse bias test device of the crimping type IGBT module in this embodiment, the center of the intermediate space between the heating plate 31 and the lower heating plate 32 above the two temperature measuring components 7 is arranged diagonally, so that the IGBT module to be tested can be monitored simultaneously. The diagonal temperature data of 2 makes the control of real-time temperature more comprehensive and specific, so as to facilitate real-time control and adjustment of test conditions.

In this embodiment, the high-temperature reverse bias testing device for the crimp IGBT module further includes:

upper adapter plate 91 . The upper adapter plate 91 is a thermally conductive flat plate with a horizontal lower surface. The upper adapter plate 91 is disposed on the lower side surface of the upper heating plate 31 .

Lower adapter plate 92. The lower adapter plate 92 is a thermally conductive flat plate with a horizontal upper surface. The lower adapter plate 92 is disposed on the upper side surface of the lower heating plate 32 .

In the high temperature reverse bias test device of the crimping type IGBT module in this embodiment, the upper and lower adapter plates 91 and 92 are arranged to make the pressure distribution on the upper and lower sides of the IGBT module 2 to be tested more uniform.

In this embodiment, the high-temperature reverse bias testing device for the crimp IGBT module further includes:

The upper insulating heat shield 81 is installed. The upper insulating and heat insulating plate 81 is disposed on the upper side surface of the upper heating plate 31 and is connected to the upper pressure component.

Lower insulating heat shield 82 . The lower insulating and heat insulating plate 82 is disposed on the lower side surface of the lower heating plate 32 and is connected to the lower pressure component.

In the high-temperature reverse bias test device of the crimp-type IGBT module of this embodiment, the heating plate and the pressure component can be separated by the arrangement of the upper insulating heat shield 81 and the lower insulating heat shield 82, so as to avoid the pressure component being accelerated and fatigued by long-term heating At the same time, the exposed part of the heating plate is reduced, which can also effectively reduce the probability of scalding for testers during operation.

The technical solutions disclosed by the present utility model have been described above through the examples. It is believed that those skilled in the art can understand the present invention through the description of the above embodiments. Obviously, the above-mentioned embodiments are only examples for clear description, and are not intended to limit the implementation manner. For those of ordinary skill in the art, changes or modifications in other different forms can also be made on the basis of the above description. There is no need and cannot be exhaustive of all implementations here. And the obvious changes or changes derived from this are still within the protection scope of the present invention.

Claims (10)

1. The utility model provides a crimping type IGBT module high temperature reverse bias testing arrangement which characterized in that includes:

a support frame;

an upper heating plate connected to the support frame by an upper pressure assembly;

a lower heating plate connected to the support frame by a lower pressure assembly;

the control unit is electrically connected with the upper heating plate and the lower heating plate respectively;

the control unit is suitable for controlling the upper heating plate and the lower heating plate to be respectively in pressure joint with the IGBT module to be tested from two sides and heating or cooling the IGBT module to be tested; the control unit is suitable for being electrically connected with the IGBT module to be tested;

the upper heating plate and the lower heating plate are both exposed to air.

2. The crimping type IGBT module high temperature reverse bias test device according to claim 1,

the upper pressure assembly comprises a pressure sensor and a spring mechanism; the pressure sensor is electrically connected with the control unit;

the lower pressure assembly comprises a top pressure mechanism and a pressurizing oil cylinder; the pressurizing oil cylinder is electrically connected with the control unit.

3. The crimping type IGBT module high temperature reverse bias test device of claim 2, characterized by further comprising:

a heat dissipating component;

the heat dissipation assembly comprises a plurality of groups of heat dissipation fins, a plurality of heat dissipation air channel shells and a plurality of heat dissipation fans;

the multiple groups of radiating fins are respectively arranged on the side part of the upper heating plate or the side part of the lower heating plate and are connected with the upper heating plate or the lower heating plate;

the plurality of heat dissipation air channel shells are respectively arranged on the side part of the upper heating plate or the side part of the lower heating plate and are respectively connected with the upper heating plate or the lower heating plate, and each heat dissipation air channel shell forms an enclosed space with the side part of the upper heating plate or the side part of the lower heating plate and respectively accommodates each group of heat dissipation fins therein;

the plurality of heat dissipation fans are respectively arranged on the heat dissipation air channel shells, and each heat dissipation air channel shell is at least provided with one heat dissipation fan; and each heat radiator is electrically connected with the control unit respectively.

4. The crimping type IGBT module high temperature reverse bias test device of claim 3,

the four groups of radiating fins are respectively arranged on the left side and the right side of the upper heating plate and the left side and the right side of the lower heating plate;

the number of the heat dissipation air duct shells is four, and the four heat dissipation air duct shells respectively surround and contain a group of heat dissipation fins;

the number of the heat dissipation fans is four, the heat dissipation fans are respectively arranged on the four heat dissipation air duct shells, and each heat dissipation air duct shell is provided with one heat dissipation fan.

5. The crimping type IGBT module high temperature reverse bias test device of claim 3, characterized by further comprising:

a temperature measuring part;

the temperature measuring component is arranged between the upper heating plate and the lower heating plate; the temperature measuring component is suitable for monitoring the temperature of the IGBT module to be measured in real time; the temperature measuring component is electrically connected with the control unit.

6. The crimping type IGBT module high temperature reverse bias test device of claim 5,

the temperature measuring component is an infrared temperature measuring probe.

7. The crimping type IGBT module high temperature reverse bias test device of claim 5,

the two temperature measuring parts are respectively arranged on the lower side of the upper heating plate and the upper side of the lower heating plate.

8. The crimping type IGBT module high temperature reverse bias test device of claim 7,

the two temperature measuring components are arranged diagonally relative to the center of the space between the upper heating plate and the lower heating plate.

9. The crimping type IGBT module high temperature reverse bias test device of claim 3, characterized by further comprising:

the upper adapter plate is a heat-conducting flat plate and is provided with a horizontal lower surface; the upper adapter plate is arranged on the lower side surface of the upper heating plate;

the lower adapter plate is a heat conduction flat plate and is provided with a horizontal upper surface; the lower adapter plate is arranged on the upper side surface of the lower heating plate.

10. The crimping type IGBT module high temperature reverse bias test device of claim 3, characterized by further comprising:

the upper insulating and heat insulating plate is arranged on the upper side surface of the upper heating plate and is connected with the upper pressure assembly;

and the lower insulating and heat insulating plate is arranged on the lower side surface of the lower heating plate and is connected with the lower pressure assembly.

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