CN215296283U - Sensor with a sensor element - Google Patents

Abstract

The application provides a sensor, which comprises a shell and a plate body part; the sensor is provided with an accommodating cavity, at least part of the component is positioned in the accommodating cavity, and at least part of the shell is positioned on the periphery of the accommodating cavity; the shell comprises a connecting wall, a main body part and a stopping part, wherein the connecting wall is positioned on one side of the plate body part in the thickness direction, and at least part of the main body part is arranged around the plate body part; the surface of one side, close to the containing cavity, of the stopping part is protruded from the surface, close to the containing cavity, of the main body part, and the surface, far away from the containing cavity, of the stopping part is sunken from the surface, far away from the containing cavity, of the main body part; or the surface of one side of the stopping part, which is close to the containing cavity, is protruded from the surface of the connecting wall, which is close to the containing cavity, and the surface of one side of the stopping part, which is far away from the containing cavity, is sunken from the surface of the connecting wall, which is far away from the containing cavity; the plate body part is fixedly or limitedly connected with the stop part. This application is favorable to reducing the weight and the processing cost of sensor.

Description

Sensor with a sensor element

Technical Field

The present application relates to a sensor.

Background

The sensor in the related art comprises a main shell, a circuit board assembly and a pressure sensitive element, wherein the circuit board assembly, the pressure sensitive element and the like are accommodated in an installation cavity of the main shell, and the pressure sensitive element is electrically connected with the circuit board assembly to realize detection of a fluid pressure signal.

The main casing inner wall department of sensor sets up a plurality of stair structures usually among the correlation technique, circuit board assembly isotructure supports and presses in this stair structure department, thereby above-mentioned stair structure can play certain support and spacing to circuit board assembly etc. the main casing body that is provided with these stair structures will be usually prepared through the mode of carrying out machining to the section bar, and the processing cost is higher, and the stair structure of processing out is solid massive, can occupy more casing material, and is unfavorable for the lightweight of sensor product.

SUMMERY OF THE UTILITY MODEL

The sensor provided by the application is beneficial to reducing the weight and the manufacturing cost of the sensor.

The application provides a sensor, which comprises a shell and a plate body part; the sensor is provided with an accommodating cavity, and at least part of the shell is positioned at the periphery of the accommodating cavity; the plate body part is at least partially positioned in the accommodating cavity;

the shell comprises a connecting wall, a main body part and a stopping part, wherein the connecting wall is positioned on one side of the plate body part in the thickness direction, and at least part of the main body part is arranged around the plate body part;

the surface of one side, close to the containing cavity, of the stopping part is protruded from the surface of the main body part, close to the containing cavity, and the surface of one side, far away from the containing cavity, of the stopping part is sunken from the surface of the main body part, far away from the containing cavity; or the surface of one side of the stopping part close to the containing cavity protrudes from the surface of the connecting wall close to the containing cavity, and the surface of one side of the stopping part far away from the containing cavity is recessed from the surface of the connecting wall far away from the containing cavity; the plate body part is fixedly or in limited connection with the stop part.

Compared with the prior art, the surface of the side, far away from the containing cavity, of the stop part is concave downwards from the surface, far away from the containing cavity, of the main body part or the connecting wall, so that the shell material occupied by the stop part is favorably reduced, and correspondingly, the weight and the manufacturing cost of the sensor are favorably reduced.

Drawings

FIG. 1 is a schematic perspective view of a sensor according to the present application;

FIG. 2 is a schematic perspective view of another angle of the sensor shown in FIG. 1;

FIG. 3 is an exploded view of the sensor shown in FIG. 1;

FIG. 4 is an exploded view of another angle of the sensor shown in FIG. 1;

FIG. 5 is a schematic perspective cross-sectional view of a sensor of the present application;

FIG. 6 is a schematic perspective cross-sectional view of a second sensor of the present application;

FIG. 7 is an enlarged view of a portion of the sensor shown in FIG. 5;

FIG. 8 is a schematic view of the housing structure of the sensor shown in FIG. 5;

FIG. 9 is a schematic cross-sectional view of a third sensor of the present application;

FIG. 10 is a cross-sectional structural view of a portion of the assembly of the sensor of FIG. 9 of the present application;

FIG. 11 is a schematic perspective view of a portion of the assembly of the sensor shown in FIG. 10;

FIG. 12 is a schematic view of another angular perspective of a portion of the assembly of the sensor shown in FIG. 10;

FIG. 13 is a schematic cross-sectional view of a fourth sensor of the present application;

FIG. 14 is a schematic cross-sectional view of a fifth sensor of the present application;

FIG. 15 is a perspective view of a plate body of the present application;

FIG. 16 is a schematic cross-sectional view of a sixth sensor of the present application;

FIG. 17 is a schematic perspective view of a molding used to form a sensor housing according to the present application;

FIG. 18 is an assembled schematic view of a sensor made according to the present application;

FIG. 19 is a schematic flow chart diagram of a method of manufacturing a sensor of the present application;

FIG. 20 is a schematic flow chart of another method of manufacturing a sensor according to the present application.

Detailed Description

In the fields of automobile air conditioners, household air conditioners, commercial air conditioners and the like, refrigerants are important heat exchange fluids in such heat management systems, and the pressure change and/or the temperature change of the refrigerants generally need to be monitored through sensors.

In the related art, in order to prepare the sensor, usually, the assembly composed of the structural components such as the circuit board and the sensing element is pushed into the inner cavity of the profile from one side of the profile for preparing the sensor housing, in order to limit the assembly in the pushing process and prevent the damage caused by the hard contact of part of the plate structure and the profile due to overpressure, the profile for preparing the sensor housing usually can be provided with step structures, the assembly is positioned, limited and supported, the profile with the step structures usually needs to be prepared in a machining mode, the processing cost is high, the step structures are solid block structures, more profile materials are occupied, the housing of the sensor is heavy, and the requirement for lightening the sensor product is difficult to meet.

Referring to fig. 1 to 18, the sensor 100 of the present application may be integrated with various types of valve components, such as a valve component formed by being installed on a valve body alone, or an electronic expansion valve, a thermal expansion valve, a solenoid valve, etc. The sensor 100 may be used to detect a temperature parameter of the refrigerant, and in some scenarios, may be used to detect both a temperature parameter and a pressure parameter of the refrigerant. Of course, the sensor 100 provided herein may also be used to detect pressure and temperature parameters of other fluids.

In some embodiments of the present application, the sensor 100 includes a housing 1 and a component 2 assembled in the housing 1, the sensor 100 is provided with a receiving cavity 200, and the component 2 includes a plate body portion 21, a ceramic portion 22 and a sensing member 23. At least a part of the case 1 surrounds the outer peripheral sides of the plate body portion 21 and the ceramic portion 22. The component 2 is accommodated in the accommodating cavity 200, the accommodating cavity 200 includes a space for accommodating the component 2 and the upper cavity 30, and the sensor 100 further has a channel 31 for fluid to flow. The plate body portion 21 has a first surface 101 and a second surface 102 located on different sides in the thickness direction thereof, respectively, and the ceramic portion 22 has a third surface 103 and a fourth surface 104 located on different sides in the thickness direction thereof, respectively. The upper cavity 30 may be enclosed by the housing 1 and the plate portion 21 together, or by the housing 1 and the plate portion 21 together with other structural members such as the cover 4. The channel 31 may be provided on the housing 1, on other structural members, or may be formed by the housing 1 and other structural members cooperating.

The board body 21 is a plate-shaped element with a certain thickness, the board body 21 may be a PCB, and a plurality of conductive traces are disposed on the surface of the board body 21, and the board body 21 may be a circuit board made of resin as a main material, or may be another type of circuit board. The board body 21 may be a rectangular circuit board, or may be a circular or other circuit board. The first surface 101 may be an upper side surface of the plate body portion 21 illustrated in fig. 5, and the second surface 102 may be a lower side surface of the plate body portion 21 illustrated in fig. 5.

The ceramic part 22 may also be a plate-shaped element with a certain thickness, and the ceramic part 22 may be a ceramic circuit board, or may be a common ceramic material plate without a circuit, in the embodiment of the present application, the ceramic part 22 is exemplified as a circuit board made of a ceramic material, for example, the third surface 103 of the ceramic part 22 may be covered with a plurality of conductive traces by a process such as copper plating, so that the ceramic part 22 may also provide a partial circuit function. The thickness of the ceramic part 22 may be smaller than that of the plate body part 21, and the ceramic part 22 is relatively thin and needs to be protected from excessive pressure damage.

The material hardness of the plate body portion 21 is greater than that of the ceramic portion 22, the ceramic portion 22 is fixed to the plate body portion 21, and the third surface 103 of the ceramic portion 22 faces at least a partial region of the second surface 102 of the plate body portion 21. Specifically, the third surface 103 of the ceramic portion 22 may be at least partially attached to the second surface 102 of the plate portion 21, and the conductive pin 24 may be fixed to the ceramic portion 22 and the plate portion 21 by using the conductive pin 24, for example, the conductive pin 24 penetrates through the ceramic portion 22 and the plate portion 21 simultaneously so that the ceramic portion 22 and the plate portion 21 are laminated together, and the conductive pin 24 and the ceramic portion 22 are fixed by soldering, and the conductive pin 24 and the plate portion 21 are fixed by soldering. Of course, the ceramic part 22 and the plate body part 21 may be fixed together by other means such as welding, adhesion, etc., instead of the conductive pins 24.

The upper cavity 30 of the sensor 100 is located on the side of the first surface 101 of the plate portion 21. The channel 31 is located on the side of the fourth surface 104 of the ceramic part 22. Fluid may contact the fourth surface 104 of the ceramic part 22 through the fluid channel 31, but the upper cavity 30 and the channel 31 are not communicated, so that the fluid does not easily enter the upper cavity 30 on the side of the first surface 101 of the plate body part 21, which is beneficial for protecting the conductive circuit and the electronic components in the upper cavity 30 from being corroded and impacted by the fluid.

The ceramic portion 22 has a via 25 penetrating through the third surface 103 and the fourth surface 104 thereof, the sensing element 23 is mounted on the side of the third surface 103 of the ceramic portion 22, and the sensing element 23 covers the via 25 and is electrically connected to the plate portion 21. The sensing member 23 seals one end (e.g., the upper end in fig. 10) of the guide hole 25, and the other end (e.g., the lower end in fig. 10) of the guide hole 25 is accessible for fluid.

The sensing member 23 can be manufactured by a Micro Electro Mechanical System (MEMS) technology, a sensing element manufactured by the MEMS technology has a small size, and a corresponding product size is generally in a millimeter level or even smaller. The sensing element 23 is a back pressure chip, the fluid enters the sensing cavity 231 from a small hole at the bottom of the sensing element 23, the front surface of the back pressure sensing element 23 is not in contact with the fluid, the sensing element 23 includes a core part 232 having a three-layer structure, the three-layer structure includes a substrate, an intermediate layer and a top layer, the substrate layer and the intermediate layer enclose the sensing cavity 231 with an opening, the sensing element 23 may further include a vacuum cavity, the vacuum cavity may be enclosed by the top layer and the intermediate layer, the vacuum cavity is disposed at the other side of the sensing cavity 231 away from the guiding hole 25, the vacuum cavity is not communicated with the sensing cavity 231, the vacuum cavity is beneficial to ensuring that the fluid pressure sensed by the pressure sensing area of the sensing element 23 is absolute pressure, of course, some sensing elements 23 may not be provided with a vacuum cavity, and accordingly, the fluid pressure sensed by the pressure sensing area is relative pressure. The silicon wafer intermediate layer of the core portion 232 has a pressure sensing region exposed to the sensing cavity 231, the pressure sensing region realizes pressure detection by a piezoresistive wheatstone bridge, and when a circuit is connected, when no pressure acts on the thin film of the silicon cell, the wheatstone bridge is balanced, and the output voltage is 0. When pressure is applied to the thin film of the silicon cell, the balance of the Wheatstone bridge is broken and a voltage is output. Therefore, the pressure change can be reflected by the change of the electric signal in the detection circuit, so that the pressure detection function is realized. Furthermore, the substrate layer can be a glass substrate, the middle layer can be a silicon crystal cell material, and the top layer can also be a glass material.

The fixing means between the sensing element 23 and the ceramic part 22 includes one of adhesion, eutectic bonding, sinter fixing and glass micro-fusion fixing. In actual manufacturing, the fixing and sealing between the core part 232 of the sensing element 23 and the ceramic part 22 can be realized by selecting a sealant adhesive and a eutectic welding manner, and the process is simple and easy to realize. Fluid does not easily leak out of the guide hole 25. Of course, the sensing element 23 may be other types of sensing elements, such as a sensing chip fixed to a circuit board in a positive pressure manner or a flip-chip manner.

The casing 1 may be made of metal, the casing 1 includes a circumferential wall 11 and a connecting wall 12, and the circumferential wall 11 and the connecting wall 12 are connected to form an integral structure. The housing 1 also comprises a stop 110, i.e. on the profile 10 of the sensor 100 forming the housing 1, both the portion for preparing the circumferential wall 11 and the portion for preparing the connecting wall 12 can be machined with the stop 110. In the embodiment of the present application, referring to fig. 9, the stopper 110 is formed with a recess 140 on the outer peripheral surface of the peripheral wall 11 away from the ceramic part 22, and the stopper 110 of this structure may be formed by notching the molding 10 for preparing the housing 1 of the sensor 100 by a notching tool, but the stopper 110 may also be formed on the peripheral wall 11 of the housing 1 by dotting.

Further, when the stopper portion 110 is prepared, the profile forming the housing 1 may be an integrally formed structural member with a uniform wall thickness, the stopper portion 110 is a protruding structure on one side of the circumferential wall 11 of the housing 1 close to the accommodating cavity, and is a recessed structure on one side far away from the accommodating cavity, the stopper portion 110 occupies less housing material compared with a step structure machined in the related art, the integrally formed profile corresponding to the housing 1 is simpler in preparation process, and lower in processing cost, which is beneficial to light weight of a sensor product.

In some embodiments of the present application, as shown in fig. 5, the connecting wall 12 is located on the side of the fourth surface 104 of the ceramic portion 22. The circumferential wall 11 includes a main body portion 111 and a stopper portion 110, the main body portion 111 is located at least partially on the outer peripheral side of the plate body portion 21, and the stopper portion 110 is located at least partially on the outer peripheral side of the ceramic portion 22. The stopper 110 protrudes from the body 111 toward the axial line of the sensor 100, and a gap is provided between the stopper 110 and the connecting wall 12. That is, the surface of the stop portion 110 close to the accommodating cavity 200 is protruded from the surface of the main body 111 close to the accommodating cavity 200, and the surface of the stop portion 110 far from the accommodating cavity 200 is recessed from the surface of the main body 111 far from the accommodating cavity 200. The axial center line of the sensor 100 can be illustrated with reference to the dashed line in fig. 5.

The connecting wall 12 has an inner wall surface 120 facing the fourth surface 104 of the ceramic portion 22. The stopper portion 110 has a support surface 130 located on a side away from the connecting wall 12 in a direction along the thickness of the connecting wall 12, the thickness of the connecting wall 12 being substantially in the same direction as the height direction H of the sensor 100. The plate body 21 is pressed against the support surface 130. The distance between the support surface 130 or the second surface 102 and the inner wall surface 120 is equal to or greater than the thickness of the ceramic portion 22.

The first surface 101 of the plate body portion 21 is stressed by a pressure from the cover 4, so that the second surface 102 of the plate body portion 21 presses against the supporting surface 130 of the stop portion 110, the plate body portion 21 can be fixed or limited in the accommodating space of the housing 1, so that the plate body portion 21 cannot move in a direction approaching and separating from the connecting wall 12 along the thickness direction of the connecting wall 12, and because the plate body portion 21 and the ceramic portion 22 are fixed together, and the distance between the supporting surface 130 of the stop portion 110 and the inner wall surface 120 of the connecting wall 12 is not smaller than the thickness of the ceramic portion 22, so that the third surface 103 side of the ceramic portion 22 is not easily stressed by the pressure from the plate body portion 21, and the fourth surface 104 side of the ceramic portion 22 is not easily stressed by the pressure of the connecting wall 12, so that the ceramic portion 22 can be prevented from being crushed by no external force or only a small external force.

The assembly 2 may further comprise a sleeve structure 32 fixed to the fourth surface 104 side of the ceramic part 22, the sleeve structure 32 being a hollow cylindrical member, the hollow interior of the sleeve structure 32 may form the passage 31. In fig. 5, and with reference to fig. 10 as necessary, the outer peripheral wall of the sleeve structure 32 can be laser-welded and sealed with the connecting wall 12, which has the advantage of avoiding fluid from entering the interior of the sensor 100 from the gap between the sleeve structure 32 and the connecting wall 12, but of course the outer peripheral wall of the sleeve structure 32 can have a gap with the connecting wall 12, and other positions of the sensor 100 can be added with a sealing structure.

In some embodiments of the present application, the sensor 100 further comprises a seal 33. The seal 33 is in contact with the fourth surface 104 of the ceramic portion 22, the seal 33 is in contact with the inner wall surface 120 of the connecting wall 12, and the seal 33 can maintain the sealing property between the ceramic portion 22 and the connecting wall 12. The seal 33 may be an elastomeric seal 33 or other type of sealing material.

As shown in fig. 6, the housing 1 further includes a groove portion 121 recessed from the connecting wall 12 in a direction away from the ceramic portion 22. The sealing member 33 is at least partially received in the groove 121, and in some embodiments, as shown in fig. 9, the groove 121 forms a protrusion 122 on an outer wall surface of the housing 1 away from the ceramic part 22. The seal 33 is an elastic seal 33, the seal 33 is compressed between the ceramic portion 22 and the connecting wall 12, and the seal 33 has a deformation amount that maintains sealability between the ceramic portion 22 and the connecting wall 12.

In one embodiment of the present application, the stopper portion 110 is a continuous closed structure in the circumferential direction around the ceramic portion 22, for example, the stopper portion 110 is a closed ring-shaped structure, in some embodiments, the wall thickness of the main portion 111 of the circumferential wall 11 is equal to the wall thickness of the connecting wall 12, and for the molded part 10 for preparing the housing 1 of the sensor 100, the molded part 10 may be prepared by an integral molding process such as extrusion integral molding, and the molded part 10 has the second wall 52 for preparing the connecting wall 12 and the first wall 51 for preparing the circumferential wall 11. An inwardly protruding stopper portion 110 is formed at an outer wall surface 511 of the first wall 51 by notching. The stopper portion 110 is thus formed with a recess 140 at the outer peripheral surface of the first wall 51. That is, at least a partial region of the first wall 51 after the machining of the stop portion 110 forms the circumferential wall 11 of the housing 1 of the sensor 100, and correspondingly, the second wall 52 forms the connecting wall 12 of the housing 1 of the sensor 100, compared with the housing 1 of the sensor 100 prepared by machining, the manufacturing cost of the sensor 100 can be greatly reduced by the manufacturing process of the integrally formed molding 10 in cooperation with the stop portion 110 machined by the grooving method. The height of the stopper 110 protruding from the body 111 is equal to or less than half the thickness of the body 111. This can avoid excessive deformation of the circumferential wall 11 during machining of the stopper portion 110, which is advantageous for improving the stability and reliability of the sensor 100 product.

Of course, in other embodiments of the present application, the circumferential wall 11 may be provided with a plurality of the stopper portions 110, and the plurality of stopper portions 110 are provided dispersed in the circumferential direction around the ceramic portion 22. The stop portion 110 may be prepared by dotting on the circumferential wall 11. That is, the plurality of stopper portions 110 of the sensor 100 are projections projecting from the main body portion 111 of the circumferential wall 11 in the axial direction of the sensor 100, and the projections of the plurality of stopper portions 110 are discontinuous.

In some embodiments of the present application, as shown in fig. 13, the board body 21 is a circuit board, and the sensor 100 further includes a sensing element electrically connected to the board body 21. The plate body portion 21 has a first surface 101 and a second surface 102 on different sides in its thickness direction. The stop portion 110 protrudes from the connecting wall 12 of the housing 1 to a side close to the receiving cavity 200, and the stop portion 110 forms a recess 140 on a side of the connecting wall 12 away from the receiving cavity 200, that is, a surface of the stop portion 110 close to the receiving cavity 200 protrudes from a surface of the connecting wall 12 close to the receiving cavity 200, and a surface of the stop portion 110 far from the receiving cavity 200 is recessed from a surface of the connecting wall 12 away from the receiving cavity 200. The second surface 102 contacts the supporting surface 130 of the positioning portion 110, that is, the plate portion 21 presses against the supporting surface 130 of the positioning portion 110, in the embodiment illustrated in fig. 13, the component 2 may not include a ceramic portion, and the plate portion 21 is a circuit board electrically connected to the sensing element. The sensor 100 has a channel 31, and the channel 31 and the connecting wall 12 are both located on the side of the second surface 102 of the plate body portion 21.

In some embodiments of the present application, as shown in fig. 14 and 15, the plate body portion 21 is a capacitive pressure-sensitive element, the plate body portion 21 has a first surface and a second surface 102 adjacent to one side of the connecting wall 12 in a thickness direction thereof, and the second surface 102 includes a first region 105 and a second region 106. The second region 106 is located at the periphery of the first region 105, the second region 106 is pressed against the supporting surface 130, and at least a portion of the first region 105 forms a pressure sensing region capable of contacting with a fluid.

In some embodiments of the present application, as shown in fig. 16, the sensor 100 includes a base 20, and the base 20 includes a plate body 21. The plate body portion 21 has a first surface 101 and a second surface 102 on different sides in its thickness direction.

The sensor 100 further includes a circuit board unit 27 and a sensing member 23, and the sensing member 23 may be a capacitive pressure sensing element. The sensing element 23 is located on the side of the first surface 101, and the sensing element 23 is located between the board body portion 21 and the circuit board unit 27.

The plate body portion 21 is provided with a hole 41. The channels 41 extend from the first surface 101 to the second surface 102. The aperture 41 may be part of the channel 31, and at least a partial area of the surface of the sensing member 23 adjacent to the plate body 21 forms a pressure sensing area for contact with the fluid. The aperture 41 is at least partially opposite the pressure sensing area of the sensing element 23. The sensing element 23 is electrically connected to the circuit board unit.

The plate body 21 and the stopper 110 can be connected in a fixed or limited manner, and for the manner of fixing or limiting the plate body 21, in some embodiments of the present application, as shown in fig. 5 to 9, the housing 1 further includes a positioning portion 112, and the positioning portion 112 is received in the upper cavity 30. The positioning portion 112 protrudes from the body portion 111 in the axial direction of the sensor 100. The positioning portion 112 is formed with a recess at the outer peripheral surface of the circumferential wall 11 away from the ceramic portion 22. The peripheral edge portion of the plate body portion 21 is fixed or restrained between the positioning portion 112 and the stopper portion 110. That is, the positioning portion 112 and the stopping portion 110 can be realized by a grooving process on the outer peripheral surface of the peripheral wall 11 away from the ceramic portion 22, so that the positioning portion 112 and the stopping portion 110 are both protruded toward the axial line direction of the sensor 100, which is beneficial for the positioning portion 112 and the stopping portion 110 to clamp the plate body portion 21, and in particular, the peripheral portion of the plate body portion 21 is fixed between the positioning portion 112 and the stopping portion 110 in a limited manner. In practice, the stop portion 110 may be first machined on the molding member forming the housing 1, then the assembly 2 including the plate body portion 21, the ceramic portion 22 and the sensing member 23 is press-fitted into the accommodating space formed by the housing 1, after the assembly 2 is press-fitted in place, the plate body portion 21 abuts against the supporting surface 130 of the stop portion 110, and then the positioning portion 112 is machined, so that the plate body portion 21 can be vertically limited. Of course, the plate body 21 and the stopper 110 may be fixed by, for example, bonding.

In other embodiments of the present application, as shown in fig. 8, the housing 1 further includes a bent portion 16, and the bent portion 16 protrudes from the main body 111 toward the axial line of the sensor 100. The bent portion 16 is farther from the connecting wall 12 than the stopper portion 110.

The sensor 100 further includes a cover 4, and the cover 4 is located on the side of the first surface 101 of the plate body portion 21. The lid 4 abuts against the board body 21, and the bent portion 16 abuts against the lid 4.

In the above two embodiments, the bent portion 16 and the positioning portion 112 may exist at the same time or may be selected from them to achieve the limit of the plate body portion 21 in the direction away from the connecting wall 12.

Based on the same inventive concept, referring to fig. 17 to 20 in combination with the corresponding drawings of the foregoing embodiments, some embodiments of the present application further provide a manufacturing method for the sensor 100 of the foregoing embodiments, including:

step S101, providing a formed part.

Specifically, the molding is a structure for preparing a housing of the sensor, and referring to fig. 18 and 19, the molding 10 includes a first wall 51 and a second wall 52, the first wall 51 is connected with the second wall 52 and circumferentially surrounds the second wall 52, the molding 10 has a receiving cavity 400, and a side of the first wall 51 away from the connecting wall 12 is formed with a mounting opening 300.

In some embodiments of the present application, in step S101, the molded part 10 may be formed by extruding, stamping, or other methods. The molding of the molded article 10 may be performed by metal injection molding, forging, or the like.

And step S102, providing a processing tool, and applying external force to the forming part through the processing tool to process the stop part.

Specifically, a processing tool is provided, an external force is applied to the processing tool from the surface of the first wall 51 on the side away from the cavity 400 to the direction close to the cavity 400, a part of the first wall 51 is deformed by the external force to form the stopper 110, the other part of the first wall 51 forms the main body 111, so that the surface of the stopper 110 on the side close to the cavity 400 is protruded from the surface of the main body 111 on the side close to the cavity 400, and the surface of the stopper 110 on the side away from the cavity 400 is recessed from the surface of the main body 111 on the side away from the cavity 400. Alternatively, the processing tool applies an external force from the surface of the second wall 52 on the side away from the cavity 400 toward the cavity 400, a portion of the second wall 52 is deformed by the external force to form the stopper 110, and the other portion of the second wall 52 forms the connecting wall 12, so that the surface of the stopper 110 on the side close to the cavity 400 is protruded from the surface of the connecting wall 12 on the side close to the cavity 400, and the surface of the stopper 110 on the side away from the cavity 400 is recessed from the surface of the connecting wall 12 on the side away from the cavity 400.

Referring to fig. 18, the stop portion 110 is formed by processing the first wall 51 by a processing tool, the stop portion 110 protrudes toward the accommodating cavity 400, and the stop portion 110 forms a supporting surface 130 along at least a part of the surface of the second wall 52 away from the second wall 52 in the wall thickness direction of the second wall 52. And the spacing between the support surface 130 and the inner wall surface 120 of the second wall 52 is greater than the thickness of the ceramic portion 22 to be assembled.

In step S102, the stopper 110 may be formed on the molding member 10 by forming the stopper 110 protruding into the accommodating cavity 200 by notching the outer wall 511 of the first wall 51 away from the accommodating cavity 200. The stopper 110 has a recess 140 formed in an outer wall 511 of the first wall 51 away from the housing cavity 200.

Step S103, assembling the plate body part or the assembly comprising the plate body part into the cavity from the mounting opening, and enabling the plate body part and the stop part to be fixedly or in limited connection.

Specifically, referring to fig. 18, the assembly 2 including the plate body 21, the ceramic part 22 and the sensing member 23 is assembled into the cavity 400 of the molding member 10 from the mounting opening 300 of the molding member 10 toward the direction close to the second wall 52, so that the plate body 21 is pressed against the supporting surface 130 of the stopper 110. And the ceramic portion 22 is made closer to the second wall 52 than the plate body portion 21. Wherein the thickness of the ceramic part 22 is smaller than the thickness of the plate body part 21, and/or the material hardness of the ceramic part 22 is smaller than the material hardness of the plate body part 21.

In some embodiments, the plate body may be separately installed in the cavity 400, and the plate body needs to be fixed or limited with the stopper in the cavity of the molding member.

The fixing or retaining means of the assembly 2 may be various, for example, after the assembly is assembled, the positioning portion 112 is formed on the molding member, the positioning portion 112 is located on the side of the stop portion 110 away from the second wall 52, and the positioning portion 112 may be formed in a manner similar to the stop portion 110. The peripheral edge portion of the plate body portion 21 is fixed or restrained between the positioning portion 112 and the stopper portion 110.

Referring to fig. 20, the present application provides a specific manufacturing method for a sensor 100, including:

and step S21, checking the appearance of the pipe.

This step S21 may be omitted for unnecessary steps in some embodiments.

And step S22, processing the formed piece.

Specifically, the pipe is extruded to form an integrally formed molding 10.

Step S23, the surface of the molded part is refined.

The inner surface and the outer surface of the formed part 10 can be cleaned in a fine mode, and/or the inner hole of the formed part 10 is subjected to finish turning treatment, and wall surface burrs and other structures are removed. This step S23 may be omitted in some embodiments.

In step S24, the stopper portion is machined.

Specifically, by means of spin grooving, an external force is applied to the first wall 51 of the molded article 10 away from the outer wall surface of the housing cavity 400 to form the stopper 110, and the stopper 110 protrudes toward the housing cavity 400 of the molded article 10.

In some embodiments, the step of processing the sensor further comprises the step of assembling a seal. In particular, the sealing element may be an elastic sealing ring, which is press-fitted into the molded part 10. It should be noted that, in some embodiments of the present application, the step of assembling the sealing member and the step of processing the stopper portion S24 may not limit the execution order of the steps, and the stopper portion may be processed first and then assembled with the sealing member, or the sealing member may be assembled first and then the stopper portion is processed. Of course, in some embodiments, the step of assembling the seal may also be omitted, so that the non-communication between the sensor channel and the cavity may be achieved in other ways.

Step S25, the component is assembled.

The component 2 may include a plate portion 21, a ceramic portion 22 and a sensing member 23 fixed together, and the component 2 is assembled into the receiving cavity 400 of the molding member 10 from the mounting opening 300 of the first wall 51 toward the direction close to the second wall 52, so that the plate portion 21 is pressed against the supporting surface 130 of the stopper portion 110.

Step S26, the positioning portion is machined.

Specifically, the positioning portion 112 is formed on the outer wall surface of the first wall 51 of the molded article 10 away from the housing cavity 400 by means of spin grooving, that is, similar to the manner of forming the stopper portion 110, and the positioning portion 112 protrudes toward the housing cavity 400 of the molded article 10. The plate body 21 may be restrained between the positioning portion 112 and the stopper portion 110.

Step S27, the cover is assembled.

Specifically, the cover 4 is positioned on the side of the first surface 101 of the plate body 21 by a tool, so that the cover 4 abuts against the plate body 21. The cover 4 may be made of plastic, which is beneficial to reduce the weight and cost of the product.

In step S28, a bent portion is machined.

Specifically, the bent portion 16 itself is a metal shell connected to the first wall 51, and it extends longitudinally in a vertical state with the first wall 51, and after the cover 4 is pressed in place, the vertical bent portion 16 is pressed inward by a tool to form a flanging structure biased to the transverse direction. The molded article 10 after the bent portion 16 is processed forms the housing 1 of the sensor 100. Finally, the bent portion 16 presses against the lid 4, and the lid 4 is further vertically restrained by the fixation of the bent portion 16 and the plate body portion 21. So that the cover 4 is stably mounted with respect to the housing 1 and falls.

It is to be noted that step S26 of machining the position fixing portion may be omitted, and steps S27 and S28 are performed after step S25. That is, the plate body portion 21 can be vertically restricted by the lid 4. Thus, the step of machining the positioning portion 112 can be omitted, and thus, the sensor 100 has fewer manufacturing steps and is relatively simple and feasible.

The above embodiments are only used for illustrating the present application and not for limiting the technical solutions described in the present application, and the present application should be understood based on the descriptions of directions such as "front", "back", "left", "right", "upper", "lower", etc. for those skilled in the art, and although the present application has been described in detail in the present application with reference to the above embodiments, those skilled in the art should understand that those skilled in the art can still make modifications or equivalent substitutions on the present application, and all technical solutions and modifications thereof that do not depart from the spirit and scope of the present application should be covered within the scope of the claims of the present application.

Claims (10)

1. A sensor, characterized by comprising a housing (1) and a plate body portion (21); the sensor is provided with a containing cavity (200), the shell (1) is at least partially positioned at the periphery of the containing cavity (200), and the plate body part (21) is at least partially positioned in the containing cavity (200);

the shell (1) comprises a connecting wall (12), a main body part (111) and a stopping part (110), wherein the connecting wall (12) is positioned at one side of the plate body part (21) in the thickness direction, and at least part of the main body part (111) is arranged around the plate body part (21);

the surface of the stop part (110) close to the accommodating cavity (200) is protruded from the surface of the main body part (111) close to the accommodating cavity (200), and the surface of the stop part (110) far away from the accommodating cavity (200) is sunken from the surface of the main body part (111) far away from the accommodating cavity (200); or the surface of the stop part (110) close to the containing cavity (200) is protruded from the surface of the connecting wall (12) close to the containing cavity (200), and the surface of the stop part (110) far away from the containing cavity (200) is sunken from the surface of the connecting wall (12) far away from the containing cavity (200); the plate body part (21) is fixedly or limitedly connected with the stop part (110).

2. The sensor according to claim 1, wherein the housing (1) is made of metal, the stopper portion (110) is connected to the main body portion (111) and is of an integral structure, the stopper portion (110) protrudes from the main body portion (111) in the axial direction of the sensor, and a gap is formed between the stopper portion (110) and the connecting wall (12);

the surface of the stop part (110) close to one side of the containing cavity (200) comprises a supporting surface (130), and the plate body part (21) is pressed against the supporting surface (130).

3. The sensor according to claim 2, wherein the stopper portion (110) is a continuous closed structure in a direction around an axial center line of the sensor, and a height of a surface of the stopper portion (110) on a side close to the housing cavity (200) relative to a surface of the main body portion (111) close to the housing cavity (200) is less than or equal to half of a wall thickness of the main body portion (111).

4. Sensor according to claim 1, characterized in that the connecting wall (12) is the same wall thickness as the main body part (111).

5. A sensor according to claim 2, wherein the plate body (21) is a circuit board; the plate body portion (21) has a first surface (101) and a second surface (102) on different sides in a thickness direction thereof; the second surface (102) is in contact with the support surface (130); the sensor has a channel (31), the channel (31) and the connecting wall (12) both being located on the side of the second surface (102).

6. The sensor according to claim 5, further comprising a sensing member (23) electrically connected to the plate body portion (21); the sensor further includes a ceramic portion (22) fixed together with the plate body portion (21), the ceramic portion (22) having a third surface (103) and a fourth surface (104) respectively located on different sides in a thickness direction thereof; a third surface (103) of the ceramic part (22) is at least partially opposite to the second surface (102) of the plate body part (21);

the ceramic part (22) is provided with a guide hole (25) penetrating through the third surface (103) and the fourth surface (104), the sensing piece (23) is installed on the side of the third surface (103) of the ceramic part (22), and the sensing piece (23) covers the guide hole (25).

7. The sensor according to claim 6, wherein a projection of the ceramic portion (22) is located within a projection range of the plate body portion (21) on a plane perpendicular to a thickness direction of the plate body portion (21), and the stopper portion (110) is located on a peripheral side of the ceramic portion (22).

8. A sensor according to claim 2, wherein the plate body portion (21) is a capacitive pressure sensitive element, the plate body portion (21) having a first surface (101) and a second surface (102) on different sides in a thickness direction thereof, the second surface (102) being closer to the connecting wall (12) than the first surface (101); the second surface (102) comprises a first region (105) and a second region (106); the second area (106) is located at the periphery of the first area (105), the second area (106) is at least partially pressed against the supporting surface (130), and the first area (105) is a pressure sensing area capable of being in contact with a fluid.

9. The sensor according to claim 1, characterized in that it comprises a base (20), said base (20) comprising said plate portion (21); the plate body portion (21) has a first surface (101) and a second surface (102) on different sides in a thickness direction thereof;

the sensor further comprises a circuit board unit (27) and a sensing member (23); the sensing piece (23) is positioned on the side of the first surface (101), and the sensing piece (23) is positioned between the board body part (21) and the circuit board unit (27);

the plate body part (21) is provided with a pore channel (41); said channel (41) extending from said first surface (101) to said second surface (102); the sensing piece (23) is close to at least partial area of the surface of the plate body part (21) to form a pressure sensing area for contacting with fluid; the duct (41) is at least partially opposite to the pressure sensing area of the sensing member (23); the sensing piece (23) is electrically connected with the circuit board unit (27).

10. The sensor according to claim 1, characterized in that the housing (1) further comprises a positioning portion (112), the positioning portion (112) being further away from the connecting wall (12) than the stopper portion (110); the positioning part (112) protrudes from the main body part (111) to the axial lead direction of the sensor; the peripheral edge part of the plate body part (21) is fixed or limited between the positioning part (112) and the stopping part (110).

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