CN215376217U - System case and electronic system using the same - Google Patents

Abstract

The present application relates to a system chassis and an electronic system using the same. The system chassis includes a bottom plate, a first side wall and a second side wall. The backplane defines the width of the system chassis. The first side wall extends substantially vertically from the first end of the base plate. The first side wall includes a first channel that is vertically offset from the floor. The first channel is used for matching with the first rail of the equipment rack. The second side wall extends substantially perpendicularly from the second end of the base plate and is opposite to the first side wall. The second side wall includes a second channel for mating with opposing rails of the equipment rack.

Description

System case and electronic system applying same

[ technical field ] A method for producing a semiconductor device

The present invention relates to a computer system case, and more particularly, to a computer system case having a larger available internal space.

[ background of the utility model ]

The advent of clouds (also known as data centers) for computing applications has increased the need for off-site installations. The data centers store data and run applications that are accessed by users of remotely connected computer devices. Such data centers typically have a large number of servers, switches, and storage devices to store and manage data. A typical data center has a physical rack structure with power and communication connections. Racks are arranged in rows in one or more rooms throughout the data center. Each rack contains a frame having vertically oriented slots or enclosures between two side walls, the slots being capable of receiving a plurality of network devices, such as servers, switches and storage devices. In modern data centers, many such network devices are stacked in such a rack structure. For example, some data centers have tens of thousands of servers with storage and network switches.

Typically, conventional server chassis are connected to a pair of slide rails at the bottom of the server chassis. For example, fig. 1 depicts a top perspective view of a known server chassis 10. The server chassis 10 includes a bottom panel 12, a first side panel 14, and a second side panel 16. First side panel 14 includes a first groove (receive) 24 extending along a length of first side panel 14 and a first lip (lip)25 protruding from first groove 24. The second side panel 16 includes a second groove 26 extending along a length of the second side panel 16 and a second lip 27 protruding from the second groove 26. The main board 50 is mounted on the bottom plate 12 of the server casing 10. Thus, the server chassis 10 can accommodate motherboards having a width up to the width 18 of the backplane 12.

Fig. 2 depicts a front view of the server chassis 10 mounted in the server rack 30. The server rack 30 has a first rack wall 34 and an opposing second rack wall 36. The first slide track 44 is supported by the first frame wall 34 and the second slide track 46 is supported by the second frame wall 36 in a position parallel to the first slide track 44. The first slide 44 fits within the first recess 24 (fig. 1) and the second slide 46 fits within the second recess 26 (fig. 1), thereby allowing the server chassis 10 to be mounted in the server rack 30. To accommodate the first and second rails 44, 46, the width 18 of the floor 12 of the server chassis 10 must be less than the width 38 of the space between the first and second rack walls 34, 36 of the server rack 30.

There is a need for a more efficient use of chassis space that will allow faster computing performance as more components can be inserted into the chassis space. The present disclosure is directed to solving these various problems.

[ Utility model ] content

The terms embodiment and similar terms are intended to refer broadly to all subject matter of the present disclosure and the following claims. It should be understood that statements containing these various terms should not limit the subject matter described herein or the meaning or scope of the claims which follow. The embodiments of the disclosure covered herein are defined by the claims below, not this summary. This summary is a general overview of various aspects of the disclosure and introduces a number of concepts that are further described below in the detailed description section. This summary is not intended to identify key or essential features of the claimed subject matter; nor should it be used solely to determine the scope of the claimed subject matter. The subject matter should be understood by reference to the entire specification of the disclosure, any or all of the drawings, and appropriate portions of each claim.

According to some embodiments of the present disclosure, a system chassis includes a floor, a first sidewall, and a second sidewall. The backplane defines a width of the system chassis. The first sidewall extends substantially perpendicularly from the first end of the bottom plate. The first sidewall includes a first channel vertically offset from the floor. The first channel is configured to mate with a first rail of an equipment rack. The second side wall extends substantially perpendicularly from the second end of the bottom plate and is opposite to the first side wall. The second side wall includes a second channel to mate with an opposing rail of the equipment rack.

In some embodiments, the first sidewall defines a height of the system chassis. In some embodiments, the first side wall has a height of about two rack units. In some embodiments, the first sidewall has a height of about 84.2 mm. In some embodiments, the first channel of the first sidewall is vertically offset from the floor of the system chassis by about 22 mm. In some embodiments, the first channel of the first sidewall is recessed about 5mm relative to the first end of the floor of the system chassis. In some embodiments, the second channel of the second sidewall is vertically offset from the floor of the system chassis. In some embodiments, the system chassis slides into the equipment rack via the first channel and the second channel.

According to some embodiments of the present disclosure, an electronic system includes a first system chassis and an equipment rack. The first system chassis includes a bottom plate, a first sidewall, and a second sidewall. The backplane of the first system chassis defines a width of the first system chassis. The first side wall of the first system chassis extends substantially perpendicularly from the first end of the floor of the first system chassis. The first sidewall of the first system chassis includes a first channel vertically offset from a floor of the first system chassis. The second side wall of the first system chassis extends substantially perpendicularly from the second end of the floor of the first system chassis. The second side wall of the first system chassis is opposite the first side wall of the first system chassis. The second side wall of the first system chassis includes a second channel vertically offset from the floor of the first system chassis. The equipment rack has a first pair of opposing rails at a first height. The first pair of opposing rails is to support the first system chassis via the first channel and the second channel of the first system chassis.

In some embodiments, the first and second sidewalls of the first system chassis define a height of the first system chassis. In some embodiments, the height of the first system chassis is about two rack units. In some embodiments, each of the first and second sidewalls of the first system chassis has a height of about 84.2 mm.

In some embodiments, the first channel and the second channel of the first system chassis are vertically offset from the floor of the first system chassis by about 22 mm. In some embodiments, the first channel of the first system chassis is recessed about 5mm relative to the first end of the floor of the first system chassis and the second channel of the first system chassis is recessed about 5mm relative to the second end of the floor of the first system chassis.

In some embodiments, the electronic system further comprises a motherboard disposed on the bottom panel of the first system chassis. In some embodiments, the motherboard has a width that is about the same as a width of the first system chassis.

In some embodiments, the electronic system further includes a second system chassis and a second pair of opposing rails. The second system chassis includes a backplane that defines a bottom width of the second system chassis. A second pair of opposing rails is connected to the equipment rack at a second elevation. The second pair of opposing rails is configured to support a second system chassis. In some embodiments, the width of the bottom of the second system chassis is less than the width of the first system chassis. In some embodiments, the width of the bottom of the second system chassis is equal to the width of the first system chassis. In some embodiments, the first system chassis and the second system chassis are the same.

The above summary is not intended to represent each embodiment or every aspect of the present disclosure. Rather, the foregoing disclosure provides only examples of some of the novel aspects and features set forth herein. The above features and advantages and other features and advantages of the present disclosure are readily apparent from the following detailed description of the representative embodiments and modes for carrying out the utility model when taken in connection with the accompanying drawings and appended claims.

In order to better appreciate the above and other aspects of the present invention, reference will now be made in detail to the following examples, which are to be read in connection with the accompanying drawings:

[ description of the drawings ]

FIG. 1 depicts a top perspective view of a known server chassis;

FIG. 2 depicts a front view of the known server chassis of FIG. 1 mounted in a server rack;

fig. 3 depicts a top perspective view of a system chassis according to some embodiments of the present disclosure;

fig. 4 illustrates a front view of the system chassis of fig. 3 mounted in an equipment rack, according to some embodiments of the present disclosure;

fig. 5 depicts a front schematic view of the system chassis of fig. 3, according to some embodiments of the present disclosure;

fig. 6 depicts a front view of the system chassis of fig. 3 installed in an equipment rack having an existing server chassis, according to some embodiments of the present disclosure.

[ notation ] to show

10 server chassis

12: bottom plate

14 first side plate

16 second side plate

18: width

24 first groove

25 first lip

26 second groove

27 second lip

30 server rack

34 first frame wall

36 second rack wall

38: width

44 first slide rail

46 second slide rail

50 the main board

100 electronic system

110 system chassis

111 first end

112, bottom plate

113 the second end

114 first side wall

116 second side wall

118,238 width

123 first lower lip

124 first channel

125 first upper lip

126 second channel

127 second upper lip

129 second lower lip

134 first internal pocket

136 second inner cavity

150 host board

152 first heat sink

154 second radiator

160,162,164 Dual inline memory Module

156 first power supply unit

158 second power supply unit

200 multiple component system

230 equipment rack

234 first frame wall

236 second rack wall

244 first guide rail

246 second guide rail

H1, H2 height

300 multiple component system

310 server chassis

344,346 first pair of opposite guide rails

350 host board

[ detailed description ] embodiments

Various embodiments of the present disclosure are described with reference to the drawings, wherein like reference numerals are used to refer to like or equivalent elements throughout. The various drawings are not drawn to scale and the drawings are intended to be illustrative of the utility model only. Several aspects of the utility model are described below with reference to exemplary applications for illustration. It should be understood that numerous specific details, relationships, and methods are set forth to provide a full understanding. One skilled in the relevant art will recognize, however, that the various embodiments can be practiced without one or more of the specific details, or with other methods. In other instances, well-known structures or operations are not shown in detail to avoid obscuring aspects of various embodiments. Various embodiments are not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events.

Elements and limitations that are disclosed, for example, in the abstract, novel summary and detailed description section but not explicitly recited in the claims, are not intended to be incorporated into the claims, either individually or collectively, by implication, inference or otherwise. For purposes of this detailed description, the singular includes the plural and vice versa unless specifically stated otherwise. The term "including" means "including but not limited to". Moreover, approximating language, such as "about," nearly, "" substantially, "" about, "etc., may be used herein to mean, for example," in, "" near, "" close to, "or" within 3-5%, or "within acceptable manufacturing tolerances," or any logical combination thereof.

In connection with the disclosure herein, the term "computer apparatus" or "computer system" or "computer" refers to any electronically or battery powered device having hardware, software, and/or firmware, wherein the software and/or firmware may be configured as operational functions on the apparatus.

The present disclosure is directed to a system chassis having a raised channel relative to a floor of the system chassis. For example, when implemented in a server chassis, the system chassis of the present disclosure may accommodate a wider motherboard and/or more cable routing space than a similarly sized conventional server chassis.

Referring to fig. 3, a top perspective view of the electronic system 100 is shown, according to some embodiments of the present disclosure. For example, electronic system 100 may be a server, a storage device, a router, a switch, and so on. Electronic system 100 includes a system chassis 110, system chassis 110 having a bottom panel 112, a first sidewall 114, and a second sidewall 116. The backplane 112 defines the width of the system chassis 110 (represented by line 118).

The first sidewall 114 extends substantially perpendicularly from the first end 111 of the base plate 112. The first sidewall 114 includes a first channel 124 vertically offset from the floor 112. In some embodiments, the first sidewall 114 includes a first upper lip 125 above the first channel 124 and a first lower lip 123 below the first channel 124. The first upper lip 125 and the first lower lip 123 protrude outwardly (e.g., toward an outer surface of the first sidewall 114, and away from internal components of the electronic system 100) relative to the first channel 124.

A second side wall 116 extends substantially perpendicularly from the second end 113 of the base plate and is opposite the first side wall 114. The second side wall 116 includes a second channel 126 vertically offset from the floor 112. In some embodiments, the second sidewall 116 includes a second upper lip 127 above the second channel 126 and a second lower lip 129 below the second channel 126. In some embodiments, the second sidewall 116 is a mirror image of the first sidewall 114. The second upper lip 127 and the second lower lip 129 protrude outwardly (e.g., toward the outer surface of the second sidewall 116 and away from the internal components of the electronic system 100) relative to the second channel 126.

In some embodiments, electronic system 100 includes a motherboard 150 positioned on the bottom panel 112 of system chassis 110. In this example, the electronic system 100 may be a server including a first Central Processing Unit (CPU) below the first heat sink 152 and a second CPU below the second heat sink 154. A first plurality of dual in-line memory modules (DIMMs) 160 is mounted between the first heat sink 152 and the second heat sink 154. A second plurality of DIMMs 162 is mounted between the first heat sink 152 and the first sidewall 114. A third plurality of DIMMs 164 is mounted between the second heat sink 154 and the second sidewall 116. In some embodiments, the electronic system 100 further includes a first Power Supply Unit (PSU) 156 and a second power supply unit 158.

Referring to fig. 4, a front view of the system chassis 110 mounted in the equipment rack 230 is shown, according to some embodiments of the present disclosure. A multiple component system (multiple component system)200 includes an equipment rack 230 and a system chassis 110. The equipment rack 230 may house multiple electronic systems having a chassis similar to the system chassis 110 or other chassis of different sizes. For example, the equipment racks 230 may house sixteen pieces of equipment, each having a chassis similar to the system chassis 110. The equipment rack 230 includes a first rack wall 234 and an opposing second rack wall 236. The first channel 124 of the system chassis 110 is configured to mate with the first rail 244 of the equipment rack 230. The second channel 126 of the system chassis 110 is configured to mate with an opposing second rail 246 of the equipment rack 230. In some embodiments, the system chassis 110 is configured to slide into the equipment racks 230 via the first rail 244 and the second rail 246. Other rails may be supported at other heights on the side walls 114 and 116 to allow for the installation of other components.

By offsetting (e.g., raising) the first and second channels 124, 126 of the system chassis 110 from the base 112, additional space may be provided to accommodate the first and second rails 244, 246 and not affect the width of the base 112. Accordingly, the width 118 of the bottom panel 112 of the system chassis 110 may occupy the width of the space (represented by line 238) between the first and second rack walls 234, 236 of the equipment rack 230. Thus, because the motherboards 150 are located on the bottom panel 112 of the system chassis 110, the system chassis 110 can accommodate any motherboards to the width represented by line 118 of the bottom panel 112 and, thus, to the width represented by line 238 of the space between the first chassis wall 234 and the second chassis wall 236.

In some implementations, the first side wall 114 and/or the second side wall 116 of the system chassis 110 define a height of the system chassis. In this example, the height of the system chassis 110 is about two standard rack units. In some embodiments, the first sidewall 114 and/or the second sidewall 116 have a height of about 84.2mm (i.e., H1+ H2). In some embodiments, the first channel 124 of the first sidewall 114 is vertically offset from the floor 112 of the system chassis 110 by about 22mm (i.e., H1). Additionally or alternatively, in some embodiments, the second channel 126 of the second sidewall 116 is vertically offset from the floor 112 of the system chassis 110 by about 22 mm.

A system chassis 110 sized for the same equipment rack 230 may accommodate larger motherboards than a conventional server chassis (e.g., server chassis 10 of fig. 1-2) because of the efficient space allocation on the motherboards 150 due to the elevated channels 124, 126. Referring to fig. 5, a front schematic view of a system chassis 110 is shown, according to some embodiments of the present disclosure. For example, in some embodiments, the first channel 124 of the first sidewall 114 is recessed (e.g., laterally offset) by about 5mm (i.e., a1) relative to the first end 111 of the bottom panel 112 of the system chassis 110. Alternatively, in some embodiments, the second channel 126 of the second sidewall 116 is recessed (e.g., laterally offset) by about 5mm (i.e., a2) relative to the second end 113 of the bottom panel 112 of the system chassis 110.

Typically, a single rack, such as the class of equipment racks 230 (fig. 4), has components, such as power supplies, of the class and physical components that hold networked equipment in slots defined by rails (e.g., the first rail 244 and the second rail 246). Network devices require cables to be connected to switches or routers, which are typically mounted in top or bottom slots, to simplify cable connections to the greatest extent possible. The extra space within the system chassis for each network device may be advantageous in efficient routing due to the large number of cables used to connect the network devices in the rack.

Thus, still referring to fig. 5, for the system chassis 110, in some embodiments, the profile difference between the first channel 124 and the first lower lip 123 of the first sidewall 114 provides a first internal pocket 134. Similarly, the difference in profile between the second channel 126 and the second lower lip 129 of the second sidewall 116 may also provide a second interior cavity 136. The first internal cavity 134 and/or the second internal cavity 136 provide additional space above the motherboard 150 that can be used to accommodate additional components for the multi-component system 200, such as additional cables, connectors, VR components, or capacitors. In addition, the system chassis 110 has a lower center of gravity compared to conventional server chassis, and thus the system chassis 110 has better structural stability.

In some embodiments, the system chassis 110 may be used in an equipment rack that already has an existing system chassis that is the same or different from the system chassis 110. Fig. 6 depicts a front view of the system chassis 110 installed in an equipment rack 230 with an existing server chassis 310, according to some embodiments of the present disclosure.

The multi-component system 300 includes an equipment rack 230 that is the same as or similar to the equipment rack 230 in fig. 4. The multi-component system 300 further includes a first pair of opposing rails 344 and 346 connected to the equipment rack 230 at a first elevation. The first pair of opposing rails 344 and 346 are configured to support a system chassis 110, the system chassis 110 being the same as or similar to the system chassis 110 of fig. 3-5.

In some embodiments, the system chassis 110 is mounted above an existing server chassis 310 of the multi-component system 300. In some such embodiments, the existing server chassis 310 is the same as or similar to the server chassis 10 shown in fig. 1. As shown in fig. 6, the system chassis 110 may accommodate motherboards 150 that are wider than the motherboards 350 of the existing server chassis 310. Thus, the system chassis 110 may be incorporated into older electronic systems that still employ traditional server chassis. In some other embodiments, the electronic system may include an equipment rack having only system chassis that are the same as or similar to system chassis 110 in fig. 3.

Although the example systems 100, 200, and 300 include the system chassis 110, vertically offset (e.g., elevated) channels (e.g., reference numerals 124 and 126 in fig. 3) may be built into any chassis of any electronic system. Such electronic systems may include, for example, any type of server, storage device, network switch, communication device, and the like.

While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. Many variations may be made to the disclosed embodiments in light of the disclosure herein without departing from the spirit or scope of the utility model. Thus, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. Rather, the scope of the utility model should be defined in accordance with the appended claims and their equivalents.

Although the utility model has been disclosed with respect to one or more embodiments, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the utility model may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms "includes," including, "" has, "" having, "or variants thereof are used in either the detailed description and/or the claims, such terms are intended to be inclusive in a manner similar to the term" comprising.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Also, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

While the utility model has been described with reference to the above embodiments, it is not intended to be limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the present invention should be determined by the appended claims.

Claims (10)

1. A system chassis, comprising:

a bottom plate defining the width of the system chassis;

a first side wall extending substantially perpendicularly from the first end of the base plate, the first side wall including a first channel vertically offset from the base plate, the first channel for mating with a first rail of an equipment rack; and

a second side wall extending substantially perpendicularly from the second end of the base plate and opposite the first side wall, the second side wall including a second channel for mating with an opposing rail of the equipment rack.

2. The system chassis of claim 1, wherein the first sidewall defines a height of the system chassis.

3. The system chassis of claim 1, wherein the second channel of the second sidewall is vertically offset from the floor of the system chassis.

4. The system chassis of claim 1, wherein the system chassis is configured to slide into the equipment rack via the first channel and the second channel.

5. An electronic system, comprising:

a first system chassis, comprising:

a backplane defining a width of the first system chassis;

a first sidewall extending substantially perpendicularly from the first end of the base plate, the first sidewall including a first channel vertically offset from the base plate; and

a second side wall extending substantially perpendicularly from the second end of the base plate and opposite the first side wall, the second side wall including a second channel vertically offset from the base plate; and

an equipment rack having a first pair of opposing rails at a first height for supporting the first system chassis through the first channel and the second channel of the first system chassis.

6. The electronic system of claim 5, wherein the first sidewall and the second sidewall define a height of the first system chassis.

7. The electronic system of claim 5, further comprising a motherboard disposed on the backplane of the first system chassis.

8. The electronic system of claim 5, further comprising:

a second system chassis including a floor defining a bottom width of the second system chassis; and

a second pair of opposing rails coupled to the equipment rack at a second height, the second pair of opposing rails configured to support the second system chassis.

9. The electronic system of claim 8, wherein the bottom width of the second system chassis is less than the width of the first system chassis.

10. The electronic system of claim 8, wherein the bottom width of the second system chassis is equal to the width of the first system chassis, the first system chassis and the second system chassis being identical.

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