CN215265794U

CN215265794U - Resin multilayer substrate

Info

Publication number: CN215265794U
Application number: CN201990001151.5U
Authority: CN
Inventors: 多胡茂; 上坪祐介; 田中千绘; 佐藤贵子; 前川大辉
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2018-12-11
Filing date: 2019-11-26
Publication date: 2021-12-21
Anticipated expiration: 2029-11-26
Also published as: WO2020121801A1

Abstract

A resin multilayer substrate (101) is provided with: a resin base (10) formed by laminating a plurality of resin layers; a functional conductor pattern (31, 32, 33) formed on at least one of the plurality of resin layers; and 1 st dummy conductors (D111, D112, D113, D114, D121, D122, D123, D124, D131, D132, D133, D134) formed on the plurality of resin layers including the resin layer on which the functional conductor patterns (31, 32, 33) are formed, respectively. The 1 st dummy conductor is not in conduction with the functional conductor patterns (31, 32, 33). The 1 st dummy conductors are arranged to intermittently surround the functional conductor patterns (31, 32, 33) when viewed in the stacking direction. Further, the 1 st dummy conductors adjacent to each other in the stacking direction are arranged so as not to overlap each other when viewed from the stacking direction.

Description

Resin multilayer substrate

Technical Field

The present invention relates to a resin multilayer substrate, and more particularly, to a resin multilayer substrate including a resin base material formed by laminating a plurality of resin layers, and a conductor pattern and a dummy conductor formed on any one of the plurality of resin layers.

Background

Conventionally, there is known a resin multilayer substrate including: a resin base material formed by laminating a plurality of resin layers; a conductor pattern formed on any one of the plurality of resin layers; and a dummy conductor formed in the resin layer on which the conductor pattern is formed among the plurality of resin layers.

For example, patent document 1 discloses a resin multilayer substrate including: a resin base material formed by laminating a plurality of resin layers; a plurality of functional conductor patterns (conductor patterns for coil) formed on the plurality of resin layers; and ring-shaped dummy conductors formed in the same layer as the functional conductor patterns, respectively, and arranged so as to surround the functional conductor patterns. According to this structure, when the resin base material is formed (when a plurality of resin layers are stacked and heated and pressed), the flow of the resin is suppressed by the dummy conductor surrounding the functional conductor pattern. Therefore, the positional deviation of the functional conductor pattern due to the flow of the resin can be suppressed, and as a result, the change in the electrical characteristics of the resin multilayer substrate can be suppressed.

Prior art documents

Patent document

Patent document 1: international publication No. 2015/079773

SUMMERY OF THE UTILITY MODEL

Problem to be solved by utility model

However, in the resin multilayer substrate disclosed in patent document 1, since the plurality of dummy conductors formed in the plurality of resin layers are stacked on each other in the stacking direction, it may be difficult to ensure the flatness of the main surface (surface orthogonal to the stacking direction) of the resin base. This is because, in general, when a plurality of resin layers having conductor patterns formed thereon are stacked, the thickness of the portion having the conductor patterns formed thereon increases in accordance with the thickness of the conductor patterns, and the thickness of the portion in the stacking direction becomes thicker than the other portions.

In the resin multilayer substrate disclosed in patent document 1, the functional conductor pattern is surrounded by a ring-shaped dummy conductor formed in the same layer as the functional conductor pattern. Therefore, when a plurality of resin layers are laminated (at the time of heating and pressing), the resin in the region surrounded by the annular dummy conductor is restricted, and the flow of the resin in the region surrounded by the annular dummy conductor is hindered, which causes deformation (deflection and the like) of the functional conductor pattern and the dummy conductor. As a result, it becomes more difficult to ensure the flatness of the main surface of the resin substrate.

An object of the present invention is to provide a resin multilayer substrate having a resin base material formed by stacking a plurality of resin layers, and a functional conductor pattern and a dummy conductor formed on any one of the plurality of resin layers, in which flatness is ensured while positional deviation of the functional conductor pattern is suppressed when the plurality of resin layers are stacked.

Means for solving the problems

The utility model discloses a resin multilayer substrate, its characterized in that possesses:

a resin base material formed by laminating a plurality of resin layers;

a functional conductor pattern formed on at least one of the plurality of resin layers and constituting at least a part of the circuit section; and

a plurality of 1 st dummy conductors formed in two or more resin layers including the resin layer forming the functional conductor pattern among the plurality of resin layers, respectively, and not electrically connected to the functional conductor pattern,

the plurality of 1 st dummy conductors are configured to intermittently surround the functional conductor pattern as viewed from a lamination direction of the plurality of resin layers,

a plurality of 1 st dummy conductors formed in the same resin layer among the plurality of 1 st dummy conductors are arranged so as to surround the functional conductor pattern when viewed from the stacking direction,

a plurality of 1 st dummy conductors adjacent in the stacking direction among the plurality of 1 st dummy conductors are arranged so as not to overlap with each other when viewed from the stacking direction.

According to this structure, the 1 st dummy conductors adjacent to each other in the stacking direction do not overlap each other in the stacking direction, and therefore, the flatness of the main surface of the resin base material can be ensured.

When the functional conductor pattern is surrounded by the annular dummy conductor, since the resin in the region surrounded by the annular dummy conductor is restricted, when a plurality of resin layers are laminated (at the time of heating and pressing), the flow of the resin from the region surrounded by the annular dummy conductor to the outside is hindered to a degree more than necessary, and as a result, the functional conductor pattern and the dummy conductor may be deformed (bent or the like). On the other hand, in this structure, since the plurality of 1 st dummy conductors intermittently (intermittently) surround the functional conductor pattern when viewed in the stacking direction, the flow of the resin in the region surrounded by the 1 st dummy conductors (particularly, the flow of the resin toward the outside from the region surrounded by the plurality of 1 st dummy conductors) can be appropriately controlled at the time of stacking. That is, in the lamination, deformation of the functional conductor pattern and the 1 st dummy conductor due to the fact that the flow of the resin in the planar direction is hindered by the dummy conductor to a degree more than necessary can be suppressed.

The utility model discloses a manufacturing method of resin multilayer substrate, its characterized in that possesses:

a functional conductor forming step of forming a functional conductor pattern on at least one of the plurality of resin layers;

a dummy conductor forming step of forming a plurality of 1 st dummy conductors in each of two or more resin layers including a resin layer in which the functional conductor pattern is formed among the plurality of resin layers, wherein when the plurality of resin layers are stacked, the plurality of 1 st dummy conductors are intermittently arranged so as to surround the functional conductor pattern when viewed from a stacking direction of the plurality of resin layers, and the plurality of 1 st dummy conductors are not electrically connected to the functional conductor pattern; and

and a resin base material forming step of forming a resin base material by laminating the plurality of resin layers and heating and pressing the resin layers after the functional conductor forming step and the dummy conductor forming step so that a plurality of 1 st dummy conductors adjacent to each other in the laminating direction do not overlap each other when viewed in the laminating direction.

With this manufacturing method, it is possible to easily manufacture a resin multilayer substrate in which flatness is ensured while suppressing positional deviation of the functional conductor pattern when a plurality of resin layers are laminated.

Effect of the utility model

According to the present invention, a resin multilayer substrate can be realized which has a resin base material formed by stacking a plurality of resin layers and a functional conductor pattern and a dummy conductor formed on any one of the plurality of resin layers, and which ensures flatness while suppressing positional deviation of the functional conductor pattern when the plurality of resin layers are stacked.

Drawings

Fig. 1 (a) is an external perspective view of a resin multilayer substrate 101 according to embodiment 1, and fig. 1 (B) is a plan view of the resin multilayer substrate 101.

Fig. 2 is an exploded plan view of the resin multilayer substrate 101.

Fig. 3 is a sectional view of the resin multilayer substrate 101.

Fig. 4 is a sectional view sequentially showing the steps of manufacturing the resin multilayer substrate 101.

Fig. 5 (a) is an external perspective view of the multilayer resin substrate 102 according to embodiment 2, and fig. 5 (B) is a plan view of the multilayer resin substrate 102.

Fig. 6 is an exploded plan view of the resin multilayer substrate 102.

Fig. 7 is a plan view of the resin multilayer substrate 201 according to embodiment 3.

Fig. 8 is an exploded plan view of the resin multilayer substrate 201.

Fig. 9 is a plan view of the resin multilayer substrate 202 according to embodiment 4.

Fig. 10 is an exploded plan view of the resin multilayer substrate 202.

Fig. 11 is a plan view of a resin multilayer substrate 203 according to embodiment 5.

Fig. 12 is a plan view of the resin layer 22 provided in the resin multilayer substrate 203.

Fig. 13 is a plan view of the resin layer 23 provided in the resin multilayer substrate 203.

Fig. 14 is an enlarged plan view of the enlarged display portion ZP in fig. 12.

Fig. 15 (a) is an enlarged plan view of the 1 st dummy conductor D112D provided in the resin multilayer substrate 203A as a modification, and fig. 15 (B) is an enlarged plan view of the 1 st dummy conductor D112e provided in the resin multilayer substrate 203B as another modification.

Detailed Description

Hereinafter, a plurality of embodiments for carrying out the present invention will be described by way of a few specific examples with reference to the drawings. The same reference numerals are given to the same parts in the drawings. In view of ease of explanation or understanding of the points, the embodiments are shown separately for convenience, but partial replacement or combination of the structures shown in different embodiments is possible. In

embodiments

2 and 2, partial replacement or combination of the structures described in embodiment 1 can be performed. In embodiment 2 and thereafter, descriptions of common matters with embodiment 1 are omitted, and only differences will be described. In particular, the same operational effects based on the same structure will not be mentioned in each embodiment.

EXAMPLE 1 embodiment

Fig. 1 (a) is an external perspective view of a resin multilayer substrate 101 according to embodiment 1, and fig. 1 (B) is a plan view of the resin multilayer substrate 101. Fig. 2 is an exploded plan view of the resin multilayer substrate 101. Fig. 3 is a sectional view of the resin multilayer substrate 101. In fig. 1 (B), the 1 st dummy conductors D121, D122, D123, and D124 are illustrated in a dotted pattern to simplify the structure. Note that, in fig. 1 (B), the input/output electrodes P1 and P2 are not shown. The resin multilayer substrate 101 according to the present embodiment is a surface-mounted component to be surface-mounted on another circuit board or the like.

The resin multilayer substrate 101 includes a resin base 10,

functional conductor patterns

31, 32, 33,

conductor patterns

41, 42, 1 st dummy conductors D111, D112, D113, D114, D121, D122, D123, D124, D131, D132, D133, D134, input/output electrodes P1, P2, interlayer connection conductors V1, V2, V3, V4, V5, V6, and the like.

As will be described later in detail, the

functional conductor patterns

31, 32, and 33 constitute a part of a circuit portion (coil) formed on the resin multilayer substrate 101. The 1 st dummy conductors D111 to D114, D121 to D124, and D131 to D134 are conductor patterns independent from the circuit unit and not electrically connected to the

functional conductor patterns

31, 32, and 33.

The resin substrate 10 is a rectangular parallelepiped whose longitudinal direction coincides with the X-axis direction, and has a 1 st main surface VS1 and a 2 nd main surface VS2 facing each other. The resin substrate 10 is a green body containing a thermoplastic resin as a main component.

The input/output electrodes P1 and P2 are formed on the 1 st main surface VS1 of the resin base 10. Inside the resin base 10,

functional conductor patterns

31, 32, and 33,

conductor patterns

41 and 42, 1 st dummy conductors D111 to D114, D121 to D124, D131 to D134, and interlayer connection conductors V1 to V6 are formed.

The resin substrate 10 is a laminate formed by laminating a plurality of resin layers 11, 12, 13, and 14. Specifically, the plurality of resin layers 14, 13, 12, and 11 are sequentially stacked. Each of the resin layers 11, 12, 13, and 14 is a rectangular resin (thermoplastic resin) flat plate whose longitudinal direction coincides with the X-axis direction. The resin layers 11, 12, 13, and 14 are resin sheets mainly composed of, for example, Liquid Crystal Polymer (LCP), polyether ether ketone (PEEK), or the like.

Input/output electrodes P1 and P2 are formed on the surface of the resin layer 11. The input/output electrode P1 is a rectangular conductor pattern disposed in the vicinity of the 1 st side of the resin layer 11 (the left side of the resin layer 11 in fig. 2). The input/output electrode P2 is a rectangular conductor pattern disposed in the vicinity of the 3 rd side of the resin layer 11 (the right side of the resin layer 11 in fig. 2). The longitudinal directions of the input/output electrodes P1 and P2 are both aligned with the Y-axis direction. The input/output electrodes P1 and P2 are conductor patterns such as Cu foils, for example.

Further, interlayer connection conductors V1 and V6 are formed in the resin layer 11.

The functional conductor pattern 31, the conductor pattern 42, and the 1 st dummy conductors D111, D112, D113, and D114 are formed on the surface of the resin layer 12. The functional conductor pattern 31 is a conductor pattern for a coil having a rectangular loop shape of 0.75 turns disposed in the vicinity of the center of the resin layer 12. The conductor pattern 42 is a rectangular conductor pattern disposed in the vicinity of the functional conductor pattern 31. The 1 st dummy conductor D111 is a rectangular conductor pattern which is arranged in the vicinity of the 1 st side (the left side of the resin layer 12 in fig. 2) of the resin layer 12 and has a longitudinal direction coincident with the Y-axis direction. The 1 st dummy conductor D112 is a rectangular conductor pattern which is arranged in the vicinity of the 2 nd side of the resin layer 12 (the upper side of the resin layer 12 in fig. 2) and has a longitudinal direction coincident with the X-axis direction. The 1 st dummy conductor D113 is a rectangular conductor pattern which is arranged in the vicinity of the 3 rd side of the resin layer 12 (the right side of the resin layer 12 in fig. 2) and has a longitudinal direction aligned with the Y-axis direction. The 1 st dummy conductor D114 is a rectangular conductor pattern which is arranged in the vicinity of the 4 th side of the resin layer 12 (the lower side of the resin layer 12 in fig. 2) and has a longitudinal direction coincident with the X-axis direction. The functional conductor pattern 31, the conductor pattern 42, and the 1 st dummy conductors D111 to D114 are conductor patterns such as Cu foil, for example.

Further, interlayer connection conductors V2 and V5 are formed in the resin layer 12.

The functional conductor pattern 32, the conductor pattern 41, and the 1 st dummy conductors D121, D122, D123, and D124 are formed on the surface of the resin layer 13. The functional conductor pattern 32 is a conductor pattern for a coil having a rectangular loop shape of 0.75 turns disposed in the vicinity of the center of the resin layer 13. The conductor pattern 41 is a rectangular conductor pattern disposed in the vicinity of the functional conductor pattern 32. The 1 st dummy conductor D121 is a rectangular conductor pattern disposed in the vicinity of the 1 st corner of the resin layer 13 (the lower left corner of the resin layer 13 in fig. 2). The 1 st dummy conductor D122 is a rectangular conductor pattern disposed in the vicinity of the 2 nd corner of the resin layer 13 (the upper left corner of the resin layer 13 in fig. 2). The 1 st dummy conductor D123 is a rectangular conductor pattern disposed near the 3 rd corner of the resin layer 13 (the upper right corner of the resin layer 13 in fig. 2). The 1 st dummy conductor D124 is a rectangular conductor pattern disposed in the vicinity of the 4 th corner of the resin layer 13 (the lower right corner of the resin layer 13 in fig. 2). The functional conductor pattern 32, the conductor pattern 41, and the 1 st dummy conductors D121 to D124 are conductor patterns such as Cu foil, for example.

Further, interlayer connection conductors V3 and V4 are formed in the resin layer 13.

The functional conductor pattern 33 and the 1 st dummy conductors D131, D132, D133, and D134 are formed on the surface of the resin layer 14. The functional conductor pattern 33 is a rectangular conductor pattern which is arranged in the vicinity of the 1 st side (the left side of the resin layer 14 in fig. 2) of the resin layer 14 and the longitudinal direction of which coincides with the Y-axis direction. The 1 st dummy conductor D132 is a rectangular conductor pattern which is arranged in the vicinity of the 2 nd side of the resin layer 14 (the upper side of the resin layer 14 in fig. 2) and has a longitudinal direction coincident with the X-axis direction. The 1 st dummy conductor D133 is a rectangular conductor pattern which is arranged in the vicinity of the 3 rd side of the resin layer 14 (the right side of the resin layer 14 in fig. 2) and whose longitudinal direction coincides with the Y-axis direction. The 1 st dummy conductor D134 is a rectangular conductor pattern which is arranged in the vicinity of the 4 th side (lower side in the resin layer 14 in fig. 2) of the resin layer 14 and whose longitudinal direction coincides with the X-axis direction. The functional conductor pattern 33 and the 1 st dummy conductors D131 to D134 are conductor patterns such as Cu foil, for example.

The input/output electrodes P1 and P2 are electrically connected to each other. Specifically, the input/output electrode P1 is connected to one end of the functional conductor pattern 31 via the interlayer connection conductor V1. The other end of the functional conductor pattern 31 is connected to one end of the functional conductor pattern 32 via the interlayer connection conductor V2. The other end of the functional conductor pattern 32 is connected to one end of the functional conductor pattern 33 via the interlayer connection conductor V3. The other end of the functional conductor pattern 33 is connected to the input/output electrode P2 via the

conductor patterns

41 and 42 and the interlayer connection conductors V4, V5, and V6. In the resin base material 10 according to the present embodiment, a rectangular spiral coil (circuit portion) is configured including the

functional conductor patterns

31, 32, and 33 and the interlayer connection conductors V2 and V3.

In the present invention, the 1 st dummy conductors are formed on two or more resin layers including the resin layer forming the functional conductor pattern, respectively. In the present embodiment, each of the 1 st dummy conductors is formed in two or more resin layers adjacent to each other in the stacking direction (Z-axis direction) including the resin layer on which the functional conductor pattern is formed. Specifically, the 1 st dummy conductors D111 to D114 are formed in the resin layer 12 where the functional conductor pattern 31 is formed. The 1 st dummy conductors D121 to D124 are formed in the resin layer 13 (resin layer adjacent to the resin layer 12) where the functional conductor pattern 32 is formed. The 1 st dummy conductors D131 to D134 are formed in the resin layer 14 (resin layer adjacent to the resin layer 13) where the functional conductor pattern 33 is formed.

In the present invention, the 1 st dummy conductors formed on the same resin layer are arranged so as to surround the functional conductor pattern when viewed in the stacking direction (Z-axis direction). Specifically, as shown in fig. 1 (B), 3, and the like, the 1 st dummy conductors D111 to D114 formed in the resin layer 12 are arranged so as to surround the

functional conductor patterns

31, 32, and 33 when viewed from the Z-axis direction. The 1 st dummy conductors D121 to D124 formed in the resin layer 13 are arranged so as to surround the

functional conductor patterns

31, 32, and 33 when viewed from the Z-axis direction. Further, the 1 st dummy conductors D131 to D134 formed in the resin layer 14 are arranged so as to surround the

functional conductor patterns

31, 32, and 33 when viewed from the Z-axis direction.

In the present specification, the phrase "a plurality of 1 st dummy conductors surround the functional conductor pattern" means that at least a part of the functional conductor pattern is disposed in a region surrounded by the plurality of 1 st dummy conductors. In other words, if at least a part of the functional conductor pattern is disposed in an area where the outer shapes of the 1 st dummy conductors are connected by straight lines, it means that "the functional conductor pattern is surrounded by the 1 st dummy conductors".

In addition, in the present invention, the 1 st dummy conductors adjacent to each other in the stacking direction (Z-axis direction) are arranged so as not to overlap each other when viewed from the Z-axis direction. Specifically, the 1 st dummy conductors D111 to D114 and the 1 st dummy conductors D121 to D124 adjacent to each other in the Z-axis direction (at the fitting position) are arranged so as not to overlap each other when viewed from the Z-axis direction. The 1 st dummy conductors D121 to D124 and the 1 st dummy conductors D131 to D134 adjacent to each other in the Z-axis direction (at the fitting positions) are arranged so as not to overlap each other when viewed from the Z-axis direction.

In the present embodiment, the 1 st dummy conductors formed on the two resin layers adjacent to each other in the stacking direction (Z-axis direction) are arranged so as not to overlap each other when viewed from the Z-axis direction. Specifically, the 1 st dummy conductors D111 to D114 formed in the resin layer 12 and the 1 st dummy conductors D121 to D124 formed in the resin layer 13 adjacent to the resin layer 12 are arranged so as not to overlap each other (at the fitting position) when viewed from the Z-axis direction. The plurality of 1 st dummy conductors D121 to D124 formed in the resin layer 13 and the plurality of 1 st dummy conductors D131 to D134 formed in the resin layer 14 adjacent to the resin layer 13 (at the fitting positions) are arranged so as not to overlap each other when viewed from the Z-axis direction.

Further, in the present invention, the 1 st dummy conductors D111 to D114, D121 to D124, and D131 to D134 are arranged to intermittently surround the

functional conductor patterns

31, 32, and 33 when viewed from the Z-axis direction.

In the present specification, the term "intermittently surrounding" means a state in which a plurality of 1 st dummy conductors intermittently surround the periphery of the functional conductor pattern with a predetermined gap therebetween. Here, the "given gap" means, for example, that "the plurality of 1 st dummy conductors intermittently surround the functional conductor pattern" if a gap (DR1) between 1 st dummy conductors adjacent to each other in a certain direction (for example, X-axis direction) is smaller than a width (WR1) of the circuit portion in the certain direction (DR1 < WR1) as viewed from the Z-axis direction.

The resin multilayer substrate 101 according to the present embodiment has the following effects.

(a) In the present embodiment, the 1 st dummy conductors adjacent to each other in the stacking direction (Z-axis direction) are arranged so as not to overlap each other when viewed from the Z-axis direction. According to this structure, since the 1 st dummy conductors adjacent to each other in the stacking direction do not overlap each other in the Z-axis direction, the flatness of the main surface (the 1 st main surface VS1 or the 2 nd main surface VS2) of the resin base material can be ensured.

In the present embodiment, a plurality of 1 st dummy conductors adjacent to each other in the stacking direction (Z-axis direction) are arranged at positions where they are fitted to each other. Here, the phrase "disposed at a position where they are fitted to each other" means that, when a plurality of resin layers are stacked, a certain 1 st dummy conductor is disposed between other 1 st dummy conductors (1 st dummy conductors adjacent to the certain 1 st dummy conductor in the stacking direction). For example, as shown in fig. 1B and 2, the 1 st dummy conductors D111 and D131 are respectively disposed between the 1 st dummy conductors D121 and D122 (see the fitting portion FP in fig. 1B). With this configuration, the positional shift, deformation, and the like of the 1 st dummy conductor due to the flow of the resin during lamination can be suppressed.

(b) Further, in the present embodiment, the 1 st dummy conductors formed on the two resin layers adjacent to each other in the Z-axis direction are arranged so as not to overlap each other when viewed from the Z-axis direction. According to this structure, as compared with the case where a resin layer in which the 1 st dummy conductor is not formed is disposed between two resin layers in which the 1 st dummy conductors are formed (which do not overlap with each other in the Z-axis direction), it is possible to further suppress positional displacement, deformation, and the like of the 1 st dummy conductor due to the flow of resin during lamination.

(c) When the functional conductor pattern is surrounded by the annular dummy conductor, since the resin in the region surrounded by the annular dummy conductor is restricted, when a plurality of resin layers are laminated (at the time of heating and pressing), the flow of the resin from the region surrounded by the annular dummy conductor toward the outside (the flow of the resin in the planar direction) is hindered to a degree more than necessary, and as a result, the functional conductor pattern and the dummy conductor may be deformed (bent or the like). On the other hand, in the present embodiment, the plurality of 1 st dummy conductors D111 to D114, D121 to D124, and D131 to D134 intermittently (intermittently) surround the

functional conductor patterns

31, 32, and 33 when viewed from the Z-axis direction. According to this structure, the flow of the resin in the region surrounded by the 1 st dummy conductor (particularly, the flow of the resin toward the outside from the region surrounded by the plurality of 1 st dummy conductors) can be appropriately controlled at the time of lamination. That is, according to this structure, it is possible to suppress deformation of the functional conductor pattern, the 1 st dummy conductor, and the like caused by the dummy conductor obstructing the flow of the resin in the planar direction more than necessary during lamination.

(d) In the present embodiment, each of the plurality of resin layers 11, 12, 13, and 14 forming the resin substrate 10 includes a thermoplastic resin. According to this structure, as will be described later in detail, the resin base 10 can be easily formed by collectively pressing the plurality of resin layers 11, 12, 13, 14. Therefore, the manufacturing process of the resin multilayer substrate 101 can be reduced, and the cost can be kept low. In the present embodiment, the resin substrate 10 is a green body of a thermoplastic resin. With this configuration, it is possible to realize a resin multilayer substrate that can be easily plastically deformed and can maintain (hold) a desired shape.

In the present embodiment, the

functional conductor patterns

31, 32, and 33 are formed on the plurality of resin layers 12, 13, and 14, respectively, but the resin multilayer substrate of the present invention is not limited to this configuration. The functional conductor pattern of the present invention can be formed only on at least one of the plurality of resin layers.

In the present embodiment, the example in which the plurality of 1 st dummy conductors are formed on two or more adjacent resin layers including the resin layer on which the plurality of functional conductor patterns are formed is shown, but the resin multilayer substrate of the present invention is not limited to this configuration. The 1 st dummy conductor of the present invention may be formed by forming two or more resin layers including a resin layer forming the functional conductor pattern among the plurality of resin layers. That is, the 1 st dummy conductors adjacent to each other in the Z-axis direction may not overlap each other when viewed from the Z-axis direction, and a structure may be adopted in which a resin layer in which the 1 st dummy conductor is not formed is interposed between two resin layers in which the 1 st dummy conductors are formed.

The resin multilayer substrate 101 according to the present embodiment is manufactured by, for example, the following manufacturing method. Fig. 4 is a sectional view sequentially showing the steps of manufacturing the resin multilayer substrate 101. In fig. 4, for convenience of explanation, a single chip (monolithic) drawing is described, but the actual manufacturing process of the resin multilayer substrate 101 is performed in a collective substrate state. The "collective substrate" refers to a mother substrate including a plurality of resin multilayer substrates 101.

First, as shown in (1) of fig. 5, a plurality of resin layers 11, 12, 13, 14 are prepared, and the resin layers 11, 12, 13, 14 are resin sheets mainly composed of, for example, Liquid Crystal Polymer (LCP), polyether ether ketone (PEEK), or the like.

Then, the input/output electrodes P1, P2, functional conductor patterns (see the

functional conductor patterns

31, 32, and 33 shown in fig. 2), the 1 st dummy conductors D114, D121, D124, and D134, and the like are formed in the resin layers 11, 12, 13, and 14, respectively. Specifically, a metal foil (e.g., Cu foil) is laminated to one side of the resin layer, and the metal foil is patterned by photolithography. Thereby, the input/output electrodes P1 and P2 are formed on the surface of the resin layer 11. A functional conductor pattern (not shown), the 1 st dummy conductor D114, and the like are formed on the surface of the resin layer 12. A functional conductor pattern (not shown), the 1 st dummy conductors D121 and D124, and the like are formed on the surface of the resin layer 13. Further, a functional conductor pattern (not shown), a 1 st dummy conductor D134, and the like are formed on the surface of the resin layer 14.

The 1 st dummy conductors D114, D121, D124, D134, and the like are independent conductor patterns that are not conductive to the functional conductor patterns. In the "resin base material forming step" described later in detail, the 1 st dummy conductors D114, D121, D124, D134 and the like are intermittently arranged so as to surround the functional conductor pattern when viewed from the Z-axis direction when the plurality of resin layers 11, 12, 13, 14 are stacked.

The step of forming the functional conductor pattern on at least one of the plurality of resin layers 11, 12, 13, and 14 is an example of the "functional conductor forming step" of the present invention. The step of forming the 1 st dummy conductors D114, D121, D124, D134, etc. in the two or more resin layers 12, 13, 14 including the resin layer forming the functional conductor pattern among the plurality of resin layers 11, 12, 13, 14 is an example of the "dummy conductor forming step" of the present invention.

Further, interlayer connection conductors (interlayer connection conductors V1, V2, V3, V4, V5, and V6 shown in fig. 2) are formed in the resin layers 11, 12, and 13. These interlayer connection conductors are provided, for example, by providing through holes in a resin layer by laser or the like, then providing a conductive paste containing one or more of Cu, Sn, and the like or an alloy thereof, and then curing the paste by subsequent heating and pressing.

Next, the plurality of resin layers 14, 13, 12, and 11 are sequentially stacked (placed). At this time, the 1 st dummy conductors adjacent to each other in the stacking direction (Z-axis direction) do not overlap each other when viewed from the Z-axis direction. In this embodiment, the two or more resin layers on which the 1 st dummy conductor is formed are adjacent to each other in the Z-axis direction, and the 1 st dummy conductors formed on the two resin layers adjacent to each other do not overlap each other when viewed from the Z-axis direction.

Specifically, the 1 st dummy conductor D114 and the like and the 1 st dummy conductors D121, D124 and the like adjacent in the Z-axis direction do not overlap each other when viewed from the Z-axis direction. Further, the 1 st dummy conductors D121 and D124 and the 1 st dummy conductor D134 and the like adjacent to each other in the Z-axis direction do not overlap each other when viewed from the Z-axis direction. Further, the resin layer 12 having the 1 st dummy conductor D114 and the like and the resin layer 13 having the 1 st dummy conductors D121, D124 and the like are adjacent to each other, and the plurality of 1 st dummy conductors (D114, D121, D124 and the like) formed in the resin layers 12, 13 adjacent to each other do not overlap each other when viewed from the Z-axis direction. Further, the resin layer 13 on which the 1 st dummy conductors D121, D124, etc. are formed and the resin layer 14 on which the 1 st dummy conductor D134, etc. are formed are adjacent to each other, and the plurality of 1 st dummy conductors (D121, 124, D134, etc.) formed on the mutually adjacent resin layers 13, 14, respectively, do not overlap each other when viewed from the Z-axis direction.

Then, the plurality of resin layers 11, 12, 13, 14 are heated and pressed (collectively pressed) in the stacking direction (Z-axis direction), thereby forming the resin base 10 shown in (2) of fig. 5.

The step of forming the resin base 10 by laminating the plurality of resin layers 11, 12, 13, and 14 and heating and pressing the same after the "functional conductor forming step" and the "dummy conductor forming step" is an example of the "resin base forming step" of the present invention.

Finally, the resin multilayer substrate 101 is obtained by separating the collective substrate into individual pieces.

In addition, according to this manufacturing method, the resin base 10 can be easily formed by collectively pressing the plurality of resin layers 11, 12, 13, and 14. Therefore, the manufacturing process of the resin multilayer substrate 101 can be reduced, and the cost can be kept low.

In the above-described manufacturing method, the "functional conductor forming step" and the "dummy conductor forming step" are performed simultaneously, but the method is not limited to this manufacturing method. The "functional conductor forming step" and the "dummy conductor forming step" may be performed before the "resin base material forming step", the "dummy conductor forming step" may be performed after the "functional conductor forming step", or the "functional conductor forming step" may be performed after the "dummy conductor forming step".

EXAMPLE 2 EXAMPLE

In embodiment 2, an example of a resin multilayer substrate including a dummy conductor (2 nd dummy conductor) different from the 1 st dummy conductor is shown.

Fig. 5 (a) is an external perspective view of the multilayer resin substrate 102 according to embodiment 2, and fig. 5 (B) is a plan view of the multilayer resin substrate 102. Fig. 6 is an exploded plan view of the resin multilayer substrate 102. In fig. 5 (B), the 1 st dummy conductors D121, D122, D123, and D124 are illustrated in a dotted pattern to simplify the structure. Note that, in fig. 5 (B), the input/output electrodes P1 and P2 are not shown. In fig. 6, the functional portion forming regions FR1, FR2, and FR3 are shown by dot patterns.

The resin multilayer substrate 102 is different from the resin multilayer substrate 101 according to embodiment 1 in that it further includes 2 nd dummy conductors D211, D221, and D231 and a conductor pattern 43. The other structure of the resin multilayer substrate 102 is substantially the same as that of the resin multilayer substrate 101.

Hereinafter, a description will be given of a portion different from the resin multilayer substrate 101 according to embodiment 1.

The 2 nd dummy conductors D211, D221, and D231 are conductors formed in any of the resin layers forming the 1 st dummy conductor. Similarly to the 1 st dummy conductors D111 to D114, D121 to D124, and D131 to D134, the 2 nd dummy conductors D211 to D231 are independent conductor patterns that are not electrically connected to the

functional conductor patterns

31, 32, and 33.

The 2 nd dummy conductor D211 is a rectangular conductor pattern formed on the surface of the resin layer 12. The 2 nd dummy conductor D211 is disposed near the center of the resin layer 12. More specifically, the 2 nd dummy conductor D211 is disposed in an area (functional portion forming area FR1 in fig. 6) surrounded by the functional conductor pattern 31 disposed in the same layer (surface of the resin layer 12). The 2 nd dummy conductor D211 is a conductor pattern such as Cu foil, for example.

The 2 nd dummy conductor D221 is a rectangular conductor pattern formed on the surface of the resin layer 13. The 2 nd dummy conductor D221 is disposed near the center of the resin layer 13. More specifically, the 2 nd dummy conductor D221 is disposed in an area (functional portion formation area FR2 in fig. 6) surrounded by the functional conductor pattern 32 disposed in the same layer (surface of the resin layer 13). The 2 nd dummy conductor D221 is a conductor pattern such as Cu foil, for example.

Each of the 2 nd dummy conductor D231 and the conductor pattern 43 is a rectangular conductor pattern formed on the surface of the resin layer 14. The 2 nd dummy conductor D231 is disposed near the center of the resin layer 14. More specifically, the 2 nd dummy conductor D231 is disposed in an area (functional portion formation area FR3 in fig. 6) surrounded by the functional conductor pattern 33 disposed in the same layer. The 2 nd dummy conductor D231 and the conductor pattern 43 are conductor patterns such as Cu foil, for example.

As shown in fig. 6, the 2 nd dummy conductor D231 according to the present embodiment is connected to the 1 st dummy conductor D133 disposed in the same layer (the surface of the resin layer 14) via the conductor pattern 43.

According to the present embodiment, in addition to the effects described in embodiment 1, the following effects are obtained.

In the present embodiment, the 2 nd dummy conductors D211, D221, D231 are disposed in the functional portion forming regions FR1, FR2, FR3 surrounded by the

functional conductor patterns

31, 32, 33, respectively. With this structure, the

functional conductor patterns

31, 32, and 33 are sandwiched between the 1 st dummy conductors D111 to D114, D121 to D124, D131 to D134, and the 2 nd dummy conductors D211 to D231. Therefore, when a plurality of resin layers are laminated (at the time of heating and pressing), the resin can be made to flow to the outside of the functional section formation regions FR1, FR2, and FR3, and deformation of the functional conductor pattern at the time of lamination can be further suppressed.

As described in this embodiment, the 1 st dummy conductor and the 2 nd dummy conductor may be connected.

In addition, although the present embodiment shows a configuration in which the 2 nd dummy conductors D211 to D231 are formed in the resin layers 12, 13, and 14 in which the 1 st dummy conductor is formed, it is not necessary to form the 2 nd dummy conductor in all of the plurality of resin layers in which the 1 st dummy conductor is formed. The 2 nd dummy conductor may be formed, for example, in any one of the plurality of resin layers forming the 1 st dummy conductor.

EXAMPLE 3

In embodiment 3, an example of a resin multilayer substrate provided with a plurality of circuit portions including a plurality of functional conductor patterns is shown.

Fig. 7 is a plan view of the resin multilayer substrate 201 according to embodiment 3. Fig. 8 is an exploded plan view of the resin multilayer substrate 201. In fig. 7, the 1 st dummy conductors D121a, D122a, D123a, D124a, D125a, and D126a are shown in a dotted pattern to make the structure easier to understand. In fig. 8, the resin layer on which the input/output electrodes P1 and P2 are formed is not illustrated.

The resin multilayer substrate 201 is different from the resin multilayer substrate 101 according to embodiment 1 in that it includes a resin base material 20. As described in detail later, the resin multilayer substrate 201 is different from the resin multilayer substrate 101 in that a plurality of circuit portions having the same function are arranged in a planar direction. The other structure of the resin multilayer substrate 201 is substantially the same as that of the resin multilayer substrate 101. The resin multilayer substrate 201 according to the present embodiment is a collective substrate (mother substrate) including a plurality of substrates.

The resin multilayer substrate 201 includes a resin base material 20, 4

functional conductor patterns

31, 32, 4 conductor patterns 41, a 1 st dummy conductor D111a, D112a, D113a, D114a, D115a, D116a, D121a, D122a, D123a, D124a, D125a, D126a, 4 interlayer connection conductors V2, V3, and the like.

The resin substrate 20 is a rectangular parallelepiped having a longitudinal direction aligned with the X-axis direction, and has a 1 st principal surface and a 2 nd principal surface opposed to each other. The resin base material 20 is a green body containing a thermoplastic resin as a main component.

On the 1 st principal surface of the resin substrate 20, 4 input/output electrodes P1 and P2 are formed, respectively. Inside the resin base material 20, 4

functional conductor patterns

31, 32, 4

conductor patterns

41, 1 st dummy conductors D111a to D116a, D121a to D124a, 4 interlayer connection conductors V2, V3, and the like are formed.

The resin substrate 20 is a laminate formed by laminating a plurality of resin layers 21 (not shown), 22, and 23. The basic structures of the resin layers 22, 23, and the like are the same as those of the resin layers 11, 12, and 13 described in embodiment 1.

On the surface of the resin layer 21 (the resin layer having the 1 st main surface of the resin substrate 20), 4 input/output electrodes P1 and P2 are formed, respectively. The 4 input/output electrodes P1 and P2 are paired. As shown in fig. 7, 4 pairs of input/output electrodes P1 and P2 are disposed near 4 corners of the resin layer.

On the surface of the resin layer 22, 4

functional conductor patterns

31, 1 st dummy conductors D111a to D116a, and 4 conductor patterns 41 are formed. The 4 functional conductor patterns 31 are conductor patterns for coil of 0.75 turns in a rectangular ring shape, which are respectively arranged near 4 corners of the resin layer 22. The 4 conductor patterns 41 are rectangular conductor patterns arranged in the vicinity of the 4 functional conductor patterns 31, respectively. The 1 st dummy conductor D111a is a rectangular conductor pattern that is disposed near the center of the 1 st side (the left side of the resin layer 22 in fig. 8) of the resin layer 22 and has a longitudinal direction that coincides with the Y-axis direction. The 1 st dummy conductor D112a is a rectangular conductor pattern disposed near the 2 nd corner of the resin layer 22 (the upper left corner of the resin layer 22 in fig. 8) and having a longitudinal direction aligned with the X-axis direction. The 1 st dummy conductor D113a is a rectangular conductor pattern arranged near the 3 rd corner of the resin layer 22 (the upper right corner of the resin layer 22 in fig. 8) and having a longitudinal direction aligned with the X-axis direction. The 1 st dummy conductor D114a is a rectangular conductor pattern that is disposed near the center of the 3 rd side (the right side of the resin layer 22 in fig. 8) of the resin layer 22 and has a longitudinal direction that coincides with the Y-axis direction. The 1 st dummy conductor D115a is a rectangular conductor pattern that is arranged near the 4 th corner of the resin layer 22 (the lower right corner of the resin layer 22 in fig. 8) and has a longitudinal direction that coincides with the X-axis direction. The 1 st dummy conductor D116a is a rectangular conductor pattern that is arranged near the 1 st corner of the resin layer 22 (the lower left corner of the resin layer 22 in fig. 8) and has a longitudinal direction that coincides with the X-axis direction.

Further, 4 interlayer connection conductors V2 and V3 are formed in the resin layer 22.

On the surface of the resin layer 23, 4

functional conductor patterns

32 and 1 st dummy conductors D121a to D126a are formed. The 4 functional conductor patterns 32 are rectangular loop-shaped conductor patterns for coil of 0.75 turns, which are disposed at 4 corners of the resin layer 23. The 1 st dummy conductor D121a is a rectangular conductor pattern that is arranged near the 1 st corner of the resin layer 23 (the lower left corner of the resin layer 23 in fig. 8) and has a longitudinal direction that coincides with the Y-axis direction. The 1 st dummy conductor D122a is a rectangular conductor pattern that is arranged near the 2 nd corner of the resin layer 23 (the upper left corner of the resin layer 23 in fig. 8) and has a longitudinal direction that coincides with the Y-axis direction. The 1 st dummy conductor D123a is a rectangular conductor pattern that is disposed near the center of the 2 nd side of the resin layer 23 (the upper side of the resin layer 23 in fig. 8) and has a longitudinal direction that coincides with the X-axis direction. The 1 st dummy conductor D124a is a rectangular conductor pattern that is arranged near the 3 rd corner of the resin layer 23 (the upper right corner of the resin layer 23 in fig. 8) and has a longitudinal direction that coincides with the Y-axis direction. The 1 st dummy conductor D125a is a rectangular conductor pattern that is arranged near the 4 th corner of the resin layer 23 (the lower right corner of the resin layer 23 in fig. 8) and has a longitudinal direction that coincides with the Y-axis direction. The 1 st dummy conductor D126a is a rectangular conductor pattern that is disposed near the center of the 4 th side of the resin layer 23 (the lower side of the resin layer 23 in fig. 8) and has a longitudinal direction that coincides with the X-axis direction.

The pair of input/output electrodes P1 and P2 are electrically connected to each other. Specifically, the input/output electrode P1 is connected to one end of the functional conductor pattern 31 via an interlayer connection conductor (not shown). The other end of the functional conductor pattern 31 is connected to one end of the functional conductor pattern 32 via the interlayer connection conductor V2. The other end of the functional conductor pattern 32 is connected to the input/output electrode P2 via the conductor pattern 41, the interlayer connection conductor V3, and the like. In the resin base material 20 according to the present embodiment, 4 coils (circuit portions) in a rectangular spiral shape including the

functional conductor patterns

31 and 32 and the interlayer connection conductor V1 are formed. The 4 coils (circuit portions) are arranged in a planar direction (on an XY plane orthogonal to the Z-axis direction).

As shown in fig. 7 and 8, the 1 st dummy conductors D111a to D116a and D121a to D126a are arranged to intermittently surround the entirety of the plurality of

functional conductor patterns

31 and 32 when viewed from the Z-axis direction.

In the present embodiment, the 1 st dummy conductors formed in the two

resin layers

22 and 23 adjacent to each other in the stacking direction (Z-axis direction) are arranged so as not to overlap each other when viewed from the Z-axis direction. Specifically, as shown in fig. 7, the 1 st dummy conductors D111a to D116a formed in the resin layer 22 and the 1 st dummy conductors D121a to D126a formed in the resin layer 23 are arranged so as not to overlap each other when viewed from the Z-axis direction.

As shown in this embodiment, the 1 st dummy conductors may be arranged so as to surround the circuit portions when viewed from the Z-axis direction.

In the present embodiment, the 1 st dummy conductors formed in the same layer are arranged in point symmetry with respect to the center of the resin layer when viewed in the Z-axis direction. Specifically, the 1 st dummy conductors D111a to D116a are disposed in point symmetry with respect to the center C22 of the resin layer 22 when viewed from the Z-axis direction. The 1 st dummy conductors D121a to D126a are disposed in point symmetry with respect to the center C23 of the resin layer 23 when viewed from the Z-axis direction. According to this structure, unevenness in the flow of the resin outside the region surrounded by the plurality of 1 st dummy conductors can be suppressed at the time of lamination (at the time of heating and pressing). Therefore, deformation of the functional conductor pattern due to irregular resin flow during lamination can be suppressed.

The resin multilayer substrate 201 according to the present embodiment is manufactured by, for example, the following manufacturing method.

First, a plurality of resin layers 21 (not shown), 22, 23, and the like are prepared. The basic structures of the resin layers 21, 22, and 23 are the same as those of the resin layers 11, 12, and 13 described in embodiment 1.

Then, the resin layers 22 and 23 and the like are formed with the plurality of

functional conductor patterns

31 and 32, the plurality of conductor patterns 41, the plurality of 1 st dummy conductors D111a to D116a, D121a to D126a, and the like, respectively. Specifically, a plurality of functional conductor patterns 31, a plurality of conductor patterns 41, and a plurality of 1 st dummy conductors D111a to D116a are formed on the surface of the resin layer 22. A plurality of functional conductor patterns 32 and a plurality of 1 st dummy conductors D121a to D126a are formed on the surface of the resin layer 23. Although not shown, a plurality of input/output electrodes P1 and P2 are formed on the surface of the resin layer 21.

As shown in fig. 8 and the like, the plurality of

functional conductor patterns

31 and 32 formed in the same layer have the same shape and are arranged in the plane direction orthogonal to the stacking direction (Z-axis direction).

The step of forming the functional conductor pattern on at least one of the plurality of resin layers 22 and 23 is an example of the "functional conductor forming step" of the present invention. The step of forming the 1 st dummy conductors D111a to D116a and D121a to D126a in the two or more resin layers 22 and 23 including the resin layer for forming the functional conductor pattern among the plurality of resin layers 22 and 23 is an example of the "dummy conductor forming step" of the present invention.

Further, interlayer connection conductors V2 and V3 are formed in the resin layer 22.

Next, the plurality of resin layers 22 and 23 including the resin layer on which the input/output electrodes P1 and P2 are formed are laminated (mounted). At this time, two or more resin layers forming the 1 st dummy conductor are adjacent to each other in the stacking direction (Z-axis direction). Further, the 1 st dummy conductors formed in the two resin layers adjacent to each other, respectively, do not overlap each other when viewed from the Z-axis direction.

Then, the plurality of resin layers 22, 23 and the like are heated and pressed (collectively pressed) in the stacking direction (Z-axis direction), thereby forming the resin base 20. Thus, the resin base material 20 in the assembled substrate state (mother substrate) is formed, and the plurality of circuit portions (coils) having the same function including the plurality of

functional conductor patterns

31 and 32 are arranged in the planar direction (XY plane) of the resin base material 20 in the assembled substrate state (mother substrate).

The step of forming the resin base material 20 in the aggregate substrate state by laminating the plurality of resin layers 22 and 23 and the like as described above and heating and pressing after the "functional conductor forming step" and the "dummy conductor forming step" is an example of the "resin base material forming step" of the present invention.

Then, a plurality of resin multilayer substrates are cut out from the resin base material 20 in the assembled substrate state.

The step of cutting out a plurality of resin multilayer boards from the resin base material 20 in the assembled board state after the "resin base material forming step" is an example of the "cutting step" of the present invention.

EXAMPLE 4 embodiment

In embodiment 4, an example in which the arrangement of the 1 st dummy conductor is different from that in the above-described embodiments is shown.

Fig. 9 is a plan view of the resin multilayer substrate 202 according to embodiment 4. Fig. 10 is an exploded plan view of the resin multilayer substrate 202. In fig. 9, the 1 st dummy conductors D121b, D122b, D123b, D124b, and D125b are illustrated in a dotted pattern to make the structure easier to understand. In fig. 10, the resin layer on which the input/output electrodes P1 and P2 are formed is not illustrated.

The resin multilayer substrate 202 is different from the resin multilayer substrate 201 according to embodiment 3 in that it includes a plurality of 1 st dummy conductors D111b, D112b, D113b, D114b, D115b, D121b, D122b, D123b, D124b, and D125 b. The other structure of the resin multilayer substrate 202 is substantially the same as that of the resin multilayer substrate 201.

Hereinafter, a description will be given of a portion different from the resin multilayer substrate 201 according to embodiment 3.

The 1 st dummy conductors D111b to D115b are formed on the surface of the resin layer 22. Each of the 1 st dummy conductors D111b is a rectangular conductor pattern that is arranged near the 1 st side (the left side of the resin layer 22 in fig. 10) of the resin layer 22 and has a longitudinal direction that coincides with the X-axis direction. Each of the 1 st dummy conductors D112b is a rectangular conductor pattern that is arranged near the 2 nd side (the upper side of the resin layer 22 in fig. 10) of the resin layer 22 and has a longitudinal direction that coincides with the Y-axis direction. Each of the 1 st dummy conductors D113b is a rectangular conductor pattern that is arranged near the 3 rd side (the right side of the resin layer 22 in fig. 10) of the resin layer 22 and has a longitudinal direction that coincides with the X-axis direction. Each of the 1 st dummy conductors D114b is a rectangular conductor pattern that is arranged near the 4 th side (lower side of the resin layer 22 in fig. 10) of the resin layer 22 and has a longitudinal direction that coincides with the Y-axis direction. Each of the 41 st dummy conductors D115b is a rectangular conductor pattern disposed near 4 corners of the resin layer 22. As shown in fig. 10, the 1 st dummy conductors D111b to D114b all have the same shape.

The 1 st dummy conductors D121b to D125b are formed on the surface of the resin layer 23. Each of the 1 st dummy conductors D121b is a rectangular conductor pattern which is disposed in the vicinity of the 1 st side (the left side of the resin layer 23 in fig. 10) of the resin layer 23 and has a longitudinal direction aligned with the X-axis direction. Each of the 1 st dummy conductors D122b is a rectangular conductor pattern which is arranged in the vicinity of the 2 nd side (the upper side of the resin layer 23 in fig. 10) of the resin layer 23 and has a longitudinal direction aligned with the Y-axis direction. Each of the 1 st dummy conductors D123b is a rectangular conductor pattern that is arranged near the 3 rd side (the right side of the resin layer 23 in fig. 10) of the resin layer 23 and has a longitudinal direction that coincides with the X-axis direction. Each of the 1 st dummy conductors D124b is a rectangular conductor pattern which is arranged in the vicinity of the 4 th side (the lower side of the resin layer 23 in fig. 10) of the resin layer 23 and has a longitudinal direction aligned with the Y-axis direction. Each of the 41 st dummy conductors D125b is an L-shaped conductor pattern disposed near 4 corners of the resin layer 23. As shown in fig. 10, the 1 st dummy conductors D121b to D124b are all the same shape.

In the present embodiment, as in the resin multilayer substrate 201 according to embodiment 3, the 1 st dummy conductors formed in the same layer are arranged in point symmetry with respect to the center of the resin layer when viewed in the Z-axis direction. Specifically, the 1 st dummy conductors D111b to D115b are disposed in point symmetry with respect to the center C22 of the resin layer 22 when viewed from the Z-axis direction. The 1 st dummy conductors D121b to D125b are disposed in point symmetry with respect to the center C23 of the resin layer 23 when viewed from the Z-axis direction.

Further, in the present embodiment, the 1 st dummy conductors formed in the same layer are arranged line-symmetrically with respect to a straight line passing through the center of the resin layer when viewed from the Z-axis direction. Specifically, the 1 st dummy conductors D111b to D115b are arranged in line symmetry with respect to a straight line passing through the center C22 of the resin layer 22 (e.g., a straight line passing through the center C22 and parallel to the Y-axis direction) when viewed from the Z-axis direction. The 1 st dummy conductors D121b to D125b are arranged in line symmetry with respect to a straight line passing through the center C23 of the resin layer 23 when viewed from the Z-axis direction. According to this structure, at the time of lamination (at the time of heating and pressing), the unevenness of the flow of the resin to the outside of the region surrounded by the plurality of 1 st dummy conductors can be further suppressed. Therefore, deformation of the functional conductor pattern due to irregular resin flow during lamination can be further suppressed.

In the present embodiment, the gaps (D1) between the 1 st dummy conductors (D111b to D114b, D121b to D124b) included in the resin multilayer substrate 201 are smaller than the gaps (D2) between the 1 st dummy conductors (the 1 st dummy conductors D111a to D114a and D121a to D124a shown in fig. 8) according to embodiment 3 (D1 < D2). In this manner, by reducing the gap between the 1 st dummy conductors formed in the same layer (by arranging the 1 st dummy conductors closer to each other), the uneven flow of the resin during lamination can be further suppressed.

Further, the 1 st dummy conductor according to the present embodiment has a length (L1) in the 1 st direction from inside the region (circuit portion) surrounded by the 1 st dummy conductors to the outside as viewed in the Z-axis direction, which is longer than a width (W1) in the 2 nd direction orthogonal to the 1 st direction (L1 > W1). For example, the length (L1) of the 1 st dummy conductor D111b in the 1 st direction (X-axis direction) shown in fig. 10 is longer than the width (W1) of the 1 st dummy conductor D111b in the 2 nd direction (Y-axis direction) (L1 > W1). Further, the length (L1) of the 1 st dummy conductor D112b in the 1 st direction (Y-axis direction) is longer than the width (W1) of the 1 st dummy conductor D112b in the 2 nd direction (X-axis direction) (L1 > W1). The same applies to the other 1 st dummy conductors D113b, D114b, D121b to D124 b.

When a plurality of dummy conductors are arranged so as to surround the functional conductor pattern when viewed in the stacking direction (Z-axis direction), if the area of the dummy conductors is too small, positional displacement of the dummy conductors is likely to occur due to the flow of resin during stacking (during heating and pressing). However, since the 1 st dummy conductor according to the present embodiment has a small width in the 2 nd direction (the direction opposite to the flow of the resin during lamination), it is less likely to be affected by the flow of the resin in the 1 st direction than the 1 st dummy conductor having a large width in the 2 nd direction. In addition, since the 1 st dummy conductor according to the present embodiment has a long length in the 1 st direction (along the direction of the resin flow during lamination), positional deviation due to the resin flow in the 1 st direction is less likely to occur than in the 1 st dummy conductor having a short length in the 1 st direction. Therefore, according to this structure, it is possible to suppress the positional deviation of the 1 st dummy conductor due to the resin flowing outward from the region surrounded by the plurality of 1 st dummy conductors during lamination.

Further, in the present embodiment, the 1 st dummy conductors D111b to D114b formed in the resin layer 22 and the 1 st dummy conductors D121b to D124b formed in the resin layer 23 (at the fitting positions) are arranged so as not to overlap with each other in the 2 nd direction when viewed from the Z-axis direction. Therefore, as in the 1 st dummy conductors D111b to D114b and D121b to D124b according to the present embodiment, even when the width (W1) in the 2 nd direction is narrow, the 1 st dummy conductor is less likely to be displaced in the 2 nd direction due to the flow of resin during lamination.

In addition, although the present embodiment shows an example in which the plural 1 st dummy conductors formed in the same layer are symmetrically arranged to suppress unevenness in resin flow in the planar direction when the layers are stacked, the present invention is not limited to this configuration. For example, when the symmetry of the outer shape (planar shape) of the functional conductor pattern is low, the flow of the resin in the planar direction at the time of lamination may be adjusted by adjusting the size, planar shape, arrangement (gap between the 1 st dummy conductors) and the like of the plurality of 1 st dummy conductors arranged so as to surround the functional conductor pattern.

EXAMPLE 5 EXAMPLE

In embodiment 5, an example is shown in which an opening is provided in a dummy conductor.

Fig. 11 is a plan view of a resin multilayer substrate 203 according to embodiment 5. Fig. 12 is a plan view of the resin layer 22 provided in the resin multilayer substrate 203. Fig. 13 is a plan view of the resin layer 23 provided in the resin multilayer substrate 203. Fig. 14 is an enlarged plan view of the enlarged display portion ZP in fig. 12. In fig. 12, 13, and 14, the 1 st dummy conductors D111c, D112c, D113c, D114c, D115c, D121c, D122c, D123c, D124c, and D125c are shown in a dotted pattern to simplify the structure.

The resin multilayer substrate 203 is different from the resin multilayer substrate 202 according to embodiment 4 in that it includes a plurality of 1 st dummy conductors D111c, D112c, D113c, D114c, D115c, D121c, D122c, D123c, D124c, and D125 c. The other structure of the resin multilayer substrate 203 is the same as that of the resin multilayer substrate 202.

Hereinafter, a description will be given of a portion different from the resin multilayer substrate 202 according to embodiment 4.

The 1 st dummy conductors D111c to D115c are formed on the surface of the resin layer 22. The 1 st dummy conductors D111c to D114c are different from the 1 st dummy conductors D111b to D114b described in embodiment 4 in that they have exhaust openings AP11 and AP 12. The other structures of the 1 st dummy conductors D111c through D114c are the same as those of the 1 st dummy conductors D111b through D114 b. The 1 st dummy conductor D115c is the same as the 1 st dummy conductor D115b described in embodiment 4.

The openings AP11 and AP12 are both circular openings. The opening AP11 is formed outside the 1 st dummy conductor D111c to D114c (see the outer peripheral portion Ao of the 1 st dummy conductor D112C in fig. 14). The opening AP12 is formed in the inner peripheral portion (see the inner peripheral portion Ai in fig. 14) of the 1 st dummy conductor D111c to D114 c. The outer peripheral portion (Ao) is a portion of the 1 st dummy conductor D111c to D114c located on the outer peripheral side of the resin layer 22 (or the resin substrate 20). The inner peripheral portion (Ai) is a portion of the 1 st dummy conductors D111c to D114c located inside the resin layer 22 (on the side where the functional conductor pattern 31 is formed). As shown in fig. 12 and 14, the diameter of the opening AP11 is smaller than the diameter of the opening AP 12. That is, the area of the opening AP11 is smaller than the area of the opening AP 12. Therefore, the conductor density of the outer peripheral portion (Ao) of the 1 st dummy conductors D111c to D114c is higher than the conductor density of the inner peripheral portion (Ai). Here, the "conductor density" is a ratio of a conductor area per unit area.

The 1 st dummy conductors D121c to D125c are formed on the surface of the resin layer 23. The 1 st dummy conductors D121c to D125c are different from the 1 st dummy conductors D121b to D125b described in embodiment 4 in that they have exhaust openings AP21 and AP 22. The other structures of the 1 st dummy conductors D121c to D125c are the same as those of the 1 st dummy conductors D121b to D125 b.

The openings AP21 and AP22 are both circular openings. The opening AP21 is formed outside the 1 st dummy conductor D121c to D125c (see the outer peripheral portion Ao of the 1 st dummy conductor D112c in fig. 14). The opening AP22 is formed in the inner peripheral portion (see the inner peripheral portion Ai in fig. 14) of the 1 st dummy conductor D121c to D125 c. As shown in fig. 13, the diameter of opening AP21 is smaller than the diameter of opening AP 22. That is, the area of the opening AP21 is smaller than the area of the opening AP 22. Therefore, the conductor density of the outer peripheral portion (Ao) of the 1 st dummy conductors D121c to D125c is higher than the conductor density of the inner peripheral portion (Ai).

The resin multilayer substrate generally has water-absorbing properties. Therefore, when the resin multilayer board is heated in a process such as reflow soldering, moisture is discharged from the resin multilayer board. In this case, if a planar metal pattern is formed on the resin multilayer substrate, defects such as delamination (interlayer peeling) and deformation (expansion and bubble protrusion) may occur due to the pressure of the gas to be discharged from the inside of the resin multilayer substrate. On the other hand, in the present embodiment, the 1 st dummy conductors D111c to D114c and D121c to D125c are provided with openings (AP11, AP12, AP21, and AP22) for exhaust. Therefore, when the resin multilayer substrate is heated, the gas generated in the resin multilayer substrate can be discharged to the outside through the opening. This reduces the amount of gas remaining in the resin multilayer substrate, and reduces delamination and deformation during heating.

In addition, in a resin multilayer substrate formed by laminating a plurality of resin layers on which conductor patterns are formed, the conductor patterns and the resin layers behave differently when heated, and therefore the resin multilayer substrate is easily deformed due to the behavior. For example, when the conductor pattern is a metal foil such as a Cu foil, the conductor pattern undergoes expansion and contraction according to its linear expansion coefficient, but the properties of the composition of the resin layer change before and after the glass transition temperature, and expansion and contraction occur along with this change. As a result, the resin multilayer substrate is likely to undergo deformation in the lamination direction (Z-axis direction) or deformation in the planar direction (X-axis direction or Y-axis direction) such as warpage or twist through the heating step. On the other hand, in the present embodiment, since the conductor density of the outer peripheral portion (Ao) of the 1 st dummy conductors D111c to D114c and D121c to D125c is higher than the conductor density of the inner peripheral portion (Ai), the unevenness of the stress applied to the interfaces between the 1 st dummy conductors D111c to D114c and D121c to D125c and the resin layers in the vicinity of the outer edge and at the end portions of the resin multilayer substrate 203 can be suppressed. Therefore, the resin multilayer substrate 203 is less deformed or deformed by heating.

Next, a modified example of the resin multilayer substrate 203 will be described. Fig. 15 (a) is an enlarged plan view of the 1 st dummy conductor D112D provided in the resin multilayer substrate 203A as a modification, and fig. 15 (B) is an enlarged plan view of the 1 st dummy conductor D112e provided in the resin multilayer substrate 203B as another modification.

The multilayer resin substrate 203A is different from the multilayer resin substrate 203 in that it includes the 1 st dummy conductor D112D. A plurality of openings AP13, which are circular openings, are formed in the 1 st dummy conductor D112D. As shown in fig. 15 (a), the distribution density of the openings AP13 in the outer peripheral portion Ao of the 1 st dummy conductor D112D is smaller than the distribution density of the openings AP13 in the inner peripheral portion Ai. That is, the conductor density in the outer peripheral portion Ao is higher than the conductor density in the inner peripheral portion Ai.

As in the case of the resin multilayer substrate 203A, the number of the openings AP13 of the outer peripheral portion Ao of the 1 st dummy conductor D112D may be larger than the number of the openings AP13 of the inner peripheral portion Ai, so that the conductor density of the outer peripheral portion Ao may be higher than that of the inner peripheral portion Ai.

The resin multilayer substrate 203B is different from the resin multilayer substrate 203 in that it includes the 1 st dummy conductor D112 e. An opening AP14 is formed in the 1 st dummy conductor D112 e. Opening AP14 is a trapezoidal opening disposed across inner peripheral portion Ai and outer peripheral portion Ao. As shown in fig. 15B, the opening AP14 has a short side (upper side) disposed in the outer peripheral portion Ao and a long side (lower side) disposed in the inner peripheral portion Ai. In other words, the opening AP14 is tapered such that the width thereof becomes narrower as it moves from the inner peripheral portion Ai toward the outer peripheral portion Ao (+ Y direction). With such a configuration, the conductor density in the outer peripheral portion Ao of the 1 st dummy conductor D112e is higher than the conductor density in the inner peripheral portion Ai.

Like the resin multilayer substrate 203B, the conductor density in the outer peripheral portion Ao may be higher than that in the inner peripheral portion Ai by the shape spanning the openings of the inner peripheral portion Ai and the outer peripheral portion Ao. The planar shape of the opening is not limited to a trapezoid, and may be, for example, a triangle, an L-shape, a T-shape, or the like.

Other embodiments

In the embodiments described above, the resin multilayer substrate is shown as an example of a surface-mount component surface-mounted on a circuit board, but the use of the resin multilayer substrate of the present invention is not limited to this. The resin multilayer substrate of the present invention may be, for example, a cable connecting two circuit boards to each other, or a cable connecting a circuit board and another component to each other. Further, a connector may be provided on the resin multilayer substrate as necessary.

In the embodiments described above, the resin base material is a rectangular parallelepiped having a longitudinal direction in the X-axis direction, but the present invention is not limited to this configuration. The shape of the resin base material can be changed as appropriate. The planar shape of the resin substrate may be, for example, a polygon, a circle, an ellipse, an L shape, a crank shape, a T shape, a Y shape, or the like. Further, the resin base material may have a bent portion, a part of which is bent by plastic deformation or the like.

In the above-described embodiments, examples of the resin base material in which 3 or 4 resin layers are laminated have been described, but the resin base material of the present invention is not limited to this. The number of resin layers forming the resin substrate can be changed as appropriate. In addition, a protective layer may be formed on the 1 st main surface VS1 or the 2 nd main surface VS2 of the resin base. The protective layer is, for example, a cover film of Polyimide (PI), polyethylene terephthalate (PET), or the like, or a solder resist mainly composed of, for example, epoxy resin (EP).

In the embodiments described above, the resin base material includes the thermoplastic resin, but the present invention is not limited to this configuration. The resin substrate may contain a thermosetting resin. The resin substrate may be a composite laminate of different resin materials, and may be a laminate of a thermosetting resin sheet such as a glass/epoxy plate and a thermoplastic resin sheet. The resin base is not limited to a structure in which a plurality of resin layers are heated and pressed (collectively pressed) and the surfaces thereof are welded to each other, and may be a structure in which an adhesive material layer is provided between the resin layers.

In the embodiments described above, the example in which the rectangular spiral coil (circuit portion) is formed on the resin multilayer substrate is shown, but the coil formed on the resin multilayer substrate is not limited to this. The coil formed on the resin multilayer substrate may be, for example, a planar spiral coil, or a coil formed by connecting a plurality of spiral coil conductor patterns.

Further, the circuit portion formed on the resin multilayer substrate is not limited to the coil. That is, the circuit of the resin multilayer substrate is not limited to the circuit configuration of each embodiment described above, and can be appropriately modified. The circuit portion formed on the resin multilayer substrate may be a frequency filter such as a capacitor formed of a conductor pattern, various filters (a low-pass filter, a high-pass filter, a band-pass filter, or a band-stop filter). In addition, various transmission lines (strip lines, microstrip lines, coplanar lines, etc.) may be formed on the resin multilayer substrate, for example. Further, various electronic components such as a sheet component may be mounted or embedded on the resin base (resin multilayer substrate).

In the above-described embodiments, the planar shape of the dummy conductors (1 st dummy conductor and 2 nd dummy conductor) is a rectangle or L-shape, but the present invention is not limited to this configuration. The planar shape of the dummy conductor may be changed as appropriate, and may be, for example, a polygon, a circle, an ellipse, an arc, a crank, a U-shape, a T-shape, a Y-shape, or the like.

In the above embodiments, the example in which the rectangular input/output electrodes P1 and P2 are formed on the 1 st main surface VS1 of the resin base material is shown, but the present invention is not limited to this configuration. The shape, number, and arrangement of the input/output electrodes can be changed as appropriate. The planar shape of the input/output electrode may be, for example, a polygon, a circle, an ellipse, an arc, a ring, an L-shape, a crank shape, a U-shape, a T-shape, a Y-shape, or the like. The input/output electrodes may be formed on both the 1 st main surface VS1 and the 2 nd main surface VS 2.

Finally, the above description of the embodiments is illustrative in all respects and not restrictive. It is obvious to those skilled in the art that the modifications and variations can be appropriately made. The scope of the present invention is shown not by the above-described embodiments but by the claims. Further, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the claims.

Description of the symbols

The center of the C22, C23 … resin layers;

d111, D112, D113, D114, D115, D116, D121, D122, D123, D124, D125, D126, D131, D132, D133, D134 dummy conductor 1;

d211, D221, D231 … dummy conductor 2;

ai … inner peripheral portion;

ao … outer circumference;

AP11, AP12, AP13, AP14, AP21, AP22 … openings;

FP … chimeric part;

FR1, FR2, FR3 … functional portion-forming regions;

p1 and P2 … input/output electrodes;

v1, V2, V3, V4, V5, V6 … interlayer connection conductors;

the 1 st main surface of the VS1 … resin substrate;

the 2 nd main surface of the VS2 … resin substrate;

10. 20 … resin base material;

11. 12, 13, 14, 22, 23 … resin layers;

31. 32, 33 … functional conductor patterns;

41. 42, 43 … conductor patterns;

101. 102, 201, 202, 203A, 203B … resin multilayer substrate.

Claims

1. A resin multilayer substrate is characterized by comprising:

a resin base material formed by laminating a plurality of resin layers;

2. The resin multilayer substrate according to claim 1,

the number of said functional conductor patterns is a plurality,

a plurality of the functional conductor patterns are formed in two or more resin layers among the plurality of resin layers,

the 1 st dummy conductors are formed on two or more of the resin layers on which the functional conductor patterns are formed, respectively.

3. The resin multilayer substrate according to claim 1 or 2,

further provided with: a 2 nd dummy conductor formed in any one of the resin layers of two or more of the resin layers in which the 1 st dummy conductors are formed among the resin layers and not electrically connected to the functional conductor pattern,

the 2 nd dummy conductor is arranged in a functional portion forming region surrounded by the functional conductor pattern, and is electrically connected to a 1 st dummy conductor arranged in the same layer among the 1 st dummy conductors.

4. The resin multilayer substrate according to claim 1 or 2,

the plurality of resin layers include a thermoplastic resin.

5. The resin multilayer substrate according to claim 1 or 2,

the number of said functional conductor patterns is a plurality,

a plurality of circuit portions having the same function and formed by the plurality of functional conductor patterns are arranged in a plane direction orthogonal to the stacking direction,

the 1 st dummy conductors are arranged to surround the circuit portions when viewed from the stacking direction.

6. The resin multilayer substrate according to claim 1 or 2,

the plurality of 1 st dummy conductors formed in the same layer among the plurality of 1 st dummy conductors are arranged line-symmetrically with respect to a straight line passing through centers of the plurality of resin layers when viewed from the stacking direction.

7. The resin multilayer substrate according to claim 6,

among the 1 st dummy conductors, the 1 st dummy conductors formed in the same layer are arranged in point symmetry with respect to the center of the resin layers when viewed in the stacking direction.

8. The resin multilayer substrate according to claim 1 or 2,

the dummy patterns of the adjacent layers do not overlap at all when viewed from the stacking direction.