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CN216333198U - Automatic tray loading device for automatic IC chip materials - Google Patents

Automatic tray loading device for automatic IC chip materials Download PDF

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Publication number
CN216333198U
CN216333198U CN202122911032.5U CN202122911032U CN216333198U CN 216333198 U CN216333198 U CN 216333198U CN 202122911032 U CN202122911032 U CN 202122911032U CN 216333198 U CN216333198 U CN 216333198U
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CN
China
Prior art keywords
hot
tray loading
automatic
track
carrier tape
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Active
Application number
CN202122911032.5U
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Chinese (zh)
Inventor
吴志明
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Shenzhen Huafuxin Technology Co ltd
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Shenzhen Huafuxin Technology Co ltd
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Priority to CN202122911032.5U priority Critical patent/CN216333198U/en
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Publication of CN216333198U publication Critical patent/CN216333198U/en
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Abstract

The utility model relates to the technical field of IC chip production, in particular to an automatic tray loading device for automatic IC chip materials, which comprises: a frame; the conveying platform is arranged on one side of the rack and is used for conveying the carrier tape; the cover disc device comprises a cover disc and a first guide wheel; the cover disc and the first guide wheel are arranged on the other side of the rack and correspond to the upper end of the conveying platform; the cover tray is used for placing a cover tape.

Description

Automatic tray loading device for automatic IC chip materials
Technical Field
The utility model relates to the technical field of IC chip production, in particular to an automatic tray loading device for automatic IC chip materials.
Background
With the rapid development of artificial intelligence, the development of IC chips is widely applied, however, before the IC chips are sold, the IC chips are divided into separate trays, in the tray loading process, the IC chips need to be conveyed and carried, and the IC chips put into the carrier tapes need to be covered with heat tapes, and then are rolled and received, so that the whole process is realized, the process is complex, if the tray loading of the IC chips is realized only by manpower, the cost is too high, and thus, the automatic tray loading is realized, the labor cost is saved, and the complexity of the process is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an automatic tray loading device for automatic IC chip materials, which aims to solve the problems of labor cost saving and process complexity reduction in the tray loading process of IC chips.
In order to achieve the above object, the present invention is widely applied to the technical scheme of switch identification, and particularly provides the following technical scheme: an automatic tray loading device for automatic IC chip materials comprises;
a frame;
the conveying platform is arranged on one side of the rack and is used for conveying the carrier tape;
the cover disc device comprises a cover disc and a first guide wheel; the cover disc and the first guide wheel are arranged on the other side of the rack and correspond to the upper end of the conveying platform; the cover disc is used for placing a cover tape;
the hot pressing device is arranged on the rack and corresponds to the upper end of the conveying platform;
when an IC chip is put into the carrier tape, the carrier tape is conveyed by the conveying platform to the position below the first guide wheel, the cover tape is conducted and covered on the corresponding carrier tape through the first guide wheel, and the carrier tape and the cover tape are fused into a whole through a hot-pressing device.
Preferably, the conveying platform comprises a track and a shell, the shell covers two sides of the track, and a feeding groove is formed in the shell corresponding to the track.
Preferably, the conveying platform further comprises two adjusting devices, and the two adjusting devices are respectively used for adjusting the width of the track.
Preferably, the two adjusting devices comprise a bracket, an adjusting knob and a plurality of adjusting rods; one end of each of the adjusting rods is arranged on the support, and the other end of each of the adjusting rods is arranged close to the two sides of the track;
one end of one of the adjusting rods is connected with the adjusting knob.
Preferably, the hot-pressing device comprises a first hot-pressing cylinder and a second hot-pressing cylinder; the first hot-pressing cylinder and the second hot-pressing cylinder are respectively arranged on two sides of the track.
Preferably, the automatic tray loading device further comprises a braiding device, and the braiding device comprises:
the motor is arranged on the rack;
and one end of the braiding pinwheel is connected with a driving shaft of the motor.
Preferably, the automatic tray loading device further comprises a material receiving device, and the material receiving device comprises;
a material receiving disc;
and the second guide wheels are arranged corresponding to the material receiving plate.
Compared with the prior art, the utility model has the beneficial effects that:
when an IC chip is placed in a carrier tape, the carrier tape is conveyed by the rail, when a cover tape is covered on the corresponding carrier tape through the conduction of a first guide wheel and the cover tape is below the first guide wheel, the first hot-pressing cylinder and the second hot-pressing cylinder respectively carry out hot melting fusion on the cover tape and the carrier tape, and therefore the IC chip is coated in the carrier tape;
when the cover tape and the carrier tape which are fused by hot melting are conveyed to the braiding pinwheel, the braiding pinwheel is driven by the motor and manually matched, so that the fused cover tape and the carrier tape are conveyed to the material tray by the plurality of second guide wheels, and when the material tray rotates, the fused cover tape and the carrier tape are coiled, so that the automatic feeding and the tray loading of the IC chip are realized.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic cross-sectional structure of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, an embodiment of the present invention is shown:
an automatic tray loading device for automatic IC chip materials comprises;
a frame 1;
a transfer platform 3, wherein the transfer platform 3 is arranged at one side of the frame 1, and the transfer platform 3 is used for transferring a carrier tape;
a cover disk device 2, wherein the cover disk device 2 comprises a cover disk 21 and a first guide wheel 22; the cover disc 21 and the first guide wheel 22 are both arranged on the other side of the rack 1, and the cover disc 21 and the first guide wheel 22 are both arranged corresponding to the upper end of the conveying platform 3; the cover tray 21 is used for placing a cover tape;
the hot pressing device 4 is arranged on the rack 1, and the hot pressing device 4 is arranged corresponding to the upper end of the conveying platform 3;
when an IC chip is put into the carrier tape, the carrier tape is conveyed by the conveying platform 3 to the position below the first guide wheel 22, the cover tape is conducted and covered on the corresponding carrier tape through the first guide wheel 22, and the carrier tape and the cover tape are fused into a whole through the hot-pressing device 4.
Further, in order to realize better transmission of the carrier tape; the conveying platform 3 comprises a track 36 and a shell, the shell covers two sides of the track 36, and a feeding groove 32 is arranged on the shell 31 corresponding to the track 36;
wherein when the carrier band carries on track 36 conveying, can further carry on spacingly to the carrier band through shell 31 to prevent that the carrier band from breaking away from track 36, the silo 32 of going up makes things convenient for the carrier band to carry out the material loading simultaneously.
Further, in order to adapt to different carrier tapes for carrying, the carrying platform 3 further comprises two adjusting devices, and the two adjusting devices are respectively used for adjusting the width of the track 36;
two of the adjusting devices are adjusted in two ways, one is to adjust the width of the rail 36 itself, and the other is to adjust the gap between the two sides of the rail 36 through the shell 31, so as to realize the transmission of different carrier tapes.
Further, in order to achieve low cost and simple structure of the apparatus itself; the two adjusting devices respectively comprise a bracket 33, an adjusting knob 34 and a plurality of adjusting rods 35; one end of each of the adjusting rods 35 is arranged on the bracket 33, and the other end of each of the adjusting rods is arranged close to two sides of the track 36;
one end of one of the adjusting rods 35 is connected with the adjusting knob 34;
meanwhile, the two adjusting devices can also be set to be in an automatic adjusting mode, for example, two driving devices (the driving device can be a motor or an air cylinder) are arranged, and then a pushing block is piled by the motor or the air cylinder, so that the adjustment of the track 36 can also be realized;
further, in order to better perform hot melting fusion of the cover tape and the carrier tape, the hot-pressing device 4 comprises a first hot-pressing cylinder and a second hot-pressing cylinder; the first hot-pressing cylinder and the second hot-pressing cylinder are respectively arranged on two sides of the rail 36.
Further, in order to pack and load the cover tape and the carrier tape after the heat fusion, the automatic tray loading device further comprises a braiding device 6, wherein the braiding device 6 comprises:
the motor 62, the said motor 62 is set up on the stander 1;
and a braiding pinwheel 61, wherein one end of the braiding pinwheel 61 is connected with a driving shaft of the motor 62.
Further, in order to enable the cover tape and the carrier tape to be subjected to heat fusion and then to be finally packaged and charged, the automatic tray filling device further comprises a material receiving device 5, and the material receiving device 5 comprises;
a material receiving tray 51;
and a plurality of second guide wheels 52, the plurality of second guide wheels 52 being disposed corresponding to the receiving tray 51.
The working principle of the utility model is as follows:
1. when an IC chip is put into the carrier tape, the track 36 conveys the carrier tape to a position below the first guide wheel 22, and when the cover tape is conducted by the first guide wheel 22 and covers the corresponding carrier tape, the first hot-pressing cylinder and the second hot-pressing cylinder respectively perform hot melting fusion on the cover tape and the carrier tape, so that the IC chip is coated in the carrier tape;
2. when the cover tape and the carrier tape which are fused by hot melting are conveyed to the braiding pinwheel 61, the braiding pinwheel 61 is driven by the motor 62 and is matched manually, so that the fused cover tape and the carrier tape are conveyed to the material tray through the second guide wheels 52, and when the material tray rotates, the fused cover tape and the carrier tape are coiled, thereby realizing the automatic feeding and the tray loading of IC chips.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (7)

1. The utility model provides an automatic change automatic sabot device of IC chip material which characterized in that: the method comprises the following steps:
a frame;
the conveying platform is arranged on one side of the rack and is used for conveying the carrier tape;
the cover disc device comprises a cover disc and a first guide wheel; the cover disc and the first guide wheel are arranged on the other side of the rack and correspond to the upper end of the conveying platform; the cover disc is used for placing a cover tape;
the hot pressing device is arranged on the rack and corresponds to the upper end of the conveying platform;
when an IC chip is put into the carrier tape, the carrier tape is conveyed by the conveying platform to the position below the first guide wheel, the cover tape is conducted and covered on the corresponding carrier tape through the first guide wheel, and the carrier tape and the cover tape are fused into a whole through a hot-pressing device.
2. The automated tray loading apparatus for IC chip materials of claim 1, wherein: the conveying platform comprises a track and a shell, the shell covers two sides of the track, and a feeding groove is formed in the shell corresponding to the track.
3. The automated tray loading apparatus for IC chip materials according to claim 2, wherein: the conveying platform further comprises two adjusting devices, and the two adjusting devices are respectively used for adjusting the width of the track.
4. The automated tray loading apparatus for IC chip materials according to claim 3, wherein: the two adjusting devices comprise a bracket, an adjusting knob and a plurality of adjusting rods; one end of each of the adjusting rods is arranged on the support, and the other end of each of the adjusting rods is arranged close to the two sides of the track;
one end of one of the adjusting rods is connected with the adjusting knob.
5. The automated tray loading apparatus for IC chip materials according to claim 2, wherein: the hot-pressing device comprises a first hot-pressing cylinder and a second hot-pressing cylinder; the first hot-pressing cylinder and the second hot-pressing cylinder are respectively arranged on two sides of the track.
6. The automated tray loading apparatus for IC chip materials of claim 1, wherein: the automatic tray loading device further comprises a braiding device, and the braiding device comprises:
the motor is arranged on the rack;
and one end of the braiding pinwheel is connected with a driving shaft of the motor.
7. The automated tray loading apparatus for IC chip materials of claim 1, wherein: the automatic tray loading device also comprises a material receiving device, and the material receiving device comprises;
a material receiving disc;
and the second guide wheels are arranged corresponding to the material receiving plate.
CN202122911032.5U 2021-11-24 2021-11-24 Automatic tray loading device for automatic IC chip materials Active CN216333198U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122911032.5U CN216333198U (en) 2021-11-24 2021-11-24 Automatic tray loading device for automatic IC chip materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122911032.5U CN216333198U (en) 2021-11-24 2021-11-24 Automatic tray loading device for automatic IC chip materials

Publications (1)

Publication Number Publication Date
CN216333198U true CN216333198U (en) 2022-04-19

Family

ID=81154124

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122911032.5U Active CN216333198U (en) 2021-11-24 2021-11-24 Automatic tray loading device for automatic IC chip materials

Country Status (1)

Country Link
CN (1) CN216333198U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114883228A (en) * 2022-07-08 2022-08-09 金动力智能科技(深圳)有限公司 Chip hot melt packaging mechanism

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114883228A (en) * 2022-07-08 2022-08-09 金动力智能科技(深圳)有限公司 Chip hot melt packaging mechanism
CN114883228B (en) * 2022-07-08 2022-11-08 金动力智能科技(深圳)有限公司 Chip hot melt packaging mechanism

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