CN216214122U - Decoupling Structure for Suppressing Mutual Coupling Between Stacked Microstrip Patch Antennas - Google Patents

Abstract

A decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas, comprising: a fixed driving patch and a parasitic patch respectively arranged on a first dielectric board and a second dielectric board, wherein: a peripheral device of the driving patch There is a C-type microstrip structure as a decoupling structure, and the driving patch and the C-type microstrip structure are respectively provided with an antenna interface and a metallized via hole. The device utilizes the characteristics of the decoupling structure to control the coupling strength between the antenna array elements, and realizes the suppression of the mutual coupling between the stacked microstrip antennas arranged on the H-plane of the two elements and the decoupling design of the stacked microstrip antenna array.

Description

Decoupling Structure for Suppressing Mutual Coupling Between Stacked Microstrip Patch Antennas

technical field

The utility model relates to a technology in the field of patch antennas, in particular to a decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas.

Background technique

Multiple-input multiple-output MIMO technology can greatly improve channel capacity and perform high data rate transmission without increasing the overhead of spectrum resources, and has been widely used in modern wireless communication systems. The stacked microstrip patch antenna has a wide impedance bandwidth, wide beam width, polarization flexibility and filter characteristics, and the stacked microstrip patch antenna is easy to achieve ESD protection, meet metal density requirements and heat dissipation. As a result, stacked microstrip patch antennas dominate the antenna array designs for 5G base stations, customer premises equipment and smartphones. However, the mutual coupling between the antenna elements can degrade the performance of the MIMO system due to the limitation of the actual system space. Moreover, most of the existing methods for alleviating the mutual coupling between the antenna elements of the multi-antenna system are based on single-layer microstrip antennas, which are difficult to be directly applied to the stacked microstrip antenna array. In addition, these methods also have their own shortcomings. For example, the decoupling network method is not suitable for the decoupling of antenna arrays with far unit intervals; the electromagnetic structure is very complex, and the defective structure is prone to large back radiation. In addition, the decoupling method of the stacked microstrip patch is insufficiently studied. The existing method adopts the form of sacrificing the bandwidth of the stacked microstrip patch antenna to obtain the reduction of mutual coupling. Moving to the case where the resonant frequency of the upper layer is consistent, the decoupling of the stacked microstrip patch antenna is realized, but this method actually sacrifices the greatest advantage of the stacked microstrip patch antenna.

Utility model content

Aiming at the above-mentioned shortcomings of the prior art, the utility model proposes a decoupling structure for suppressing the mutual coupling between the stacked microstrip patch antennas. The characteristics of the decoupling structure are used to control the coupling strength between the antenna array units, thereby realizing two The suppression of the mutual coupling between the stacked microstrip antennas arranged on the H surface of the unit is designed by decoupling the stacked microstrip antenna array.

The utility model is achieved through the following technical solutions:

The utility model relates to a decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas, comprising: a fixed driving patch and a parasitic patch respectively arranged on a first medium plate and a second medium plate, wherein: The periphery of the chip is provided with a C-type microstrip structure as a decoupling structure, and the driving patch and the C-type microstrip structure are respectively provided with an antenna interface and a metallized via hole.

The C-type microstrip structure is placed around the non-radiating edge of the driver patch, and the metallized vias are located at the top and center of the two branches of the C-type microstrip structure to adjust the stacked microstrip patch antenna array at low frequencies. coupling at.

A square ring structure is arranged on the periphery of the parasitic patch as an auxiliary decoupling structure, and the square ring structure is located around the parasitic patch to regulate the coupling of the stacked microstrip patch antenna array at high frequencies.

The first dielectric plate is provided with a metal stratum; the second dielectric plate has no metal stratum.

Description of drawings

Fig. 1 is the physical schematic diagram of the decoupling structure loaded simultaneously by the driver patch and the parasitic patch;

Fig. 2 is the physical schematic diagram of driving patch loading decoupling structure;

FIG. 3 is a schematic diagram of the S-parameters when only the driver patch is loaded with the decoupling structure;

FIG. 4 is a schematic diagram of S-parameters when the driver patch and the parasitic patch are loaded with the decoupling structure at the same time;

In the figure: the first dielectric board 1, the second dielectric board 2, the driver patch 3, the parasitic patch 4, the C-type microstrip structure 5, the metallized via 6, the square ring structure 7, the metal ground layer 8, the antenna interface 9 .

Detailed ways

As shown in FIG. 1 and FIG. 2 , the present embodiment relates to a decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas, including: respectively setting on a first dielectric board 1 and a second dielectric board 2 and fixing The driving patch 3 and the parasitic patch 4, wherein: the periphery of the driving patch 3 is provided with a C-type microstrip structure 5 as a decoupling structure, and the driving patch 3 and the C-type microstrip structure 5 are respectively provided with an antenna interface 9 and metallized vias 6.

The C-type microstrip structure 5 is placed around the non-radiating edge of the drive patch 3, and the metallized vias 6 are located at the top and center of the two branches of the C-type microstrip structure 5 to adjust the stacked microstrip patch. Coupling of antenna arrays at low frequencies.

The periphery of the parasitic patch 4 is provided with a square ring structure 7 as an auxiliary decoupling structure, and the square ring structure 7 is located around the parasitic patch 4 to regulate the coupling of the stacked microstrip patch antenna array at high frequencies .

The first dielectric board 1 and the second dielectric board 2 are both FR4 rectangular dielectrics with a dielectric constant of 4.4 and a loss tangent of 0.02, with a size of 140mm*80mm*3mm, wherein the first dielectric board 1 is provided with metal Formation 8; the second dielectric plate 2 has no metal formation.

The driving patch 3 is a 17.6mm*17.6mm square microstrip patch, and the parasitic patch 4 is a 17.65mm*17.65mm square microstrip patch located on one side of the second dielectric plate 2 .

The stacked microstrip patch antenna elements are arranged along the H plane, and the spacing between the antenna elements is 0.5λ ₀ .

As shown in Figure 2, when only the driver patch is loaded, the coupling of the stacked microstrip antenna array at low frequencies can be adjusted. As shown in Figure 3, the line width of the C-type microstrip structure is 2.2mm. The lengths of the two branches are 16.8mm and 15.7mm respectively, the distance between the decoupling structure and the driving unit is 0.3mm, and the decoupling effect of the antenna array when the radius of the metallized via is 0.8mm. Continue to load the parasitic patch, and by adjusting the parameters of the decoupling structure, the decoupling of the stacked microstrip patch antenna array at high and low frequencies can be achieved at the same time. As shown in Figure 4, it is the decoupling effect when the driver patch and the parasitic patch are loaded at the same time.

The above-mentioned specific implementation can be partially adjusted by those skilled in the art in different ways without departing from the principle and purpose of the present utility model. The protection scope of the present utility model is based on the claims and is not limited by the above-mentioned specific implementation. Each implementation scheme within its scope is bound by the present invention.

Claims (7)

1. A decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas, characterized in that it comprises: a fixed driving patch and a parasitic patch are respectively arranged on the first dielectric plate and the second dielectric plate, wherein: A C-type microstrip structure as a decoupling structure is arranged on the periphery of the driving patch, and an antenna interface and a metallized via hole are respectively arranged on the driving patch and the C-type microstrip structure. 2. The decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas according to claim 1, wherein the C-type microstrip structure is placed along the non-radiating side of the driving patch, and the metallized Vias are located at the top and center positions of the two branches of the C-type microstrip structure to adjust the coupling of the stacked microstrip patch antenna array at low frequencies. 3. The decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas according to claim 1, wherein a square ring structure is provided on the periphery of the parasitic patch as an auxiliary decoupling structure. A loop structure is placed around the parasitic patch to tune the coupling of the stacked microstrip patch antenna array at high frequencies. 4. The decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas according to claim 1, 2 or 3, wherein the first dielectric plate is provided with a metal ground layer; the second dielectric plate There are no metal formations. 5. The decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas according to claim 1 or 2, wherein the first dielectric plate and the second dielectric plate are both with a dielectric constant of 4.4 , a FR4 rectangular dielectric with a loss tangent of 0.02 and a size of 140mm*80mm*3mm, wherein the first dielectric plate is provided with a metal stratum; the second dielectric board has no metal stratum. 6. The decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas according to claim 1 or 2, wherein the driving patch is a 17.6mm*17.6mm square microstrip patch, The parasitic patch is a 17.65mm*17.65mm square microstrip patch located on one side of the second dielectric plate. 7. The decoupling structure for suppressing mutual coupling between stacked microstrip patch antennas according to claim 1 or 2, wherein the line width of the C-type microstrip structure is 2.2 mm, and the line width of the two branches is 2.2 mm. The lengths are 16.8mm and 15.7mm respectively, the distance between the decoupling structure and the drive unit is 0.3mm, and the radius of the metallized via is 0.8mm.

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