CN215615644U

CN215615644U - Thing networking baseband data processing apparatus

Info

Publication number: CN215615644U
Application number: CN202121555050.8U
Authority: CN
Inventors: 易程杰
Original assignee: Shenzhen Lianwo Information Technology Co ltd
Current assignee: Shenzhen Lianwo Information Technology Co ltd
Priority date: 2021-07-08
Filing date: 2021-07-08
Publication date: 2022-01-25
Anticipated expiration: 2031-07-08

Abstract

The utility model discloses an internet of things baseband data processing device, which relates to the technical field of baseband data processing equipment and comprises a mounting seat, a machine body, an upper cover, a sealing ring and an observation window, wherein the machine body is fixedly mounted on the upper surface of the mounting seat, the upper cover is mounted at the top of the machine body through a hinge, the sealing ring is pasted on the side wall of the upper cover, the observation window is embedded on the surface of the upper cover, a mounting inclined plate is fixedly mounted at the top of an inner cavity of the machine body, a heating pipe is mounted on the lower surface of the mounting inclined plate, a semiconductor refrigerating sheet is mounted on the side wall of the bottom of the heating pipe, a refrigerating table is mounted on the surface of one side of the semiconductor refrigerating sheet, and a circulating fan is mounted on the surface of the refrigerating table. The utility model can improve the uniformity of heating the solder paste when in use, and can cool the base band at the same time, thereby avoiding the damage of the base band when in heating, and the utility model has safer use, faster processing speed of the base band and more convenient use.

Description

Thing networking baseband data processing apparatus

Technical Field

The utility model relates to the technical field of baseband data processing equipment, in particular to an internet of things baseband data processing device.

Background

Internet of things baseband-called microcircuits (microcircuits), microchips (microchips), and chips (chips) are one way to miniaturize circuits (mainly including semiconductor devices, also including passive components, etc.) in electronics, and are typically fabricated on the surface of a semiconductor wafer. The integrated circuit manufactured on the surface of the semiconductor chip is also called a thin-film (thin-film) integrated circuit. Another type of thick-film (thick-film) hybrid integrated circuit (ic) is a miniaturized circuit formed by a separate semiconductor device and passive components integrated onto a substrate or circuit board. This document relates to monolithic (monolithic) integrated circuits, i.e., thin film integrated circuits. After the utility model of the transistor is produced in large quantities, various solid semiconductor components such as diodes, transistors and the like are used in large quantities, and the functions and roles of the vacuum tube in the circuit are replaced. By the middle and late 20 th century, semiconductor manufacturing technology advances, making integrated circuits possible. It is a great advance that integrated circuits can integrate a very large number of micro-transistors into a single small chip, as opposed to manually assembling the circuits using individual discrete electronic components. The large-scale throughput, reliability, and modularity of circuit design of integrated circuits ensures that standardized ICs are quickly adopted instead of using discrete transistors for the design.

The existing internet of things baseband data processing device is uneven in heating of solder paste when processing the internet of things baseband data, the temperature is high in the heating process, damage to the internet of things baseband is easily caused, and the using effect of the internet of things baseband data processing device is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model provides an internet of things baseband data processing device which has the advantages of high temperature prevention, safe heating and high processing efficiency, and solves the problems that when the existing internet of things baseband data processing device processes internet of things baseband data, tin paste is not uniformly heated, and the temperature is high during heating, so that the internet of things baseband is easily damaged, and the using effect of the internet of things baseband data processing device is greatly reduced.

In order to realize the purposes of high temperature prevention, safe heating and high treatment efficiency, the utility model provides the following technical scheme: the utility model provides a thing networking baseband data processing apparatus, includes mount pad, organism, upper cover, sealing washer and observation window, fixed surface installs the organism on the mount pad, there is the upper cover organism at the organism top through the hinge mounting, the upper cover lateral wall is pasted and is had the sealing washer, upper cover surface mosaic has the observation window, inner chamber of the engine top fixed mounting has the installation swash plate, surface mounting has the heating pipe under the installation swash plate, semiconductor refrigeration piece is installed to heating pipe bottom lateral wall, semiconductor refrigeration piece one side surface mounting has the refrigeration platform, refrigeration platform surface mounting has circulating fan, semiconductor refrigeration piece opposite side surface mounting has radiating fin, radiating fin surface mounting has radiator fan.

As a preferred technical scheme, a first mounting groove is formed in the surface of one side of the machine body, a second mounting groove is formed below the first mounting groove, a first mounting plate is movably mounted in the inner cavity of the first mounting groove, and a second mounting plate is movably mounted in the inner cavity of the second mounting groove.

As a preferred technical scheme, guide grooves are formed in two sides of the first mounting plate and the second mounting plate, and guide seats are arranged in inner cavities of the first mounting groove and the second mounting groove.

As a preferred technical scheme, the first mounting plate is provided with a first limiting groove on the surface, a tin coating plate is movably mounted in the inner cavity of the first limiting groove, and limiting seats are slidably mounted on two sides of the first limiting groove.

As a preferred technical scheme of the utility model, a second limiting groove is formed in the surface of the second mounting plate, and a baseband data main body is movably mounted in the inner cavity of the second limiting groove.

According to a preferable technical scheme of the utility model, an electric telescopic rod is fixedly installed at the bottom of the inner cavity of the machine body, a top plate is fixedly installed at the top of the electric telescopic rod, and a rubber supporting pad is installed on the surface of the top plate.

Compared with the prior art, the utility model provides an Internet of things baseband data processing device, which has the following beneficial effects:

1. this thing networking baseband data processing apparatus, the heating pipe can release the heat after the circular telegram, thereby realize the heating to the tin cream, the heating pipe can be to the even shining of tin cream, can make the heating more even to the tin cream, semiconductor material's Peltier effect can be played through semiconductor refrigeration piece below the baseband data main part, cold volume transmits to the refrigeration bench, and by the air flow rate on circulating fan acceleration refrigeration bench surface, thereby can realize the effect that plays the cooling to baseband data main part lower surface, avoid when heating the tin cream, heat transfer causes the damage of baseband data main part to baseband data main part inner chamber, the heat that the opposite side surface of refrigeration piece released transmits on the fin, can cool down the semiconductor refrigeration piece with radiator fan mutually supporting.

2. This thing networking baseband data processing apparatus mutually supports through a mounting panel and No. two mounting panels and can realize the rapid processing to the baseband data main part, uses more swiftly.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

FIG. 3 is a schematic structural diagram of a first mounting plate according to the present invention;

FIG. 4 is a schematic view of the second mounting plate structure of the present invention.

In the figure: 1. a mounting seat; 101. a body; 102. an upper cover; 103. a seal ring; 104. an observation window; 2. a first mounting groove; 201. a first mounting plate; 202. mounting grooves II; 203. a second mounting plate; 204. a guide seat; 205. a guide groove; 206. a first limit groove; 207. coating tin plates; 208. a limiting seat; 209. a second limiting groove; 210. a baseband data body; 3. installing an inclined plate; 301. heating a tube; 4. an electric telescopic rod; 401. a top plate; 402. a rubber support pad; 5. a semiconductor refrigeration sheet; 501. a refrigeration station; 502. a circulating fan; 503. a heat dissipating fin; 504. a heat dissipation fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the utility model discloses an internet of things baseband data processing device, which comprises a mounting base 1, a machine body 101, an upper cover 102, a sealing ring 103 and an observation window 104, wherein the machine body 101 is fixedly mounted on the upper surface of the mounting base 1, the upper cover 102 is mounted on the top of the machine body 101 through a hinge, the sealing ring 103 is adhered on the side wall of the upper cover 102, the observation window 104 is embedded on the surface of the upper cover 102, a mounting inclined plate 3 is fixedly mounted on the top of the inner cavity of the machine body 101, a heating pipe 301 is mounted on the lower surface of the mounting inclined plate 3, a semiconductor refrigeration sheet 5 is mounted on the side wall of the bottom of the heating pipe 301, a refrigeration table 501 is mounted on the surface of one side of the semiconductor refrigeration sheet 5, a circulating fan 502 is mounted on the surface of the refrigeration table 501, a heat dissipation fin 503 is mounted on the other side surface of the semiconductor refrigeration sheet 5, and a heat dissipation fan 504 is mounted on the surface of the heat dissipation fin 503, heating pipe 301 circular telegram back releasable heat, thereby realize the heating to the tin cream, heating pipe 301 can be to the even shining of tin cream, can make the heating more even to the tin cream, baseband data main part 210 below utilizes semiconductor material's Peltier effect can play refrigerated effect through semiconductor refrigeration piece 5, cold volume transmits on refrigeration platform 501, and by circulating fan 502 air velocity on refrigeration platform 501 surface with higher speed, thereby can realize playing the effect of cooling to baseband data main part 210 lower surface, avoid when heating the tin cream, heat transfer causes baseband data main part 210's damage to baseband data main part 210 inner chamber, the heat that releases of the other side surface of refrigeration piece 5 transmits on radiating fin 503, can cool down semiconductor refrigeration piece 5 mutually in mutually supporting with radiator fan 504.

Specifically, a mounting groove 2 has been seted up to organism 101 a side surface, No. 2 mounting grooves 202 are installed to a mounting groove below, No. 2 inner chamber movable mounting of mounting groove have mounting panel 201, No. two mounting panel 203 are installed to mounting groove 202 inner chamber movable mounting.

In this embodiment, No. one mounting panel 201 and No. two mounting panels 203 are installed respectively in No. one mounting groove 2 and No. two mounting groove 202 inner cavities.

Specifically, guide way 205 has all been seted up to a mounting panel 201 and No. two mounting panels 203 both sides, guide holder 204 is all installed to a mounting groove 2 and No. two mounting groove 202 inner chamber.

In this embodiment, the guide seat 204 and the guide groove 205 are matched with each other to guide the first mounting plate 201 and the second mounting plate 203.

Specifically, a limiting groove 206 has been seted up on a mounting panel 201 surface, a limiting groove 206 inner chamber movable mounting has scribbles tin plate 207, the equal slidable mounting in a limiting groove 206 both sides has spacing seat 208.

In this embodiment, the first limiting groove 206 can be used for installing the tin-coated plate 207, and the limiting seat 208 is used for limiting the tin-coated plate 207.

Specifically, No. two spacing grooves 209 have been seted up on No. two mounting panels 203 surface, No. two spacing groove 209 inner chamber movable mounting has baseband data main part 210.

In this embodiment, the baseband data main body 210 can be limited by the second limiting groove 209.

Specifically, body 101 inner chamber bottom fixed mounting has electric telescopic handle 4, 4 top fixed mounting of electric telescopic handle has roof 401, roof 401 surface mounting has rubber supporting pad 402.

In this embodiment, stretch out and draw back through control electric telescopic handle 4 to accessible roof 401 is fixed baseband data main part 210, can play the effect of buffering through rubber supporting pad 402, avoids causing baseband data main part 210's damage.

The working principle and the using process of the utility model are as follows: when the device is used, the machine body 101 can be installed and fixed through the installation seat 1, the first installation plate 201 and the second installation plate 203 are respectively pulled out from the first installation groove 2 and the second installation groove 202, the baseband data main body 210 is placed in the second limiting groove 209, the contact of the baseband data main body 210 faces upwards, the tin-coated plate 207 matched with the baseband data main body 210 is placed in the first limiting groove 206, the limiting seat 208 is pushed, the limiting seat 208 plays a limiting role on the tin-coated plate 207, the first installation plate 201 and the second installation plate 203 are pushed into the first installation groove 2 and the second installation groove 202, the electric telescopic rod 4 is controlled to stretch and retract, so that the top plate 401 can be pushed to jack up the baseband data main body 210, the contact of the baseband data main body 210 is attached to the tin-coated plate 207, the upper cover 102 is opened, tin paste is coated on the surface of the tin-coated plate 207, and then the redundant tin paste is scraped off, the upper cover 102 is closed, the joint of the upper cover 102 and the machine body 101 can be sealed through the sealing ring 103, an operator can watch the inner cavity of the machine body 101 through the observation window 104, the heating pipe 301 can release heat after being electrified, so that the heating of the solder paste is realized, the heating pipe 301 can uniformly irradiate the solder paste, so that the solder paste can be heated more uniformly, the cooling effect can be realized by utilizing the Peltier effect of a semiconductor material through the semiconductor refrigerating sheet 5 below the baseband data main body 210, the cold energy is transferred to the refrigerating table 501, the air flow rate on the surface of the refrigerating table 501 is accelerated by the circulating fan 502, so that the cooling effect on the lower surface of the baseband data main body 210 can be realized, the phenomenon that the heat is transferred to the inner cavity of the baseband data main body 210 to damage the baseband data main body 210 when the solder paste is heated is avoided, and the heat released by the other side surface of the semiconductor refrigerating sheet 5 is transferred to the radiating fins 503, can cool down semiconductor refrigeration piece 5 mutually supporting with radiator fan 504, handle the completion back to baseband data main part 210, electric telescopic handle 4 contracts, can take out baseband data main part 210 after pulling out No. two mounting panels 203, and the quick processing operation to baseband data main part 210 can be realized to repeated above-mentioned action, uses more convenient.

To sum up, this thing networking baseband data processing apparatus through setting up heating pipe 301, electric telescopic handle 4, roof 401, rubber supporting pad 402, semiconductor refrigeration piece 5, refrigeration platform 501 and circulating fan 502 to solve current thing networking baseband data processing apparatus when handling thing networking baseband data, it is inhomogeneous to the heating of tin cream, the temperature is higher during the concurrent heating, causes the damage of thing networking baseband easily, greatly reduced the problem of thing networking baseband data processing apparatus's result of use.

It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a thing networking baseband data processing apparatus, includes mount pad (1), organism (101), upper cover (102), sealing washer (103) and observation window (104), fixed surface installs organism (101) on mount pad (1), there is upper cover (102) organism (101) top through hinged mounting, upper cover (102) lateral wall is pasted and is had sealing washer (103), upper cover (102) surface mosaic has observation window (104), its characterized in that: organism (101) inner chamber top fixed mounting has installation swash plate (3), installation swash plate (3) lower surface mounting has heating pipe (301), semiconductor refrigeration piece (5) are installed to heating pipe (301) bottom lateral wall, semiconductor refrigeration piece (5) one side surface mounting has refrigeration platform (501), refrigeration platform (501) surface mounting has circulating fan (502), semiconductor refrigeration piece (5) opposite side surface mounting has radiating fin (503), radiating fin (503) surface mounting has radiator fan (504).

2. The baseband data processing device of the internet of things of claim 1, wherein: organism (101) side surface has seted up mounting groove (2) No. one, mounting groove (2) below is installed No. two mounting grooves (202), mounting groove (2) inner chamber movable mounting has mounting panel (201) No. one, mounting groove (202) inner chamber movable mounting has mounting panel (203) No. two.

3. The baseband data processing device of the internet of things of claim 2, wherein: guide way (205) have all been seted up to mounting panel (201) and No. two mounting panel (203) both sides, guide holder (204) are all installed to mounting groove (2) and No. two mounting groove (202) inner chamber.

4. The baseband data processing device of the internet of things of claim 3, wherein: a spacing groove (206) has been seted up on mounting panel (201) surface, No. one spacing groove (206) inner chamber movable mounting has scribbles tin plate (207), equal slidable mounting in a spacing groove (206) both sides has spacing seat (208).

5. The baseband data processing device of the internet of things of claim 2, wherein: no. two spacing grooves (209) have been seted up on No. two mounting panel (203) surface, No. two spacing groove (209) inner chamber movable mounting has baseband data main part (210).

6. The baseband data processing device of the internet of things of claim 1, wherein: organism (101) inner chamber bottom fixed mounting has electric telescopic handle (4), electric telescopic handle (4) top fixed mounting has roof (401), roof (401) surface mounting has rubber supporting pad (402).