CN216313701U - Radiator for air-conditioning computer board and air conditioner - Google Patents

Abstract

The present application relates to the technical field of heat dissipation, and discloses a radiator for an air conditioner computer board. The heat pipe is arranged on the heat dissipation surface and includes an evaporation section and a condensation section, the evaporation section is arranged in the high heating section, and the condensation section is arranged in the low heating section. In the present application, the evaporating section of the heat pipe is arranged on the high-heating part of the heat-dissipating surface, and the condensing section is arranged on the low-heating part of the heat-dissipating surface, so that the heat of the heat-dissipating surface can be transferred from the high-heating part to the low-heating part, so that the temperature of the heat-dissipating surface is higher. Balance, enhance the heat dissipation effect on the high heat generation part of the heat dissipation surface, thereby improving the heat dissipation efficiency of the high heat generation part of the computer board, avoiding the computer board burning due to high local heat generation or limiting the performance of the air conditioner of the whole machine. The application also discloses an air conditioner.

Description

Radiator and air conditioner for air conditioner computer board

technical field

The present application relates to the field of heat dissipation technology, for example, to a radiator for an air conditioner computer board and an air conditioner.

Background technique

In the high temperature environment in summer, the computer board chip of the inverter air conditioner has poor heat dissipation, which leads to the slow and difficult frequency upscaling of the air conditioner, which causes the control logic to report errors easily, the cooling capacity is insufficient, and the operation power consumption is large, causing users to complain. Under T3 working condition (53°C) or higher ambient temperature, the air temperature around the inverter chip is +10°C (63°C), the difference between the heat source temperature (68°C～120°C) of the computer board and the ambient temperature (5～ 57°C) becomes smaller, the heat dissipation power becomes smaller, and even the computer board is burned, the system is down, and hardware failure occurs.

At present, some inverter air conditioners are equipped with radiators for the computer boards, such as aluminum heat sinks, which transfer the heat of the computer boards to the aluminum heat sinks, and then release the heat through the aluminum heat sinks.

In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art: the heat distribution of the computer board is not uniform, and the common heat dissipation plate cannot quickly dissipate the local high temperature of the computer board, which causes the computer board to fail easily.

Utility model content

In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended to be an extensive review, nor to identify key/critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

Embodiments of the present disclosure provide a radiator and an air conditioner for an air-conditioning computer board, which can enhance the temperature uniformity of different areas of the computer board, and enable the parts of the computer board to quickly dissipate heat.

In some embodiments, a heat sink for an air conditioner computer board, comprising:

The substrate includes a heat-conducting surface and a heat-dissipating surface, the heat-conducting surface is in contact with the computer board, and the heat-dissipating surface and the heat-conducting surface are arranged opposite to each other and include a high-heating part and a low-heating part;

The heat pipe includes an evaporating section and a condensing section, the evaporating section is arranged on the high heat-generating part of the heat-dissipating surface, and the condensing section is arranged on the low-heating part of the heat-dissipating surface;

Among them, the heat of the high heat generation part is conducted to the low heat generation part through the heat pipe.

In some embodiments, the heat pipe is disposed in contact with the heat dissipation surface.

In some embodiments, the heat dissipation surface is provided with a guide groove extending from the high heat generation part to the low heat generation part, and the heat pipe is disposed in the guide groove.

In some embodiments, the extended shapes of the guide groove and the heat pipe are both S-shaped, the corner of the guide groove is bent at a right angle, and the corner of the heat pipe is bent in an arc shape.

In some embodiments, the heat dissipation surface further includes:

The transition part is arranged between the high heat generation part and the low heat generation part;

Wherein, the heat pipe extends from the high heat generation part to the low heat generation part through the transition part.

In some embodiments, the heat pipe further includes:

The first bending section is communicated with the evaporation section;

The second bending section is communicated with the first bending section and forms an inverted U shape with the first bending section;

The third bending section is communicated with the second bending section and is opposite to the bending direction of the second bending section;

Wherein, the second bending section and the third bending section are arranged in the transition portion.

In some embodiments, the connection between the second bending section and the third bending section is disposed close to the first side of the substrate.

In some embodiments, the heat pipe further includes:

The fourth bending section is communicated with the third bending section and the condensation section, and forms a U shape with the third bending section;

Wherein, the connection between the third bending section and the fourth bending section is disposed close to the second side of the substrate.

In some embodiments, the condensation section is positioned adjacent to the third side of the substrate.

In some embodiments, an air conditioner includes:

computer board; and

According to the heat sink provided in any of the foregoing embodiments, the heat sink is connected to the computer board.

The radiator and air conditioner for an air-conditioning computer board provided by the embodiments of the present disclosure can achieve the following technical effects: the heat of the computer board is absorbed and transferred to the heat-dissipating surface by contacting the heat-conducting surface of the substrate with the computer board, and the heat of the heat pipe is The evaporation section is set on the high heat-generating part of the heat-dissipating surface, and the condensing section is set on the low-heat-generating part of the heat-dissipating surface, so that the heat of the heat-dissipating surface can be transferred from the high-heat-generating part to the low-heat-generating part, so that the temperature of the heat-dissipating surface is more balanced, and the heat-dissipating surface is enhanced. The heat dissipation effect of the high heat generation part can improve the heat dissipation efficiency of the high heat generation part of the computer board, and prevent the computer board from being burned due to high local heat generation or limit the performance of the air conditioner of the whole machine.

The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.

Description of drawings

One or more embodiments are exemplified by the accompanying drawings, which are not intended to limit the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, The drawings do not constitute a limitation of scale, and in which:

1 is a side view of a radiator for an air conditioner computer board provided by an embodiment of the present disclosure;

Fig. 2 is the sectional view of Fig. 1;

Fig. 3 is the A-A sectional view of Fig. 1;

FIG. 4 is an overall structural diagram of a radiator for an air conditioner computer board provided by an embodiment of the present disclosure.

Reference number:

10, substrate; 11, heat dissipation surface; 12, first side; 13, second side; 14, third side; 15, fourth side; 20, heat pipe; 21, evaporation section; 22, first Bending section; 23, second bending section; 24, third bending section; 25, fourth bending section; 26, condensation section; 30, guide groove; 40, fin.

Detailed ways

In order to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings, which are for reference only and are not intended to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, numerous details are provided to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and tanks may be shown simplified in order to simplify the drawings.

The terms "first", "second" and the like in the description and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data so used may be interchanged under appropriate circumstances for the purposes of implementing the embodiments of the disclosure described herein. Furthermore, the terms "comprising" and "having", and any variations thereof, are intended to cover non-exclusive inclusion.

In the embodiments of the present disclosure, the orientations or positional relationships indicated by the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", etc. are based on the orientations shown in the drawings or Positional relationship. These terms are primarily used to better describe the embodiments of the present disclosure and embodiments thereof, and are not intended to limit the fact that the indicated tank, element or component must have a particular orientation, or be constructed and operated in a particular orientation. In addition, some of the above-mentioned terms may be used to express other meanings besides orientation or positional relationship. For example, the term "on" may also be used to express a certain attachment or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific situations.

In addition, the terms "arranged", "connected" and "fixed" should be construed broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral construction; it may be a mechanical connection, or an electrical connection; it may be a direct connection, or an indirect connection through an intermediary, or two tanks, elements, or Internal connectivity between components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific situations.

Unless stated otherwise, the term "plurality" means two or more.

It should be noted that the embodiments in the embodiments of the present disclosure and the features in the embodiments may be combined with each other in the case of no conflict.

1-3, an embodiment of the present disclosure provides a heat sink for an air conditioner computer board, including a substrate 10 and a heat pipe 20, wherein the substrate 10 includes a heat-conducting surface and a heat-dissipating surface 11, and the heat-conducting surface is in contact with the computer board. contact, the heat dissipation surface 11 is arranged opposite the heat conduction surface and includes a high heat generation part and a low heat generation part; the heat pipe 20 includes an evaporation section 21 and a condensation section 26, the evaporation section 21 is arranged in the high heat generation part of the heat dissipation surface 11, and the condensation section 26 is arranged in the heat dissipation section 26. The low heat generation part of the surface 11; wherein, the heat of the high heat generation part is conducted to the low heat generation part through the heat pipe 20.

Using the heat sink provided by the embodiment of the present disclosure, the heat conduction surface of the substrate 10 can be in contact with the computer board, and the heat of the computer board can be absorbed and transferred to the heat dissipation surface 11 . The high heat generation part, the condensation section 26 is arranged on the low heat generation part of the heat dissipation surface 11, so that the heat of the heat dissipation surface 11 can be transferred from the high heat generation part to the low heat generation part, so that the temperature of the heat dissipation surface 11 is more balanced, and the high heat generation of the heat dissipation surface 11 is enhanced. It can improve the heat dissipation effect of the computer board, so as to improve the heat dissipation efficiency of the high heat generation part of the computer board, and avoid the computer board burning due to high local heat generation or limiting the performance of the air conditioner of the whole machine.

The evaporation section 21 and the condensation section 26 of the heat pipe 20 in the embodiment of the present disclosure are located in different regions of the heat dissipation surface 11 , such as the high heat generation part and the low heat generation part, so that the heat of the high heat generation part can be transferred to the low heat generation part through the heat pipe 20 , to reduce the temperature of the high heat generation part and increase the temperature of the low heat generation part, so that the temperature of each area of the heat dissipation surface 11 is more balanced.

The high heat generation part of the heat dissipation surface 11 is generated because the heat conduction surface of the substrate 10 mainly absorbs the parts with high heat generation of the computer board, and the low heat generation part is generated because the heat conduction surface of the substrate 10 mainly absorbs the parts with less heat generation of the computer board. produce. The parts with high heat generation of the computer board are such as the position of the IPM module (Intelligent Power Module, intelligent power module), the position of the IGBT module (Insulated Gate Bipolar Transistor, the position of the insulated gate bipolar transistor), the position of the diode, the position of the rectifier bridge, etc. These locations generate high heat during operation, which can make them hotter than other locations. If the high heat-generating part of the heat-dissipating surface 11 can be effectively dissipated, the temperature of the high-heat-generating part of the computer board can be lowered to avoid failure due to excessive temperature.

Optionally, the substrate 10 is made of aluminum. The aluminum substrate 10 is not easily corroded by the refrigerant, and has a high heat transfer coefficient and a good heat dissipation effect.

The heat pipe 20 is a pipe section with closed ends, and the refrigerant circulates inside. The liquid refrigerant changes into a gaseous state after absorbing heat in the evaporation section 21, and flows along the heat pipe 20 to the condensation section 26. After the condensing section 26 releases heat, it becomes liquid, and the liquid refrigerant The sintered copper powder along the tube wall flows back to the evaporation section 21 by means of siphon force for evaporation and heat absorption, thereby forming a cycle. The heat transfer is realized through the phase change and circulating flow of the refrigerant.

Under the action of the temperature of the high heat generating portion of the heat dissipation surface 11 of the substrate 10 , the heat pipe 20 does not need to be driven by electric power, and can realize self-circulation with poor refrigerant density. Optionally, the heat dissipation surface 11 of the substrate 10 is provided with fins 40 . The heat pipe 20 cooperates with the forced convection heat exchange of the fins 40, which can further enhance the heat dissipation effect.

Most of the tube shells of the heat pipes 20 are metal seamless steel tubes, and different materials, such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc., can be used according to different needs. The tube of the heat pipe 20 may be a standard circular shape, or a special shape, such as an oval, square, rectangular, flat, corrugated tube and the like.

Optionally, the heat pipe 20 is a round pipe or a flat pipe. The use of round or flat tubes can make the refrigerant flow smoothly in the tube and facilitate the circulation of the refrigerant in the tube. By adopting the flat tube, the contact area between the heat pipe 20 and the heat dissipation surface 11 can also be increased, and the heat exchange effect between the refrigerant and the heat dissipation surface 11 can be enhanced.

Optionally, the height of the evaporation section 21 of the heat pipe 20 is lower than the height of the condensation section 26 . The refrigerant absorbs heat in the evaporation section 21 and evaporates into a gaseous state. The gaseous refrigerant has a lower density and tends to flow upward. Compared with the evaporation section 21, the height of the condensation section 26 is higher, which is conducive to the flow of the gaseous refrigerant from the evaporation section 21 to the condensation section. 26. The refrigerant releases heat and condenses into a liquid state in the condensation section 26. The liquid refrigerant has a higher density and tends to flow downward. Compared with the condensation section 26, the height of the evaporation section 21 is lower, which is conducive to the flow of the liquid refrigerant from the condensation section 26 back to the evaporation section. twenty one. By setting the height difference between the evaporation section 21 and the condensation section 26, the power of the refrigerant circulating flow can be enhanced.

In some embodiments, the heat pipe 20 is disposed in close contact with the heat dissipation surface 11 . The heat pipe 20 and the heat dissipation surface 11 are attached and arranged, on the one hand, it is convenient for the refrigerant in the heat pipe 20 to fully exchange heat with the heat dissipation surface 11, and the refrigerant in the evaporation section 21 of the heat pipe 20 fully absorbs the heat generated by the heat dissipation surface 11 to vaporize; on the other hand, The distance between the heat pipe 20 and the heat dissipation surface 11 is closer, which can make the overall structure of the heat sink more compact.

The arrangement of the heat pipe 20 and the heat dissipation surface 11 in close contact means that the bottom of the outer tube wall of the heat pipe 20 is in contact with the heat dissipation surface 11 , and heat can be quickly transferred between the heat dissipation surface 11 and the heat pipe 20 through the contact.

In some embodiments, the heat dissipation surface 11 is provided with a guide groove 30 extending from the high heat generation part to the low heat generation part, and the heat pipe 20 is disposed in the guide groove 30 .

By providing the guide groove 30 extending from the high heat generation part to the low heat generation part on the heat dissipation surface 11 , the heat pipe 20 can be installed in the guide groove 30 and the heat pipe 20 can be extended from the high heat generation part to the low heat generation part. The heat pipe 20 is arranged in the guide groove 30 , the heat exchange area with the heat dissipation surface 11 is increased, and the heat pipe 20 can be closer to the heat conduction surface, thereby enhancing the heat exchange effect with the heat dissipation surface 11 . Moreover, disposing the heat pipe 20 in the guide groove 30 can not only make the structure of the heat sink compact, but also have a certain protective effect on the heat pipe 20 .

The guide groove 30 is formed so that a local area of the heat dissipation surface 11 is recessed inward. The guide groove 30 is beneficial to limit the position of the heat pipe 20, which can make the pipe more firm and stable. When the heat pipe 20 is a flat tube, the depth of the guide groove 30 need not be set too deep, and the flat tube can be embedded in the guide groove 30 . The depth of the guide groove 30 is in a shallow range, which is also beneficial to ensure the mechanical strength of the substrate 10 .

Optionally, the cross-section of the guide groove 30 is adapted to the shape of the cross-section of the heat pipe 20 . The heat pipe 20 can be embedded in the guide groove 30 to maintain firmness and stability, and fully contact the heat dissipation surface 11 for heat exchange.

Optionally, a gap exists between the guide groove 30 and the heat pipe 20 . The existence of the gap can allow the airflow to pass through it, and use the airflow to take away part of the heat, which can also enhance the heat dissipation effect to a certain extent.

Optionally, the depth of the guide groove 30 is smaller than the diameter of the heat pipe 20 . In this way, the heat pipe 20 can partially expose the guide groove 30, protrude outward relative to the heat dissipation surface 11, and utilize the protruding part to release heat to the external environment.

Optionally, the depth of the guide groove 30 is greater than the diameter of the heat pipe 20 . In this way, the heat pipe 20 can be completely placed in the guide groove 30 to fully absorb the heat generated by the heat dissipation surface 11 .

Optionally, the groove surface of the guide groove 30 is coated with silicone grease. By applying silicone grease on the groove surface, the heat dissipation effect of the heat dissipation surface 11 can be enhanced.

Optionally, the depth of the guide groove 30 increases gradually from the high heat generation part to the low heat generation part, and the pipe diameter of the evaporation section 21 of the heat pipe 20 is larger than the depth of the guide groove 30 located in the high heat generation part. In this way, in the high heat generation part, the heat pipe 20 is partially located in the guide groove 30, and part of the heat pipe 20 protrudes to the outside relative to the heat dissipation surface 11, so that after the heat of the high heat generation part is transferred to the heat pipe 20, part of it can be released to the outside air in time, enhancing the heat dissipation. The heat dissipation effect of the heat generating part: in the low heat generating part, the heat pipes 20 are all located in the guide groove 30, and the heat from the high heat generating part is fully released to the low heat generating part, so that the temperature of the whole heat dissipation surface 11 is more balanced.

In some embodiments, the extended shapes of the guide groove 30 and the heat pipe 20 are both S-shaped, the corner of the guide groove 30 is bent at a right angle, and the corner of the heat pipe 20 is bent in an arc shape.

The extension shape of the heat pipe 20 is designed to be S-shaped, which can extend the length of the heat pipe 20, so that the heat pipe 20 can pass through multiple areas of the heat dissipation surface 11, so that the refrigerant in the heat pipe 20 can fully exchange heat with the heat dissipation surface 11, and improve the heat exchange effect. . Designing the extending shape of the guide groove 30 to be an S shape can make the heat pipe 20 more suitable for its shape, so as to extend in an S shape therein.

The corners of the guide groove 30 and the heat pipe 20 are designed in different shapes, so that the heat pipe 20 and the guide groove 30 are not completely fitted and matched, and a gap is formed at the corners of the guide groove 30 and the heat pipe 20, so that the Part of the sidewall heat can be released directly into the air. Moreover, it is also convenient to fit the heat pipe 20 into the guide groove 30 .

In some embodiments, the heat dissipation surface 11 further includes a transition portion, and the transition portion is disposed between the high heat generation portion and the low heat generation portion; wherein the heat pipe 20 extends from the high heat generation portion through the transition portion to the low heat generation portion.

The transition part is between the high heat generation part and the low heat generation part, and its heat generation degree is also between the high heat generation part and the low heat generation part. By arranging a transition part between the high heat generation part and the low heat generation part, and making the heat pipe 20 pass through the transition part, the refrigerant in the heat pipe 20 can fully release part of the heat at the transition part, so as to facilitate the heat pipe 20 to release in the low heat generation part The remaining heat enhances the heat dissipation effect of the heat pipe 20 . In addition, the heat pipe 20 releases part of the heat in the transition part, which is beneficial to the more uniform temperature distribution of the heat dissipation surface 11 and effectively avoids the high temperature of the high heat generating part from being too high.

In some embodiments, the heat pipe 20 further includes: a first bending section 22, a second bending section 23 and a third bending section 24, the first bending section 22 communicates with the evaporation section 21; the second bending section 23 It communicates with the first bending section 22 and forms an inverted U shape with the first bending section 22 ; the third bending section 24 communicates with the second bending section 23 and is opposite to the bending direction of the second bending section 23 ; Among them, the second bending section 23 and the third bending section 24 are arranged in the transition portion.

The heat pipe 20 is provided with a plurality of bending sections, and the cooling medium can flow from the evaporation section 21 through the transition section to the condensation section 26 through the communication of the bending sections in turn. The first bending section 22 and the second bending section 23 form an inverted U shape. , so that the heat pipe 20 can extend from the high heat generation part to the transition part adjacent to its position, and prolong the flow path of the refrigerant; the bending directions of the second bending section 23 and the third bending section 24 are opposite, so that the heat pipe 20 can be Under the continuous bending, the extending trend toward the low heat generation portion is maintained, so that the heat pipe 20 extends from the transition portion toward the low heat generation portion. Through the bending design of the second bending section 23 and the third bending section 24, the refrigerant can have a longer flow path in the transition part, which is beneficial to transfer the heat of the high heat generation part to the transition part, and improve the heat dissipation surface 11 temperature effect.

Optionally, both the first bending section 22 and the second bending section 23 are arc-shaped, and the corresponding central angle is 90°. In this way, the heat pipe 20 can be bent at a moderate extent, so that it can meander through different areas, so as to avoid the influence of heat dissipation due to the closeness of the pipe sections, and the length of the heat pipe 20 can be extended as much as possible, thereby extending the path length of the refrigerant flow and enhancing the heat transfer effect. .

Optionally, the heights of the evaporation section 21, the third bending section 24 and the fourth bending section 25 are the same, the heights of the condensation section 26, the first bending section 22 and the second bending section 23 are the same, and the evaporation section 21 has the same height. The height is less than the condensation section 26 . By setting the height of each pipe section, it is beneficial for the refrigerant in different phases to flow in the heat pipe 20, which can enhance the circulation flow power of the refrigerant and improve the heat transfer effect of the heat pipe 20 from the high heat generation part to the low heat generation part.

The height refers to the distance between the heat pipe 20 and the ground when the substrate 10 is in a horizontal state in actual use of the heat sink.

In some embodiments, the connection between the second bending section 23 and the third bending section 24 is disposed close to the first side edge 12 of the substrate 10 .

When the refrigerant flows through the connection between the second bending section 23 and the third bending section 24, since the position is close to the first side 12 of the base plate 10, it is easier to release heat to the external environment than the central position of the base plate 10. The refrigerant can release more heat to the external environment, thereby improving the heat dissipation effect of the heat pipe 20 .

Optionally, the distance between the connection between the second bending section 23 and the third bending section 24 and the first side edge 12 is 0.5 cm to 1 cm.

Optionally, the substrate 10 includes: a first side 12 , a second side 13 , a third side 14 and a fourth side 15 , wherein the first side 12 and the second side 13 are located opposite to each other, and the third side One end of the side edge 14 is connected to the first side edge 12 , and the other end is connected to the second side edge 13 . The third side edge 14 and the fourth side edge 15 are located opposite to each other.

Optionally, the high heat generation part, the low heat generation part and the transition part of the heat dissipation surface 11 are located in the area enclosed by the first side edge 12, the second side edge 13, the third side edge 14 and the fourth side edge 15, and the high heat generation part is The heat pipe 20 extends from the high heat generation part through the transition part to the low heat generation part.

1 and 3, an embodiment of the present disclosure further provides a heat sink for an air conditioner computer board, including a substrate 10 and a heat pipe 20, wherein the substrate 10 includes a heat-conducting surface and a heat-dissipating surface 11, and the heat-conducting surface and the computer board In contact, the heat dissipation surface 11 is arranged opposite the heat conduction surface and includes a high heat generation part and a low heat generation part; the heat pipe 20 is arranged on the heat dissipation surface 11 and includes an evaporation section 21, a first bending section 22, and a second bending section 23 which are connected in sequence. , the third bending section 24, the fourth bending section 25 and the condensation section 26, the evaporation section 21 extends straight from the second side 13 to the first side 12 in the high heat generation area, and the first bending section 22 The second bending section 23 communicates with the first bending section 22 and bends and extends in the direction of the first side 12, and the third bending section 24 communicates with the second bending section 23 and bends and extends toward the direction of the third side edge 14, the fourth bending section 25 communicates with the third bending section 24 and bends and extends toward the direction of the second side edge 13, and evaporates The segment 21 communicates with the fourth bending segment 25 and extends linearly toward the second side edge 13 ; the evaporation segment 21 is arranged in the high heat generation part, and the condensation segment 26 is arranged in the low heat generation part.

In some embodiments, the heat pipe 20 further includes a fourth bending section 25, the fourth bending section 25 communicates with the third bending section 24 and the condensation section 26, and forms a U shape with the third bending section 24; wherein, The connection between the third bending section 24 and the fourth bending section 25 is disposed close to the second side edge 13 of the substrate 10 .

By arranging the third bending section 24 and the fourth bending section 25 and forming a U shape, the heat pipe 20 extends from the transition part to the condensing part during the bending, and the flow path of the refrigerant in the heat pipe 20 is extended, enhancing the The heat exchange effect with the heat dissipation surface 11 is improved, the heat is fully transferred from the high heat generation part to the low heat generation part, the heat dissipation effect of the substrate 10 is improved, and the temperature of the high heat generation part of the substrate 10 is prevented from being too high, thereby preventing the air conditioning computer board. Temperature is too high. When the refrigerant flows through the connection between the third bending section 24 and the fourth bending section 25, since the position is close to the second side 13 of the base plate 10, it is easier to release heat to the external environment than at the central position of the base plate 10. The refrigerant can release more heat to the external environment, thereby improving the heat dissipation effect of the heat pipe 20 .

In addition, the connection between the first bending section 22 and the second bending section 23 and the connection between the third bending section 24 and the fourth bending section 25 are respectively close to different sides, which can reduce mutual influence. , which is beneficial for the refrigerant to fully release the heat.

In some embodiments, the condensation section 26 is disposed adjacent to the third side 14 of the substrate 10 . The condensing section 26 is positioned close to the third side edge 14, so that the refrigerant in the condensing section 26 can more easily release heat to the external environment.

1-4, an embodiment of the present disclosure further provides a heat sink for an air conditioner computer board, including: a substrate 10, a heat pipe 20 and fins 40, wherein the substrate 10 includes a heat conduction surface and a heat dissipation surface 11, The heat-conducting surface is in contact with the computer board, and the heat-dissipating surface 11 is arranged opposite the heat-conducting surface and includes a high-heating part and a low-heating part; the heat pipe 20 is arranged on the heat-dissipating surface 11, including an evaporation section 21 and a condensation section 26, and the evaporation section 21 is arranged in the high-heating section. The condensing section 26 is set in the low heat generation part; the heat dissipation surface 11 is provided with a guide groove 30 extending from the high heat generation part to the low heat generation part, the heat pipe 20 is set in the guide groove 30; the fins 40 are set on the heat dissipation surface 11 and cross the guide notch of slot 30.

Optionally, the fins 40 extend away from the heat dissipation surface 11 . The heat on the heat dissipation surface 11 and the heat pipe 20 can be quickly released to the external environment through the fins 40, thereby improving the heat dissipation effect of the heat sink. By arranging the heat pipes 20 , the uniformity of the temperature of the substrate 10 is enhanced, and the temperature of the high heat-generating part is prevented from being too high. The heat dissipation effect of the fins 40 on the substrate 10 and the heat pipes 20 can further balance the temperature of the substrate 10 and reduce the local temperature of the substrate 10 . High temperature, improve the heat dissipation effect of the radiator.

An embodiment of the present disclosure also provides an air conditioner, comprising: a computer board and the radiator provided in any of the above embodiments, where the radiator is connected to the computer board.

By setting the radiator in the air conditioner, the heat of the heat dissipation surface 11 of the substrate 10 can be transferred from the high heat generation part to the low heat generation part through the function of the substrate 10 and the heat pipe 20 , so that the temperature of the heat dissipation surface 11 is more balanced, and the heat dissipation surface 11 is enhanced. The heat dissipation effect of the high heat generation part can improve the heat dissipation efficiency of the high heat generation part of the computer board, and prevent the computer board from being burned due to high local heat generation or limit the performance of the air conditioner of the whole machine.

The foregoing description and drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples are only representative of possible variations. Unless expressly required, individual components and functions are optional and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. Embodiments of the present disclosure are not limited to the structures that have been described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. a radiator for air-conditioning computer board, is characterized in that, comprises: a base plate, comprising a heat-conducting surface and a heat-dissipating surface, the heat-conducting surface is in contact with the computer board, the heat-dissipating surface and the heat-conducting surface are arranged opposite to the heat-conducting surface and include a high-heating part and a low-heating part; The heat pipe includes an evaporation section and a condensation section, the evaporation section is arranged on the high heat generation part of the heat dissipation surface, and the condensation section is arranged at the low heat generation part of the heat dissipation surface; Wherein, the heat of the high heat generation part is conducted to the low heat generation part through the heat pipe. 2 . The radiator according to claim 1 , wherein the heat pipe is disposed in contact with the heat dissipation surface. 3 . 3 . The heat sink according to claim 2 , wherein the heat dissipation surface is provided with a guide groove extending from the high heat generation portion to the low heat generation portion, and the heat pipe is provided in the guide groove. 4 . 4 . The heat sink according to claim 3 , wherein the extending shapes of the guide groove and the heat pipe are both S-shaped, the corner of the guide groove is bent at a right angle, and the corner of the heat pipe is bent at a right angle. 5 . Bend in an arc. 5. The heat sink according to any one of claims 1 to 4, wherein the heat dissipation surface further comprises: a transition part, arranged between the high heat generation part and the low heat generation part; Wherein, the heat pipe extends from the high heat generation part to the low heat generation part through the transition part. 6. The heat sink according to claim 5, wherein the heat pipe further comprises: a first bending section, communicated with the evaporation section; The second bending section is communicated with the first bending section and forms an inverted U shape with the first bending section; a third bending section, communicated with the second bending section, and opposite to the bending direction of the second bending section; Wherein, the second bending section and the third bending section are arranged at the transition portion. 7 . The heat sink according to claim 6 , wherein the connection between the second bending section and the third bending section is disposed close to the first side of the substrate. 8 . 8. The heat sink according to claim 6, wherein the heat pipe further comprises: a fourth bending section, communicated with the third bending section and the condensation section, and forming a U-shape with the third bending section; Wherein, the connection between the third bending section and the fourth bending section is disposed close to the second side of the substrate. 9 . The heat sink according to claim 1 , wherein the condensation section is disposed close to the third side of the base plate. 10 . 10. An air conditioner, characterized in that, comprising: computer board; and The heat sink according to any one of claims 1 to 9, wherein the heat sink is connected with the computer board.

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