CN216213404U

CN216213404U - Package cooling device for tiled power semiconductor

Info

Publication number: CN216213404U
Application number: CN202121453315.3U
Authority: CN
Inventors: 黄斌斌
Original assignee: Zhongchuang Dufei Beijing Automotive Technology Co ltd
Current assignee: Zhongchuang Dufei Beijing Automotive Technology Co ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2022-04-05
Anticipated expiration: 2031-06-29

Abstract

The utility model provides a packaging and cooling device of a tiled power semiconductor, which comprises: drain pan, heat-conducting plate and circulating device. The bottom shell is provided with a plurality of grooves arranged side by side, and the whole bottom shell is plate-shaped. The heat conducting plate is connected with the bottom shell in a sealing mode and seals openings of the grooves to form a plurality of cooling cavities, and the heat conducting plate is used for installing a plurality of power semiconductor devices. The circulating device is communicated with the cooling cavity and is used for circularly supplying cooling liquid into the cooling cavity. According to the packaging cooling device provided by the utility model, the circulating device circularly supplies the cooling liquid into the cooling cavity, the temperature of the heat-conducting plate is reduced by the cooling liquid, and the heat-conducting plate cools a plurality of power semiconductor devices arranged on the heat-conducting plate.

Description

Package cooling device for tiled power semiconductor

Technical Field

The utility model relates to the technical field of electric automobiles, in particular to a packaging and cooling device for a tiled power semiconductor.

Background

The description of the background of the utility model pertaining to the related art to which this invention pertains is given for the purpose of illustration and understanding only of the content of the application of the present invention, and is not to be construed as an admission that the applicant explicitly or putatively admitted the prior art at the filing date of the first-filed application of the present invention.

Along with traditional new energy automobile's continuous development, market segment has also appeared in new energy automobile market, the power 35KW of many lease market motorcycle types in current market is left and right sides, mainly match the family car and be leading to, the standard encapsulation module is generally chooseed for use to the motor controller of this kind of electric automobile collocation, need adopt the water-cooling to dispel the heat and guarantee the normal output performance of car, the general cost of this kind of motor controller is also higher, structural design is comparatively complicated, power semiconductor's subsides dress mode is vertical subsides in the cooling device both sides, whole power module can be a flat high type cuboid under this kind of equipment mode, the direction of height that leads to using the motor controller of this kind of power module can not too low. The height direction of a front drive engine cabin of a new energy car on the market is compact, and the height direction of the position of a rear drive shaft of a new energy car with a rear drive is compact, so that the spatial arrangement of a motor controller is difficult.

SUMMERY OF THE UTILITY MODEL

The utility model provides a packaging and cooling device of a tiled power semiconductor, which is used for cooling a power semiconductor device of an electric automobile and comprises: the bottom shell is provided with a plurality of grooves which are arranged side by side, and the whole bottom shell is plate-shaped; the heat conducting plate is connected with the bottom shell in a sealing mode and seals openings of the grooves to form a plurality of cooling cavities, and the heat conducting plate is used for mounting a plurality of power semiconductor devices; and the circulating device is communicated with the cooling cavity and is used for circularly supplying cooling liquid into the cooling cavity.

In some embodiments, the heat-conducting plate includes a plurality of sub-plates, each of which seals an opening of one of the recesses to form the cooling cavity, and the sub-plates are sealingly connected to the bottom case.

In some embodiments, the thermally conductive plate includes a substrate and a plurality of thermally conductive portions disposed on the substrate, the thermally conductive portions being located within the cooling cavity.

In some of these embodiments, the heat conducting portion is a heat conducting fin or a heat conducting pin.

In some of these embodiments, the thermally conductive plate is a copper plate or an aluminum plate.

In some embodiments, the heat-conducting plate is connected with the bottom shell through screws, and a sealing part is arranged between the heat-conducting plate and the bottom shell; or the heat conducting plate is connected with the bottom shell in a friction welding mode.

In some of these embodiments, the packaged cooling device for tiled power semiconductors further comprises: the drainage plate is arranged at the bottom of the groove and is arranged along the flowing direction of the cooling liquid; and the flow distribution plate is arranged at the bottom of the groove and is vertical to the drainage plate, and the drainage plate is connected with the middle part of the flow distribution plate.

The technical scheme of the utility model has the following advantages: circulating device is to cooling intracavity circulation supply coolant liquid, and the coolant liquid has reduced the temperature of heat-conducting plate, and the heat-conducting plate is cooled down to a plurality of power semiconductor device that set up on it, and the radiating efficiency of this kind of mode is higher, effectively guarantees the part validity. In addition, the whole bottom shell is plate-shaped, namely the whole packaging cooling device is plate-shaped, so that the height of the power module formed by the plurality of power semiconductor devices is reduced, the whole power module is a flat cuboid, and the power module is more suitable for the requirements of the use environment. The structure of the packaging cooling device is simplified, so that the assembly efficiency of the module is improved, and the production efficiency of the product is improved.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a packaged cooling device for a tiled power semiconductor according to the present invention;

fig. 2 is an exploded view of the tiled power semiconductor package cooling arrangement of fig. 1;

fig. 3 is a schematic top view of a first embodiment of the heat-conducting plate according to the utility model;

fig. 4 is a schematic side view of the first embodiment of the heat-conducting plate according to the utility model;

FIG. 5 is a schematic top view of another embodiment of the thermal plate of the present invention;

FIG. 6 is a schematic side view of another embodiment of the thermal plate of the present invention;

fig. 7 is a schematic structural diagram of the bottom case of the present invention.

Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 7 is:

the heat conducting plate comprises a bottom shell 10, a groove 11, a heat conducting plate 20, a sub-plate 21, a base plate 22, a heat conducting part 23, a screw 30, a flow guiding plate 40, a flow distribution plate 50 and a power semiconductor device 60.

Detailed Description

In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the utility model will be rendered by reference to the appended drawings. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

The following discussion provides multiple embodiments of the utility model. While each embodiment represents a single combination of applications, different embodiments of the utility model can be substituted or combined, and thus the utility model is considered to encompass all possible combinations of the same and/or different embodiments described. Thus, if one embodiment comprises A, B, C and another embodiment comprises a combination of B and D, then the utility model should also be construed as comprising an embodiment that comprises A, B, C, D in all other possible combinations, although this embodiment may not be explicitly recited in the following text.

As shown in fig. 1 and fig. 2, the novel tiled power semiconductor package cooling device for cooling a power semiconductor device 60 of an electric vehicle according to the present invention includes: a bottom shell 10, a heat-conducting plate 20 and a circulation device (not shown).

As shown in fig. 2, the bottom case 10 has a plurality of grooves 11 arranged side by side, and the bottom case 10 is plate-shaped as a whole.

As shown in fig. 2, the heat conductive plate 20 is hermetically coupled to the bottom case 10 and seals the openings of the plurality of recesses 11 to form a plurality of cooling cavities, and the heat conductive plate 20 is used to mount a plurality of power semiconductor devices 60.

As shown in fig. 2, in an embodiment of the present invention, the heat conductive plate 20 includes a plurality of sub-plates 21, each sub-plate 21 sealing an opening of one of the recesses 11 to form a cooling chamber, and the sub-plates 21 are hermetically coupled to the bottom case 10.

A circulation device communicates with the cooling chamber for circulating a cooling fluid into the cooling chamber, for example, OUT from the OUT mark shown in fig. 2.

The plurality of cooling cavities can be respectively and independently connected with the circulating device, or the plurality of cooling cavities are connected with the circulating device after being connected in parallel.

According to the novel tiled power semiconductor packaging and cooling device, the circulating device circularly supplies cooling liquid into the cooling cavity, the temperature of the heat conducting plate 20 is reduced by the cooling liquid, the heat conducting plate 20 cools the plurality of power semiconductor devices 60 arranged on the heat conducting plate, the heat radiating efficiency is higher, and the effectiveness of parts is effectively guaranteed.

In addition, as shown in fig. 2, the bottom case 10 is plate-shaped as a whole, that is, the package cooling device is plate-shaped as a whole, so that the height of the power module formed by the plurality of power semiconductor devices 60 is reduced, the power module is flat and rectangular, the power module is more suitable for the use environment, and the reasonable layout of the product is ensured. The structure of the packaging cooling device is simplified, so that the assembly efficiency of the module is improved, and the production efficiency of the product is improved.

As shown in fig. 1 and 2, in one embodiment of the present invention, the heat conductive plate 20 is coupled with the bottom case 10 by screws 30, and a sealing portion is provided between the heat conductive plate 20 and the bottom case 10.

The connection mode of the screw 30 is simple in structure, reliable in connection, convenient to operate and low in price, the sealing portion is arranged to seal a gap between the heat conducting plate 20 and the bottom shell 10, and the sealing portion can be a sealing ring or sealing glue.

In another embodiment of the present invention, the heat conductive plate 20 and the bottom case 10 are coupled by friction welding. The friction welding is a method for welding by using heat generated by friction of a contact surface of a workpiece as a heat source and enabling the workpiece to generate plastic deformation under the action of pressure, and the friction welding is realized by welding a heat conduction plate and a bottom shell by using materials of the heat conduction plate and the bottom shell, so that the heat conduction plate and the bottom shell have good sealing performance.

In the packaged cooling device for a tiled power semiconductor provided by the utility model, as shown in fig. 3 to 6, schematic structural diagrams in top view and side view of the first and other embodiments of the heat-conducting plate of the utility model are respectively shown. Wherein in the first and other embodiments, the heat-conducting plates 20 each comprise a base plate 22 and a plurality of heat-conducting portions 23 provided on the base plate 22, the heat-conducting portions 23 being located in the cooling chamber.

As shown in fig. 3 and 4, in the first embodiment of the present invention, the heat conduction portion 23 is a heat conduction fin or a heat conduction pin.

The heat conducting portion 23 is located in the cooling cavity, so that the heat conducting portion 23 is in full contact with the cooling liquid, that is, the above structure of the heat conducting plate 20 increases the contact area between the heat conducting plate 20 and the cooling liquid, thereby rapidly reducing the temperature of the substrate 22 and rapidly and fully cooling the power semiconductor device 60.

In other embodiments of the utility model, the thermally conductive plate is a copper or aluminum plate, as shown in fig. 5 and 6.

Copper and aluminum have better thermal conductivity, the thermal conductivity of copper is 401W/mK, the thermal conductivity of aluminum is 237W/m K, copper is higher than the thermal conductivity of aluminum, but the price of aluminum is lower than that of copper, and a person skilled in the art can select corresponding materials to prepare the heat-conducting plate according to specific requirements. Alternatively, the substrate and the heat-conducting portion are made of different materials, such as copper and aluminum as the substrate, or copper and aluminum as the substrate.

In an alternative embodiment of the utility model, as shown in fig. 2 and 7, the package cooling device further comprises: a flow directing plate 40 and a flow distribution plate 50.

The flow guide plate 40 is arranged at the bottom of the groove 11 and along the flowing direction of the cooling liquid. The liquid inlet of the cooling cavity is arranged with the drainage plate 40.

The flow distribution plate 50 is arranged at the bottom of the groove 11 and is perpendicular to the flow guide plate 40, and the flow guide plate 40 is connected with the middle part of the flow distribution plate 50. The liquid outlet of the cooling cavity is arranged corresponding to the middle part of the flow distribution plate 50.

The cooling liquid enters the cooling cavity from the liquid inlet IN and then collides with the flow guide plate 40, the cooling liquid is divided into two streams by the flow guide plate 40, the two streams of cooling liquid respectively move along two sides of the flow guide plate 40, and after the cooling liquid collides with the flow distribution plate 50, the cooling liquid bypasses the rear side surface of the flow distribution plate 50 from the front side surface of the flow distribution plate 50, so that the liquid outlet OUT flows OUT. The structure increases the flowing time of the cooling liquid in the cooling cavity, thereby ensuring the sufficient heat exchange between the cooling liquid and the heat conducting plate 20.

In addition, the flow dividing plate 50 and the side wall of the groove 11 can have a small spacing distance, which can further reduce the flow rate of the cooling liquid.

In the present invention, the terms "mounting," "connecting," "fixing," and the like are used in a broad sense, for example, "connecting" may be a fixed connection, a detachable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A tiled power semiconductor's encapsulation cooling device for cooling down electric automobile's power semiconductor device, its characterized in that includes:

the bottom shell is provided with a plurality of grooves which are arranged side by side, and the whole bottom shell is plate-shaped;

the heat conducting plate is connected with the bottom shell in a sealing mode and seals openings of the grooves to form a plurality of cooling cavities, and the heat conducting plate is used for mounting a plurality of power semiconductor devices; and

and the circulating device is communicated with the cooling cavity and is used for circularly supplying cooling liquid into the cooling cavity.

2. The package cooling device of a tiled power semiconductor according to claim 1,

the heat-conducting plate comprises a plurality of sub-plates, each sub-plate seals an opening of the groove to form the cooling cavity, and the sub-plates are connected with the bottom shell in a sealing mode.

3. The package cooling device of a tiled power semiconductor according to claim 1,

the heat conducting plate comprises a substrate and a plurality of heat conducting parts arranged on the substrate, and the heat conducting parts are located in the cooling cavity.

4. A package cooling device of a tiled power semiconductor according to claim 3,

the heat conducting part is a heat conducting fin or a heat conducting pin.

5. The package cooling device of a tiled power semiconductor according to claim 1,

the heat conducting plate is a copper plate or an aluminum plate.

6. The package cooling device of a tiled power semiconductor according to claim 1,

the heat conducting plate is connected with the bottom shell through screws, and a sealing part is arranged between the heat conducting plate and the bottom shell; or

The heat conducting plate is connected with the bottom shell in a friction welding mode.

7. A packaged cooling device for a tiled power semiconductor according to claim 1, further comprising:

the drainage plate is arranged at the bottom of the groove and is arranged along the flowing direction of the cooling liquid; and

the flow distribution plate is arranged at the bottom of the groove and is vertical to the drainage plate, and the drainage plate is connected with the middle part of the flow distribution plate.