CN215787514U - Protection film laser cutting machine - Google Patents
Protection film laser cutting machine Download PDFInfo
- Publication number
- CN215787514U CN215787514U CN202022891688.0U CN202022891688U CN215787514U CN 215787514 U CN215787514 U CN 215787514U CN 202022891688 U CN202022891688 U CN 202022891688U CN 215787514 U CN215787514 U CN 215787514U
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- laser cutting
- driving
- protective film
- cutting machine
- laser
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 120
- 230000007246 mechanism Effects 0.000 claims abstract description 81
- 230000001681 protective effect Effects 0.000 claims abstract description 59
- 238000005520 cutting process Methods 0.000 claims abstract description 29
- 230000001360 synchronised effect Effects 0.000 claims description 17
- 230000003993 interaction Effects 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 19
- 239000007769 metal material Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 64
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of cutting equipment, in particular to a laser cutting machine for a protective film. Protection film laser cutting machine includes workstation, laser cutting mechanism and actuating mechanism, the workstation has the mesa that is used for placing the protection film, laser cutting mechanism is located the top of workstation to can remove along the direction parallel with the mesa, laser cutting mechanism includes laser generator, and laser cutting mechanism passes through laser generator and cuts on the protection film and form specific pattern, actuating mechanism is connected with laser cutting mechanism, in order to be used for driving laser cutting mechanism and remove along the direction parallel with the mesa. This protection film laser cutting machine can be automatically treat and directly carry out laser cutting on the processing protection film and obtain required pattern, has effectively realized treating the automatic cutting of processing protection film, and the better cutting demand that satisfies the protection film of treating processing. The laser cutting machine for the protective film can be used for cutting and processing the protective film and can also be used for cutting and processing other small non-metallic materials.
Description
Technical Field
The utility model relates to the technical field of cutting equipment, in particular to a laser cutting machine for a protective film.
Background
The laser cutting machine is a device which focuses laser emitted from a laser generator into laser beams with high power density through an optical path system, and the laser beams irradiate the surface of a medium to be processed so as to cut the medium to be processed into a specific pattern. The laser cutting processing method has the advantages of high processing precision, low processing cost and the like, and is widely applied to the manufacturing industry.
In recent years, with the rapid development of laser cutting technology, laser cutting has also been used in electronic fields such as protective films, however, the existing laser cutting machine still has the problems of insufficient precision, insufficient reliability and the like when cutting thin films such as protective films, and a laser cutting machine suitable for automatic cutting of protective films to form specific patterns is still lacking.
SUMMERY OF THE UTILITY MODEL
The main purposes of the utility model are: the protective film laser cutting machine can automatically cut and form specific patterns on the protective film so as to better meet the cutting requirement of the protective film.
In order to achieve the above technical problem, the present invention provides a protective film laser cutting machine, which includes a worktable having a table top for placing a protective film, a laser cutting mechanism located above the worktable and capable of moving in a direction parallel to the table top, the laser cutting mechanism including a laser generator, and the laser cutting mechanism cutting the protective film to form a specific pattern by the laser generator, and a driving mechanism connected to the laser cutting mechanism for driving the laser cutting mechanism to move in the direction parallel to the table top.
Optionally, the laser cutting mechanism further comprises a moving seat, the moving seat is capable of moving along a direction parallel to the table top, and the laser generator is held on the moving seat.
Optionally, the position of the laser generator in the height direction relative to the moving seat is adjustable, so that the position of the laser generator relative to the plane of the table top is adjusted.
Optionally, the driving mechanism includes a first driving assembly and a second driving assembly, the first driving assembly is configured to drive the laser cutting mechanism to move along a first direction parallel to the table top, the second driving assembly is configured to drive the laser cutting mechanism to move along a second direction parallel to the table top, and the second direction is perpendicular to the first direction.
Optionally, the first driving assembly includes a first driving wheel, a first driven wheel, a first driving member for rotationally driving the first driving wheel, and a first synchronous belt wound around the first driving wheel and the first driven wheel;
the second driving assembly comprises a second driving wheel, a second driven wheel, a second driving piece used for rotationally driving the second driving wheel and a second synchronous belt wound on the second driving wheel and the second driven wheel.
Optionally, the inner circumferential surface of the first synchronous belt has first teeth that mate with the first drive wheel;
the inner peripheral surface of the second synchronous belt is provided with second teeth matched with the second driving wheel.
Optionally, the protective film laser cutting machine further comprises a positioning element, and the positioning element is used for positioning the cutting position of the laser generator.
Optionally, the worktable comprises a vacuum plate, a negative pressure chamber and a negative pressure machine, the vacuum plate is located above the negative pressure chamber and has the table top, the vacuum plate is provided with a plurality of air holes communicated with the negative pressure chamber, and the negative pressure machine can enable the negative pressure chamber to form negative pressure through the air holes.
Optionally, the protection film laser cutting machine further comprises a control mechanism, the control mechanism comprises a control part and an interaction part, the control part is electrically connected with the driving mechanism and used for controlling the laser cutting mechanism to move, the interaction part is electrically connected with the control part and comprises an input panel and a display panel, the input panel is used for inputting a movement instruction, and the display panel is used for displaying the movement instruction.
Optionally, the laser cutting machine for the protective film further comprises a frame, and the workbench, the laser cutting mechanism and the driving mechanism are all located on the frame.
The utility model has the beneficial effects that: according to the protective film laser cutting machine, during laser cutting, a to-be-processed protective film is placed on the table top of the workbench, the driving mechanism drives the laser cutting mechanism to move to the position of the to-be-processed protective film along the direction parallel to the table top, then the driving mechanism continues to drive the laser cutting mechanism to move according to a specific path and cut through the laser generator, so that the to-be-processed protective film is cut to form a specific pattern, and laser cutting of the to-be-processed protective film is completed. This protection film laser cutting machine is through setting up laser cutting mechanism and actuating mechanism, can be automatically treat to process directly on the protection film laser cutting and obtain required pattern, has effectively realized the automatic cutting of treating the processing protection film, and the better cutting demand that satisfies the protection film of treating processing. In addition, the laser cutting machine for the protective film can be used for cutting and processing the protective film and other small non-metallic materials.
Drawings
The advantages of the above and/or additional aspects of the present invention will become apparent and readily appreciated from the following description of the embodiments taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural view of a protective film laser cutting machine of the present invention;
fig. 2 is a front view of the laser cutter of fig. 1.
Wherein the corresponding relations between the reference numbers and the names of the components in fig. 1 and 2 are as follows:
10. a work table; 11. a vacuum plate; 111. a table top; 12. a negative pressure chamber;
20. a laser cutting mechanism; 21. a laser generator; 22. a movable seat;
30. a drive mechanism; 31. a first drive assembly; 311. a first drive wheel; 312. a first driven wheel; 313. a first driving member; 314. a first synchronization belt; 32. a second drive assembly;
40. a control mechanism; 41. an interaction section;
50. and a frame.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the utility model will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the communication may be direct, indirect via an intermediate medium, or internal to both elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
An embodiment of the present invention provides a protective film laser cutting machine capable of automatically cutting a protective film to form a specific pattern, so as to better meet the cutting requirement of the protective film. As shown in fig. 1 and 2, the laser cutting machine for protecting film comprises a worktable 10, a laser cutting mechanism 20 and a driving mechanism 30, wherein the worktable 10 is provided with a table 111 for placing the protecting film, the laser cutting mechanism 20 is positioned above the worktable 10 and can move along a direction parallel to the table 111, the laser cutting mechanism 20 comprises a laser generator 21, the laser cutting mechanism 20 forms a specific pattern on the protecting film by cutting through the laser generator 21, and the driving mechanism 30 is connected with the laser cutting mechanism 20 and is used for driving the laser cutting mechanism 20 to move along a direction parallel to the table 111.
According to the protective film laser cutting machine, during laser cutting, a protective film to be processed is placed on the table top 111 of the workbench 10, the driving mechanism 30 drives the laser cutting mechanism 20 to move to the position of the protective film along the direction parallel to the table top 111, then the driving mechanism 30 continues to drive the laser cutting mechanism 20 to move according to a specific path, cutting is carried out through the laser generator 21, the protective film to be processed is cut to form a specific pattern, and laser cutting of the protective film to be processed is completed. This protection film laser cutting machine is through setting up laser cutting mechanism 20 and actuating mechanism 30, can be automatically treat to process directly to carry out laser cutting on the protection film and obtain required pattern, has effectively realized treating the automatic cutting of processing the protection film, and the better cutting demand that satisfies the protection film of treating processing. In addition, the laser cutting machine for the protective film can be used for cutting and processing the protective film and other small non-metallic materials.
In this embodiment, the laser generator 21 may be a gas laser generator 21, such as a carbon dioxide laser generator 21, and the gas laser generator 21 is excited by electric discharge, and is a continuous wave processing, because the gas laser generator 21 can generate a large amount of heat during laser processing, the cutting amount is large, and the cost of using the gas laser generator 21 is low. Alternatively, in this embodiment, the laser generator 21 may be a solid-state laser generator 21, and the solid-state laser generator 21 is excited by a lamp, a semiconductor laser array, or other laser irradiation pump, and is used for pulse wave processing, and the cutting is more precise due to the short pulse time of the solid-state laser generator 21.
In the present embodiment, the laser cutting mechanism 20 further includes a moving base 22, the moving base 22 is capable of moving in a direction parallel to the table 111, and the laser generator 21 is held on the moving base 22. When performing laser cutting, the protective film to be processed is placed on the table surface 111 of the worktable 10, and the driving mechanism 30 drives the movable base 22 to move according to a specific path and simultaneously drives the laser generator 21 to move, so as to cut the protective film to be processed into a specific pattern. Through setting up the removal seat 22, be convenient for install laser generator 21, and then remove seat 22 through the drive and drive laser generator 21 and remove according to specific route and cut simple structure, the drive of being convenient for.
Further, in the present embodiment, the position of the laser generator 21 relative to the movable base 22 in the height direction is adjustable, so as to adjust the position of the laser generator 21 relative to the plane of the table 111. Specifically, in this embodiment, the protection film laser cutting machine further includes an adjusting bolt, a mounting hole for mounting the adjusting bolt is provided on the movable base 22, and a bar-shaped hole extending in the vertical direction is provided on the housing of the laser generator 21. During installation, the adjusting bolt sequentially passes through the strip-shaped hole and the mounting hole to hold the laser generator 21 on the movable base 22. Since the laser generator 21 is mounted on the movable base 22 through the bar-shaped hole, the laser generator 21 can be raised or lowered relative to the table 111 by changing the position of the adjusting bolt in the bar-shaped hole, so as to adjust the laser focus position formed by the laser generator 21, which is the plane position of the protective film. Therefore, the position of the laser generator 21 relative to the table board 111 can be adjusted according to the cutting requirement of the protective film to be processed before laser cutting, the laser generator 21 can be guaranteed to smoothly perform laser cutting on the protective film to be processed, and the laser cutting quality and the laser cutting efficiency are improved.
In the present embodiment, the driving mechanism 30 includes a first driving assembly 31 and a second driving assembly 32, the first driving assembly 31 is used for driving the laser cutting mechanism 20 to move along a first direction parallel to the table 111, the second driving assembly 32 is used for driving the laser cutting mechanism 20 to move along a second direction parallel to the table 111, and the second direction is perpendicular to the first direction. Specifically, in this embodiment, the protective film laser cutting machine further includes a first guide rail and a second guide rail perpendicular to the first guide rail. During laser cutting, the protective film to be processed is placed on the table board 111, the first driving component 31 drives the laser cutting mechanism 20 to horizontally move along the first guide rail in the first direction, the second driving component 32 drives the laser cutting mechanism 20 to horizontally move along the second guide rail in the second direction, so that the horizontal movement of the laser cutting mechanism 20 in the first direction and the second direction is realized, a specific pattern is formed on the protective film to be processed along the first direction and the second direction, the laser cutting of the protective film to be processed is completed, and the deviation can be corrected by arranging the first guide rail and the second guide rail, so that the precision of the laser cutting is further ensured.
Further, in this embodiment, the first driving assembly 31 includes a first driving wheel 311, a first driven wheel 312, a first driving element 313 for rotationally driving the first driving wheel 311, and a first synchronous belt 314 wound around the first driving wheel 311 and the first driven wheel 312, the second driving assembly 32 includes a second driving wheel, a second driven wheel, a second driving element for rotationally driving the second driving wheel, and a second synchronous belt wound around the second driving wheel and the second driven wheel, and both the first driving element 313 and the second driving element are motors. During laser cutting, the first driving member 313 drives the first driving wheel 311 to rotate, and simultaneously drives the first driven wheel 312 to rotate synchronously through the first synchronous belt 314, so as to drive the movable base 22 to move along the first direction, and similarly, the second driving member 32 drives the movable base 22 to move along the second direction, so that the laser generator 21 moves and cuts along the first direction and the second direction. First drive assembly 31 and second drive assembly 32 all adopt the drive structure of hold-in range, synchronizing wheel, not only can guarantee laser cutting precision, simple structure, with low costs moreover. In addition, the first driving assembly 31 may include two first driven wheels 312 and two first synchronous belts 314 to adjust the rotation speed, and similarly, the second driving assembly 32 may also include two second driven wheels and two second synchronous belts to further improve the quality of the laser cutting. Of course, in other embodiments, the first driving assembly 31 and the second driving assembly 32 may also adopt other structural forms.
It should be noted that, in the present embodiment, the inner circumferential surface of the first synchronous belt 314 has first teeth which are engaged with the first driving wheel 311. Specifically, in the present embodiment, the width of the first tooth is set to 0.1 mm. Since the inner peripheral surface of the first synchronous belt 314 has the first teeth with the width set to 0.1 mm, which are matched with the first driving wheel 311, the movement of the laser cutting mechanism 20 in the first direction can be finely controlled, so that the precision of the laser cutting machine for the protective film to be processed in laser cutting is controlled within 0.1 mm, and the precision and reliability requirements of the film such as the protective film are met. In a similar way, the inner peripheral surface of the second synchronous belt is provided with a second tooth matched with the second driving wheel, the width of the second tooth is also a set value, and the laser cutting precision is further ensured.
In this embodiment, the laser cutting machine for protective film further comprises a positioning element, which is mounted on the movable base 22 and is used for positioning the cutting position of the laser generator 21, and preferably, the positioning element is positioned by using a CCD. Through setting up the locating element to can carry out accurate location to the cutting position of protection film earlier when laser cutting, avoid appearing the cutting deviation.
In this embodiment, the table 10 includes a vacuum plate 11, a negative pressure chamber 12, and a negative pressure machine, the vacuum plate 11 is located above the negative pressure chamber 12 and has a table surface 111, the vacuum plate 11 is provided with a plurality of air holes communicating with the negative pressure chamber 12, and the negative pressure machine can make the negative pressure chamber 12 form a negative pressure through the air holes. So, when placing the protection film of waiting to process on mesa 111, the air in negative pressure room 12 is discharged in order to set for the negative pressure to the negative pressure machine to can adsorb the protection film of waiting to process fixedly, make the relative position of the protection film of waiting to process at mesa 111 when carrying out laser cutting work unchangeable, guarantee the precision of laser cutting.
In this embodiment, the laser cutting machine for protecting film further includes a control mechanism 40, the control mechanism 40 includes a control portion and an interaction portion 41, the control portion is electrically connected to the driving mechanism 30 for controlling the movement of the laser cutting mechanism 20, the interaction portion 41 is electrically connected to the control portion and includes an input panel and a display panel, the input panel is used for inputting a movement instruction, and the display panel is used for displaying the movement instruction. Before laser cutting, the processing shape data can be input through the interaction part 41 and sent to the control part, the control part reads the processing shape data and controls the first driving assembly 31 and the second driving assembly 32 to carry out driving operation so as to carry out laser cutting on the protective film, the automation of the whole laser cutting operation is realized, and the processing shape data can be displayed through the display panel.
In addition, in the present embodiment, the laser cutting machine for protecting film further includes a frame 50, and the worktable 10, the laser cutting mechanism 20 and the driving mechanism 30 are all located on the frame 50. The frame 50 is provided to horizontally hold the table 10 and also serves as a mounting base for the laser cutting mechanism 20, the driving mechanism 30, the control mechanism 40, and other various structures.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (9)
1. A protective film laser cutting machine characterized by comprising:
the workbench is provided with a table top for placing the protective film;
a laser cutting mechanism which is positioned above the workbench and can move along the direction parallel to the table top, wherein the laser cutting mechanism comprises a laser generator, and a specific pattern is formed on the protective film by cutting through the laser generator by the laser cutting mechanism; and
the driving mechanism is connected with the laser cutting mechanism and used for driving the laser cutting mechanism to move along the direction parallel to the table top, the driving mechanism comprises a first driving component and a second driving component, the first driving component is used for driving the laser cutting mechanism to move along the first direction parallel to the table top, the second driving component is used for driving the laser cutting mechanism to move along the second direction parallel to the table top, and the second direction is perpendicular to the first direction.
2. The protective film laser cutting machine according to claim 1, characterized in that: the laser cutting mechanism further comprises a moving seat, the moving seat can move along the direction parallel to the table top, and the laser generator is kept on the moving seat.
3. The protective film laser cutting machine according to claim 2, characterized in that: the position of the laser generator relative to the moving seat in the height direction can be adjusted, so that the position of the laser generator relative to the plane of the table top is adjusted.
4. The protective film laser cutting machine according to claim 1, characterized in that: the first driving assembly comprises a first driving wheel, a first driven wheel, a first driving piece and a first synchronous belt, wherein the first driving piece is used for driving the first driving wheel in a rotating mode, and the first synchronous belt is wound on the first driving wheel and the first driven wheel;
the second driving assembly comprises a second driving wheel, a second driven wheel, a second driving piece used for rotationally driving the second driving wheel and a second synchronous belt wound on the second driving wheel and the second driven wheel.
5. The protective film laser cutting machine according to claim 4, characterized in that: the inner circumferential surface of the first synchronous belt is provided with first teeth matched with the first driving wheel;
the inner peripheral surface of the second synchronous belt is provided with second teeth matched with the second driving wheel.
6. The protective film laser cutting machine according to claim 1, characterized in that: the protective film laser cutting machine further comprises a positioning element, and the positioning element is used for positioning the cutting position of the laser generator.
7. The protective film laser cutting machine according to claim 1, characterized in that: the worktable comprises a vacuum plate, a negative pressure chamber and a negative pressure machine, wherein the vacuum plate is positioned above the negative pressure chamber and is provided with the table board, the vacuum plate is provided with a plurality of air holes communicated with the negative pressure chamber, and the negative pressure machine can enable the negative pressure chamber to form negative pressure through the air holes.
8. The protective film laser cutting machine according to claim 1, characterized in that: the protection film laser cutting machine further comprises a control mechanism, the control mechanism comprises a control portion and an interaction portion, the control portion is electrically connected with the driving mechanism and used for controlling the laser cutting mechanism to move, the interaction portion is electrically connected with the control portion and comprises an input panel and a display panel, the input panel is used for inputting a moving instruction, and the display panel is used for displaying the moving instruction.
9. The protective film laser cutting machine according to claim 1, characterized in that: the protective film laser cutting machine further comprises a frame, and the workbench, the laser cutting mechanism and the driving mechanism are all located on the frame.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202022891688.0U CN215787514U (en) | 2020-12-02 | 2020-12-02 | Protection film laser cutting machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202022891688.0U CN215787514U (en) | 2020-12-02 | 2020-12-02 | Protection film laser cutting machine |
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CN215787514U true CN215787514U (en) | 2022-02-11 |
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CN202022891688.0U Expired - Fee Related CN215787514U (en) | 2020-12-02 | 2020-12-02 | Protection film laser cutting machine |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118472780A (en) * | 2024-07-15 | 2024-08-09 | 长春中科长光时空光电技术有限公司 | Laser chip processing device |
-
2020
- 2020-12-02 CN CN202022891688.0U patent/CN215787514U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118472780A (en) * | 2024-07-15 | 2024-08-09 | 长春中科长光时空光电技术有限公司 | Laser chip processing device |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220211 |
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