CN214841783U - Refrigeration plant and vehicle - Google Patents

Abstract

The utility model provides a refrigeration plant and vehicle relates to vehicle technical field, and wherein, in refrigeration plant located the trunk of vehicle, refrigeration plant included: semiconductor refrigeration piece has cold junction and the hot junction of relative setting, and the hot junction of semiconductor refrigeration piece sets up with the inner wall laminating of trunk, and the cold junction of semiconductor refrigeration piece sets up towards the inner space of trunk. According to the technology disclosed by the invention, the specific refrigeration requirement on the refrigeration object arranged in the trunk can be met, and the semiconductor refrigeration sheet has no noise in the refrigeration process, so that the riding experience of drivers and passengers is favorably improved; moreover, the cost of secondary processing of the vehicle body is reduced, and the installation convenience of the refrigeration equipment in the trunk is improved.

Description

Refrigeration plant and vehicle

Technical Field

The present disclosure relates to vehicle technology, and more particularly to refrigeration equipment technology.

Background

The vehicle-mounted intelligent equipment of the automatic driving vehicle is usually arranged in the trunk, and because the vehicle-mounted intelligent equipment generates a large amount of heat in the working process, in order to improve the working stability of the vehicle-mounted intelligent equipment, the auxiliary heat dissipation equipment is required to be additionally arranged in the trunk to dissipate heat of the vehicle-mounted intelligent equipment.

In the related art, the auxiliary heat dissipation device generally employs a fan, and air flow formed by the fan is used for cooling and dissipating heat of the vehicle-mounted intelligent device. However, the heat dissipation efficiency of the heat dissipation mode is low, the heat dissipation effect is poor, and a vent hole needs to be formed in the vehicle body to exhaust heat in the trunk, so that the vehicle body is changed greatly, and the processing cost is high.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a refrigeration apparatus and a vehicle.

According to an aspect of the present disclosure, there is provided a refrigeration apparatus provided in a trunk of a vehicle, the refrigeration apparatus including:

semiconductor refrigeration piece has cold junction and the hot junction of relative setting, and the hot junction of semiconductor refrigeration piece sets up with the inner wall laminating of trunk, and the cold junction of semiconductor refrigeration piece sets up towards the inner space of trunk.

According to another aspect of the present disclosure, there is also provided a vehicle including the refrigeration apparatus according to the above-described embodiments of the present disclosure.

According to the technology disclosed by the invention, the specific refrigeration requirement on the refrigeration object arranged in the trunk can be met, and the semiconductor refrigeration sheet has no noise in the refrigeration process, so that the riding experience of drivers and passengers is favorably improved; moreover, the cost of secondary processing of the vehicle body is reduced, and the installation convenience of the refrigeration equipment in the trunk is improved.

It should be understood that what is described in this summary section is not intended to limit key or critical features of the embodiments of the disclosure, nor is it intended to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following description.

Drawings

The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements, and wherein:

FIG. 1 illustrates a schematic view of an installation of a refrigeration unit in a trunk in accordance with an embodiment of the present disclosure;

FIG. 2 illustrates a schematic view of an installation of a refrigeration unit in a trunk in accordance with an embodiment of the present disclosure;

fig. 3 shows a schematic structural diagram of a semiconductor chilling plate of a refrigeration device according to an embodiment of the present disclosure.

Description of reference numerals:

a vehicle 1; a trunk 1 a; a bottom wall 1 b;

a refrigeration device 100;

a semiconductor refrigeration plate 10; a cold end 10 a; a hot end 10 b; a first insulating heat-conductive sheet 111; a second insulating heat-conductive sheet 112; an N-type semiconductor element 121; a P-type semiconductor element 122; a first metal conductor 131; a second metal conductor 132;

a fan 20;

cooling guide fins 30;

the object 200 is cooled.

Detailed Description

Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings, in which various details of the embodiments of the disclosure are included to assist understanding, and which are to be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

A refrigeration apparatus 100 according to an embodiment of the present disclosure is described below with reference to fig. 1 and 2.

As shown, the refrigeration apparatus 100 according to the embodiment of the present disclosure is provided in the trunk 1a of the vehicle 1.

Specifically, refrigeration plant 100 includes semiconductor refrigeration piece 10, and semiconductor refrigeration piece 10 has cold junction 10a and hot junction 10b of relative setting, and the hot junction 10b of semiconductor refrigeration piece 10 sets up with the inner wall laminating of trunk 1a, and the cold junction 10a of semiconductor refrigeration piece 10 sets up towards the inner space of trunk 1 a.

In the embodiment of the present disclosure, the refrigeration object 200 may be placed in the trunk 1a, and the refrigeration object 200 may be any device, for example, an in-vehicle smart device installed in the trunk 1 a.

It is understood that the semiconductor chilling plate 10 includes an N-type semiconductor material and a P-type semiconductor material, which are joined to form a thermocouple pair. When a current flows through the thermocouple pair, heat transfer occurs at two ends of the semiconductor chilling plate 10, that is, heat is transferred from one end of the thermocouple pair to the other end, so that a temperature difference is generated at two ends of the semiconductor chilling plate 10, and a cold end 10a and a hot end 10b are respectively formed at two ends of the semiconductor chilling plate 10.

As shown in fig. 3, in a specific example, the semiconductor cooling plate 10 includes two insulating heat conducting plates disposed at intervals, a plurality of N-type semiconductor elements 121 and a plurality of P-type semiconductor elements 122 are disposed between the two insulating heat conducting plates, the N-type semiconductor elements 121 and the P-type semiconductor elements 122 are alternately arranged, and end portions of adjacent N-type semiconductor elements 121 and P-type semiconductor elements 122 are connected by a metal conductor, so that the plurality of semiconductor elements are electrically conducted in sequence to form a complete circuit. The metal conductor may be made of other metal materials such as copper and aluminum.

More specifically, the plurality of metal conductors includes a first metal conductor 131 and a second metal conductor 132. In the flowing direction of the current, the first metal conductor 131 is connected between the first end of the N-type semiconductor element 121 and the first end of the P-type semiconductor element 122, and the plurality of first metal conductors 131 are attached to the first insulating heat-conducting sheet 111; the second metal conductor 132 is connected between the second end of the P-type semiconductor element 122 and the second end of the N-type semiconductor element 121, and the plurality of second metal conductors 132 are attached to the second insulating heat-conducting sheet 112. In the process that current flows from the N-type semiconductor element 121 to the P-type semiconductor element 122 through the first metal conductor 131 therebetween, the first metal conductor 131 absorbs heat; in the process of current flowing from the P-type semiconductor element 122 to the N-type semiconductor element 121 through the second metal conductor 132 therebetween, the second metal conductor 132 releases heat. Thus, in the process of connecting the semiconductor chilling plate 10 with current, the first insulating and heat-conducting plate 111 bonded to the plurality of first metal conductors 131 forms the cold end 10a of the semiconductor chilling plate 10, and the second insulating and heat-conducting plate 112 bonded to the plurality of second metal conductors 132 forms the hot end 10b of the semiconductor chilling plate 10.

In addition, the cooling effect of the semiconductor cooling plate 10 is related to the magnitude of the conduction current and the number of the thermocouple pairs formed by the N-type semiconductor element 121 and the P-type semiconductor element 122, and the magnitude of the conduction current and the number of the thermocouple pairs formed by the N-type semiconductor element 121 and the P-type semiconductor element 122 may be set according to the actual cooling requirement, which is not specifically limited in the embodiment of the present disclosure.

The cold end 10a and the hot end 10b of the semiconductor refrigeration sheet 10 are respectively formed on two outer surfaces of the semiconductor refrigeration sheet 10 which are oppositely arranged. The cold end 10a of the semiconductor chilling plate 10 is disposed toward the inner space of the trunk 1a to chill the inner space of the trunk 1a and the chilling object 200.

It will be appreciated that the trunk 1a of the vehicle 1 is generally defined by a vehicle body, and the material of the vehicle body is generally metal, and the hot end 10b of the semiconductor refrigeration sheet 10 may be directly attached to the metal vehicle body forming the inner wall of the trunk 1 a. The inner wall of the trunk 1a may be specifically a bottom wall 1b of the trunk 1a, or may be a side wall or a top wall of the trunk 1 a.

According to the refrigeration equipment 100 of the embodiment of the disclosure, the refrigeration equipment 100 is arranged in the trunk 1a of the vehicle 1, and the semiconductor refrigeration piece 10 is arranged to refrigerate the refrigeration object 200 in the trunk 1a, especially for the vehicle-mounted intelligent equipment arranged in the trunk 1a, because the semiconductor refrigeration piece 10 has the characteristics of no noise, no vibration, no refrigerant, small volume, light weight and the like, and has the advantages of reliable operation, simple and convenient operation and convenient cold quantity adjustment, on one hand, the refrigeration requirement specific to the refrigeration object 200 arranged in the trunk 1a can be met, and the semiconductor refrigeration piece 10 has no noise in the refrigeration process, thereby being beneficial to improving the riding experience of drivers and passengers; on the other hand, the overall dimension of the refrigeration device 100 is reduced, so that the space occupation of the trunk 1a is reduced, and the space utilization rate of the trunk 1a is ensured.

Moreover, the hot end 10b of the semiconductor refrigeration piece 10 is attached to the inner wall of the trunk 1a, so that heat emitted by the hot end 10b of the semiconductor refrigeration piece 10 can be directly conducted to a vehicle body forming the inner wall of the trunk 1a, and the heat is emitted to the outside through the metal vehicle body, and therefore, on one hand, the heat emission effect of a semiconductor cooling fin can be improved, and the refrigeration efficiency of the refrigeration equipment 100 is improved; on the other hand, compared with the prior art that the refrigeration equipment 100 is cooled by arranging the fan 20 in the trunk 1a, in the process that the refrigeration equipment 100 cools the cooling object 200, other structures such as a vent hole do not need to be arranged on the trunk 1a, so that the cost of secondary processing of the vehicle body is reduced, and the installation convenience of the refrigeration equipment 100 in the trunk 1a is improved.

As shown in fig. 1 and 2, in one embodiment, the hot end 10b of the semiconductor chilling plate 10 is attached to the bottom wall 1b of the trunk 1 a.

For example, a heat-conducting silica gel may be disposed between the hot end 10b of the semiconductor refrigeration sheet 10 and the bottom wall 1b of the trunk 1a, so as to improve the heat-conducting performance and the heat-conducting efficiency between the semiconductor refrigeration sheet 10 and the bottom wall 1b of the trunk 1 a.

The connection and fixation manner of the semiconductor refrigeration sheet 10 on the bottom wall 1b of the trunk 1a is not particularly limited in the embodiment of the present disclosure, for example, the semiconductor refrigeration sheet 10 may be fixed on the bottom wall 1b of the trunk 1a by a fixing support connected with the bottom wall 1b of the trunk 1 a.

It can be understood that the cold end 10a of the semiconductor chilling plate 10 is arranged opposite to the hot end 10b, the hot end 10b of the semiconductor chilling plate 10 is arranged downwards and attached to the bottom wall 1b of the trunk 1a, and correspondingly, the hot end 10b of the semiconductor chilling plate 10 is arranged upwards and faces the inner space of the trunk 1a, so that the cold energy generated by the cold end 10a of the semiconductor chilling plate 10 refrigerates the inner space of the trunk 1 a.

According to the above embodiment, the hot end 10b of the semiconductor refrigeration piece 10 is attached to the bottom wall 1b of the trunk 1a, so that on one hand, a large contact area between the hot end 10b of the semiconductor refrigeration piece 10 and the inner wall of the trunk 1a can be ensured, on the other hand, the fixing effect of the semiconductor refrigeration piece 10 in the trunk 1a can be improved, and the structural stability is ensured.

As shown in fig. 1, in one embodiment, the cold end 10a of the semiconductor chilling plate 10 is disposed at a predetermined distance from the chilling object 200.

In other words, the cold end 10a of the semiconductor refrigeration sheet 10 and the refrigeration object 200 are disposed in a non-contact manner, and the cold end 10a of the semiconductor refrigeration sheet 10 cools the entire internal space of the trunk 1a to reduce the temperature of the working environment of the refrigeration object 200, thereby achieving the purpose of cooling the refrigeration object 200.

It should be noted that the preset distance between the cold end 10a of the semiconductor refrigeration sheet 10 and the refrigeration object 200 may be adjusted according to actual situations. For example, the actual size of the trunk 1a, the cooling capacity required by the cooling object 200, and the cooling effect of the cooling device 100 may be comprehensively considered, and the distance therebetween may be set as long as the cooling capacity of the semiconductor cooling fins 10 can satisfy the cooling demand of the cooling object 200.

Through the above embodiment, the semiconductor refrigeration piece 10 can perform overall refrigeration on the internal space of the trunk 1a, so that refrigeration is performed on the working environment of the refrigeration object 200, and the long-time stable working temperature of the working environment of the refrigeration object 200 is guaranteed, so that the working stability of the refrigeration object 200 is improved.

As shown in fig. 1, in one embodiment, the refrigeration appliance 100 further includes a fan 20. The fan 20 is disposed adjacent to the cold end 10a of the semiconductor chilling plate 10, and the air outlet direction of the fan 20 is disposed toward the refrigerated object 200.

Illustratively, the refrigeration device 100 further comprises heat-conducting fins, and the heat-conducting fins are mounted at the cold end 10a of the semiconductor chilling plate 10 and used for conducting the chilling energy of the semiconductor chilling plate 10. Fan 20 is mounted on the heat conductive fin, and the air outlet direction of fan 20 is set toward cooling object 200.

From this, can make the cold volume that the cold junction 10a of semiconductor refrigeration piece 10 produced form cold wind under the drive of the air current that fan 20 formed to the flow direction of cold wind sets up towards refrigeration object 200, in order to satisfy the specific refrigeration demand to refrigeration object 200, improves the refrigeration effect to refrigeration object 200.

As shown in fig. 2, in one embodiment, the cold end 10a of the semiconductor chilling plate 10 is disposed in close proximity to at least a portion of the refrigerated object 200.

Illustratively, the hot end 10b of the semiconductor refrigeration piece 10 is attached to the bottom wall 1b of the trunk 1a, and the refrigeration object 200 is installed above the cold end 10a of the semiconductor refrigeration piece 10, that is, the lower surface of the refrigeration object 200 is attached to the outer surface of the cold end 10a of the semiconductor refrigeration piece 10. Wherein, the laminating area of cold junction 10a of semiconductor refrigeration piece 10 and refrigeration object 200 is provided with heat conduction silica gel to improve the heat conductivility between cold junction 10a of semiconductor refrigeration piece 10 and the refrigeration object 200.

In addition, the cold end 10a of the semiconductor refrigeration piece 10 and the refrigeration object 200 can be fixedly connected through a fastener or other modes, so that the connection stability between the two is improved, and the two can be stably attached.

According to the above embodiment, the cold end 10a of the semiconductor refrigeration piece 10 is attached to the refrigeration object 200, so that the cold end 10a of the semiconductor refrigeration piece 10 directly absorbs heat dissipated by the refrigeration object 200, rapid refrigeration of the refrigeration object 200 is realized, the refrigeration effect of the refrigeration equipment 100 on the refrigeration object 200 is ensured, and specific refrigeration of the refrigeration object 200 is realized. Furthermore, the integrated arrangement of the refrigeration apparatus 100 and the refrigeration object 200 is realized, so that the occupation of the internal space of the trunk 1a is reduced, and the improvement of the space utilization rate of the trunk 1a is facilitated.

In one embodiment, the semiconductor chilling plates 10 are plural, and the plural semiconductor chilling plates 10 are arranged at intervals in a preset direction.

In one example, the hot ends 10b of the plurality of semiconductor chilling plates 10 are attached to the bottom wall 1b of the trunk 1a, and the plurality of semiconductor chilling plates 10 may be arranged in an array, so that the plurality of semiconductor chilling plates 10 form a uniform chilling effect. The outer surface of the refrigerating object 200 may be simultaneously attached to the cold ends 10a of the plurality of semiconductor refrigerating sheets 10.

In another example, the cold ends 10a of the plurality of semiconductor chilling plates 10 are attached to the outer surface of the refrigerated object 200. The hot ends 10b of some semiconductor refrigeration pieces 10 in the plurality of semiconductor refrigeration pieces 10 are attached to the inner wall of the trunk 1a, and the hot ends 10b of other semiconductor refrigeration pieces 10 are arranged in the inner space of the trunk 1a in a spacing mode. Accordingly, the cold ends 10a of the plurality of semiconductor cooling fins 10 can sufficiently absorb heat generated from the cooling object 200, thereby improving a cooling effect on the cooling object 200.

It should be noted that the arrangement of the plurality of semiconductor cooling fins 10 on the outer surface of the cooling object 200 may be set according to the heating values of different areas of the cooling object 200. For example, for an area with a large heating value of the cooling object 200, the arrangement density of the semiconductor cooling fins 10 is correspondingly large; for the region with smaller heat generation amount of the cooling object 200, the arrangement density of the semiconductor cooling fins 10 is reduced accordingly.

In one embodiment, the semiconductor cooling plate 10 is electrically connected to the power supply system of the vehicle 1.

Illustratively, the semiconductor chilling plates 10 are electrically connected with a direct current power supply module in the power supply system of the vehicle 1, so as to supply power to the semiconductor chilling plates 10 through the direct current power supply module.

Further, the control device of the vehicle 1 may adjust the cooling capacity of the semiconductor cooling plate 10 by adjusting the magnitude of the power supply current of the dc power supply module to the cooling plate.

Therefore, the cooling capacity of the refrigeration device 100 can be adjusted correspondingly according to different temperature conditions, so that the refrigeration object 200 is in a working environment with relatively stable temperature.

In one embodiment, the refrigeration device 100 further comprises a dc power supply electrically connected to the semiconductor refrigeration chip 10.

Illustratively, the dc power supply device may be a battery, for example, a primary battery, a zinc-manganese dry battery, a lithium battery, or any other kind of battery, as long as the dc power supply requirement of the semiconductor cooling plate 10 can be satisfied.

Through the above embodiment, the refrigeration equipment 100 can work independently without an external power supply, so that the use convenience of the refrigeration equipment 100 is improved, and the application scene and the application range of the refrigeration equipment 100 are favorably improved.

According to an embodiment of another aspect of the present disclosure, there is also provided a vehicle 1.

As shown in fig. 1 and 2, a vehicle 1 according to an embodiment of the present disclosure includes a refrigeration apparatus 100 of the above-described embodiment of the present disclosure.

The vehicle 1 of the embodiment of the present disclosure may be, for example, a general vehicle, an automatic driving vehicle, or a training vehicle.

According to the vehicle 1 of the embodiment of the present disclosure, by using the refrigeration device 100 according to the above-described embodiment of the present disclosure, on one hand, the refrigeration requirement specific to the refrigeration object 200 installed in the trunk 1a can be satisfied, and the semiconductor refrigeration sheet 10 has no noise in the refrigeration process, which is beneficial to improving the riding experience of the driver and the passenger; on the other hand, the overall dimension of the refrigeration device 100 is reduced, so that the space occupation of the trunk 1a is reduced, and the space utilization rate of the trunk 1a is ensured. Furthermore, compared with the prior art in which refrigeration equipment 100 is cooled by providing fan 20 in trunk 1a, vehicle 1 according to the embodiment of the present disclosure does not need to provide other structures such as a vent hole in trunk 1a, thereby reducing the cost of performing secondary processing on the vehicle body and improving the convenience of installation of refrigeration equipment 100 in trunk 1 a.

In one embodiment, the vehicle 1 further includes an in-vehicle smart device provided in a trunk 1a of the vehicle 1, and the in-vehicle smart device is a cooling target 200 corresponding to the cooling device 100.

In one particular example, the vehicle 1 may be an autonomous vehicle and the in-vehicle smart device may be an in-vehicle computing unit. The on-vehicle computing unit is configured to execute relevant computing processing to realize an automatic driving function of the vehicle 1. In particular, the on-board computing unit may include a central processing unit, a graphics processor) and computer hardware such as field programmable gate arrays (fpga's), each of which generates a large amount of heat under high load operation. The on-board computing unit may be integrated with the refrigeration device 100, for example, the on-board computing unit may be attached to the cold end 10a of the semiconductor refrigeration sheet 10 of the refrigeration device 100, so as to meet a specific refrigeration requirement of the on-board computing unit.

Other configurations of the vehicle 1 according to the embodiment of the present disclosure may adopt various technical solutions known by those skilled in the art now and in the future, and will not be described in detail herein.

In the description of the present specification, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present disclosure.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "a plurality" means two or more unless specifically limited otherwise.

In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different features of the disclosure. In order to simplify the disclosure of the present disclosure, specific example components and arrangements are described above. Of course, they are merely examples and are not intended to limit the present disclosure. Moreover, the present disclosure may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed.

The above detailed description should not be construed as limiting the scope of the disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present disclosure should be included in the scope of protection of the present disclosure.

Claims (10)

1. A refrigeration apparatus, characterized in that, in locating the trunk of a vehicle, the refrigeration apparatus includes:

the semiconductor refrigeration piece is provided with a cold end and a hot end which are arranged oppositely, the hot end of the semiconductor refrigeration piece is attached to the inner wall of the trunk, and the cold end of the semiconductor refrigeration piece faces towards the inner space of the trunk.

2. The refrigeration equipment as claimed in claim 1, wherein the hot end of the semiconductor refrigeration sheet is attached to the bottom wall of the trunk.

3. The refrigeration device as claimed in claim 1, wherein a refrigeration object is placed in the trunk, and the cold end of the semiconductor refrigeration sheet is disposed at a preset distance from the refrigeration object.

4. The refrigeration appliance according to claim 3, further comprising:

the fan is arranged close to the cold end of the semiconductor refrigeration piece, and the air outlet direction of the fan faces towards the refrigeration object.

5. The refrigeration equipment as recited in claim 1 wherein a refrigeration object is placed in the trunk, and the cold end of the semiconductor refrigeration sheet is attached to at least a portion of the refrigeration object.

6. The refrigeration equipment as claimed in claim 1, wherein the semiconductor refrigeration piece is plural, and the plural semiconductor refrigeration pieces are arranged at intervals in a preset direction.

7. A cold appliance according to any of claims 1-6, wherein the semiconductor chilling plates are electrically connected to the vehicle's power supply system.

8. The refrigeration apparatus as claimed in any one of claims 1 to 6, further comprising:

and the direct current power supply device is electrically connected with the semiconductor refrigerating sheet.

9. A vehicle, characterized in that it comprises a refrigeration device according to any one of claims 1 to 8.

10. The vehicle of claim 9, further comprising:

and the vehicle-mounted intelligent equipment is arranged in a trunk of the vehicle, and is a refrigeration object corresponding to the refrigeration equipment.

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