CN215869379U - LED light source, lighting device and display device - Google Patents
LED light source, lighting device and display device Download PDFInfo
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- CN215869379U CN215869379U CN202122406819.6U CN202122406819U CN215869379U CN 215869379 U CN215869379 U CN 215869379U CN 202122406819 U CN202122406819 U CN 202122406819U CN 215869379 U CN215869379 U CN 215869379U
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- Prior art keywords
- led
- light source
- bottom wall
- reflector
- led light
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- 238000009434 installation Methods 0.000 claims abstract description 10
- 230000007423 decrease Effects 0.000 claims description 9
- 230000003247 decreasing effect Effects 0.000 claims 3
- 235000012431 wafers Nutrition 0.000 abstract description 43
- 230000003466 anti-cipated effect Effects 0.000 abstract description 5
- 239000012790 adhesive layer Substances 0.000 description 9
- 230000011514 reflex Effects 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model relates to an LED light source, a lighting device and a display device, wherein the LED light source comprises a bracket, a reflecting device and a plurality of LED wafers; the support is provided with an accommodating groove, the bottom wall of the accommodating groove is provided with an installation position, and the light reflecting device is arranged in the accommodating groove and positioned on the installation position; the support is provided with an accommodating groove, the bottom wall of the accommodating groove is provided with a plurality of LED bonding pads, each LED bonding pad corresponds to each LED wafer one by one, each LED wafer is arranged on each LED bonding pad in a one-to-one correspondence mode and is electrically connected with the LED bonding pad, and each LED wafer surrounds the light reflecting device. Above-mentioned LED light source, lighting device and display device are equivalent to the LED wafer by the outside lateral wall of support and including reflector's surface surrounds for the light homoenergetic that each LED wafer sent toward different directions is gone out by the reflection, improves the luminous efficacy of each LED wafer, uses less LED wafer also can reach anticipated light efficiency, reduce cost.
Description
Technical Field
The utility model relates to the technical field of packaging, in particular to an LED light source, an illuminating device and a display device.
Background
The LED light source is often used as a backlight source and a light source in a display device and a lighting device, and the light emission of the display device and the lighting device can be realized only by the LED light source.
In the conventional LED light source structure, a manner of increasing the number of LED (light emitting diode) chips is generally adopted to improve the light efficiency of the LED light source, which leads to an increase in the cost of the LED light source and a lower light emitting efficiency of each LED chip in the LED light source.
SUMMERY OF THE UTILITY MODEL
Based on this, it is necessary to provide an LED light source, an illumination device, and a display device.
An LED light source comprises a support, a reflecting device and a plurality of LED wafers; the support is provided with an accommodating groove, the bottom wall of the accommodating groove is provided with an installation position, and the light reflecting device is arranged in the accommodating groove and positioned on the installation position; the support is provided with an accommodating groove, the bottom wall of the accommodating groove is provided with a plurality of LED bonding pads, each LED bonding pad corresponds to each LED wafer one by one, each LED wafer is arranged on each LED bonding pad in a one-to-one correspondence mode and is electrically connected with the LED bonding pad, and each LED wafer surrounds the light reflecting device.
In one embodiment, the cross-section of the reflector is circular in shape.
In one embodiment, the cross-section of the light reflecting device is shaped as an N-sided polygon, where N is greater than 4.
In one embodiment, the width of the longitudinal section of the reflector means decreases progressively in a direction from adjacent the trough bottom wall to remote therefrom.
In one embodiment, the reflector has a trapezoidal shape in longitudinal section, and the width of the longitudinal section of the reflector gradually decreases from the position near the bottom wall of the groove to the position far away from the bottom wall of the groove.
In one embodiment, the longitudinal section of the reflector is flared, and the width of the longitudinal section of the reflector gradually decreases from the position near the bottom wall of the groove to the position far away from the bottom wall of the groove.
In one embodiment, the reflector has a longitudinal cross-section in the shape of a bell jar, the longitudinal cross-section of the reflector having a width that decreases in a direction from adjacent the bottom wall of the trough to distal the bottom wall of the trough.
In one embodiment, the LED chip is disposed around the light reflecting means to form a ring shape.
A lighting device comprising an LED light source as described in any of the above embodiments.
A display device comprising an LED light source as described in any of the above embodiments.
The utility model has the beneficial effects that: through setting up reflector in the support to make each LED wafer in the support set up around reflector, be equivalent to the LED wafer by the lateral wall of support outside and including reflector's surface surround, make each LED wafer can reflect away toward the light homoenergetic of equidirectional emission, improve the luminous efficacy of each LED wafer, use less LED wafer also can reach anticipated light efficiency, reduce the cost of LED light source.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of an LED light source according to an embodiment;
FIG. 2 is a schematic view of another angle of an LED light source according to an embodiment;
FIG. 3 is a schematic cross-sectional view of an LED light source according to an embodiment;
FIG. 4 is a schematic cross-sectional view of another embodiment of an LED light source;
fig. 5 is a schematic cross-sectional view of an LED light source according to another embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model discloses an LED light source, which comprises a bracket, a reflecting device and a plurality of LED wafers; the support is provided with an accommodating groove, the bottom wall of the accommodating groove is provided with an installation position, and the light reflecting device is arranged in the accommodating groove and positioned on the installation position; the support is provided with an accommodating groove, the bottom wall of the accommodating groove is provided with a plurality of LED bonding pads, each LED bonding pad corresponds to each LED wafer one by one, each LED wafer is arranged on each LED bonding pad in a one-to-one correspondence mode and is electrically connected with the LED bonding pad, and each LED wafer surrounds the light reflecting device.
Above-mentioned LED light source, through set up reflex reflector in the support to make each LED wafer in the support set up around reflex reflector, be equivalent to the LED wafer by the lateral wall of outer support and including the surface surrounding of reflex reflector, make each LED wafer can reflect away toward the light homoenergetic of equidirectional transmission, improve the luminous efficacy of each LED wafer, use less LED wafer also can reach anticipated light efficiency, reduce the cost of LED light source.
In order to facilitate understanding of the LED light source of the present application, the LED light source will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 5, an LED light source 10 includes: a support 100, a light reflecting device 200, and a plurality of LED chips 300. The holder 100 is used to receive the light reflecting device 200, the LED chip 300, and the like. The light reflecting device 200 serves to reflect light. The LED chip 300 is used for emitting light, and can emit any one color of light, such as white light, blue light, green light, red light, and violet light.
The bracket 100 is provided with an accommodating groove 101, the bottom wall of the accommodating groove 101 is provided with an installation position, and the light reflecting device 200 is arranged in the accommodating groove 101 and is positioned on the installation position; the support 100 is provided with a receiving groove 101, a plurality of LED bonding pads are arranged on the bottom wall of the receiving groove 101, each LED bonding pad corresponds to the LED chip 300 one by one, each LED chip 300 is arranged on each LED bonding pad one by one and is electrically connected with the LED bonding pad, and each LED chip 300 is arranged around the light reflecting device 200.
In the LED light source 10, the light reflecting device 200 is disposed in the support 100, and the LED chips 300 in the support 100 are disposed around the light reflecting device 200, which is equivalent to the LED chips 300 being surrounded by the outer sidewall of the support 100 and the inner surface of the light reflecting device 200, so that the light emitted from the LED chips 300 in different directions can be reflected, the light emitting efficiency of the LED chips 300 is improved, the expected light effect can be achieved by using fewer LED chips 300, and the cost of the LED light source 10 is reduced.
In one embodiment, the material of the bracket is at least one of copper, ceramic and aluminum. In one embodiment, a printed circuit board is arranged on the floor of the bracket, and pads and circuits are designed on the printed circuit board in advance. In one embodiment, the receiving groove may be circular or square in shape. In one embodiment, the number of the receiving grooves may be one or more.
In one embodiment, the LED chip is at least one of a blue LED chip, a green LED chip, a red LED chip, a violet LED chip, and the like.
In one embodiment, the LED chip is disposed on the pad through solder paste or insulating paste, and the LED chip is electrically connected to the substrate through a bonding wire. In one embodiment, the bonding wire is a gold wire.
In one embodiment, the LED chip is disposed on the bonding pad and electrically connected to the substrate by silver paste or other conductive paste.
In one embodiment, the LED light source further includes an encapsulation adhesive layer disposed on the support and sealing the receiving groove. The packaging adhesive layer is used for sealing the containing groove so as to prevent the LED light source from being oxidized due to contact with external water vapor.
In one embodiment, the material of the encapsulation adhesive layer is epoxy resin. In one embodiment, the material of the encapsulating adhesive layer is a mixture of epoxy resin and diffusing powder. In one embodiment, the material of the encapsulating adhesive layer is a mixture of epoxy resin and fluorescent powder. The packaging adhesive layer made of epoxy resin or a mixture of epoxy resin and diffusion powder is transparent, and the light emitting color of the LED light source is determined by the LED wafer. The packaging adhesive layer made of the mixture of the epoxy resin and the fluorescent powder is a colored packaging adhesive layer, the specific color is determined by the color of the fluorescent powder, and the luminous color of the LED light source is determined by the effect achieved after the LED wafer excites the fluorescent powder in the packaging adhesive layer.
In one embodiment, the number of the LED chips is more than 2.
In one embodiment, the material of the light reflecting device is epoxy resin glue. In one embodiment, a high reflectivity additive is disposed on the light reflecting means. In one embodiment, at least one of a titanium dioxide layer, an aluminum oxide layer and a silver layer is arranged on the light reflecting device.
In order to further increase the luminous intensity of the LED light source, in one embodiment, the cross-section of the reflector is circular, as shown in fig. 1. In one embodiment, as shown in fig. 2, the cross-section of the reflector has the shape of an N-sided polygon, where N is greater than 4. Therefore, when the light rays in different directions emitted by the LED wafers at different angles irradiate the cambered surface or the reflecting surface at different angles, the light rays can be reflected by the reflecting device more effectively, and the luminous intensity of the LED light source is improved. It should be noted that the cross section of the light reflecting device is a section of the light reflecting device parallel to the bottom of the accommodating groove.
In order to further increase the luminous intensity of the LED light source, in one embodiment, the width of the longitudinal section of the reflector means gradually decreases from the position near the bottom wall of the groove to the position far away from the bottom wall of the groove. In one embodiment, as shown in fig. 3, the reflector has a trapezoidal shape in longitudinal section, and the width of the longitudinal section of the reflector gradually decreases from the vicinity of the bottom wall of the groove to the distance from the bottom wall of the groove. In one embodiment, as shown in fig. 4, the longitudinal section of the reflector is shaped like a horn, and the width of the longitudinal section of the reflector gradually decreases from the vicinity of the bottom wall of the tank to the distance from the bottom wall of the tank. In one embodiment, as shown in fig. 5, the reflector has a longitudinal cross-section in the shape of a bell jar, and the width of the longitudinal cross-section of the reflector gradually decreases from the vicinity of the bottom wall of the groove to the distance from the bottom wall of the groove. Therefore, when the light rays in different directions emitted by the LED wafers at different angles irradiate the reflecting device on the inclined plane, the light rays can be more effectively reflected by the reflecting device, and the luminous intensity of the LED light source is improved. It should be noted that the longitudinal section of the light reflecting device is a section of the light reflecting device perpendicular to the bottom of the accommodating groove.
In one embodiment, the reflector has a trapezoidal shape in longitudinal section. In one embodiment, the width of the side of the light reflecting means remote from the trough bottom wall is one half of the width of the side of the light reflecting means adjacent to the trough bottom wall. In one embodiment, the width of the side of the light reflecting device adjacent to the bottom wall of the groove is smaller than the width of the LED chip. In one embodiment, the distance between the LED wafer and the reflecting device is smaller than the width of the LED wafer. In one embodiment, the height of the light emitting device is equal to the height of the LED wafer.
In order to make the light of the LED chip more reflected by the light reflecting means, in one embodiment, the LED chip is arranged around the light reflecting means to form a ring shape. Therefore, the light emitted by each LED chip can be reflected by the reflecting device.
In one embodiment, the present application further discloses a lighting device comprising the LED light source according to any of the above embodiments.
Above-mentioned lighting device, through set up reflex reflector in the support of LED light source to make each LED wafer in the support set up around reflex reflector, be equivalent to the LED wafer by the lateral wall of outer support and including the surface surrounding of reflex reflector, make each LED wafer can reflect away toward the light homoenergetic of equidirectional transmission, improve the luminous efficacy of each LED wafer, use less LED wafer also can reach anticipated light efficiency, reduce the cost of LED light source.
In one embodiment, the present application further discloses a display device comprising the LED light source according to any of the above embodiments.
Above-mentioned display device, through set up reflex reflector in the support of LED light source to make each LED wafer in the support set up around reflex reflector, be equivalent to the LED wafer by the lateral wall of outer support and including the surface surrounding of reflex reflector, make each LED wafer can reflect away toward the light homoenergetic of equidirectional transmission, improve the luminous efficacy of each LED wafer, use less LED wafer also can reach anticipated light efficiency, reduce the cost of LED light source.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An LED light source, comprising: the LED chip comprises a support, a reflecting device and a plurality of LED chips;
the support is provided with an accommodating groove, the bottom wall of the accommodating groove is provided with an installation position, and the light reflecting device is arranged in the accommodating groove and positioned on the installation position;
the support is provided with an accommodating groove, the bottom wall of the accommodating groove is provided with a plurality of LED bonding pads, each LED bonding pad corresponds to each LED wafer one by one, each LED wafer is arranged on each LED bonding pad in a one-to-one correspondence mode and is electrically connected with the LED bonding pad, and each LED wafer surrounds the light reflecting device.
2. The LED light source of claim 1 wherein the reflector has a circular cross-sectional shape.
3. The LED light source of claim 1 wherein the reflector has a cross-sectional shape that is N-sided with N being greater than 4.
4. The LED light source of claim 1 wherein the width of the longitudinal cross-section of the reflector decreases in a direction from adjacent the trough bottom wall to distal the trough bottom wall.
5. The LED light source of claim 1 wherein the reflector has a longitudinal cross-section that is trapezoidal in shape, the width of the longitudinal cross-section of the reflector decreasing in a direction from adjacent the channel bottom wall to distal the channel bottom wall.
6. The LED light source of claim 1 wherein the reflector has a longitudinal cross-section that is flared, the width of the longitudinal cross-section of the reflector decreasing in a direction from adjacent the channel bottom wall to distal the channel bottom wall.
7. The LED light source of claim 1 wherein the reflector has a longitudinal cross-section that is bell-shaped, the width of the longitudinal cross-section of the reflector decreasing in a direction from adjacent the trough bottom wall to distal the trough bottom wall.
8. The LED light source of claim 1 wherein the LED die is disposed around the reflector to form a ring.
9. A lighting device comprising the LED light source of any one of claims 1 to 8.
10. A display device comprising the LED light source according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122406819.6U CN215869379U (en) | 2021-09-30 | 2021-09-30 | LED light source, lighting device and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122406819.6U CN215869379U (en) | 2021-09-30 | 2021-09-30 | LED light source, lighting device and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215869379U true CN215869379U (en) | 2022-02-18 |
Family
ID=80260191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122406819.6U Expired - Fee Related CN215869379U (en) | 2021-09-30 | 2021-09-30 | LED light source, lighting device and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215869379U (en) |
-
2021
- 2021-09-30 CN CN202122406819.6U patent/CN215869379U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220218 |
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| CF01 | Termination of patent right due to non-payment of annual fee |