CN214848610U

CN214848610U - Double-bending flattening lead and packaging shell

Info

Publication number: CN214848610U
Application number: CN202120729123.4U
Authority: CN
Inventors: 谢树华
Original assignee: Shanghai Kefa Precision Alloy Material Co ltd
Current assignee: Shanghai Kefa Precision Alloy Material Co ltd
Priority date: 2021-04-09
Filing date: 2021-04-09
Publication date: 2021-11-23
Anticipated expiration: 2031-04-09

Abstract

The application relates to a two bend lead wire and encapsulation shell of flattening relates to electronic components's technical field, and it is including being used for wearing out the section and connecting in the flat section of wearing out the section with other components and parts are connected, the flat section is bar sheet structure. This application has the effect that is more simple and convenient relatively when making the wire of many chip contacts and the welding of same root lead wire.

Description

Double-bending flattening lead and packaging shell

Technical Field

The application relates to the technical field of electronic components, in particular to a double-bending flattening lead and a packaging shell.

Background

In the processing of electronic components, circuit chips need to be packaged and protected to prevent the performance of electric appliances from being reduced due to the corrosion of the chip circuits by impurities in the air. Most of the chip packages in the prior art use a package casing to package the chip, and a circuit of the chip is connected with an electronic component of the package casing through a lead.

The patent document with the application number of 200620011371.0 discloses a semiconductor separation device shell packaging structure, wherein a frame is arranged on a plane of a bottom plate, and lead wires are arranged on two side walls of the frame; the two ends of the bottom plate are provided with arc-shaped notches extending inwards; the lead wires are two lead wires, and each lead wire is three lead wires with one end connected with each other and the other end slightly extending into the frame and fixed on the frame.

With respect to the related art among the above, the inventors consider that the following technical drawbacks exist: when the wires of a plurality of contacts of the chip need to be connected to the same lead, the plurality of wires are concentrated with the welding spots penetrating the end of the lead in the packaging shell, and the welded wire is easily fused again in the welding process, so that the welding process is relatively more difficult.

SUMMERY OF THE UTILITY MODEL

In order to make it relatively easier when the wire of many chip contacts and same lead wire weld, this application provides a two-fold bend flatten lead wire and encapsulation shell.

In a first aspect, the present application provides a double-folded flattened lead wire, which adopts the following technical scheme:

the double-bending flattening lead comprises a penetrating section and a flat section, wherein the penetrating section is used for being connected with other components, and the flat section is connected to the penetrating section and is of a strip-shaped sheet structure.

Through adopting above-mentioned technical scheme, the platykurtic is the lamellar structure of bar, and when the wire of a plurality of chip contacts welded the platykurtic, the great welding area of platykurtic and longer length can make a plurality of wires distributed welding in the platykurtic to reduce the condition that a good wire of previous welding melts again among the welding process appears, make the wire of a plurality of chip contacts weld in the platykurtic more easily.

Optionally, the flat section is concavely formed with a plurality of weld grooves, and notches of the plurality of weld grooves face the same direction.

By adopting the technical scheme, the welding grooves can be in one-to-one correspondence with the wires to be welded, so that the welding process is relatively clear, the welding spots are more orderly, and the connecting area of the welding points and the flat section can be increased by the welding grooves, so that the wires of the chip connecting points can be more firmly connected with the flat section.

Optionally, the flat section is bent towards one end of the penetrating section to form a bent section, the central axis of the flat section is parallel to the central axis of the penetrating section, and the extending direction of the end part of the flat section is opposite to the extending direction of the end part of the penetrating section.

Through adopting above-mentioned technical scheme, when the installation is folded the bend and is flattened the lead wire, the bending segment can play limiting displacement, makes the difficult condition that takes place the skew of position of flat section.

Optionally, the peripheral walls of the penetrating section and the flat section are plated with protective layers.

Through adopting above-mentioned technical scheme, the inoxidizing coating can be protected wearing out section and flat section, reduces wearing out the section and the flat section receives the condition of corroding.

The second aspect, the application provides a packaging shell, flatten the lead wire including shell, bed course and two bends, two bends flatten the lead wire including wearing out the section, the connecting hole has been seted up to the shell, wear out the section and wear to locate the inner chamber that connecting hole and flat section are located the shell, the bed course is fixed in the diapire of shell, flat section butt is in the notch bed course dorsad of bed course and weld groove.

Through adopting above-mentioned technical scheme, the shell can protect the chip of inner chamber, and the function of being connected the chip with other electronic components electricity can be realized to the double bend lead wire of flattening of beating, and the bed course can carry out the butt to the double bend lead wire of flattening of beating and support, reduces the flat section and takes place the condition of buckling deformation.

Optionally, a placing groove is formed in one side, facing the flat section, of the cushion layer, and the flat section is arranged in the placing groove.

Through adopting above-mentioned technical scheme, the standing groove can be used to place the platykurtic to carry on spacingly to the platykurtic, reduce the condition that the position of platykurtic took place the skew.

Optionally, the groove wall of the placing groove is adapted to the peripheral wall of the flat section, and the groove bottom wall of the placing groove is attached to the lower end face of the flat section.

Through adopting above-mentioned technical scheme, the cell wall laminating of standing groove in the lower terminal surface of platykurtic for the standing groove can carry out better support and limiting displacement to the platykurtic.

Optionally, the edge of the opening at one side of the connecting hole facing the cushion layer is provided with a chamfer, and one side of the bending section back to the cushion layer is attached to the hole wall of the connecting hole.

By adopting the technical scheme, the aperture of one side of the connecting hole can be enlarged by the arranged chamfer so as to facilitate the penetration of the bending section to penetrate through the connecting hole, and the bending section can be abutted against the hole wall of the connecting hole, so that the connecting hole can play a role in preliminary position limitation of the double-bending flattening lead.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the flat section has a larger welding area and a longer length, so that a plurality of wires can be distributed and welded on the flat section, thereby reducing the condition that the former welded wire is re-fused in the welding process, and leading the wires of a plurality of chip joints to be easier to weld on the flat section;

2. the shell can protect the chip of inner chamber, and two bending flatten the lead wire and can realize the function of being connected inside chip and other electronic components electricity, and the bed course can be supported the butt to two bending flatten the lead wire, reduces the flat section and takes place the condition of buckling deformation.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of the present application;

FIG. 2 is an exploded view of a double bend flattened lead and package housing of an embodiment of the present application;

fig. 3 is a schematic partial cross-sectional view of an embodiment of the present application.

Description of reference numerals: 1. a piercing section; 2. a flattened section; 21. welding a groove; 3. bending the section; 4. a protective layer; 5. a housing; 51. connecting holes; 6. a cushion layer; 61. and (6) placing the groove.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses a packaging shell. Referring to fig. 1, the package housing includes a housing 5, a cushion 6, and two double bend flattened leads. The outer shell 5 is of a rectangular box-shaped structure with an opening, two connecting holes 51 are formed in the side wall of the outer shell 5, and the double-bent flattened lead can be connected with other electronic components through the connecting holes 51.

Bed course

6 and 5 integrated into one piece of shell, bed course 6 sets up in the diapire of 5 inner chambers of shell.

The two bend flattening lead wires are including wearing out section 1 and flat section 2, flat section 2 is located the inner chamber of shell 5, many wires of chip contact can be welded in flat section 2, wear out section 1 and flat section 2 integrated into one piece, flat section 2 is rectangular shape sheet structure, thereby the flat section 2 of bar can make the wire dispersion welding of many chip contacts, in addition, sheet structure multiplicable welded contact area, thereby make the welded process relatively convenient and the wire of welding back chip contact more stable with flat section 2's connection relatively. The penetrating section 1 is in a round rod-shaped structure, the penetrating section 1 is arranged in the connecting hole 51 in a penetrating manner, and the end part of the penetrating section 1 extends out of the connecting hole 51.

Referring to fig. 2 and 3, the flat section 2 is bent towards one end of the piercing section 1 to form a bent section 3, and the bending angle between the bent section 3 and the flat section 2 is alpha (180 degrees > alpha ≧ 90 degrees). The central axis of the flat section 2 is parallel to the central axis of the penetrating section 1, and the extending direction of the end part of the flat section 2 is opposite to the extending direction of the end part of the penetrating section 1, so that the double-bending flattening lead is in a Z shape. When the double-bending flattened lead is mounted on the housing 5, after the penetrating section 1 penetrates through the connecting hole 51, the bending section 3 tends to bend upwards, so that the horizontal height of the flat section 2 is higher than that of the penetrating section 1 (the bottom wall of the housing 5 is taken as a standard). Therefore, the bending section 3 can be abutted against the inner wall of the shell 5 so as to achieve the effect of limiting and fixing the double-bending lead, and the flat section 2 is not easy to be pulled out of the shell 5. And, the up end of bed course 6 is set up to the lower terminal surface of flat section 2, and bed course 6 can support flat section 2, reduces flat section 2 and takes place the condition of buckling deformation.

In order to more stably connect the lead of the chip contact to the flat section 2, the flat section 2 is pressed and sunken to form two welding grooves 21, the notches of the two welding grooves 21 face the same direction, the groove walls of the welding grooves 21 can be used for accommodating the lead and the welding point of the flat section 2, so that the welding points of the lead and the flat section are not easily abraded or impacted, and the condition that the lead is separated from the flat section 2 is reduced. In addition, the circumferential wall of the double-bending flattened lead is further plated with a protective layer 4, the protective layer 4 can be a tin layer or a silver layer, the protective layer 4 can reduce the corrosion of the double-bending flattened lead, and meanwhile, the protective layer 4 can be melted to a certain extent in the welding process so that the connection between the lead and the flat part 2 is relatively stable.

Referring to fig. 2 and 3, a placing groove 61 is formed in one side of the cushion 6 facing the flat section 2, the placing groove 61 is in the shape of a long-strip groove, the placing groove 61 is in an upper opening structure, and one side of the placing groove 61 facing the connecting hole 51 is in an opening structure. The flat part 2 is positioned in the placing groove 61, and the groove wall of the placing groove 61 can play a role in limiting or protecting the flat part 2, so that the flat part 2 is not easy to deviate and deform. In addition, the sectional view of the bottom wall of the placement groove 61 along the longitudinal direction of the flat portion 2 is a wavy structure, so that the bottom wall of the placement groove 61 can be attached to the lower end surface of the flat portion 2, and the bottom wall of the placement groove 61 can support the flat portion 2 more comprehensively. When the flat portion 2 is placed in the placement groove 61, the upper end surface of the flat portion 2 does not exceed the upper end surface of the pad 6, so that the flat portion 2 can be less worn.

The connecting hole 51 is provided with a chamfer towards the opening edge of one side of the cushion layer 6, and the chamfer is in arc surface transition, so that the hole wall of the connecting hole 51 can be better attached to the side surface of the bending section 3 back to the cushion layer 6. The double-bent flattened lead is relatively more firmly mounted with the housing 5.

The production process of the packaging shell in the embodiment of the application is as follows: firstly, the piercing-out section 1 passes through the connecting hole 51, at this time, the hole wall of the connecting hole 51 can be abutted against the bending section 3 and limit the double-bending flattening lead, and the flat section 2 can be clamped in the placing groove 61, so that the double-bending flattening lead can be relatively firmly fixed on the shell 5. In addition, the soldering grooves 21 on the flat section 2 allow a plurality of wires of the chip contacts to be soldered in the soldering grooves 21, respectively, so that the connection between the wires and the flat section 2 is relatively stable.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A double-bend flattening lead wire is characterized in that: including being used for wearing out section (1) and connecting in wearing out the flat section (2) of section (1) with other components and parts are connected, flat section (2) are bar sheet structure.

2. The double bend flattened lead of claim 1, wherein: the flat section (2) is concavely provided with a plurality of welding grooves (21), and the notches of the welding grooves (21) face to the same direction.

3. The double bend flattened lead of claim 2, wherein: one end of the flat section (2) which penetrates out of the section (1) is bent to form a bent section (3), the central axis of the flat section (2) is parallel to the central axis of the section (1), and the extending direction of the end part of the flat section (2) is opposite to the extending direction of the end part of the section (1).

4. The double bend flattened lead of claim 3, wherein: the peripheral walls of the penetrating section (1) and the flat section (2) are plated with protective layers (4).

5. A package housing using double bend flattened leads, comprising: including shell (5), bed course (6) and two bends flatten the lead wire, two bends flatten the lead wire including wearing out section (1), connecting hole (51) have been seted up in shell (5), wear out section (1) and wear to locate connecting hole (51) and flat section (2) and be located the inner chamber of shell (5), bed course (6) are fixed in the diapire of shell (5), flat section (2) butt is in bed course (6) and weld notch (21) back to bed course (6).

6. The package housing with double bend flattened leads as claimed in claim 5, wherein: a placing groove (61) is formed in one side, facing the flat section (2), of the cushion layer (6), and the flat section (2) is arranged in the placing groove (61).

7. The package housing with double bend flattened leads as claimed in claim 6, wherein: the groove wall of the placing groove (61) is matched with the peripheral wall of the flat section (2), and the groove bottom wall of the placing groove (61) is attached to the lower end face of the flat section (2).

8. The package housing with the application of the double bend flattened lead according to any of the claims 5-7, wherein: and a chamfer is arranged on the opening edge of one side of the connecting hole (51) facing the cushion layer (6), and one side of the bending section (3) back to the cushion layer (6) is attached to the hole wall of the connecting hole (51).