CN215301281U - Liquid cooling heat dissipation device and electronic equipment - Google Patents
Liquid cooling heat dissipation device and electronic equipment Download PDFInfo
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- CN215301281U CN215301281U CN202121267520.0U CN202121267520U CN215301281U CN 215301281 U CN215301281 U CN 215301281U CN 202121267520 U CN202121267520 U CN 202121267520U CN 215301281 U CN215301281 U CN 215301281U
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- 239000002826 coolant Substances 0.000 claims abstract description 40
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Abstract
The application discloses liquid cooling heat abstractor, electronic equipment includes: a circulation loop for circulating the cooling liquid; the heat dissipation part is arranged in the circulation loop, and the cooling liquid carrying heat can dissipate heat when flowing through the heat dissipation part; a pump disposed on the heat dissipating part and pressurizing the coolant flowing through the heat dissipating part to provide a flow power to the coolant; the flow guide path of the heat dissipation part comprises a flow guide path and a backflow path, the backflow path is arranged in the middle of the heat dissipation part in the width direction, the flow guide paths are multiple and are respectively located on two sides of the backflow path, and cooling liquid in all the flow guide paths flows back after being collected in the backflow path. The pump is arranged on the heat dissipation part by the liquid cooling heat dissipation device, and the heat dissipation part is used for realizing heat exchange between cooling liquid and air and has a large size, so that the pump is stably and reliably supported on the heat dissipation part, and the structural strength of the liquid cooling heat dissipation device is improved.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a liquid cooling heat dissipation device, and also relates to electronic equipment with the liquid cooling heat dissipation device.
Background
At present, a pump for driving a cooling liquid to flow is generally disposed in a liquid cooling heat dissipation device for dissipating heat from an electronic apparatus such as a computer, and the pump is disposed on a heat absorbing member or a fluid guiding hose (the fluid guiding hose is a pipe for communicating the heat absorbing member and the heat dissipation member), but the heat absorbing member or the fluid guiding hose has a poor effect of supporting the pump, which results in poor structural strength of the liquid cooling heat dissipation device.
SUMMERY OF THE UTILITY MODEL
In view of this, the present application provides a liquid cooling heat dissipation device, which can improve the structural strength thereof. The application also provides an electronic device with the liquid cooling heat dissipation device.
In order to achieve the above purpose, the present application provides the following technical solutions:
a liquid-cooled heat sink comprising:
a circulation loop for circulating the cooling liquid;
the heat dissipation part is arranged in the circulation loop and is a component of the circulation loop, and the cooling liquid carrying heat can dissipate heat when flowing through the heat dissipation part;
a pump disposed on the heat radiating member and pressurizing the coolant flowing through the heat radiating member to power the flow of the coolant in the circulation loop;
the heat dissipation part comprises a heat dissipation part and a plurality of cooling liquid guiding paths, wherein the heat dissipation part comprises a plurality of flow guiding paths and a plurality of backflow paths, the backflow paths are arranged in the middle of the heat dissipation part in the width direction, the flow guiding paths are arranged on two sides of the backflow paths respectively, and all the cooling liquid in the flow guiding paths flows back after being collected in the backflow paths.
Optionally, in the above liquid-cooled heat dissipation device, the heat dissipation component has a first state and a second state, wherein:
the first state is a position state when the liquid cooling heat dissipation device works normally;
the second state is a position state that satisfies a vertical condition with the first state, and in the second state, the heat radiating member includes a first heat radiating region that contains a coolant and is located on the side of the return flow path in the width direction, and the pump is located within the first heat radiating region.
Optionally, in the above liquid-cooled heat dissipation device, in the second state, the width direction is a vertical direction, and the first heat dissipation area is an area of the heat dissipation component located on a lower side of the return path.
Optionally, in the above liquid cooling heat dissipation device, the heat dissipation component includes a flow guide structure, the flow guide structure includes:
a liquid inlet and a liquid outlet;
the drainage pipes are communicated with the liquid inlet and are arranged in parallel, cooling liquid carrying heat flows in the drainage pipes to realize heat dissipation, and the drainage path on one side of the backflow path is formed by one drainage pipe or a plurality of drainage pipes arranged in parallel;
the return pipe is used for guiding the cooling liquid which finishes heat dissipation to the liquid outlet, and the return pipe forms the return path;
wherein the pump is disposed on the return pipe.
Optionally, in the above liquid-cooling heat dissipation device, the return pipes are arranged in parallel to form a plurality of return paths, the pump communicates with all the return pipes, and the sum of the cross-sectional areas of all the return pipes is equal to the sum of the cross-sectional areas of all the drainage pipes.
Optionally, in the above liquid-cooling heat dissipation device, the heat dissipation component is provided with a fan, and the fan and the pump are coaxially arranged.
Optionally, in the above liquid-cooled heat dissipating device, the liquid-cooled heat dissipating device includes a heat absorbing component for absorbing heat generated by the heat generating component, the heat absorbing component is communicated with the liquid inlet through a liquid inlet pipeline to guide the coolant absorbing the heat to the drainage tube, and the heat absorbing component is communicated with the liquid outlet through a liquid outlet pipeline to guide the coolant completing heat dissipation to the heat absorbing component.
Optionally, in the above liquid-cooled heat dissipation device, the liquid inlet and the liquid outlet are located on the same side of the diversion structure, and in the second state, the height of the liquid inlet is greater than that of the liquid outlet.
An electronic device, comprising:
a housing;
a heat generating component;
liquid cooling heat abstractor sets up in the casing and include: a circulation loop for circulating the cooling liquid; the heat dissipation part is arranged in the circulating loop and is a component of the circulating loop, and the cooling liquid absorbing the heat generated by the heat generating part can dissipate the heat when flowing through the heat dissipation part; a pump disposed on the heat radiating member and pressurizing the coolant flowing through the heat radiating member to power the flow of the coolant in the circulation loop; the heat dissipation part comprises a heat dissipation part and a plurality of cooling liquid guiding paths, wherein the heat dissipation part comprises a plurality of flow guiding paths and a plurality of backflow paths, the backflow paths are arranged in the middle of the heat dissipation part in the width direction, the flow guiding paths are arranged on two sides of the backflow paths respectively, and all the cooling liquid in the flow guiding paths flows back after being collected in the backflow paths.
Optionally, in the electronic device, the housing is a rectangular box and includes a top wall and a front wall, and the heat dissipation component is parallel to and attached to the top wall or the front wall.
The application provides a liquid cooling heat abstractor, including circulation circuit and heat dissipation part and the pump of setting in circulation circuit, and set up the pump on heat dissipation part when setting up the pump, because heat dissipation part is used for realizing the heat exchange of coolant liquid and air, so heat dissipation part has great volume and great heat radiating area, consequently can make the pump by stable, reliable support with the pump setting on the great heat dissipation part of volume, and then can make liquid cooling heat abstractor's structural strength obtain promoting.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a liquid-cooled heat dissipation apparatus according to an embodiment of the present disclosure;
fig. 2 is a schematic structural view of the heat dissipation member in a first state and in parallel and attached arrangement with the top wall of the host;
FIG. 3 is a schematic structural view of the heat dissipation member being parallel to and attached to the top wall of the host device and in a second state;
fig. 4 is a schematic structural view of the heat dissipation member being parallel to and attached to the front wall of the host and in a first state;
fig. 5 is a schematic structural view of the heat dissipation member in a second state, wherein the heat dissipation member is parallel to and attached to the front wall of the host.
In fig. 1-5:
1-a heat dissipation part, 2-a pump, 3-a liquid inlet, 4-a liquid outlet, 5-a liquid guide pipe, 6-a drainage path, 7-a backflow path, 8-a fin, 9-a first heat dissipation area, 10-a second heat dissipation area, 11-a heat absorption part, 12-a liquid inlet pipeline and 13-a liquid outlet pipeline.
Detailed Description
The application provides a liquid cooling heat abstractor can make its structural strength obtain promoting. The application also provides an electronic device with the liquid cooling heat dissipation device.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 to 5, the embodiments of the present application provide a liquid-cooled heat dissipation apparatus, which can be installed in electronic equipment such as a computer, a server, etc. to dissipate heat from the electronic equipment, and the related improved components of the liquid-cooled heat dissipation apparatus mainly include a circulation loop, a heat dissipation component 1, and a pump 2, where the circulation loop is a path for circulating a cooling liquid, and the cooling liquid absorbs and dissipates heat during the circulation flow; the heat dissipation part 1 is arranged in the circulation loop, and the coolant flows through the heat dissipation part 1, that is, the heat dissipation part 1 is a component of the circulation loop, the coolant can carry heat to flow into the heat dissipation part 1 after absorbing the heat, and the heat is dissipated into the air by flowing in the heat dissipation part 1, that is, the heat dissipation part 1 is a part for realizing heat exchange between the coolant and the air, and the structure thereof can be selected in various ways, for example, as shown in fig. 3, the heat dissipation part 1 is a cold drain structure formed by arranging a plurality of liquid guide tubes 5 (the liquid guide tubes 5 are a general name of a drainage tube and a return tube which are described later) in parallel and in parallel, and the fins 8 are arranged on the surface of the liquid guide tube 5 to further increase the heat dissipation area, and in order to improve the heat exchange efficiency with the air, the optional liquid guide tubes 5 and the fins 8 are made of metal materials such as aluminum, copper, silver and the like with high thermal conductivity, that is, the heat dissipation member 1 which is composed of a plurality of metal liquid guide tubes 5 and is provided with the metal fins 8 has large structural strength and has large volume due to large heat exchange area, so that the pump 2 is arranged on the heat dissipation member 1, the firmness and stability of the connection, fixation and support of the pump 2 can be obviously improved, the pump 2 is a member for pressurizing cooling liquid, the cooling liquid is provided with power for the flow of the cooling liquid in a circulation loop by pressurizing the cooling liquid, namely, the cooling liquid has enough flow power, the pump 2 is arranged on the heat dissipation member 1, so that the cooling liquid is pressurized by the pump 2 when flowing through the heat dissipation member 1, and the paths of the guide cooling liquid of the heat dissipation member 1 and composed of the liquid guide tubes 5 comprise a flow guide path 6 and a return path 7 (the flow guide path 6 and the return path 7 are paths distributed on the heat dissipation member 1, which is a component of the whole circulation flow path), and when the heat dissipation component 1 is specifically arranged, the backflow paths 7 are arranged at the middle position in the width direction of the heat dissipation component 1 (the heat dissipation component 1 is rectangular in the overall shape shown in fig. 1 and 3), the drainage paths 6 are provided with a plurality of, optionally two, and the drainage paths 6 are respectively arranged at two sides of the backflow paths 7, and the cooling liquid in all the drainage paths 6 is collected in the backflow paths 7 and then flows back through the backflow paths 7, namely the cooling liquid drained from all the drainage paths 6 is collected in the backflow paths 7 and then flows back through the backflow paths 7 during backflow, so that a plurality of U-shaped heat dissipation paths (a plurality of U-shaped heat dissipation paths have overlapped parts, namely the backflow paths 7) are formed in the heat dissipation component 1, thereby realizing the parallel arrangement of the paths, and enabling the cooling liquid carrying heat to respectively flow to a plurality of different parts of the heat dissipation component 1 to dissipate heat simultaneously, the heat dissipation efficiency of the heat dissipation member 1 can be significantly improved compared to the conventional series path heat dissipation.
On one hand, the liquid cooling heat dissipation device with the structure is characterized in that the pump 2 is arranged on the heat dissipation component 1, and compared with the existing liquid cooling heat dissipation device in which the pump 2 is arranged on the heat absorption component (the heat absorption component needs to be matched with and mounted with a heating component of electronic equipment, so that the volume of the heat absorption component is smaller) and the diversion hose, the heat dissipation component 1 has higher structural strength and larger volume, so that the firmness and stability of the connection, fixation and support of the pump 2 can be obviously improved by arranging the pump 2 on the heat dissipation component 1, and the liquid cooling heat dissipation device is simple and attractive, so that the structure of the whole liquid cooling heat dissipation device is optimized, and the structural strength is improved; on the other hand, the path inside the heat dissipation component 1 is set to be a parallel path, so that the heat dissipation efficiency of the heat dissipation component 1 can be obviously improved, and the heat dissipation performance of the liquid cooling heat dissipation device is further improved.
In the present application, the heat-dissipating member 1 has a first state and a second state in which: the first state is a position state when the liquid cooling heat dissipation device works normally; the second state is a position state satisfying a vertical condition with the first state, and in the second state, the heat radiating member 1 includes a first heat radiating region 9 containing the coolant and located on the side of the return path 7 in the width direction, and the pump 2 is located in the first heat radiating region 9, and optionally, in the second state, the width direction of the heat radiating member 1 is the vertical direction, and the first heat radiating region 9 is a region of the heat radiating member 1 located on the lower side of the return path 7. The first state and the second state refer to states in which the heat sink member 1 is located at different positions, specifically: the first state is the position state of the liquid cooling heat dissipation device when the liquid cooling heat dissipation device is normally operated, i.e. the position state of the liquid cooling heat dissipation device when the liquid cooling heat dissipation device is installed in an electronic apparatus and the electronic apparatus is normally placed on a desktop or a ground, for example, when the electronic apparatus is a host of a desktop computer, the host is in a rectangular shape, and when the wall surface with the largest area of the host is a vertical surface (or the wall surface with the largest area of the host is perpendicular to the desktop), the host is in a normally placed state, and when the liquid cooling heat dissipation device is installed in the host in the normally placed state, as shown in fig. 2, the rectangular heat dissipation part 1 can be parallel to and attached to the top wall of the host, or as shown in fig. 4, the rectangular heat dissipation part 1 is attached to the front wall of the host (the front wall refers to a wall surface which is perpendicular to both the wall with the largest area and the top wall, a power-on key of the host is arranged on the front wall in general) and arranged in parallel and in a fitting manner, under the condition that the host is normally placed, the position state of the heat dissipation component 1 is a first state, and under the state, no matter whether the heat dissipation component 1 is parallel and fitted with the top wall or the front wall, the wide side of the rectangular heat dissipation component 1 is horizontally arranged (namely, the wide side is a horizontal side); under the condition that the host lies down, that is, under the condition that the wall with the largest area of the host is attached to the desktop (so that the host is placed, for example, for making the host raise and supporting a display screen of a computer), the heat dissipation component 1 parallel to the top wall or the front wall and attached to the top wall or the front wall rotates 90 degrees along with the lying down of the host, so that the heat dissipation component 1 is in the second state which satisfies the vertical condition with the first state (the vertical condition is that the heat dissipation component 1 in the first state and the heat dissipation component 1 in the second state are perpendicular to each other or can be regarded as approximately perpendicular to each other), thereby the wide side of the rectangular heat dissipation component 1 is changed from the horizontal arrangement in the normal placement state of the host to the vertical arrangement in the lying state (that the wide side is changed to the vertical side, that is, the width direction of the heat dissipation component 1 is changed from the horizontal direction to the vertical direction), that is, the state shown in fig. 2 is changed to the state shown in fig. 3, or from the state shown in fig. 4 to the state shown in fig. 5, in which the width direction of the heat-dissipating member 1 is the vertical direction (shown in fig. 3 and 5), and since the return path 7 is located at the middle position in the width direction of the heat-dissipating member 1, as shown in fig. 3, the return flow path 7 is located at a middle position of the heat-radiating member 1 in the vertical direction, while the first heat dissipation area 9, which is located at one side of the return flow path 7, can be selected as an area located at the lower side of the return flow path 7 in the vertical direction, i.e. the side close to the table top, since this area is located at the lower side of the whole heat dissipation member 1, therefore, even if the liquid coolant in the circulation circuit is reduced due to vaporization or generation of bubbles in the circuit, the liquid coolant can be gathered in the first heat dissipation area 9 located on the lower side by gravity, therefore, the pump 2 arranged in the area can not idle, and the liquid cooling heat dissipation device is ensured to have good heat dissipation performance. Furthermore, the pump 2 may be arranged in the second heat dissipation area 10 on the premise that a sufficient amount of the cooling liquid is ensured, that is, when the main unit is lying down, the cooling liquid not only fills the lower first heat dissipation area 9 but also has a margin in the second heat dissipation area 10 located above the return flow path 7.
Specifically, as shown in fig. 1 and 3, the heat-dissipating member 1 includes a flow-guiding structure, and the flow-guiding structure includes: a liquid inlet 3 and a liquid outlet 4; the plurality of drainage tubes are communicated with the liquid inlet 3 and are arranged in parallel, cooling liquid carrying heat flows in the drainage tubes to realize heat dissipation, and the drainage path 6 positioned on one side of the backflow path 7 is formed by one drainage tube or a plurality of drainage tubes arranged in parallel; a return pipe communicating the plurality of draft tubes and the liquid outlet 4, the return pipe being configured to guide the coolant that completes heat dissipation to the liquid outlet 4, the return pipe forming a return path 7; wherein the pump 2 is arranged on the return line. In this structure, since the liquid guide tube 5 of the heat dissipating part 1 constitutes the flow guide path 6 and the return path 7, the liquid guide tube 5 is divided into a flow guide tube and a return tube, the flow guide tube is used to constitute the flow guide path 6, and the flow guide path 6 located on either side of the return path 7 includes one or more flow guide tubes, and the cooling liquid absorbing or carrying heat enters the heat dissipating part 1 from the liquid inlet 3 and then first enters the flow guide tube, and is heat dissipated through the flow guide tube and the fins 8 provided on the flow guide tube while flowing in the flow guide tube, since the flow guide path 6 is provided in plurality, the cooling liquid carrying heat is divided into the flow guide tubes belonging to different flow guide paths 6 after entering the heat dissipating part 1 from the liquid inlet 3, and when the same flow guide path 6 is constituted by a plurality of flow guide tubes, the cooling liquid is divided again, thus, heat dissipation can be simultaneously realized at a plurality of different parts of the heat dissipation component 1, and the heat dissipation component 1 has higher heat dissipation efficiency. When the cooling liquid flows through the drainage tubes, the cooling liquid enters the return path 7, in the process of entering the return path 7, all the drainage tubes are communicated with the return tube, so that the cooling liquid can realize the confluence of the cooling liquid in the process of flowing into the return tube, and the cooling liquid flows back to the outlet of the heat dissipation component 1 through the return tube, in the process of flowing back, the heat which is not dissipated in the cooling liquid can still be dissipated through the return tube and the fins 8 arranged on the return tube, and meanwhile, because the pump 2 is arranged in the return path 7, namely on the return tube, the pump 2 can pressurize all the cooling liquid which is converged in the return tube, so that the cooling liquid has flowing power which flows into the return tube again. Since the return path 7 is provided at the middle position in the width direction of the heat radiating member 1, and the first heat radiating region 9 and the second heat radiating region 10 are defined by the return path 7, the pump 2 provided on the return path 7 is located at the top edge position of the first heat radiating region 9, and based on this, it is possible to determine whether the amount of the coolant in the circulation circuit is less than the critical value at which the first heat radiating region 9 cannot be filled by determining whether the pump 2 is idling in the second state of the heat radiating member 1, and to indicate whether the coolant needs to be added.
In the present application, since the number of the flow guiding paths 6 is greater than the number of the circuit paths, in order to improve the smoothness of the backflow of the coolant, the number of the backflow pipes may be selected to be a plurality of backflow paths 7 arranged in parallel, the pump 2 communicates with all the backflow pipes, and the sum of the sectional areas of all the backflow pipes is equal to the sum of the sectional areas of all the flow guiding pipes. Therefore, the flow of the cooling liquid can be improved, the timely and smooth backflow of the cooling liquid is ensured, and the liquid cooling heat dissipation device is further ensured to have efficient cooling performance. In the case where only one return pipe is provided, the amount of return of the coolant may be increased by increasing the inner diameter of the return pipe.
In addition, a fan is provided on the heat radiating member 1, and optionally the fan and the pump 2 are coaxially provided. The reason why the fan is provided in the heat dissipation member 1 is to drive the air around the heat dissipation member 1, thereby improving the air fluidity around the heat dissipation member 1 and further improving the heat dissipation efficiency. The fan and the pump 2 are coaxially arranged, namely, the fan and the pump 2 are overlapped at the arrangement positions on the heat dissipation part 1, so that the occupation of the heat dissipation area of the heat dissipation part 1 when the fan is arranged on the heat dissipation part 1 is reduced as much as possible, and the heat dissipation effect of the heat dissipation part 1 is improved.
As shown in fig. 1-5, the liquid-cooled heat dissipating device provided by the present application further includes a heat absorbing member 11 for absorbing heat generated by the heat generating component, the heat absorbing member 11 is communicated with the liquid inlet 3 through a liquid inlet pipe 12 to guide the heat absorbing coolant to the liquid guiding pipe, and the heat absorbing member 11 is communicated with the liquid outlet 4 through a liquid outlet pipe 13 to guide the heat dissipating coolant to the heat absorbing member 11. That is, the liquid outlet pipe 13, the heat absorbing member 11 and the liquid inlet pipe 12 constitute the rest of the circulation circuit, which constitutes a complete circulation circuit by cooperating with the heat radiating member 1. The heat absorbing member 11 is a heat absorbing plate or a heat absorbing block attached to a heat generating component (e.g., a CPU, a motherboard, a video card, etc.) of the electronic device, and has an inner cavity therein, the coolant absorbs heat generated by the heat generating component by flowing through the inner cavity and guides the heat-absorbed coolant to the heat dissipating member 1 through the liquid inlet pipe 12, and after the coolant dissipates heat in the heat dissipating member 1, the coolant without heat is guided to the inner cavity of the heat absorbing member 11 through the liquid outlet pipe 13 to be used for absorbing heat again, so that a cooling cycle is completed.
As shown in fig. 1-5, the liquid inlet 3 and the liquid outlet 4 are optionally located on the same side of the flow guiding structure, and in the second state, the height of the liquid inlet 3 is greater than that of the liquid outlet 4. Set up inlet 3 and liquid outlet 4 in the same one side of water conservancy diversion structure, not only can make whole liquid cooling heat abstractor's structure obtain optimizing, can make its can be better with electronic equipment's other part cooperations, electronic equipment structural layout's rationality has been promoted, but also can make the structure of heat dissipation part 1 self obtain optimizing, can realize 6 sharing backward flow routes 7 of a plurality of drainage routes, make drainage route 6 and backward flow route 7 can realize more reasonable overall arrangement. And make inlet 3 be higher than liquid outlet 4 under the second state, then be favorable to liquid coolant to flow from heat-dissipating part 1 to heat-absorbing part 11, and the coolant that absorbs heat then can flow to the higher inlet 3 of position through the heat absorption inflation to make liquid cooling heat abstractor can dispel the heat to the part that generates heat more reliably.
In addition, the present application also provides an electronic device, including: a housing; a heat generating component; liquid cooling heat abstractor sets up in the casing and include: a circulation loop for circulating the cooling liquid; a heat dissipation member 1 which is provided in the circulation circuit and is a component of the circulation circuit, and which can dissipate heat when the coolant absorbing the heat generated by the heat generating member flows through the heat dissipation member 1; a pump 2 which is provided on the heat radiating member 1 and pressurizes the coolant flowing through the heat radiating member 1 to power the flow of the coolant in the circulation circuit; the flow guide path of the heat dissipation component 1 comprises a flow guide path 6 and a backflow path 7, the backflow path 7 is arranged in the middle of the heat dissipation component 1 in the width direction, the flow guide paths 6 are multiple and are respectively located on two sides of the backflow path 7, and cooling liquid in all the flow guide paths 6 flows back after being collected in the backflow path 7.
That is to say, the electronic device has the liquid-cooled heat dissipation apparatus, and please refer to the above contents for the beneficial effects brought by the liquid-cooled heat dissipation apparatus of the electronic device, which will not be described herein again.
In addition, in order to optimize the structure of the electronic device, the optional electronic device is a desktop computer, and as described above, the optional liquid cooling heat dissipation device is arranged in a rectangular host of the desktop computer, that is, the housing is a rectangular box of the host, and six wall surfaces of the box are respectively a left wall, a right wall, a top wall, a bottom wall, a front wall and a rear wall, wherein the left wall and the right wall are two wall surfaces with the largest area of the housing, and the two wall surfaces are vertical wall surfaces when the host is normally placed; when the liquid cooling heat dissipation device is arranged, in order to optimize the structural layout of internal parts of the host, the rectangular heat dissipation part 1 can be arranged on the inner side of the top wall in parallel and in an attached manner; the front wall and the rear wall are the other two wall surfaces of the shell, the rear wall is generally used as a wiring wall surface of the host, i.e. an I/O interface is arranged on the rear wall, the front wall is a functional wall surface of the host, on which an optical drive, a start-up key and the like are generally arranged, and similarly, in order to optimize the structural layout of internal components of the host, the rectangular heat dissipation component 1 can be arranged on the inner side of the front wall in parallel and in a joint manner. That is, this application is through setting up the parallel roof of heat dissipation part 1 or antetheca for the host computer can collect in the first heat dissipation region 9 that is close to the desktop when lying down the coolant liquid, so just so can avoid setting up the pump idle running in first heat dissipation region 9, makes liquid cooling heat abstractor still can have good radiating effect to the host computer.
In this specification, the structure of each part is described in a progressive manner, the structure of each part is mainly described as different from the existing structure, and the whole and part of the structure of the liquid-cooled heat dissipation device can be obtained by combining the structures of the parts.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A liquid-cooled heat sink comprising:
a circulation loop for circulating the cooling liquid;
the heat dissipation part is arranged in the circulation loop and is a component of the circulation loop, and the cooling liquid carrying heat can dissipate heat when flowing through the heat dissipation part;
a pump disposed on the heat radiating member and pressurizing the coolant flowing through the heat radiating member to power the flow of the coolant in the circulation loop;
the heat dissipation part comprises a heat dissipation part and a plurality of cooling liquid guiding paths, wherein the heat dissipation part comprises a plurality of flow guiding paths and a plurality of backflow paths, the backflow paths are arranged in the middle of the heat dissipation part in the width direction, the flow guiding paths are arranged on two sides of the backflow paths respectively, and all the cooling liquid in the flow guiding paths flows back after being collected in the backflow paths.
2. The liquid-cooled heat sink of claim 1, said heat sink member having a first state and a second state, wherein:
the first state is a position state when the liquid cooling heat dissipation device works normally;
the second state is a position state that satisfies a vertical condition with the first state, and in the second state, the heat radiating member includes a first heat radiating region that contains a coolant and is located on the side of the return flow path in the width direction, and the pump is located within the first heat radiating region.
3. The liquid-cooled heat sink of claim 2, wherein in the second state, the width direction is a vertical direction, and the first heat dissipation area is an area of the heat dissipation member located on a lower side of the return path.
4. The liquid-cooled heat sink of claim 1, the heat sink member comprising a flow directing structure, the flow directing structure comprising:
a liquid inlet and a liquid outlet;
the drainage pipes are communicated with the liquid inlet and are arranged in parallel, cooling liquid carrying heat flows in the drainage pipes to realize heat dissipation, and the drainage path on one side of the backflow path is formed by one drainage pipe or a plurality of drainage pipes arranged in parallel;
the return pipe is used for guiding the cooling liquid which finishes heat dissipation to the liquid outlet, and the return pipe forms the return path;
wherein the pump is disposed on the return pipe.
5. The liquid-cooled heat sink of claim 4, wherein the return pipe is provided in plurality in parallel to form a plurality of return paths, the pump communicates with all the return pipes, and the sum of the cross-sectional areas of all the return pipes is equal to the sum of the cross-sectional areas of all the drain pipes.
6. The liquid-cooled heat sink of claim 1, said heat sink member having a fan disposed thereon, said fan and said pump being disposed coaxially.
7. The liquid-cooled heat dissipating apparatus according to claim 4, comprising a heat absorbing member for absorbing heat generated from the heat generating member, the heat absorbing member being communicated with the liquid inlet through a liquid inlet pipe to guide the heat absorbing coolant to the liquid outlet, and the heat absorbing member being communicated with the liquid outlet through a liquid outlet pipe to guide the heat dissipating coolant to the heat absorbing member.
8. The liquid-cooled heat sink of claim 4, wherein the inlet and the outlet are located on the same side of the flow-guiding structure, and in the second state, the height of the inlet is greater than the height of the outlet.
9. An electronic device, comprising:
a housing;
a heat generating component;
liquid cooling heat abstractor sets up in the casing and include: a circulation loop for circulating the cooling liquid; the heat dissipation part is arranged in the circulating loop and is a component of the circulating loop, and the cooling liquid absorbing the heat generated by the heat generating part can dissipate the heat when flowing through the heat dissipation part; a pump disposed on the heat radiating member and pressurizing the coolant flowing through the heat radiating member to power the flow of the coolant in the circulation loop; the heat dissipation part comprises a heat dissipation part and a plurality of cooling liquid guiding paths, wherein the heat dissipation part comprises a plurality of flow guiding paths and a plurality of backflow paths, the backflow paths are arranged in the middle of the heat dissipation part in the width direction, the flow guiding paths are arranged on two sides of the backflow paths respectively, and all the cooling liquid in the flow guiding paths flows back after being collected in the backflow paths.
10. The electronic device according to claim 9, wherein the housing is a rectangular parallelepiped box and includes a top wall and a front wall, and the heat dissipation member is disposed in parallel to and in close contact with the top wall or the front wall.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121267520.0U CN215301281U (en) | 2021-06-07 | 2021-06-07 | Liquid cooling heat dissipation device and electronic equipment |
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| CN202121267520.0U CN215301281U (en) | 2021-06-07 | 2021-06-07 | Liquid cooling heat dissipation device and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114442771A (en) * | 2022-01-07 | 2022-05-06 | 宝德计算机系统股份有限公司 | Liquid-cold air-cooling integrated heat dissipation device and heat dissipation method |
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2021
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114442771A (en) * | 2022-01-07 | 2022-05-06 | 宝德计算机系统股份有限公司 | Liquid-cold air-cooling integrated heat dissipation device and heat dissipation method |
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