CN214529306U - Electroplating liquid circulating device - Google Patents
Electroplating liquid circulating device Download PDFInfo
- Publication number
- CN214529306U CN214529306U CN202022734607.6U CN202022734607U CN214529306U CN 214529306 U CN214529306 U CN 214529306U CN 202022734607 U CN202022734607 U CN 202022734607U CN 214529306 U CN214529306 U CN 214529306U
- Authority
- CN
- China
- Prior art keywords
- liquid
- space
- purge
- outlet
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an electroplating solution circulating device, it includes a stock solution device, a work groove, an at least first filter equipment and an at least second filter equipment, wherein the stock solution device have a stock solution space and be linked up in a stock solution export and a stock solution import of stock solution space, wherein the work groove have a workspace and be linked up in a inlet and a liquid outlet of workspace, wherein first filter equipment be linked up in the stock solution device stock solution export with the work groove the inlet, wherein the second filter equipment be linked up in the stock solution device stock solution import with the work groove the liquid outlet, borrow by first filter equipment with the second filter equipment is right the electroplating solution carries out at least twice filtration, and then ensures the purity of electroplating solution.
Description
Technical Field
The utility model relates to an electroplate the field, in particular to plating solution circulating device.
Background
Electroplating refers to the electrolytic reaction in a metal salt solution under the action of direct current, so that a metal layer or an alloy layer is deposited on the surface of an electric conductor such as a metal. For example, in the specific electroplating process, taking the example of forming a copper layer on the surface of the key by using an electroplating process, a metal copper plate is electrically connected to the anode of a power supply, and an electrically conductive iron key is electrically connected to the cathode of the power supply, wherein the metal copper plate and the key are immersed in an electroplating solution (e.g., a copper sulfate solution), under the action of direct current, the cations and the anions in the electroplating solution are regularly moved, the key at the cathode gradually deposits a layer of metal copper, and the metal copper plate at the anode is continuously dissolved to supplement copper ions consumed in the electroplating solution. In this way, the metallic copper connected to the anode is gradually transferred to the surface of the iron key.
The glossiness of the surface of the key is improved by electroplating, and the attractiveness of the key is improved. The common tap, door handle, ornaments and the like in daily life are formed, and a copper plating layer, a nickel plating layer and the like are formed on the surfaces of the tap and the door handle through electroplating by utilizing an electroplating process, or a gold plating layer and a silver plating layer are formed on the surfaces of the ornaments by utilizing the electroplating process, so that the product is attractive, and the value of the product is improved. In addition, the electroplating improves the corrosion resistance of the key, the iron key is easy to oxidize and rust after being exposed in the air for a long time, the use of a user is seriously influenced, and after a zinc coating and a nickel coating are formed by utilizing the electroplating process, the key with the coating can better resist corrosion, so that the service life of the product is prolonged. In addition, the electroplating can also repair damaged parts and form coatings with special performance, such as a reflective silver coating, a conductive silver coating, an anti-reflection black nickel coating and the like. In a word, the electroplating process greatly improves the functionality, the decoration and the protection of products, and the electroplating process plays an important role in daily life and industrial production of people.
In the electroplating process, the purity of the electroplating solution directly affects the electroplating effect and the quality of the plating layer formed on the surface of the workpiece. If solid particles suspended in the plating solution are attached to the surface of the plating layer formed on the surface of the workpiece, problems such as reduced flatness of the plating layer, loss of gloss of the plating layer, and slow light emission may occur, or pinholes, pits, and the like may occur in the plating layer, thereby reducing the corrosion resistance of the plating layer. In addition, in the long-time electroplating process, a lot of impurities are inevitably precipitated in the electroplating solution, and if the concentration of the impurities exceeds the standard, the workpieces are reworked and even scrapped. Therefore, the purity of the plating solution directly affects the performance of the plating and the proper operation of the plating process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electroplating solution circulating device, wherein electroplating solution circulating device is right ordering about the in-process that an electroplating solution circulation flows the electroplating solution carries out twice filtration at least, in order to ensure the purity of electroplating solution.
Another object of the utility model is to provide an electroplating solution circulating device, wherein electroplating solution circulating device is filtering the normal clear of electroplating process is not influenced in the process of electroplating solution, has ensured electroplating process's efficiency.
Another object of the present invention is to provide an electroplating circulation device and an electroplating solution filtering method, wherein the electroplating solution circulation device includes a working tank, a plating metal and a workpiece connected to an anode and a cathode of a power supply are disposed in the electroplating solution in the working tank, after a chemical reaction, a plating layer is formed on the surface of the workpiece, wherein the electroplating solution in the working tank is always maintained at a standard liquid level, so as to improve the uniformity of the plating layer.
Another object of the present invention is to provide an electroplating solution circulating device, wherein the electroplating circulating device includes at least two filters, one of them the filter is to getting into before a work space of work groove the electroplating solution filters, another the filter is right the work groove flow out in the work space the electroplating solution filters, improves through twice filterable mode at least the purity of electroplating solution, and then the guarantee the quality of cladding material.
Another object of the present invention is to provide a plating solution circulating device, wherein the plating solution circulating device the work tank has an overflow port, wherein the overflow port is communicated with the work space, wherein the overflow port is located the upper portion of the work tank, by the overflow port definition the work tank in the plating solution the standard liquid level surpasses the standard liquid level the plating solution certainly the overflow port flows out, in order to ensure the work tank in the plating solution can be kept in the standard liquid level all the time.
Another object of the present invention is to provide an electroplating solution circulating device, wherein the electroplating solution circulating device includes a transition groove, wherein a solution containing space of the transition groove is communicated with the overflow port, the working space is internally provided with the standard liquid level, and the electroplating solution enters from the overflow port to the transition groove, and the electroplating solution is in the transition groove to carry out secondary filtration in the containing space.
Another object of the present invention is to provide an electroplating solution circulating device, wherein the electroplating solution circulating device further comprises a liquid storage device, wherein an inlet and an outlet of the liquid discharge device are respectively communicated with two filtering devices, from the liquid storage device enters into the working tank, the electroplating solution in the working space flows to the working space in the liquid storage device, the electroplating solution is filtered and processed, which is favorable for ensuring, the liquid storage device is filled with the electroplating solution, and the electroplating solution is purified.
Another object of the present invention is to provide an electroplating solution circulating device, wherein the electroplating solution circulating device further comprises a purifying device, wherein the purifying device is communicated with the liquid storage device, wherein the purifying device is right for containing the electroplating solution in the liquid storage device to purify and further ensure the purity of the electroplating solution in the liquid storage device.
Another object of the present invention is to provide an electroplating solution circulating device, wherein the electroplating solution is continuously pumped into the working tank, the electroplating solution flows into the working tank, the electroplating solution is in a flowing state, which is favorable for accelerating the movement speed of ions in the electroplating solution in the working tank, and further reducing the concentration gradient of the electroplating solution in the working tank, and further reducing the polarization of the electroplating solution, and accelerating the current efficiency and the electroplating efficiency.
According to an aspect of the utility model, the utility model provides an electroplating solution circulating device, it is applicable to and carries an electroplating solution, electroplating solution circulating device includes:
the liquid storage device is provided with a liquid storage space, a liquid storage outlet and a liquid storage inlet which are communicated with the liquid storage space;
the working groove is provided with a working space, and a liquid inlet and a liquid outlet which are communicated with the working space;
at least one first filtering device, wherein the first filtering device is arranged between the liquid storage device and the working tank, and the first filtering device is communicated with the liquid storage outlet of the liquid storage device and the liquid inlet of the working tank; and
at least one second filtering device, wherein the second filtering device is arranged between the liquid storage device and the working tank, and the second filtering device is communicated with the liquid storage inlet of the liquid storage device and the liquid outlet of the working tank.
According to an embodiment of the invention, the working channel has an overflow opening, wherein the overflow opening is connected to the working space of the working channel, by means of which a standard liquid level is defined.
According to an embodiment of the present invention, the plating solution circulating means further comprises a transition tank, wherein the transition tank has a liquid containing space, a transition inlet and a transition outlet, wherein the transition inlet and the transition outlet are communicated with the liquid containing space, the overflow port of the working tank is communicated with the overflow port of the transition tank.
According to an embodiment of the present invention, the plating solution circulating means further comprises a liquid level detecting means, wherein the liquid level detecting means is provided in the liquid containing space of the transition tank, the liquid level detecting means is communicably connected to the second filtering means.
According to an embodiment of the present invention, the plating solution circulating device further includes a purifying device, wherein the reservoir device has a purifying outlet and a purifying inlet, wherein the purifying outlet and the purifying inlet are communicated with the reservoir space of the reservoir device, wherein the purifying device is communicated with the purifying outlet and the purifying inlet of the reservoir device.
According to the utility model discloses an embodiment, the purification export set up in purifier's upper portion, purifier will stock solution device stock solution space in the plating solution take out from bottom to top.
According to an embodiment of the invention, the purification outlet is arranged in the bottom of the purification device.
According to an embodiment of the invention, the purification inlet is arranged in the upper part or the bottom of the purification device.
According to an embodiment of the invention, the first filter device, the second filter device and the purification device are implemented as a filter.
According to an embodiment of the invention, the liquid level detection device is implemented as a liquid level meter or a sensor.
Drawings
Fig. 1 is a schematic diagram of a structure of an electroplating apparatus according to a preferred embodiment of the present invention.
FIG. 2 is a schematic view showing the application of the electroplating apparatus according to the above preferred embodiment of the present invention.
FIG. 3 is a schematic view showing the application of the electroplating apparatus according to the above preferred embodiment of the present invention.
FIG. 4 is a schematic view showing the application of the electroplating apparatus according to the above preferred embodiment of the present invention.
FIG. 5 is a schematic view showing the application of the electroplating apparatus according to the above preferred embodiment of the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purposes of limitation.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
Referring to fig. 1 to 5, an electroplating solution circulating apparatus 100 according to a preferred embodiment of the present invention will be described in the following description, wherein the electroplating solution circulating apparatus 100 filters an electroplating solution at least twice during a process of driving the electroplating solution to circulate, thereby ensuring the purity of the electroplating solution and avoiding affecting the quality and performance of a plating layer formed on a workpiece surface during electroplating.
Specifically, the electroplating cycle apparatus 100 further comprises a working tank 10, at least one first filter device 20, at least one second filter device 30 and a liquid storage device 40, wherein the working tank 10 has a working space 101 and a liquid inlet 102 and a liquid outlet 103 communicated with the working space 101, and the liquid outlet device 40 has a liquid storage space 401 and a liquid storage inlet 402 and a liquid storage outlet 403 communicated with the liquid storage space. The first filter device 20 is disposed between the reservoir outlet 403 of the reservoir device 40 and the inlet 102 of the working tank 10, and the first filter device 20 is communicated with the reservoir outlet 403 of the reservoir device 40 and the inlet 102 of the working tank 10. The second filtering device 30 is disposed between the liquid inlet 402 of the liquid storage device 40 and the liquid outlet 103 of the working tank 10, and the second filtering device 30 is communicated with the liquid inlet 402 of the liquid storage device 40 and the liquid outlet 103 of the working tank 10.
Referring to fig. 2, at least one first filter device 20 pumps the plating solution in the reservoir space 401 of the reservoir device 40 into the working space 101 of the working tank 10, and the first filter device 20 filters the plating solution during the delivery of the plating solution. The filtered electroplating solution flows into the working space 101 from the liquid inlet 102 of the working tank 10, and the electroplating solution is filtered at least once before entering the working space 101, so that the purity of the electroplating solution entering the working space 101 of the working tank 10 is guaranteed.
A plated metal electrically connected to an anode of a power source and a work electrically connected to a cathode of the power source are held in the working space 101 of the working tank 10, respectively, and the work and the plated metal are held in the plating solution. Under the action of the DC current, the positive and negative ions in the plating solution move regularly, a plating layer is formed on the surface of the workpiece gradually, and the plating metal is dissolved in the plating solution continuously to replenish the ions consumed in the plating solution, so that the plating metal connected to the anode of the power supply is transferred to the surface of the workpiece gradually.
It should be noted that the specific embodiments of the workpiece, the plating layer and the plating metal are not limited, the workpiece may be implemented by metals such as iron, copper, silver and the like and metal products thereof, and the plating metal may be implemented by metals such as copper, silver, gold, nickel, chromium and the like, and copper plating, silver plating, gold plating, nickel plating, chromium plating and the like are correspondingly formed.
Preferably, the first filtering device 20 pumps the electroplating solution in the storage space 401 of the storage device 40 into the working space 101 of the working tank 10 from a direction away from the workpiece, so as to prevent the electroplating solution entering the working space 101 from impacting the coating formed on the surface of the workpiece, thereby affecting the uniformity and quality of the coating formed on the surface of the workpiece. More preferably, the plating solution flows into the working space 101 of the working tank 10 from the outlet of the first transition device 20 along an arc direction in a direction away from the workpiece.
In this particular embodiment of the plating circulation apparatus 100 of the present invention, the plating liquid in the working space 101 of the working tank 10 of the plating circulation apparatus 100 can be maintained at a standard level. On one hand, when the workpieces in the same batch are electroplated, the liquid level of each workpiece which can be immersed into the electroplating liquid is the same all the time, and uniformity of the coating formed on the workpieces in the same batch is facilitated. On the other hand, different batches of workpieces are also placed in the electroplating solution at the same standard liquid level, which is beneficial to ensuring the uniformity of the plating layers formed on the surfaces of the workpieces in different batches.
Referring to fig. 3, in particular, the working tank 10 further has an overflow port 104, wherein the overflow port 104 is communicated with the working space 101. The overflow port 104 is formed in the upper part of the working tank 10, and the standard level of the plating solution in the working space 101 of the working tank 10 is defined by the height of the overflow port 104. When the plating solution in the working space 101 of the working tank 10 reaches the standard level, the plating solution flows out from the overflow port 104 to maintain the plating solution in the working tank 10 at the standard level. Further, the overflow port 104 can prevent the plating liquid in the working space 101 of the working vessel 10 from overflowing to contaminate the working environment.
Further, the plating circulation equipment 100 includes a transition tank 50, wherein the transition tank 50 has a liquid containing space 501 and a transition inlet 502 and a transition outlet 503 which are communicated with the liquid containing space 501, and wherein the overflow 104 is communicated with the liquid containing space 501 of the transition tank 50 and the working space 101 of the working tank 10. Once the plating liquid level in the working space 101 of the working tank 10 reaches the overflow 104, the plating liquid flows out from the overflow 104 and flows into the liquid holding space 501 of the transition tank 50.
The second filtering device 30 is disposed between the transition tank 50 and the liquid storage device 40, and the second filtering device 30 is communicated with the liquid containing space 501 of the transition tank 50 and the liquid outlet 402 of the liquid storage device 40. The plating liquid flowing into the liquid containing space 501 of the transition tank 50 from the overflow port 104 passes through the second filter device 30 and then enters the liquid storage device 40. Specifically, the second filtering device 30 pumps the plating solution in the solution containing space 501 of the transition tank 50 into the solution storage space 401 of the solution storage device 40, and the second filtering device 30 filters the plating solution during the process of delivering the plating solution, so as to ensure the purity of the plating solution flowing into the solution storage device 40 and avoid contamination of the plating solution in the solution storage device 40. Therefore, the electroplating solution is filtered at least twice by the first filtering device 20 and the second filtering device 30, so that the purity of the electroplating solution is improved, and the quality of the plating layer is guaranteed.
Preferably, the first filter device 20 continuously pumps the plating solution in the reservoir space 401 of the reservoir device 40 into the working space 101 of the working tank 10, and the plating solution in the working space 101 of the working tank 10 continuously flows from the overflow port 104 into the solution space 501 of the transition tank 50, so that the plating solution in the working space 101 is always in motion. On the other hand, the continuous inflow of the plating liquid can reduce the concentration gradient of the plating liquid in the work space 101, thereby reducing the plan of the plating liquid, and further improving the current efficiency and the plating efficiency. On the other hand, the electroplating solution is in a motion state continuously, which is beneficial to preventing impurities in the electroplating solution from depositing at the bottom of the working tank 10, and further improves the filtering effect of the electroplating solution circulating device 100.
Referring to fig. 4, in this particular embodiment of the present invention, the plating liquid circulating apparatus 100 further comprises a liquid level detecting device 60, wherein the liquid level detecting device 60 is disposed in the passing space 501 of the transition tank 50, and the liquid level detecting device 60 is communicably connected to the second filtering device 30. The liquid level detection device 60 detects the electroplating solution in the transition space 501 of the transition groove 50, when the liquid level of the electroplating solution in the transition space 501 reaches a preset liquid level, the liquid level detection device 60 controls the second filtering device 30 to pump the electroplating solution in the transition space 501 into the liquid storage device 40, and meanwhile, the second filtering device 30 filters the conveyed electroplating solution. That is, the second filtering means 30 may be operated only when the plating solution stored in the transition space 501 of the transition tank 50 reaches a certain level, and the second filtering means 30 may be operated in a standby state when the plating solution stored in the transition space 501 of the transition tank 50 does not reach the preset level. In this way, not only can the efficiency of delivering the plating solution be improved, but also the saving of electric energy is facilitated.
Alternatively, in another specific example of the present invention, the second filtering device 30 may also be implemented to continuously work, once the electroplating solution in the working space 101 of the working tank 10 overflows to the transition space 501 of the transition tank 50, the second filtering device 30 filters the electroplating solution in time and pumps the electroplating solution into the storage device 40 to avoid the electroplating solution staying in the transition space 501 of the transition tank 50 for too long to generate precipitation at the bottom of the transition tank 50. It should be understood by those skilled in the art that the embodiment of the second filter 30 is exemplary only and should not be construed as limiting the scope and content of the plating solution circulating device 100 of the present invention.
It should be noted that the specific implementation of the first filtering device 20, the second filtering device 30 and the liquid level detecting device 60 is not limited, for example, but not limited to, the first filtering device 20 and the second filtering device 30 are implemented as filters, and the liquid level detecting device 60 is implemented as a liquid level meter or a sensor. Although in this particular embodiment of the present invention, the first filter device 20 and the second filter device 30 are implemented as one, in other embodiments of the present invention, the second filter device 20 and the second filter device 30 may be implemented as two or more than two. That is, the plating solution in the reservoir unit 40 is filtered by at least two first filter units 20 and then flows into the working space 101 of the working tank 10, and the plating solution in the working space 101 of the working tank 10 is filtered by at least two second filter units and then flows into the reservoir unit 40. The first filter device 20 and the second filter device 30 are added to improve the filtering efficiency of the plating solution circulation device 100, thereby further improving the purity of the plating solution.
Referring to FIG. 5, in this particular embodiment of the plating solution circulation device 100 of the present invention, the plating solution circulation device 100 further includes a purification device 70, wherein the purification device 70 is disposed in the reservoir device 40, wherein the purification device 70 filters and purifies the plating solution in the reservoir space 401 of the reservoir device 40, further improving the purity of the plating solution in the reservoir space 401 of the reservoir device 40.
Specifically, the reservoir 40 further has a purge outlet 404 and a purge inlet 405, wherein the purge inlet 404 and the purge outlet 405 are in communication with the reservoir 401. The purge device 70 is disposed between the purge outlet 404 and the purge inlet 405 of the reservoir 40, and the purge device 70 is in communication with the purge outlet 404 and the purge inlet 405 of the reservoir 40. The plating solution in the reservoir space 401 of the reservoir device 40 is pumped out through the purge outlet 404 by the purge device 70, and the plating solution is pumped into the reservoir space 401 through the purge inlet 405 by the purge device 70 after passing through the purge device 70. The purifying device 70 filters the plating solution during the process of delivering the plating solution, so as to ensure the purity of the plating solution in the storage space 401 of the storage device 40.
It should be noted that the purifying device 70 continuously pumps the plating solution in the reservoir space 401 of the reservoir device 40 out of the purifying outlet 404 and then into the purifying inlet 405, so that the plating solution in the reservoir space 401 is always in a flowing state, which is beneficial to preventing impurities in the plating solution from precipitating during the static process of the plating solution, and further improving the filtering effect of the plating solution circulating device.
The utility model discloses a this concrete embodiment, purify export 404 with purify entry 405 set up in the upper portion of stock solution device 40, purifier 70 will stock solution device 40 in the stock solution space 401 the plating solution is taken out from bottom to top, is favorable to depositing in the impurity of stock solution space 401 bottom is taken out in the lump, will filter again the plating solution top-down ground pump is gone into stock solution space 401, and then improves in the stock solution space 401 the purity of plating solution.
Preferably, the purge outlet 404 is disposed at an upper portion of the reservoir device 40, the purge inlet 405 is disposed at a bottom portion of the reservoir device, and the purge device 70 pumps the plating solution in the reservoir space 401 of the reservoir device 40 from bottom to top, and then pumps the filtered plating solution into the reservoir space 401 from the bottom portion of the reservoir device 40, so that the plating solution is in a churning state, which is not only beneficial to preventing impurities in the plating solution from precipitating, but also reduces the concentration gradient of the plating solution.
Preferably, the purge outlet 404 is disposed at the bottom of the reservoir 40 and the purge inlet 405 is disposed at the top of the reservoir. Thus, the electroplating solution at the bottom of the storage space 401 of the storage device 40 is pumped away by the purification device 70 and then pumped into the storage space 40 from the upper part of the storage device 40, so that the electroplating solution in the storage space 401 of the storage device 40 continuously flows from top to bottom, the concentration gradient of the electroplating solution in the storage space 401 is favorably reduced, the uniformity of the electroplating solution is improved, and the current efficiency and the electroplating efficiency in the subsequent electroplating process are favorably ensured.
It should be noted that the embodiments of the purge outlet 404 and the purge inlet 405 are not limited, nor are the embodiments of the purge apparatus 70 limited, and that the descriptions in the text and drawings are provided as examples only and should not be construed as limiting the scope and content of the plating solution circulation apparatus 100 of the present invention.
According to another aspect of the present invention, there is provided a method for filtering an electroplating solution, wherein the method for filtering an electroplating solution comprises the steps of:
(a) filtering the plating solution flowing from the reservoir device 40 into the working space 101 of the working tank 10 by at least one first filter device 20; and
(b) the plating liquid flowing from the working space 101 of the working tank 10 to the reservoir space 401 of the reservoir device 40 is filtered by at least one second filter device 30.
Specifically, in step (a), the first filtering device 20 continuously pumps the plating solution in the reservoir space 401 of the reservoir device 40 into the working space 101 of the working tank 10, and the flowing plating solution facilitates reducing the concentration gradient. Further, the first and second filtering devices 20 and 30 filter the plating solution during transportation of the plating solution.
In this particular embodiment of the present invention, in the step (b), the plating solution in the working space 101 of the working tank 10 is maintained at the standard level. Specifically, in the above method, the plating liquid in the working space 101 reaches the overflow port 104 of the working tank 10, and then overflows from the overflow port 104 to the liquid holding space 501 of the transition tank 50.
Further, in the above method, the liquid level of the plating solution in the solution containing space 501 of the transition tank 50 is detected by the liquid level detecting device 60, and the liquid level detecting device 60 controls the second filtering device 30 to pump the plating solution in the solution containing space 501 of the transition tank 50 into the solution storage space 401 of the solution storage device 40 according to the detection result.
Preferably, after the liquid level detection device 60 detects that the plating solution reaches the preset liquid level, the liquid level detection device 60 controls the second filtering device 30 to pump the plating solution in the solution containing space 501 of the transition tank 50 into the solution storage space 401 of the solution storage device 40. Alternatively, once the liquid level detection device 60 detects the presence of the plating liquid in the liquid containing space 501 of the transition tank 50, the liquid level detection device 60 controls the second filter device 30 to pump the plating liquid in the liquid containing space 501 of the transition tank 50 into the liquid storage space 401 of the liquid storage device 40.
In one embodiment of the present invention, the plating solution filtering method further includes the step (c) of filtering the plating solution in the reservoir space 401 of the reservoir device 40 by the purifying device 70 communicated with the purifying outlet 404 and the purifying inlet 405 of the reservoir device 40. It is worth mentioning that the steps (a), (b) and (c) have no sequential limitation, and the steps (a), (b) and (c) can be performed simultaneously.
Specifically, the purification device 70 pumps the plating solution from the reservoir space 401 of the reservoir device 40 from the bottom up, and pumps the plating solution from the bottom up into the reservoir space 401 after the plating solution is filtered. Alternatively, the purification device 70 pumps the plating solution in the reservoir space 401 of the reservoir device 40 from bottom to top and pumps the plating solution into the reservoir space 401 from top to bottom after the plating solution is filtered. Alternatively, the purging device 70 draws the plating solution from the reservoir space 401 of the reservoir device 40 from the bottom and pumps the plating solution into the reservoir space 401 after filtration.
It will be appreciated by persons skilled in the art that the above embodiments are only examples, wherein features of different embodiments may be combined with each other to obtain embodiments which are easily imaginable in accordance with the disclosure of the invention, but which are not explicitly indicated in the drawings.
It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.
Claims (10)
1. An electroplating solution circulating device, suitable for conveying an electroplating solution, characterized in that the electroplating solution circulating device comprises:
the liquid storage device is provided with a liquid storage space, a liquid storage outlet and a liquid storage inlet which are communicated with the liquid storage space;
the working groove is provided with a working space, and a liquid inlet and a liquid outlet which are communicated with the working space;
at least one first filtering device, wherein the first filtering device is communicated with the liquid storage outlet of the liquid storage device and the liquid inlet of the working tank; and
at least one second filtering device, wherein the second filtering device is communicated with the liquid storage inlet of the liquid storage device and the liquid outlet of the working tank.
2. The plating solution circulating apparatus as claimed in claim 1, wherein the working tank has an overflow port, wherein the overflow port is connected to the working space of the working tank, and a standard level is defined by the overflow port.
3. The plating solution circulation arrangement as recited in claim 2 further comprising a transition tank, wherein the transition tank has a fluid holding volume, a transition inlet and a transition outlet, wherein the transition inlet and the transition outlet are in communication with the fluid holding volume and the overflow outlet of the working tank is in communication with the overflow outlet of the transition tank.
4. The plating liquid circulation device as claimed in claim 3, further comprising a liquid level detection device, wherein the liquid level detection device is provided in the liquid holding space of the transition tank, the liquid level detection device being communicably connected to the second filtration device.
5. The plating solution circulation device as recited in claim 4, further comprising a purge device, wherein the reservoir device has a purge outlet and a purge inlet, wherein the purge outlet and the purge inlet are in communication with the reservoir space of the reservoir device, and wherein the purge device is in communication with the purge outlet and the purge inlet of the reservoir device.
6. The plating liquid circulating apparatus as claimed in claim 5, wherein the purge outlet is provided at an upper portion of the purge device, and the purge device draws out the plating liquid in the reservoir space of the reservoir device from below to above.
7. The plating solution circulating apparatus as claimed in claim 5, wherein the purge outlet is provided at a bottom of the purge apparatus.
8. The plating solution circulating apparatus according to claim 5, wherein the purge inlet is provided at an upper portion or a bottom portion of the purge apparatus.
9. The plating solution circulating apparatus as claimed in claim 5, wherein said first filtering means, said second filtering means and said purifying means are implemented as a filter.
10. The plating solution circulating apparatus as claimed in claim 4, wherein said liquid level detecting means is implemented as a liquid level meter or a sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022734607.6U CN214529306U (en) | 2020-11-23 | 2020-11-23 | Electroplating liquid circulating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022734607.6U CN214529306U (en) | 2020-11-23 | 2020-11-23 | Electroplating liquid circulating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214529306U true CN214529306U (en) | 2021-10-29 |
Family
ID=78289061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022734607.6U Active CN214529306U (en) | 2020-11-23 | 2020-11-23 | Electroplating liquid circulating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214529306U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114438573A (en) * | 2022-03-01 | 2022-05-06 | 中国原子能科学研究院 | Electroplating system |
| CN114525574A (en) * | 2020-11-23 | 2022-05-24 | 余姚市爱迪升电镀科技有限公司 | Plating solution circulating device and plating solution filtering method |
-
2020
- 2020-11-23 CN CN202022734607.6U patent/CN214529306U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114525574A (en) * | 2020-11-23 | 2022-05-24 | 余姚市爱迪升电镀科技有限公司 | Plating solution circulating device and plating solution filtering method |
| CN114438573A (en) * | 2022-03-01 | 2022-05-06 | 中国原子能科学研究院 | Electroplating system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214529306U (en) | Electroplating liquid circulating device | |
| CN101397691B (en) | Apparatus and technology for controlling and improving plating solution PH value on fingerprint resistant production chain | |
| JP2008506035A (en) | Chrome plating method | |
| CH710741A2 (en) | Ecological procedure for continuous chrome plating of bars and relative equipment. | |
| CN111850670A (en) | Electrolytic stripping solution for steel electroplating hanger and stripping method | |
| CN101648758A (en) | Electroplating recession water processing and Ni-Cu recovering process | |
| CN115466957A (en) | A method and device for electrolytic regeneration of copper by precipitation of acidic copper chloride etching waste liquid | |
| CN114525574A (en) | Plating solution circulating device and plating solution filtering method | |
| Snyder | Decorative chromium plating | |
| CN203486944U (en) | Online electro-deposition device for metal waste water | |
| CN106865816A (en) | A kind of chemical nickel plating cleans waste water online resource method | |
| CN203419996U (en) | Electroforming equipment | |
| US5716509A (en) | Process and device for the electrolytic surface coating of workpieces | |
| CN111826690B (en) | Formula and process of vertical high-speed continuous tin plating solution | |
| CN217069899U (en) | Workpiece water circulation flushing device of electroplating equipment | |
| CN1952217B (en) | Process for applying waste and old zinc to continuous zinc coating of steel plate | |
| CN116685721A (en) | Optimization process and device for insoluble anodic acidic sulfate electroplated copper | |
| CN210458419U (en) | Electroplating device capable of improving ion concentration of electrolyte | |
| CN114016119B (en) | Electroplating bath solution comprehensive management device | |
| CN1455027A (en) | Combined-box plating apparatus of crystallizer copper plate for continuous caster | |
| CN207391573U (en) | The device that various heavy separates and recovers simultaneously in a kind of electroplating wastewater | |
| CN219239828U (en) | Roll-to-roll electroplating noble metal silver recovery device | |
| CN221421247U (en) | Electroplating station electroplating liquid external circulation device | |
| CN212865035U (en) | Electrogalvanizing zinc dissolving application equipment | |
| CN214627511U (en) | Regeneration device for prolonging service life of pickling tank of PCB factory |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |