CN214793551U - Sputtering film pressure core body assembly and pressure sensor - Google Patents
Sputtering film pressure core body assembly and pressure sensor Download PDFInfo
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- CN214793551U CN214793551U CN202120853304.8U CN202120853304U CN214793551U CN 214793551 U CN214793551 U CN 214793551U CN 202120853304 U CN202120853304 U CN 202120853304U CN 214793551 U CN214793551 U CN 214793551U
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- sputtering film
- film pressure
- pressure sensor
- sensitive element
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Abstract
The invention provides a sputtering film pressure core body assembly and a pressure sensor, wherein the sputtering film pressure core body assembly comprises a base and a sputtering film sensitive element, a containing hole is formed in the base in a penetrating mode, the sputtering film sensitive element is contained in the containing hole, and the lower edge of the sputtering film sensitive element is connected with the lower end edge of the containing hole in a welding and sealing mode.
Description
Technical Field
The embodiment of the invention relates to the technical field of pressure sensors, in particular to a sputtering film pressure core body assembly and a pressure sensor.
Background
The sputtering film pressure sensor adopts a strain type resistance structure, and a film pressure-sensitive structure is manufactured on a stainless steel substrate by matching of ion beam sputtering coating, ion beam etching and micromachining processes.
In the prior art, for example, in patent CN202010651589.7, a connection between a sputtering film sensitive element and a side surface of a core seat is usually welded, that is, welded to an arc surface, which is inconvenient to operate, and has problems of high process requirement, high cost, low integration level, and the like.
Disclosure of Invention
The invention aims to provide a sputtering film pressure core body assembly and a pressure sensor, and aims to solve the problems that in the prior art, a sputtering film sensitive element of a sputtering film pressure sensor is high in installation cost, inconvenient to operate and low in integration level.
To solve the above technical problem, an embodiment of the present invention provides a sputtering film pressure core assembly including:
a base, through which a containing hole is arranged;
the sputtering film sensitive element is accommodated in the accommodating hole, and the lower edge of the sputtering film sensitive element is welded and hermetically connected with the joint of the lower edge of the accommodating hole.
According to the invention, the base is arranged and provided with the accommodating hole, the sputtering film sensitive element is accommodated in the accommodating hole, the integrated level of the button type installation mode is high, and the connection part of the lower edge of the sputtering film sensitive element and the lower end edge of the accommodating hole is welded and hermetically connected, so that the welding of a plane to a plane is realized, and compared with the welding on a side wall (curved surface), the welding process is convenient to operate, simple and low in cost.
Preferably, in the sputtering film pressure core body assembly, the accommodating hole is a step-shaped hole with a wide top and a narrow bottom, and a first step surface of the accommodating hole bears the sputtering film sensitive element.
Preferably, in the sputtering film pressure core assembly, the upper end and the lower end of the pedestal are respectively flush with the upper end and the lower end of the sputtering film sensitive element.
In order to achieve the above object, the present invention provides a sputtered film pressure sensor including the above sputtered film pressure core assembly.
Preferably, in the sputtering film pressure sensor, the accommodating hole is a multi-step-shaped hole with a wide upper part and a narrow lower part;
the sputtering film pressure sensor further comprises a substrate, wherein the substrate is provided with a yielding hole for avoiding a sputtering film sensitive element, and the substrate is borne on a second step surface positioned on the upper part of the containing hole.
Preferably, in the sputtered film pressure sensor, the sputtered film pressure sensor further includes:
the shell is provided with a cavity and a medium channel communicated with the cavity;
the first sealing element is arranged between the base and the bottom wall of the containing cavity so as to separate the containing cavity into an upper cavity and a lower cavity which are isolated from each other, and the lower cavity is communicated with the medium channel.
Preferably, in the sputtering film pressure sensor, the sputtering film pressure sensor further includes a connecting member and an electrical connector, the electrical connector is riveted in the upper edge of the housing, and the connecting member is disposed between the electrical connector and the base.
Preferably, in the sputtering film pressure sensor, a third step surface is formed on an inner wall of the housing, the third step surface bears the electrical connector, and a second sealing member is disposed between the electrical connector and the third step surface.
Preferably, the second seal is a sealing ring.
Preferably, the first seal is a sealing ring.
In order to achieve the above object, the present invention further provides a method for packaging the sputtered film pressure sensor, including:
installing the sputtering film sensitive element in the accommodating hole;
integrally inverting the sputtering film sensitive element and the base, and enabling the sputtering film sensitive element and the upward part of the base to be flush;
and welding and sealing the connection part of the upward edge of the sputtering film sensitive element and the upward end edge of the containing hole to form a sputtering film pressure core body assembly.
Preferably, in the encapsulation method, the encapsulation method further includes:
and (4) rightly arranging the welded sputtering film pressure core body assembly and installing the sputtering film pressure core body assembly into the shell.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
FIG. 1 is a schematic diagram of an embodiment of a sputtered film pressure sensor according to the invention;
FIG. 2 is a cross-sectional view of the sputtered film pressure sensor of FIG. 1;
FIG. 3 is a perspective view of a portion of the structure of FIG. 1;
FIG. 4 is an exploded view of FIG. 3;
FIG. 5 is a cross-sectional view of FIG. 3;
fig. 6 is a cross-sectional view of fig. 5 after inversion.
The invention is illustrated by the reference numerals:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
31 | Hole of stepping down |
| 11 | Containing hole | 4 | |
| 111 | |
41 | |
| 112 | |
42 | |
| 113 | |
43 | |
| 114 | |
5 | |
| 2 | Sputtering film |
6 | Connecting |
| 21 | |
7 | |
| 3 | |
8 | Second seal |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a sputtering film pressure core body assembly, please refer to fig. 4 to 6, which comprises a base 1 and a sputtering film sensitive element 2, wherein the base 1 is provided with a containing hole 11 in a penetrating way, the sputtering film sensitive element 2 is contained in the containing hole 11, and the joint of the lower edge 21 of the sputtering film sensitive element 2 and the lower end edge 111 of the containing hole 11 is welded and sealed.
In the prior art, the sputtering film pressure sensor is usually welded at the joint of the sputtering film sensitive element 2 and the side surface of the core body seat, and the method has the problems of inconvenient operation, high process requirement, high installation cost, low integration level and the like.
According to the invention, the base 1 is arranged, the containing hole 11 is arranged on the base 1, the sputtering film sensitive element 2 is contained in the containing hole 11, the integration level of the button type installation mode is high, and the connection part of the lower edge 21 of the sputtering film sensitive element 2 and the lower end edge 111 of the containing hole 11 is welded and hermetically connected, so that the welding of a plane to a plane is realized, and compared with the welding on a side wall (curved surface), the welding device is convenient to operate, simple in welding process and low in cost.
Referring to fig. 6, fig. 6 is a schematic view of integrally inverting the sputtering film sensor 2 and the base 1, when welding, the sputtering film sensor 2 is installed in the accommodating hole 11, the sputtering film sensor 2 and the base 1 are integrally inverted, the sputtering film sensor 2 and the base 1 are flush with each other at the upward part, and the upward edge of the sputtering film sensor 2 is welded and hermetically connected with the upward end edge of the accommodating hole 11 to form a sputtering film pressure core assembly.
Specifically, the accommodating hole 11 is a step-shaped hole with a wide top and a narrow bottom, and the first step surface 112 of the accommodating hole 11 bears the sputtering film sensitive element 2.
In order to achieve the above object, referring to fig. 1 to 3, the present invention further provides a sputtered film pressure sensor including the sputtered film pressure core assembly.
In order to further improve the integration level, the accommodating holes 11 are multi-step-shaped holes with wide upper parts and narrow lower parts; the sputtering film pressure sensor further comprises a substrate 3, the substrate 3 is provided with a yielding hole 31 for avoiding the sputtering film sensitive element 2, and the substrate 3 is borne on a second step surface 113 positioned on the upper part of the containing hole 11, so that the installation space can be further saved, the whole volume is reduced, and the integration level is improved.
Sputtering film pressure sensor still includes casing 4 and first sealing member 5, casing 4 have hold the chamber and with hold the medium passageway 43 of chamber intercommunication, first sealing member 5 locate base 1 with between the diapire that holds the chamber, with will hold the chamber and separate formation isolated epicoele 41 and cavity 42, cavity 42 with medium passageway 43 communicates. Preferably, the first sealing member 5 is a sealing ring, and in this embodiment, the first sealing member 5 is an O-ring. The upper chamber 41 is isolated from the lower chamber 42 by the first seal 5.
Further, the sputtering film pressure sensor further comprises a connecting piece 6 and an electrical connector 7, wherein the electrical connector 7 is riveted in the upper edge of the shell 4, and the connecting piece 6 is arranged between the electrical connector 7 and the base 1. In this embodiment, the connecting member 6 is a sleeve, and the sleeve is disposed between the electrical connector 7 and the base 1 to complete the abutting connection.
For convenience, a third step surface 114 is formed on the inner wall of the housing 4, the third step surface 114 bears the electrical connector 7, and a second sealing element 8 is arranged between the electrical connector 7 and the step surface, so that the upper cavity 41 is isolated from the outside, preferably, the second sealing element 8 is a sealing ring. In this embodiment, the second seal 8 is an O-ring.
In order to achieve the above object, the present invention further provides a method for packaging the sputtered film pressure sensor, including:
step S210: the sputtering film sensitive element 2 is arranged in the containing hole 11;
specifically, referring to fig. 5, the lower end of the sputtering film sensor 2 is in clearance fit with the lower end of the accommodating hole 11.
Step S220: integrally inverting the sputtering film sensitive element 2 and the base 1, and enabling the sputtering film sensitive element 2 and the base 1 to be flush with the upward parts;
specifically, referring to fig. 6, in this embodiment, the upper and lower ends of the sputtering thin film sensor 2 are respectively flush with the upper and lower ends of the pedestal 1, and after the sputtering thin film sensor 2 and the pedestal 1 are integrally inverted and placed on a plane, the upward portions of the sputtering thin film sensor 2 and the pedestal 1 are flush with each other.
Step S230: and welding and sealing the connection part of the upward edge of the sputtering film sensitive element 2 and the upward end edge of the containing hole 11 to form a sputtering film pressure core body assembly.
According to the invention, the base 1 is arranged, the containing hole 11 is arranged on the base 1, the sputtering film sensitive element 2 is contained in the containing hole 11, the integration level of the button type installation mode is high, and the connection part of the lower edge 21 of the sputtering film sensitive element 2 and the lower end edge 111 of the containing hole 11 is welded and hermetically connected, so that the welding of a plane to a plane is realized, and compared with the welding on a side wall (curved surface), the welding device is convenient to operate, simple in welding process and low in cost.
The packaging method comprises the steps of righting and installing the welded sputtering film pressure core body assembly into the shell 4, installing the first sealing member 5 and the like, and details are not repeated.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A sputtering film pressure core assembly comprising:
a base, through which a containing hole is arranged;
the sputtering film sensitive element is accommodated in the accommodating hole, and the lower edge of the sputtering film sensitive element is welded and hermetically connected with the joint of the lower edge of the accommodating hole.
2. The sputtering film pressure core assembly of claim 1 wherein said receiving bore is a stepped bore having a wide top and a narrow bottom, said first stepped surface of said receiving bore carrying said sputtering film susceptor.
3. The sputtering film pressure core assembly of claim 1 wherein the upper and lower ends of said pedestal are flush with the upper and lower ends of said sputtering film sensing element, respectively.
4. A sputtered film pressure sensor comprising a sputtered film pressure core assembly of any of claims 1-3.
5. The sputtered film pressure sensor of claim 4, wherein the receiving hole is a multi-step stepped hole with a wide top and a narrow bottom;
the sputtering film pressure sensor further comprises a substrate, wherein the substrate is provided with a yielding hole for avoiding a sputtering film sensitive element, and the substrate is borne on a second step surface positioned on the upper part of the containing hole.
6. The sputtered film pressure sensor of claim 4 further comprising:
the shell is provided with a cavity and a medium channel communicated with the cavity;
the first sealing element is arranged between the base and the bottom wall of the containing cavity so as to separate the containing cavity into an upper cavity and a lower cavity which are isolated from each other, and the lower cavity is communicated with the medium channel.
7. The sputtered film pressure sensor of claim 6 further comprising a connector riveted within an upper edge of the housing and an electrical connector disposed between the electrical connector and the pedestal.
8. The sputtered film pressure sensor of claim 7 wherein the inner wall of the housing defines a third step surface, the third step surface carrying the electrical connector, and a second seal is disposed between the electrical connector and the third step surface.
9. The sputtered film pressure sensor of claim 8 wherein the second seal is a seal ring.
10. The sputtered film pressure sensor of claim 6 wherein the first seal is a seal ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120853304.8U CN214793551U (en) | 2021-04-23 | 2021-04-23 | Sputtering film pressure core body assembly and pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120853304.8U CN214793551U (en) | 2021-04-23 | 2021-04-23 | Sputtering film pressure core body assembly and pressure sensor |
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| Publication Number | Publication Date |
|---|---|
| CN214793551U true CN214793551U (en) | 2021-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120853304.8U Active CN214793551U (en) | 2021-04-23 | 2021-04-23 | Sputtering film pressure core body assembly and pressure sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125057A (en) * | 2021-04-23 | 2021-07-16 | 武汉飞恩微电子有限公司 | Sputtering film pressure core body assembly, pressure sensor and packaging method |
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2021
- 2021-04-23 CN CN202120853304.8U patent/CN214793551U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125057A (en) * | 2021-04-23 | 2021-07-16 | 武汉飞恩微电子有限公司 | Sputtering film pressure core body assembly, pressure sensor and packaging method |
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