CN215363794U - Wafer frame loading attachment for chip package - Google Patents
Wafer frame loading attachment for chip package Download PDFInfo
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- CN215363794U CN215363794U CN202121889446.6U CN202121889446U CN215363794U CN 215363794 U CN215363794 U CN 215363794U CN 202121889446 U CN202121889446 U CN 202121889446U CN 215363794 U CN215363794 U CN 215363794U
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- driving motor
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- lead screw
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- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 11
- 241000446313 Lamella Species 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 89
- 238000000034 method Methods 0.000 description 14
- 230000033001 locomotion Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses a wafer frame feeding device for chip packaging, which comprises a supporting table, wherein a material taking mechanism and a transferring mechanism for transferring a wafer frame into a frame box are connected to the supporting table; the material taking mechanism comprises a suction assembly, a lifting assembly and a transverse moving assembly, the suction assembly is connected with the lifting assembly, the lifting assembly is connected with the transverse moving assembly, and the transverse moving assembly is connected with the supporting table; the suction assembly comprises a connecting rod, the connecting rod is connected with the lifting assembly, a sucker is fixedly connected to the connecting rod, and the sucker is used for sucking the wafer frame. The wafer frame feeding device for chip packaging provided by the utility model reduces the vibration of the wafer frame box in the wafer frame box and reduces the occurrence of the wafer frame damage phenomenon.
Description
Technical Field
The application relates to the field of chip packaging, in particular to a wafer frame feeding device for chip packaging.
Background
In the semiconductor industry, the storage or transport of various semiconductor devices or semiconductor semi-finished products has become a significant issue. In the case of automated machines, it is critical to efficiently produce semiconductor devices to transport desired materials or semiconductor devices to a desired location.
Semiconductor devices that are often required to be stored or transported include wafers, substrates, masks or wafer frames (waferframes), and the like. And the dimensions used in different semiconductor processes are different, carriers of different sizes are derived.
At present, chinese patent application with application number CN201910510341.6 discloses a horizontal moving device for a wafer frame box and a wafer loading system, which includes a slide rail, a slide block, a horizontal movement driving mechanism, a lifting mechanism, and a bearing structure, wherein the bearing structure is installed on the lifting mechanism, and the slide block is directly or indirectly fixedly connected with the lifting mechanism; the lifting mechanism is used for driving the corresponding bearing structure to do lifting motion, so that the bearing structure can be supported on the lower side of the wafer frame box after being lifted, and the wafer frame box can be loaded; the horizontal movement driving mechanism can drive the sliding block to horizontally move along the sliding rail, so that the lifting mechanism directly or indirectly connected to the sliding block, the bearing structure and the wafer frame box synchronously move horizontally.
In view of the above-mentioned related art, the inventor believes that the wafer frame is accommodated by moving the wafer frame cassette, and the wafer frame is likely to vibrate in the wafer frame cassette during the movement of the wafer frame cassette, which may cause the wafer frame to be damaged.
SUMMERY OF THE UTILITY MODEL
In order to reduce the vibration of a wafer frame in a wafer frame box and reduce the damage of the wafer frame, the application provides a wafer frame feeding device for chip packaging.
The application provides a wafer frame loading attachment for chip package adopts following technical scheme:
a wafer frame feeding device for chip packaging comprises a supporting table, wherein a material taking mechanism and a transfer mechanism for transferring a wafer frame into a frame box are connected to the supporting table;
the material taking mechanism comprises a suction assembly, a lifting assembly and a transverse moving assembly, the suction assembly is connected with the lifting assembly, the lifting assembly is connected with the transverse moving assembly, and the transverse moving assembly is connected with the supporting table;
the suction assembly comprises a connecting rod, the connecting rod is connected with the lifting assembly, a sucker is fixedly connected to the connecting rod, and the sucker is used for sucking the wafer frame.
Through adopting above-mentioned technical scheme, the sucking disc adsorbs wafer frame, lifting unit passes through connecting rod and sucking disc and drives wafer frame and rises, transverse movement subassembly drives lifting unit and wafer frame transverse movement after wafer frame rises to suitable height, after removing suitable position, lifting unit drives wafer frame and descends, when wafer frame is located the transport mechanism, the sucking disc stops adsorbing, wafer frame falls on the transport mechanism, transport mechanism removes wafer frame to in the wafer frame box, thereby wafer frame's vibrations in the wafer frame box have been reduced, the emergence of the damaged phenomenon of wafer frame has been reduced.
Optionally, the lifting assembly comprises a lifting frame, a first lead screw and a first driving motor, the lifting frame is connected with the transverse moving assembly, two ends of the first lead screw are rotatably connected with the lifting frame, the first driving motor drives the first lead screw to rotate through a leather belt, the first lead screw is in threaded connection with a lifting block, the lifting block is in sliding connection with the lifting frame, and the lifting block is fixedly connected with the connecting rod through a connecting plate.
Through adopting above-mentioned technical scheme, start first driving motor, first driving motor passes through the belt and drives first lead screw rotation, and first lead screw pivoted in-process drives the elevator and goes up and down along the elevator frame, and the elevator drives the connecting rod and goes up and down to drive sucking disc and wafer frame lift.
Optionally, the transverse moving assembly includes a transverse frame, a second lead screw and a second driving motor, both ends of the second lead screw are rotatably connected to the transverse frame, an output shaft of the second driving motor is coaxially and fixedly connected to the second lead screw, a transverse moving block is in threaded connection with the second lead screw, the transverse moving block is slidably connected to the transverse frame, and the lifting frame is fixedly connected to the transverse moving block.
By adopting the technical scheme, the second driving motor is started, the output shaft of the second driving motor drives the second lead screw to rotate, the transverse moving block is driven to move in the rotating process of the second lead screw, and the transverse moving block drives the lifting frame to move, so that the wafer frame is transversely moved.
Optionally, the transfer mechanism comprises a bottom plate, two vertical plates parallel to each other are fixedly connected to the bottom plate, the bottom plate is provided with a middle plate, one side wall of one vertical plate close to the middle plate and one side wall of the middle plate close to one vertical plate are both rotationally connected with two driven wheels, the two driven wheels on the same plane are sleeved with a conveyor belt, the vertical plates and the middle plate are both rotatably connected with driving wheels, the driving wheels are in contact connection with the conveyor belt, the other vertical plate is fixedly connected with a third driving motor, an output shaft of the third driving motor is coaxially and fixedly connected with a rotating shaft, the rotating shaft penetrates through the middle plate and the driving wheel, one end of the rotating shaft, which is far away from the third driving motor, is rotatably connected with the vertical plate, the rotating shaft drives the driving wheel to rotate, the middle plate is rotatably connected with two first tensioning wheels, and the two first tensioning wheels are positioned on two sides of the driving wheel.
Through adopting above-mentioned technical scheme, start third driving motor, third driving motor's output shaft drives the axis of rotation and rotates, and the axis of rotation drives two action wheels and rotates, and the action wheel drives the conveyer belt and rotates, and the sucking disc is placed the wafer frame on the conveyer belt to conveniently convey the wafer frame in the frame box.
Optionally, two it adjusts the lead screw to rotate to be connected with three between the riser, does not there is fixedly connected with fourth driving motor on the riser of action wheel, fourth driving motor's output shaft and one adjust the coaxial fixed connection of lead screw, it is three it all passes the intermediate lamella and with intermediate lamella threaded connection to adjust the lead screw, fourth driving motor's output shaft passes through the belt and drives two other regulation lead screws and rotate.
Through adopting above-mentioned technical scheme, start fourth drive motor, fourth drive motor drives three regulation lead screw and rotates, adjusts lead screw pivoted in-process and drives the intermediate lamella and remove to adjust the distance between two conveyer belts, thereby the convenience is transported the wafer frame of equidimension not.
Optionally, a second tensioning wheel is fixedly connected to one of the vertical plates, and the second tensioning wheel is tightly attached to a belt of a fourth driving motor.
Through adopting above-mentioned technical scheme, the second take-up pulley makes the belt be in the tight state to improve the synchronism of device.
Optionally, the adjusting screw rod is coaxially and fixedly connected with a belt pulley, and the belt pulley is sleeved with the belt.
Through adopting above-mentioned technical scheme, the belt drives the belt pulley and rotates, and the belt pulley drives the regulation lead screw and rotates to improve the synchronism of adjusting the lead screw.
Optionally, a placing mechanism is arranged on the supporting table, the placing mechanism includes a placing plate, the placing plate is arranged on the supporting table, and the placing plate is fixedly connected with a plurality of fixing rods.
Through adopting above-mentioned technical scheme, wafer frame places on placing the board, and the fixed rod supports wafer frame to make things convenient for the absorption of sucking disc.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the sucker is arranged, the sucker adsorbs the wafer frame, the first driving motor is started, the first driving motor drives the first lead screw to rotate through the belt, the lifting block is driven to lift along the lifting frame in the rotating process of the first lead screw, and the lifting block drives the connecting rod to lift, so that the sucker and the wafer frame are driven to lift. And starting the second driving motor, driving the second lead screw to rotate by an output shaft of the second driving motor, driving the transverse moving block to move in the rotating process of the second lead screw, and driving the lifting frame to move by the transverse moving block, thereby transversely moving the wafer frame. When the wafer frame is positioned above the conveying belt, the third driving motor is started, an output shaft of the third driving motor drives the rotating shaft to rotate, the rotating shaft drives the two driving wheels to rotate, the driving wheels drive the conveying belt to rotate, and the wafer frame is placed on the conveying belt by the suction disc, so that the wafer frame can be conveniently conveyed to the frame box. The whole feeding process reduces the occurrence of vibration of the wafer frame in the wafer frame box and reduces the occurrence of damage of the wafer frame;
according to the utility model, the fourth driving motor and the adjusting screw rods are arranged, the fourth driving motor is started, the fourth driving motor drives the three adjusting screw rods to rotate, and the middle plate is driven to move in the rotating process of the adjusting screw rods, so that the distance between the two conveyor belts is adjusted, and the wafer frames with different sizes can be conveniently transported.
Drawings
Fig. 1 is a schematic structural diagram of a wafer frame loading device for chip packaging according to the present invention;
fig. 2 is a schematic structural diagram of a material taking mechanism in a wafer frame loading device for chip packaging according to the present invention;
fig. 3 is a schematic structural diagram of a transfer mechanism in a wafer frame loading apparatus for chip packaging according to the present invention;
fig. 4 is a schematic structural diagram of a driving wheel and a first tension wheel in a wafer frame loading device for chip packaging according to the present invention.
In the figure: 1. a support table; 2. a material taking mechanism; 21. a suction assembly; 211. a connecting rod; 212. a suction cup; 22. a lifting assembly; 221. a lifting frame; 222. a first lead screw; 223. a first drive motor; 224. a lifting block; 23. a lateral movement assembly; 231. a transverse frame; 232. a second lead screw; 233. a second drive motor; 234. a transverse moving block; 3. a transfer mechanism; 31. a base plate; 32. a vertical plate; 33. a middle plate; 34. a driven wheel; 35. a conveyor belt; 36. a driving wheel; 37. a first tensioning wheel; 38. a third drive motor; 39. adjusting the lead screw; 310. a fourth drive motor; 311. a second tensioning wheel; 312. a belt pulley; 4. a placement mechanism; 41. placing the plate; 42. and (5) fixing the rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, the embodiment of the wafer frame loading device for chip packaging according to the utility model includes a supporting table 1, and the supporting table 1 is connected with a material taking mechanism 2 and a transferring mechanism 3 for transferring a wafer frame into a frame box. The material taking mechanism 2 comprises a suction assembly 21, a lifting assembly 22 and a transverse moving assembly 23. The suction assembly 21 is connected with the lifting assembly 22, the lifting assembly 22 is connected with the transverse moving assembly 23, and the transverse moving assembly 23 is connected with the supporting table 1 through a mounting plate.
Referring to fig. 1, a placing mechanism 4 is provided on a support table 1, the placing mechanism 4 includes a placing plate 41, the placing plate 41 is provided on the support table 1, and a plurality of fixing rods 42 are fixedly connected to the placing plate 41. The wafer frame is placed on the placing plate 41, and the fixing lever 42 supports the wafer frame, thereby facilitating the suction of the suction module 21.
Referring to fig. 1, the suction component 21 adsorbs the wafer frame, the lifting component 22 drives the suction component 21 and the wafer frame to ascend, the transverse moving component 23 drives the lifting component 22 and the wafer frame to transversely move after the wafer frame ascends to a proper height, the lifting component 22 drives the wafer frame to descend after moving to a proper position, when the wafer frame is located on the transfer mechanism 3, the suction component 21 stops adsorbing, the wafer frame falls onto the transfer mechanism 3, the transfer mechanism 3 moves the wafer frame into the wafer frame box, thereby reducing the vibration of the wafer frame in the wafer frame box, and reducing the occurrence of the damage phenomenon of the wafer frame.
Referring to fig. 1 and 2, the suction assembly 21 includes a connection rod 211, the connection rod 211 is connected to the lifting assembly 22, a suction cup 212 is connected to the connection rod 211, and the suction cup 212 is used for sucking the wafer frame.
Referring to fig. 1 and 2, the lifting assembly 22 includes a lifting frame 221, a first lead screw 222, and a first driving motor 223. The lifting frame 221 is connected with the transverse moving assembly 23, two ends of the first lead screw 222 are rotatably connected with the lifting frame 221, and the first driving motor 223 is fixedly connected with the lifting frame 221. First driving motor 223 passes through the first lead screw 222 of skin drive and rotates, and first lead screw 222 threaded connection has elevator 224, elevator 224 and elevator frame 221 sliding connection, and connecting rod 211 passes through connecting plate and elevator 224 fixed connection.
Referring to fig. 1 and 2, the first driving motor 223 is started, the first driving motor 223 drives the first lead screw 222 to rotate through the belt, the first lead screw 222 drives the lifting block 224 to lift along the lifting frame 221 in the rotating process, and the lifting block 224 drives the connecting rod 211 to lift, so as to drive the chuck 212 and the wafer frame to lift.
Referring to fig. 1 and 2, the traverse assembly 23 includes a traverse frame 231, a second lead screw 232, and a second driving motor 233. Both ends of the second lead screw 232 are rotatably connected with the transverse frame 231, the second driving motor 233 is fixedly connected with the transverse frame 231, an output shaft of the second driving motor 233 is coaxially and fixedly connected with the second lead screw 232, a transverse moving block 234 is in threaded connection with the second lead screw 232, the transverse moving block 234 is in sliding connection with the transverse frame 231, and the lifting frame 221 is fixedly connected with the transverse moving block 234.
Referring to fig. 2, the second driving motor 233 is started, the output shaft of the second driving motor 233 drives the second lead screw 232 to rotate, the second lead screw 232 drives the traverse block 234 to move in the rotating process, and the traverse block 234 drives the lifting frame 221 to move, so as to move the wafer frame laterally.
Referring to fig. 1, 3 and 4, the transfer mechanism 3 includes a bottom plate 31, and the bottom plate 31 is fixedly connected to the support table 1. Two mutually parallel vertical plates 32 are fixedly connected to the bottom plate 31. The bottom plate 31 is provided with an intermediate plate 33, a vertical plate 32 is close to one side wall of the intermediate plate 33, and the intermediate plate 33 is close to the side wall of the vertical plate 32, two driven wheels 34 are connected with the intermediate plate 32 in a rotating mode, a conveyor belt 35 is sleeved on the two driven wheels 34 on the same plane, and driving wheels 36 are connected with the vertical plate 32 and the intermediate plate 33 in a rotating mode. The driving wheel 36 is in contact connection with the conveyor belt 35, a third driving motor 38 is fixedly connected to the other vertical plate 32, an output shaft of the third driving motor 38 is coaxially and fixedly connected with a rotating shaft, the rotating shaft penetrates through the intermediate plate 33 and the driving wheel 36, and one end, far away from the third driving motor 38, of the rotating shaft is rotatably connected with the vertical plate 32. The rotating shaft drives the driving wheel 36 to rotate, and two first tensioning wheels 37 are rotatably connected to the middle plate 33, and the two first tensioning wheels 37 are positioned on two sides of the driving wheel 36.
Referring to fig. 1, 3 and 4, when the third driving motor 38 is started, the output shaft of the third driving motor 38 drives the rotation shaft to rotate, the rotation shaft drives the two driving wheels 36 to rotate, the driving wheels 36 drive the conveyor belt 35 to rotate, and the wafer frame is placed on the conveyor belt 35 by the suction cup 212, so that the wafer frame is conveniently conveyed to the frame box.
Referring to fig. 3 and 4, three adjusting screws 39 are rotatably connected between the two vertical plates 32, and a fourth driving motor 310 is fixedly connected to one vertical plate 32 without the driving wheel 36. The output shaft of the fourth driving motor 310 is coaxially and fixedly connected with an adjusting screw 39, and the three adjusting screws 39 all penetrate through the middle plate 33 and are in threaded connection with the middle plate 33. The output shaft of the fourth driving motor 310 drives the other two adjusting screws 39 to rotate through the belt. The fourth driving motor 310 is started, the fourth driving motor 310 drives the three adjusting screws 39 to rotate, and the adjusting screws 39 drive the middle plate 33 to move in the rotating process, so that the distance between the two conveyor belts 35 is adjusted, and the wafer frames with different sizes are conveniently transferred.
Referring to fig. 3 and 4, a second tensioning wheel 311 is fixedly connected to a vertical plate 32, and the second tensioning wheel 311 is closely attached to a belt of the fourth driving motor 310. The second tension pulley 311 puts the belt in tension, thereby improving the synchronism of the apparatus.
Referring to fig. 3 and 4, a belt pulley 312 is coaxially and fixedly connected to each of the three adjusting screws 39, and a belt is sleeved on the belt pulley 312. The belt drives the pulley 312 to rotate, and the pulley 312 drives the adjusting screw 39 to rotate, so as to improve the synchronism of the adjusting screw 39.
The working principle is as follows: the wafer frame is adsorbed by the chuck 212, the first driving motor 223 is started, the first driving motor 223 drives the first lead screw 222 to rotate through a belt, the first lead screw 222 drives the lifting block 224 to lift along the lifting frame 221 in the rotating process, and the lifting block 224 drives the connecting rod 211 to lift, so that the chuck 212 and the wafer frame are driven to lift.
The second driving motor 233 is started, the output shaft of the second driving motor 233 drives the second lead screw 232 to rotate, the second lead screw 232 drives the transverse moving block 234 to move in the rotating process, and the transverse moving block 234 drives the lifting frame 221 to move, so that the wafer frame is transversely moved.
After the wafer frame is moved to a proper position, the lifting block 224 drives the wafer frame to descend, when the wafer frame is located above the conveyor belt 35, the third driving motor 38 is started, the output shaft of the third driving motor 38 drives the rotating shaft to rotate, the rotating shaft drives the two driving wheels 36 to rotate, the driving wheels 36 drive the conveyor belt 35 to rotate, and the wafer frame is placed on the conveyor belt 35 through the suction cup 212, so that the wafer frame is conveniently conveyed to the frame box. The whole feeding process reduces the vibration of the wafer frame in the wafer frame box and reduces the damage of the wafer frame.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a wafer frame loading attachment for chip package which characterized in that: the wafer frame transfer device comprises a support table (1), wherein a material taking mechanism (2) and a transfer mechanism (3) used for transferring a wafer frame into a frame box are connected to the support table (1);
the material taking mechanism (2) comprises a suction assembly (21), a lifting assembly (22) and a transverse moving assembly (23), the suction assembly (21) is connected with the lifting assembly (22), the lifting assembly (22) is connected with the transverse moving assembly (23), and the transverse moving assembly (23) is connected with the supporting table (1);
the suction assembly (21) comprises a connecting rod (211), the connecting rod (211) is connected with the lifting assembly (22), a sucker (212) is fixedly connected to the connecting rod (211), and the sucker (212) is used for sucking the wafer frame.
2. The wafer frame loading device for chip packaging according to claim 1, wherein: lifting unit (22) include lifting frame (221), first lead screw (222) and first driving motor (223), lifting frame (221) is connected with lateral shifting subassembly (23), the both ends and the lifting frame (221) of first lead screw (222) rotate and are connected, first driving motor (223) rotate through first lead screw (222) of skin drive, first lead screw (222) threaded connection has elevator (224), elevator (224) and lifting frame (221) sliding connection, elevator (224) are through connecting plate and connecting rod (211) fixed connection.
3. The wafer frame loading device for chip packaging according to claim 2, wherein: the transverse moving assembly (23) comprises a transverse frame (231), a second lead screw (232) and a second driving motor (233), two ends of the second lead screw (232) are rotatably connected with the transverse frame (231), an output shaft of the second driving motor (233) is coaxially and fixedly connected with the second lead screw (232), a transverse moving block (234) is connected to the second lead screw (232) in a threaded manner, the transverse moving block (234) is slidably connected with the transverse frame (231), and the lifting frame (221) is fixedly connected with the transverse moving block (234).
4. The wafer frame loading device for chip packaging according to claim 1, wherein: the transfer mechanism (3) comprises a bottom plate (31), two mutually parallel vertical plates (32) are fixedly connected to the bottom plate (31), an intermediate plate (33) is arranged on the bottom plate (31), one vertical plate (32) is close to one side wall of the intermediate plate (33) and the side wall of the intermediate plate (33) close to one vertical plate (32) are connected with two driven wheels (34) in a rotating mode, two driven wheels (34) on the same plane are sleeved with a conveyor belt (35), the vertical plates (32) and the intermediate plate (33) are connected with a driving wheel (36) in a rotating mode, the driving wheel (36) is in contact connection with the conveyor belt (35), the other vertical plate (32) is fixedly connected with a third driving motor (38), an output shaft of the third driving motor (38) is fixedly connected with a rotating shaft, and the rotating shaft penetrates through the intermediate plate (33) and the driving wheel (36), the one end that third driving motor (38) was kept away from to the axis of rotation rotates with riser (32) to be connected, the axis of rotation drives action wheel (36) and rotates, it is connected with two first tight pulley (37) to rotate on intermediate lamella (33), two first tight pulley (37) are located the both sides of action wheel (36).
5. The wafer frame loading device for chip packaging according to claim 4, wherein: two it is connected with three regulation lead screw (39) to rotate between riser (32), does not fixedly connected with fourth driving motor (310) on riser (32) of action wheel (36), the output shaft and the coaxial fixed connection of one regulation lead screw (39) of fourth driving motor (310), three it all passes intermediate lamella (33) and with intermediate lamella (33) threaded connection to adjust lead screw (39), the output shaft of fourth driving motor (310) passes through the belt and drives two other regulation lead screws (39) and rotate.
6. The wafer frame loading device for chip packaging according to claim 5, wherein: and a second tensioning wheel (311) is fixedly connected to one vertical plate (32), and the second tensioning wheel (311) is tightly attached to a belt of a fourth driving motor (310).
7. The wafer frame loading device for chip packaging according to claim 6, wherein: the adjusting screw rod (39) is coaxially and fixedly connected with a belt pulley (312), and the belt is sleeved on the belt pulley (312).
8. The wafer frame loading device for chip packaging according to claim 6, wherein: the supporting platform is characterized in that a placing mechanism (4) is arranged on the supporting platform (1), the placing mechanism (4) comprises a placing plate (41), the placing plate (41) is arranged on the supporting platform (1), and a plurality of fixing rods (42) are fixedly connected to the placing plate (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121889446.6U CN215363794U (en) | 2021-08-12 | 2021-08-12 | Wafer frame loading attachment for chip package |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121889446.6U CN215363794U (en) | 2021-08-12 | 2021-08-12 | Wafer frame loading attachment for chip package |
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| Publication Number | Publication Date |
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| CN215363794U true CN215363794U (en) | 2021-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121889446.6U Active CN215363794U (en) | 2021-08-12 | 2021-08-12 | Wafer frame loading attachment for chip package |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833466A (en) * | 2022-05-23 | 2022-08-02 | 东莞市译码半导体有限公司 | Wafer cutting device with material loading function |
| CN117068752A (en) * | 2023-10-12 | 2023-11-17 | 常州比太科技有限公司 | Silicon wafer overturning and conveying system and working method thereof |
-
2021
- 2021-08-12 CN CN202121889446.6U patent/CN215363794U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833466A (en) * | 2022-05-23 | 2022-08-02 | 东莞市译码半导体有限公司 | Wafer cutting device with material loading function |
| CN114833466B (en) * | 2022-05-23 | 2023-07-14 | 东莞市译码半导体有限公司 | Wafer cutting device with material loading function |
| CN117068752A (en) * | 2023-10-12 | 2023-11-17 | 常州比太科技有限公司 | Silicon wafer overturning and conveying system and working method thereof |
| CN117068752B (en) * | 2023-10-12 | 2024-01-23 | 常州比太科技有限公司 | Silicon wafer overturning and conveying system and working method thereof |
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