CN214753690U

CN214753690U - a transfer carrier

Info

Publication number: CN214753690U
Application number: CN202121204517.4U
Authority: CN
Inventors: 薛水源; 庄文荣; 孙明; 付小朝
Original assignee: Dongguan HCP Technology Co Ltd
Current assignee: Dongguan HCP Technology Co Ltd
Priority date: 2021-05-28
Filing date: 2021-05-28
Publication date: 2021-11-16
Anticipated expiration: 2031-05-28

Abstract

The utility model discloses a transfer support plate, including basement, first light resistance layer and expanded material. Wherein the substrate is light permeable and comprises a first surface and a second surface which are opposite. The first photoresist layer is covered on the second surface and is provided with a plurality of through holes penetrating through the thickness of the first photoresist layer. The expansion material is filled in the corresponding through hole and expands when being irradiated by laser, so that the chip is pushed to the PCB/another carrier plate positioned below the chip, and the accurate transfer of the chip can be realized. Meanwhile, due to the arrangement of the first photoresist layer, the second surface side of the substrate is opaque in the area outside the through hole, so that laser is prevented from being transmitted to the adjacent expansion material, and the accuracy of chip transfer is further improved.

Description

Transfer support plate

Technical Field

The utility model relates to a semiconductor device makes technical field, especially relates to a shift support plate.

Background

In the manufacturing process of the Mini/micro LED, the huge transfer of the Mini/micro LED chips is involved. A common practice is to arrange the chips to be transferred on a transfer carrier having a paste material layer, align the chips on the transfer carrier with the PCB/another transfer carrier, apply laser or heat from the opposite side of the substrate where the paste material layer is provided, expand the paste material layer, further push the chips onto the PCB/another transfer carrier, and finally separate the chips from the paste material layer.

In the conventional technology, the adhesive material layer 2 ' (films or glues) is directly coated on the plane of the transfer carrier 1 ' (as shown in fig. 1), and when the gas is ejected or bubbled by laser irradiation and ablation, the direction of the gas ejection and the shape of the bubbling are not easy to control, which easily causes the position of the chip 3 ' on the PCB/another transfer carrier to shift (the mark of the chip for accurate transfer is 5 ', the mark of the chip for positional shift is 5a '), and it is difficult to realize precise and rapid transfer of the chip.

Therefore, it is desirable to provide a transfer carrier capable of accurately transferring chips to solve the above-mentioned problems in the prior art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a can realize the accurate transfer support plate that shifts of chip.

To achieve the above object, the present invention provides a transfer support plate, which includes a substrate, a first photoresist layer and an expansion material. Wherein the substrate is light permeable and comprises opposing first and second surfaces. The first photoresist layer covers the second surface and is provided with a plurality of through holes penetrating through the thickness of the first photoresist layer. The expansion material is filled in the corresponding through hole and expands when being irradiated by laser.

Compared with the prior art, the utility model discloses set up first light resistance layer on the second surface of basement to set up the through-hole that runs through its thickness at first light resistance layer, through filling expanding material at the through-hole, when the expanding material in the through-hole stimulated light irradiation inflation, with the chip top to the PCB board/another support plate that is located its below, can realize the accurate of chip and shift. Meanwhile, due to the arrangement of the first photoresist layer, the second surface side of the substrate is opaque in the area outside the through hole, so that laser is prevented from being transmitted to the adjacent expansion material, and the accuracy of chip transfer is further improved.

Preferably, the intumescent material shrinks and recovers when the laser irradiation is removed.

Specifically, the swelling material is a photosensitive material or a thermosensitive material.

In one embodiment, the swelling material has a tackiness, and the swelling material is used to adhere the chip.

Preferably, an end of the intumescent material facing away from the second surface projects outwardly of the through hole.

In one embodiment, the intumescent material in at least two of the through holes cooperatively adheres to a chip.

In an embodiment, the transfer carrier further includes an adhesive layer, the adhesive layer covers a surface of the first photoresist layer facing away from the substrate, the adhesive layer is used for adhering the chip, and the expansion material pushes the adhesive layer outwards when expanding.

In an embodiment, the transfer carrier further includes a second photoresist layer covering the first surface, and an opening penetrating the thickness of the second photoresist layer is formed at a position opposite to the through hole.

In one embodiment, the substrate is a glass plate.

Drawings

Fig. 1 is a schematic diagram of a prior art transfer of LED chips from a transfer carrier to a PCB/another carrier.

Fig. 2 is a schematic view of a transfer carrier according to an embodiment of the present invention.

Fig. 3 is a schematic view of a transfer carrier according to another embodiment of the present invention.

Fig. 4 is a schematic view of a transfer carrier according to another embodiment of the present invention.

Fig. 5 is a schematic view of transferring LED chips to a PCB board/another carrier board using the transfer carrier board shown in fig. 2.

Fig. 6 is a schematic view of a process of the transfer carrier shown in fig. 2.

Fig. 7 is a schematic view of a transfer carrier according to another embodiment of the present invention.

Detailed Description

In order to explain technical contents and structural features of the present invention in detail, the following description is further made with reference to the accompanying drawings in combination with the embodiments; like element numbers in the figures represent like elements. The utility model provides a transfer support plate 100 mainly is applicable to the huge amount transfer of Mini micro LED chip, nevertheless does not regard this as the limit.

In the description of the present invention, it should be understood that the terms "upper", "lower", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and thus, are not to be construed as limiting the protection of the present invention.

Referring to fig. 2, a transfer carrier 100 of the present embodiment includes a substrate 1, a first photoresist layer 2, and an expansion material 3. Wherein the substrate 1 is light permeable and comprises a first surface 11 and a second surface 12 opposite to each other. The second surface 12 is covered by a first photoresist layer 2, and the first photoresist layer 2 has a plurality of through holes 20 (see fig. 6 (c)) penetrating through the thickness thereof. The swelling material 3 has a viscosity for adhering the chip 5, and the swelling material 3 fills the corresponding through hole 20 and swells when irradiated by the laser 7, thereby pushing the chip 5 to the PCB/another carrier board 6 located therebelow (see (c) in fig. 5).

The transfer carrier plate 100 of the present invention will be described in detail with reference to fig. 2 to 6.

Referring to fig. 2 and 3, fig. 2 and 3 show two different embodiments of the through hole 20, respectively. In the embodiment shown in fig. 2, the diameter of the through holes 20 is made larger (slightly smaller than the chip 5 to be adhered), and the expansion material 3 in each through hole 20 is used for adhering a chip 5. In the embodiment shown in fig. 3, the diameter of the through holes 20 is made smaller, the swelling material 3 in three through holes 20 is cooperatively adhered to one chip 5, and the distance between three through holes 20 cooperatively adhered to the same chip 5 is smaller than the distance between the three through holes 20 and other through holes 20.

Incidentally, the depth of the through hole 20 is not limited, and may be the thickness of the chip 5 or a multiple of the thickness of the chip 5. The aperture size of the through hole 20 is not limited, and the through hole 20 may be a straight hole or may have a wider side and a narrower side.

Wherein, when the expandable material 3 is in a normal state (an expanded state without laser irradiation), one end (an angle shown in the drawing is taken as an example, the lower end of the expandable material 3) of the expandable material 3 facing away from the second surface 12 can be an outward protruding through hole 20 to better adhere the chip 5; of course, the lower end of the swelling material 3 may be flush with the through-hole 20 as long as it can contact the chip 5 to adhere the chip 5.

Referring to fig. 4, in the embodiment shown in fig. 4, the transfer carrier 100 further includes a second photoresist layer 4, the second photoresist layer 4 covers the first surface 11, and the position of the second photoresist layer 4 opposite to the through hole 20 has an opening 40 penetrating through the thickness thereof. By arranging the second photoresist layer 4, the shading effect is better, the light-proof of the area outside the through hole 20 can be further ensured, and the accuracy of chip transfer is improved.

In one embodiment, the intumescent material 3 is a photosensitive or heat sensitive material that swells when irradiated by the laser 7; when the irradiation of the laser light 7 is canceled, the shrinkage is recovered, whereby the transfer carrier 100 can be reused. Specifically, when it is desired to transfer a certain chip 5 onto the PCB/another carrier 6, the expanding material 3 adhering to the chip 5 is irradiated with the laser 7 to expand the expanding material 3 to push the chip 5 onto the PCB/another carrier 6 (as shown in (c) of fig. 5), after the chip 5 is fixed on the PCB/another carrier 6, the expanding material 3 is separated from the chip 5, and the laser irradiation is cancelled to shrink and recover the expanding material 3 (as shown in (d) of fig. 5).

Incidentally, the laser light source used may be UV light or IR light as long as the wavelength of the laser light source corresponds to the wavelength to which the intumescent material 3 is sensitive.

In this embodiment, the substrate 1 is a high-transmittance glass plate, but it should not be limited thereto, and any material having good light transmittance may be used in the specific implementation.

Next, a chip transfer process using the transfer carrier 100 according to an embodiment of the present invention will be described with reference to fig. 5 by taking the embodiment shown in fig. 2 as an example.

First, the chips 5 to be transferred are sequentially adhered to the expansion material 3 filled in the respective through holes 20, as shown in fig. 5 (a); next, aligning the chip 5 on the transfer carrier 100 with the corresponding pad on the PCB/corresponding placement location of another carrier, and aligning the laser source with one of the chips 51 to be transferred, as shown in fig. 5 (b); next, irradiating the expansion material 31 corresponding to the chip 51 from the first surface side of the substrate 1 by using the laser 7, so that the expansion material 31 expands to push the chip 51 to be in contact with a corresponding pad on the PCB/a corresponding placement site of another carrier board, as shown in fig. 5 (c); next, the laser light source is aligned with the next chip 52 to be transferred, as shown in fig. 5 (d); next, irradiating the expansion material 32 corresponding to the chip 52 from the first surface side of the substrate 1 by using the laser 7, so that the expansion material 32 expands to push the chip 52 to be in contact with a corresponding pad on the PCB/a corresponding placement site of another carrier board, as shown in fig. 5 (e); for the transfer of other chips, and so on.

In some embodiments, the chips on the transfer carrier 100 may be transferred to another carrier and then transferred for a second time, in which the reference numeral 6 is another carrier, and the separation of the chips 51 and the expansion material 31 may be performed after the chips 31 are bonded and fixed to another carrier 6 (as shown in fig. 5 (d)), or after all the chips to be transferred on the transfer carrier 100 are bonded and fixed to another carrier 6, the

chips

51, 52, etc. are uniformly peeled off from the transfer carrier 100. In some embodiments, the chips on the transfer carrier 100 may be transferred to a PCB board, in which case the reference numeral 6 is the PCB board, and the detachment of the chip 51 from the expansion material 31 is after the

chips

51, 52, etc. are all soldered to the corresponding pads on the PCB board 6.

Incidentally, in some embodiments, a plurality of laser light sources may be provided, and the expansion materials 3 corresponding to the laser light sources are respectively irradiated by the laser light sources, so as to simultaneously push the plurality of chips 5 to be attached to the corresponding placement positions of the other carrier 6, thereby achieving efficient chip transfer. For example, the two laser light sources irradiate the

expansion materials

31 and 32 simultaneously, and the

chips

51 and 52 are pushed to be attached to the corresponding positions of the other carrier 6.

Next, a manufacturing process of the transfer carrier 100 according to an embodiment of the present invention will be described with reference to fig. 6 by taking the embodiment shown in fig. 2 as an example.

First, a substrate 1 with high light transmittance is provided, as shown in fig. 6 (a); next, a first photoresist layer 2 is disposed on the second surface 12 of the substrate 1, as shown in fig. 6 (b); then, opening a plurality of through holes 20 penetrating the first photoresist layer 2, as shown in fig. 6 (c); then, filling the expansion material 3 into each through hole 20, as shown in fig. 6 (d), wherein the expansion material 3 may be flush with the lower end of the through hole 20, i.e. flush with the lower surface of the first photoresist layer 2, or may slightly protrude outward from the through hole 20, i.e. outward beyond the lower surface of the first photoresist layer 2; finally, the procedures of baking, surface finish polishing and the like are carried out, and the transfer carrier plate 100 is obtained.

Referring now to fig. 7, fig. 7 shows another embodiment of a transfer carrier 100. fig. 7 shows a transfer carrier 100 comprising a substrate 1, a first photoresist layer 2, an expandable material 3 and an adhesive layer 8. Wherein the substrate 1 is light permeable and comprises a first surface 11 and a second surface 12 opposite to each other. The second surface 12 is covered by a first photoresist layer 2, and the first photoresist layer 2 has a plurality of through holes 20 (see fig. 6 (c)) penetrating through the thickness thereof. The adhesive layer 8 covers the surface of the first photoresist layer 2 away from the substrate 1 for adhering the chip 5. The intumescent material 3 fills the corresponding through hole 20 and expands to push the adhesive layer 8 outwards when irradiated by the laser 7, so that the corresponding part of the adhesive layer 8 bulges, thereby pushing the corresponding chip 5 on the adhesive layer 8 to the PCB/another carrier board 6 located therebelow (see (c) in fig. 5).

Unlike the embodiment shown in fig. 1 to 6, in this embodiment, the die 5 is adhered by disposing the adhesive layer 8 on the side of the first photoresist layer 2 away from the substrate 1, the expandable material 3 may be sticky or non-sticky, and the rest of the structures (such as the second photoresist layer 4, the through holes 20, etc.), the die transferring process of the transfer carrier 100, etc. can refer to the foregoing description and will not be described again.

To sum up, the utility model discloses set up first light resistance layer 2 at the second surface 12 of basement 1 to set up the through-hole 20 that runs through its thickness at first light resistance layer 2, through filling expanding material 3 at through-hole 20, when expanding material 3 in through-hole 20 receives laser 7 to shine the inflation, with chip 5 top to the PCB board/another support plate 6 that is located its below, can realize chip 5's accurate transfer. Meanwhile, due to the arrangement of the first photoresist layer 2, the second surface side of the substrate 1 is opaque in the region outside the through hole 20, so that the laser 7 is prevented from being transmitted to the adjacent expansion material 3, and the accuracy of transferring the chip 5 is further improved.

The above disclosure is only a preferred embodiment of the present invention, and the scope of the claims of the present invention should not be limited thereby, and all the equivalent changes made in the claims of the present invention are intended to be covered by the present invention.

Claims

1. A transfer carrier, comprising:

a substrate, light permeable, comprising opposing first and second surfaces;

the first light resistance layer covers the second surface and is provided with a plurality of through holes penetrating through the thickness of the first light resistance layer; and

an expansion material filling the corresponding through hole and expanding when irradiated by the laser.

2. The transfer carrier of claim 1 wherein said intumescent material shrinks and recovers upon the removal of laser light.

3. The transfer carrier of claim 1, wherein the intumescent material is a photosensitive material or a heat sensitive material.

4. The transfer carrier of claim 1 wherein the intumescent material is tacky and the intumescent material is used to adhere the chips.

5. The transfer carrier of claim 4 wherein an end of said intumescent material facing away from said second surface protrudes outwardly from said through hole.

6. The transfer carrier of claim 4 wherein the intumescent material in at least two of said through holes cooperatively adheres to a chip.

7. A transfer carrier as in claim 1 further comprising an adhesive layer overlying a side of said first photoresist layer facing away from said substrate, said adhesive layer for adhering the chip, said intumescent material urging said adhesive layer outwardly upon expansion.

8. The transfer carrier according to any one of claims 1-7 further comprising a second photoresist layer overlying said first surface, said second photoresist layer having an opening through its thickness at a location opposite said through hole.

9. The transfer carrier of claim 1, wherein the substrate is a glass plate.