CN215120810U - RF test socket matching device, RF signal transceiver and RF equipment - Google Patents

Abstract

The utility model relates to a radio frequency test seat matching device, a radio frequency signal transceiver and radio frequency equipment. The RF test seat matching device includes: a first dielectric substrate, the first surface of the first dielectric substrate is used for setting the RF test seat and the transmission line; the first ground metal layer is arranged on the second surface of the first dielectric substrate, The second board surface is opposite to the first board surface; a first hollowed-out area is partially formed on the first ground metal layer, and the orthographic projection of the first hollowed-out area on the first board surface covers the signal pads of the RF test socket on the first An orthographic projection on the first board surface, and covering the orthographic projection of the connecting end of the test socket of the transmission line on the first board surface. In the present application, the equivalent capacitance of the signal pad can be reduced and the equivalent series capacitance can be reduced by hollowing out one ground metal layer, and broadband matching can be achieved without drilling holes in the dielectric substrate and without processing the multi-layer signal layers. And reduce the matching loss, with the advantage of simple implementation.

Description

Radio frequency test seat matching device, radio frequency signal transceiver and radio frequency equipment

Technical Field

The utility model relates to an electronic circuit technical field especially relates to radio frequency test seat matching device, radio frequency signal transceiver and radio frequency equipment.

Background

With the advent and development of mobile communication technology, signal parameters of radio frequency signals become one of important parameters affecting communication quality. At present, in order to realize normal transceiving of radio frequency signals, a mobile terminal is provided with a corresponding radio frequency signal transceiver in the device, and the radio frequency signal transceiver realizes transceiving of radio frequency signals through matching of a radio frequency test seat and a transmission line with a corresponding circuit.

However, the radio frequency test socket is connected to the transmission line through the signal pad therein, and the size of the signal pad is slightly larger than that of the transmission line, so that the radio frequency test socket and the transmission line are unmatched after being connected, which causes different matching losses of signals and affects the normal operation of communication.

In order to solve the problem, in the conventional technology, a matching structure is arranged on one or more signal layers below a radio frequency test seat, and then a metal through hole is used for respectively connecting the matching structure and the radio frequency test seat, so that the aim of reducing matching loss is fulfilled. However, this implementation method requires punching holes in the bonding pads, which is a problem of complex implementation.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a matching device of a radio frequency test socket, a radio frequency signal transceiver and a radio frequency device, which can both ensure matching loss and implementation difficulty, and can simplify the implementation difficulty while ensuring the improvement effect of matching loss, aiming at the problem of complex implementation.

In order to achieve the above object, in a first aspect, an embodiment of the present application provides an rf test socket matching apparatus, which includes a first dielectric substrate and a first ground metal layer. The first plate surface of the first dielectric substrate is used for arranging a radio frequency test seat and a transmission line; the first grounding metal layer is arranged on the second plate surface of the first dielectric substrate, and the second plate surface is back to the first plate surface. The first grounding metal layer is partially provided with a first hollowed area, the orthographic projection of the first hollowed area on the first board surface covers the orthographic projection of the signal pad of the radio frequency test seat on the first board surface, and the orthographic projection of the test seat connecting end part of the transmission line on the first board surface.

In one embodiment, the radio frequency test socket matching device further comprises a second dielectric substrate and a second grounding metal layer. The second dielectric substrate comprises a third plate surface and a fourth plate surface back to the third plate surface, and a first grounding metal layer is clamped between the third plate surface and the second plate surface. The second grounding metal layer is arranged on the fourth plate surface.

In one embodiment, the second ground metal layer covers the fourth plate surface.

In one embodiment, the matching device of the rf test socket further includes a third ground metal layer disposed on the first board surface. A test seat main body hollowed area is formed in the local part of the third grounding metal layer, and the test seat main body hollowed area is used for arranging a main body structure of the radio frequency test seat; the orthographic projection of the hollowed-out area of the test seat main body on the second plate surface covers the orthographic projection of the first hollowed-out area on the second plate surface.

In one embodiment, the rf socket matching device further includes a socket connecting structure electrically connected to the rf socket, and the socket connecting structure is disposed on the first board surface and electrically connected to the third ground metal layer.

In one embodiment, the first hollowed area is a rectangular area.

In a second aspect, an embodiment of the present application provides an rf signal transceiver, which includes an rf test socket, a transmission line, and the rf test socket matching apparatus in any of the above embodiments. The radio frequency test seat and the transmission line are both arranged on the first plate surface. The transmission line comprises a test seat connecting end part which is electrically connected with the radio frequency test seat.

In one embodiment, the transmission line includes a bent portion, and the bent portion is close to the connection end of the test socket. The orthographic projection of the bent part on the first plate surface is overlapped with at least part of orthographic projection of the first hollow area on the first plate surface.

In one embodiment, the bending part is arranged in a central symmetry manner.

In a third aspect, an embodiment of the present application further provides a radio frequency device, where the radio frequency device includes the radio frequency signal transceiver in any of the foregoing embodiments.

In the radio frequency test socket matching device, the radio frequency signal transceiver and the radio frequency equipment, the first plate surface of the first dielectric substrate is used for arranging the radio frequency test socket and the transmission line, and the second plate surface of the first dielectric substrate is provided with the first grounding metal layer. Through forming the first hollowed-out area on the local part of the first ground metal layer, the orthographic projection of the first hollowed-out area on the first plate surface can cover the orthographic projection of the signal pad of the radio frequency test seat on the first plate surface, and therefore the equivalent capacitance of the signal pad can be reduced. Meanwhile, the orthographic projection of the first hollowed area on the first board surface can also cover the orthographic projection of the connecting end part of the test seat of the transmission line on the first board surface, so that the series inductance can be equivalent, and the impedance matching can be carried out on the series inductance and the bonding pad. Therefore, the equivalent capacitance and the equivalent series capacitance of the signal pad can be reduced by hollowing out the ground metal layer, impedance matching is achieved, the dielectric substrate does not need to be punched, broadband matching can be achieved without processing multiple signal layers, matching loss is reduced, implementation is simple, further, the implementation difficulty is reduced while the matching loss is reduced, the size of the signal pad of the radio frequency test base is not limited, and the applicable scene is wide.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of a connection between a radio frequency test socket and a transmission line on a PCB of a radio frequency device in the prior art;

FIG. 2 is a schematic diagram of a first embodiment of an RF test socket matching apparatus;

FIG. 3 is a bottom view of the RF test socket mating apparatus of FIG. 1;

FIG. 4 is a second schematic diagram of an exemplary RF test socket matching apparatus;

FIG. 5 is a bottom view of the RF test socket mating arrangement of FIG. 4;

FIG. 6 is a schematic diagram of a third exemplary embodiment of an RF test socket matching apparatus;

FIG. 7 is a top view of the RF test socket mating apparatus shown in FIG. 6;

FIG. 8 is a schematic perspective view of a first hollowed-out area and a hollowed-out area of a test socket of the RF test socket matching apparatus shown in FIG. 6;

FIG. 9 is a diagram illustrating an exemplary RF transceiver;

fig. 10 is a 3D schematic diagram of the radio frequency transceiver of fig. 9;

fig. 11 is a comparison diagram of ADS simulation between the rf transceiver shown in fig. 9-10 and a conventional rf transceiver.

Description of reference numerals:

10-radio frequency test socket matching device, 110-first dielectric substrate, 112-first board surface, 114-first board surface, 120-first ground metal layer, 122-first hollowed area, 130-second dielectric substrate, 132-third board surface, 134-fourth board surface, 140-second ground metal layer, 150-third ground metal layer, 152-test socket main body hollowed area, 154-transmission structure hollowed area, 162-first test socket connection pad, 164-second test socket connection pad, 166-third test socket connection pad, 20-transmission line and signal pad-30.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," "disposed," and "attached" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.

Referring to fig. 1, fig. 1 shows a schematic diagram of a connection between a radio frequency test socket and a transmission line on a PCB of a current radio frequency device, where the transmission line is used for transmitting a radio frequency signal, and if there is no reflection during the transmission of the radio frequency signal, it can be considered that impedance between the radio frequency test socket and the transmission line is completely matched, and there is no matching loss during the transmission of the signal. However, as shown in fig. 1, the size of the pad of the current rf test socket is larger than the width of the transmission line, which causes the situation of mismatch after the rf test socket is connected to the transmission line, and the problem of matching loss in different degrees.

However, as described in the background art, the conventional technology has a problem of complicated implementation in solving the matching loss problem, and the inventors have found through research that the reason for this problem is that: on one hand, in some schemes in the prior art, a plurality of signal layers below a signal pad of the radio frequency test socket are hollowed, and the number of the layers to be hollowed is large, so that the method is difficult to realize in a PCB with a multi-layer board for high-density routing and is complex to realize. For example, for the structure of the dielectric substrate 1-the metal layer 1-the dielectric substrate 2-the metal layer 2, if the radio frequency test socket is disposed on the dielectric substrate 1 away from the metal layer 1, it can be considered that there are 2 signal layers, namely the metal layer 1 and the metal layer 2, under the radio frequency test socket. On the other hand, other schemes of the conventional technology can also set a matching structure on a signal layer below the pad, and the signal pad and the matching structure are respectively connected by utilizing the metal through hole through punching the PCB so as to reduce the matching loss. However, this method requires punching, which limits the size of the signal pad and complicates the implementation process.

Therefore, there is a need for a matching device for a radio frequency test socket, a radio frequency signal transceiver and a radio frequency device that can both match loss and implementation difficulty, and can simplify the implementation difficulty while ensuring the effect of improving the match loss.

In one embodiment, as shown in fig. 2-3, an rf test socket mating apparatus 10 is provided. The rf socket matching device 10 includes a first dielectric substrate 110 and a first ground metal layer 120. The first plate surface 112 of the first dielectric substrate 110 is used for arranging the rf test socket and the transmission line 20. The first ground metal layer 120 is disposed on the second plate surface 114 of the first dielectric substrate 110, and the second plate surface 114 is opposite to the first plate surface 112. A first hollowed-out area 122 is formed in a part of the first ground metal layer 120, and an orthographic projection of the first hollowed-out area 122 on the first board surface 112 covers an orthographic projection of the first hollowed-out area 122 on the first board surface 112 of the signal pad 30 of the rf test socket and covers an orthographic projection of the test socket connection end of the transmission line 20 on the first board surface 112.

Specifically, the rf socket matching device 10 is a circuit structure used in cooperation with the rf socket and the transmission line 20 in the rf transceiver, and can be implemented by a PCB. The radio frequency test socket matching device 10 can be respectively provided with a radio frequency test socket, the radio frequency test socket is electrically connected with the transmission line 20, the transmission line 20 is electrically connected with a next-stage radio frequency device (such as a switch, a filter and the like), and thus, the radio frequency test socket can perform the receiving and sending processing of radio frequency signals with the next-stage radio frequency device through the transmission line 20.

The signal pad 30 of the rf test socket refers to a pad at which the rf test socket is connected to the transmission line 20, and the test socket connection end of the transmission line 20 refers to an end of the transmission line 20 connected to the rf test socket, that is, the rf test socket can be connected to the transmission line 20 through the signal pad 30 and the test socket connection end, thereby completing the transmission of the rf signal.

In the rf socket matching apparatus 10 of the present application, it includes a first dielectric substrate 110 and a first ground metal layer 120. The first dielectric substrate 110 may be any type, shape and/or size of dielectric substrate, which is not particularly limited in this application, and only the rf test socket can be disposed thereon. The first ground metal layer 120 may be implemented by any type of metal (e.g., copper, silver), and may be any shape and/or any size, which is not specifically limited in this application, and only needs to implement a grounding function.

The first dielectric substrate 110 includes a first plate surface 112 and a second plate surface 114 opposite to the first plate surface 112. The second board 114 is provided with a first ground metal layer 120, and when the rf socket matching device 10 is put into use, the rf socket and the transmission line 20 can be disposed on the first board 112. Thus, the rf test socket and the transmission line 20 can be located above the first ground metal layer 120, the rf test socket and the transmission line 20 form a signal layer, and the first ground metal layer 120 forms another signal layer.

A first hollowed-out region 122 is formed in a part of the first ground metal layer 120, wherein the first hollowed-out region 122 is an area without metal coverage, in other words, a part of the first ground metal layer 120 is not covered by metal. The location, shape and other parameters of the first hollowed-out area 122 can be determined according to the location of the rf test socket and the transmission line 20 on the first board 112. In one embodiment, the first hollowed-out area 122 is a rectangular area, which facilitates the process and further simplifies the implementation.

Specifically, the orthographic projection of the first hollowed-out area 122 on the first board surface 112 covers the orthographic projection of the signal pad 30 of the rf test socket on the first board surface 112, and at this time, the orthographic projection of the first hollowed-out area 122 may cover the entire orthographic projection of the signal pad 30. Thus, the equivalent capacitance of the signal pad 30 can be reduced. Meanwhile, the orthographic projection of the first hollowed-out area 122 on the first board surface 112 also covers the orthographic projection of the connecting end of the test line of the transmission line 20 on the first board surface 112, in this case, the orthographic projection of the first hollowed-out area 122 on the first board surface 112 can partially cover the orthographic projection of the transmission line 20 on the first board surface 112, and the covered area is the orthographic projection of the end of the transmission line 20 connected with the radio frequency test socket on the first board surface 112. It should be noted that the length and size of the connection end of the test line can be determined according to factors such as radio frequency signal parameters, design requirements, and radio frequency test seat model, which is not specifically limited in the present application. In this way, the connection of the signal pads 30 is equivalent to a series inductance by performing a hollow process below the transmission line 20 having a certain length.

This application can realize the broadband through hollowing out the one deck signal layer that lies in under signal pad 30 and transmission line 20 and match the loss and reduce, when reducing the matching loss, need not to excavate the processing to other layers (like second, three-layer signal layer that lie in under signal pad 30 and transmission line 20), also need not punch to signal pad 30 or PCB board, simple structure. Therefore, the radio frequency test socket matching device can fully utilize other signal layers to carry out PCB wiring, and further can improve the PCB wiring density. In addition, the scheme of the application is not limited by the size of the bonding pad, can be matched with bonding pads of various types and sizes, and can be implemented in a PCB with a multi-layer board and high-density wiring, so that the limiting factor of implementation of the scheme is reduced, and the application scene of the radio frequency test socket matching device 10 is widened.

In the above-mentioned radio frequency test socket matching device 10, the first board surface 112 of the first dielectric substrate 110 is used for installing the radio frequency test socket and the transmission line 20, and the second board surface 114 of the first dielectric substrate 110 is provided with the first ground metal layer 120. By forming the first hollow region 122 in a local portion of the first ground metal layer 120, an orthographic projection of the first hollow region 122 on the first board surface 112 can cover an orthographic projection of the signal pad 30 of the rf test socket on the first board surface 112, thereby reducing an equivalent capacitance of the signal pad 30. Meanwhile, the orthographic projection of the first hollowed-out area 122 on the first board surface 112 can also cover the orthographic projection of the test socket connection end of the transmission line 20 on the first board surface 112, so that the series inductance can be equivalent. Therefore, the equivalent capacitance and the equivalent series capacitance of the signal pad 30 can be reduced by hollowing out the ground metal layer, the dielectric substrate does not need to be punched, the broadband matching can be realized without processing multiple signal layers, the matching loss is reduced, the implementation is simple, the implementation difficulty is reduced while the matching loss is reduced, the size of the signal pad 30 of the radio frequency test base is not limited, and the applicable scene is wide.

In one embodiment, as shown in fig. 4 and 5, the rf socket matching device 10 further includes a second dielectric substrate 130 and a second ground metal layer 140. The second dielectric substrate 130 includes a third plate surface 132 and a fourth plate surface 134 opposite to the third plate surface 132, the first ground metal layer 120 is sandwiched between the third plate surface 132 and the second plate surface 114, that is, the third plate surface 132 is attached to one side of the first ground metal layer 120, and the second plate surface 114 is attached to the other side of the first ground metal layer 120. The fourth board surface 134 is provided with a second ground metal layer 140.

Since the first ground metal layer 120 is partially formed with a hollow region, a voltage on the first ground metal layer 120 may deviate from voltages of other ground metal layers. When the rf test socket is grounded through the first ground metal layer 120, the ground level of the rf test socket is not equal to the ground level of other devices, so that the rf test socket is prone to failure when receiving and transmitting rf signals, and the reliability of communication is reduced. In consideration of the situation, the present application ensures the consistency of the ground levels of the devices in the device by disposing a complete ground metal layer under the first ground metal layer 120 as a reference ground plane, so as to reduce the occurrence probability of errors and further improve the communication reliability.

Specifically, the first ground metal layer 120 is attached to the third plate surface 132 of the second dielectric substrate 130, and the second ground metal layer 140 is disposed on a surface (i.e., the fourth plate surface 134) of the second dielectric substrate 130 away from the first ground metal layer 120. In one embodiment, no hollowed-out region may be formed in the second ground metal layer 140, i.e., the second ground metal layer 140 does not include a region surrounded by metal layers. Similar to the first ground metal layer 120, the second ground metal layer 140 may be implemented by any type of metal (e.g., copper, silver), and may be any shape and/or any size, which is not particularly limited in this application, and only needs to implement a grounding function. It should be noted that the shape and size of the second ground metal layer 140 are not necessarily related to the shape and size of the first ground metal layer 120, for example, the shape of the second ground metal layer 140 may be the same as or different from the shape of the first ground metal layer 120.

In one embodiment, the second ground metal layer 140 may cover the fourth plate 134, that is, the second ground metal layer 140 may cover the fourth plate 134 as much as possible, so that the second ground metal layer 140 does not need to be hollowed or etched, which further simplifies the implementation. It should be noted that the coverage ratio of the second ground metal layer 140 to the fourth board surface 134 is not particularly limited in the present application, as long as the second ground metal layer 140 can achieve the uniformity of the ground level. In some embodiments, whether the second ground metal layer 140 completely covers the fourth board surface 134 or not, as long as the second ground metal layer 140 can directly or indirectly make the ground level of the rf ground test socket consistent with the ground level of other devices, the second ground metal layer 140 may be applied in the solution of the present application.

In one embodiment, as shown in fig. 6-8, the rf socket matching apparatus 10 further includes a third ground metal layer 150 disposed on the first board surface 112, a socket body hollow area 152 is partially formed on the third ground metal layer 150, the socket body hollow area 152 is used for disposing a main structure of the rf socket, and an orthographic projection of the socket body hollow area 152 on the second board surface 114 covers an orthographic projection of the first hollow area 122 on the second board surface 114.

The main structure of the rf test socket may refer to a structure of the rf test socket except for the signal pad 30 and the connection pin. Specifically, to prevent the main structure of the rf test socket from being electrically connected to the third ground metal layer 150, which may cause signal grounding to affect the normal operation of communication, a test socket main body hollowed-out region 152 may be formed on the third ground metal layer 150, so as to accommodate the main structure of the rf test socket through the test socket main body hollowed-out region 152. Referring to fig. 8, the orthographic projection of the test socket body hollow area 152 on the second board surface 114 may partially cover the orthographic projection of the first hollow area 122 on the second board surface 114, so that the orthographic projections of the two hollow areas form a concave structure as shown in fig. 8, thereby further reducing the capacitance of the signal pad 30, further realizing broadband matching and reducing the matching loss.

In one embodiment, the third ground metal layer 150 may further be formed with a transmission structure hollowed-out area 154, and the transmission structure hollowed-out area 154 is communicated with the test socket main body hollowed-out area 152 and is used for accommodating the signal pad 30 of the transmission line 20 radio frequency test socket, so as to prevent the transmission line 20 and the signal pad 30 from being electrically connected with the third ground metal layer 150, which may cause the signal ground to affect the normal operation of the communication, thereby improving the reliability of the communication.

In one embodiment, the rf socket matching device 10 further includes a socket connecting structure disposed on the first board surface 112, the socket connecting structure being electrically connected to the third ground metal layer 150 and being used for electrically connecting to an rf socket. When the radio frequency test socket matching device 10 is put into use, the radio frequency test socket can be electrically connected with the radio frequency test socket matching device 10 through the test socket connecting structure, and under the condition that the test socket connecting structure is determined, the setting position, the setting direction, the setting position of the signal bonding pad 30 and other factors of the radio frequency test socket are determined, so that the position and subsequent design of the first hollowed area 122 can be determined conveniently.

In one embodiment, as shown in fig. 7, the socket connection structure may include a first socket connection pad 162, a second socket connection pad 164, and a third socket connection pad 166, and the rf socket may be electrically connected to the third ground metal layer 150 through the aforementioned 3 socket connection pads.

In one embodiment, a radio frequency transceiver is provided that includes a radio frequency test socket, a transmission line 20, and the radio frequency test socket matching device 10 of any of the above embodiments. The rf test socket and the transmission line 20 are both disposed on the first plate 112 of the first dielectric substrate 110, and the transmission line 20 includes a test socket connection end portion electrically connected to the rf test socket.

It should be noted that the transmission line 20 may be bent, or may be straight, or may be partially bent, and the rest is straight. The specific implementation structure of the transmission line 20 may be determined according to the length of the transmission line 20, the design parameters of the radio frequency transceiver, the size of the first hollowed area 122, and other factors, which is not specifically limited in this application.

In one embodiment, as shown in fig. 9-10, the transmission line 20 includes a bent portion, the bent portion is close to the connection end of the test socket, and an orthogonal projection of the bent portion on the first board 112 overlaps at least a portion of an orthogonal projection of the first hollow area 122 on the first board 112. The bent portion is the transmission line 20 that is bent. Referring to fig. 9-10, the orthographic projection of the bending portion on the second board surface 114 falls partially or completely into the first hollow area 122, so as to improve the equivalent inductance value, facilitate the impedance matching with the pad, further improve the broadband matching and reduce the matching loss, and have the advantage of simple implementation. In one embodiment, the bending portion may be disposed in a central symmetry.

It should be noted that, when the transmission line 20 is partially bent (the transmission line 20 is a bent portion), and the rest is straight (the transmission line 20 is a straight portion), the orthographic projection of the bent portion on the second plate surface 114 may partially or completely fall into the first hollowed area 122, and the orthographic projection of the straight portion on the second plate surface 114 may partially or completely fall into the second hollowed area.

Referring to fig. 10, fig. 10 shows the simulation of the rf signal transceiver of the present application and the conventional rf signal transceiver by the ADS simulation software, where the model of the rf test socket is 9820189. As can be seen from fig. 10, the insertion loss of the present application is 0.147dB, whereas the insertion loss of the conventional technology is 0.546 dB. The matching degree is marked by the return loss, and is improved from-10.6 dB of the traditional technology to-23.8 dB of the application.

In one embodiment, there is provided a radio frequency device comprising the radio frequency transceiver of any of the above embodiments. It is to be understood that the radio frequency device in this embodiment may be any device that needs to perform radio frequency signal transceiving, and may be, but is not limited to, various base stations, personal computers, notebook computers, smart phones, tablet computers, and portable wearable devices.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A radio frequency test socket mating device, comprising:

the first plate surface of the first dielectric substrate is used for arranging a radio frequency test seat and a transmission line;

the first grounding metal layer is arranged on a second plate surface of the first dielectric substrate, and the second plate surface is opposite to the first plate surface; and a first hollowed area is formed in a part of the first ground metal layer, and the orthographic projection of the first hollowed area on the first board surface covers the orthographic projection of the signal pad of the radio frequency test socket on the first board surface and covers the orthographic projection of the test socket connecting end of the transmission line on the first board surface.

2. The radio frequency test socket mating arrangement of claim 1, further comprising:

the second dielectric substrate comprises a third plate surface and a fourth plate surface opposite to the third plate surface, and the first grounding metal layer is clamped between the third plate surface and the second plate surface;

and the second grounding metal layer is arranged on the fourth board surface.

3. The radio frequency test socket matching device of claim 2, wherein the second ground metal layer covers the fourth board surface.

4. The radio frequency test socket matching device of claim 1, further comprising a third ground metal layer disposed on the first board surface;

a test seat main body hollowed area is formed in a part of the third ground metal layer, and the test seat main body hollowed area is used for arranging a main body structure of the radio frequency test seat; the orthographic projection of the test seat main body hollowed area on the second plate surface covers the orthographic projection of the first hollowed area on the second plate surface.

5. The radio frequency test socket matching device of claim 4, further comprising a test socket connection structure for electrically connecting the radio frequency test socket;

the test seat connecting structure is arranged on the first plate surface and is electrically connected with the third grounding metal layer.

6. The radio frequency test socket mating arrangement of any one of claims 1 to 5, wherein the first hollowed-out area is a rectangular area.

7. A radio frequency signal transceiver, comprising:

the radio frequency test socket mating arrangement of any one of claims 1 to 6;

the radio frequency test seat is arranged on the first plate surface;

the transmission line is arranged on the first board surface; the transmission line comprises a test seat connecting end part which is electrically connected with the radio frequency test seat.

8. The radio frequency signal transceiver of claim 7, wherein the transmission line includes a bend portion, the bend portion being proximate to the test socket connection end;

the orthographic projection of the bent part on the first plate surface is overlapped with at least part of orthographic projection of the first hollowed area on the first plate surface.

9. The radio frequency signal transceiver of claim 8, wherein the bending portion is disposed in a central symmetry.

10. A radio frequency device comprising a radio frequency signal transceiver as claimed in any one of claims 7 to 9.

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