CN214502746U - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
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- CN214502746U CN214502746U CN202120939898.4U CN202120939898U CN214502746U CN 214502746 U CN214502746 U CN 214502746U CN 202120939898 U CN202120939898 U CN 202120939898U CN 214502746 U CN214502746 U CN 214502746U
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Abstract
The utility model discloses a pressure sensor, which comprises a PCB (printed circuit board), a wafer and a stainless steel diaphragm assembly, wherein the PCB comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a signal output pin; the wafer is arranged on the second surface; the stainless steel diaphragm assembly comprises a stainless steel shell and a stainless steel diaphragm arranged inside the stainless steel shell, the stainless steel shell is sleeved on the wafer and is in sealing connection with the second surface through tin, the stainless steel diaphragm divides the space inside the stainless steel shell into a first cavity and a second cavity, the wafer is located in the first cavity, and a pressure conduction medium is filled inside the first cavity; the stainless steel shell is hermetically connected with the PCB through tin, so that the pressure sensor has high shearing strength, high pressure resistance, high overload capacity and low possibility of damage; compared with a rubber diaphragm or a plastic diaphragm, the stainless steel diaphragm has the advantages of better medium compatibility and stability, difficult aging, high transmission efficiency and strong long-term reliability.
Description
Technical Field
The utility model relates to a in forced induction device technical field, especially relate to a pressure sensor.
Background
A Pressure Transducer is a device or apparatus that senses a Pressure signal and converts the Pressure signal into a usable output electrical signal according to a certain rule. The pressure sensor is the most common sensor in industrial practice, is widely applied to various industrial automatic control environments, and relates to a plurality of industries such as water conservancy and hydropower, railway traffic, intelligent buildings, production automatic control, aerospace, military industry, petrochemical industry, oil wells, electric power, ships, machine tools, pipelines and the like. At present, the existing pressure sensor is easy to damage in the using process, so that the reliability is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a pressure sensor, have higher reliability.
An embodiment of the utility model provides a pressure sensor, include:
the PCB comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a signal output pin;
the wafer is arranged on the second surface;
stainless steel diaphragm assembly, stainless steel diaphragm assembly includes the stainless steel casing and sets up the inside stainless steel diaphragm of stainless steel casing, the stainless steel casing cover is located the wafer and with the second surface passes through tin sealing connection, the stainless steel diaphragm will the inside space of stainless steel casing is cut apart into first cavity and second cavity, the wafer is located first cavity, the inside packing of first cavity has pressure conduction medium.
According to the utility model discloses pressure sensor who provides has following beneficial effect at least: the PCB is directly used as a supporting plate, a wafer is arranged on the second surface of the PCB, the stainless steel shell is sleeved on the wafer and is in sealing connection with the second surface through tin, namely the PCB seals a first cavity of the stainless steel shell, a pressure conducting medium is filled in the sealed first cavity, a medium to be measured in pressure extrudes a stainless steel diaphragm from the second cavity, then the pressure is transmitted to the wafer through the pressure conducting medium, and the wafer outputs a pressure signal from a signal output pin after measuring the pressure signal; the stainless steel shell is hermetically connected with the PCB through tin, so that the pressure sensor has high shearing strength, high pressure resistance, high overload capacity and low possibility of damage; compared with a rubber diaphragm or a plastic diaphragm, the stainless steel diaphragm has the advantages of better medium compatibility and stability, difficult aging, high transmission efficiency and strong long-term reliability.
In the pressure sensor, the pressure sensor further comprises a protective cover arranged in the first cavity, the wafer is sleeved with the protective cover, and a first through hole for the circulation of the pressure conduction medium is formed in the protective cover.
Through at the inside safety cover that sets up of first cavity, the wafer is located to the safety cover, can play the guard action to the wafer, and in addition, the safety cover also can play the limited effect to the deformation of stainless steel diaphragm, when the pressure of the medium of measuration pressure is greater than pressure sensor's range, can play the supporting role to the stainless steel diaphragm, avoids the excessive deformation of stainless steel diaphragm to lead to damaging, has higher reliability.
In the pressure sensor, the wafer is adhered to the center of the second surface, and the first through hole is arranged corresponding to the wafer.
The wafer is stuck to the center position of the second surface, and the pressure from all directions can be sensed more uniformly; the position of the first through hole corresponds to the wafer, and when the stainless steel diaphragm deforms, the pressure conducting medium in the first chamber can circulate through the first through hole, so that pressure is directly transmitted to the wafer.
In the above pressure sensor, the protective cover includes a third surface parallel to the stainless steel diaphragm, and the third surface is spaced from the stainless steel diaphragm by a first preset distance.
When the pressure of the medium to be measured is large, the stainless steel diaphragm can generate large deformation, if the deformation amplitude of the stainless steel diaphragm is larger than the first preset distance, the stainless steel diaphragm can support the third surface, the third surface of the protective cover plays a supporting role for the stainless steel diaphragm, and the stainless steel diaphragm is prevented from being excessively deformed and damaged.
In the pressure sensor, the PCB is provided with a second through hole for injecting the pressure conductive medium, the second through hole is communicated to the first chamber, and the second through hole is blocked by tin.
Through set up the second through-hole on the PCB board, can get up PCB board and stainless steel casing through tin sealing connection earlier, rethread second through-hole toward the inside pressure conduction medium that pours into of first chamber into, can realize the high vacuum and pour into the pressure conduction medium to make the inside precompression that does not have of first chamber, make pressure sensor have higher measurement accuracy.
In the pressure sensor, the PCB is printed with a temperature-sensitive resistor.
The temperature sensing resistor is printed on the PCB, so that the temperature can be directly measured or the temperature can be compensated for the pressure sensor. It is understood that the temperature-sensitive resistor may be printed on either the first surface or the second surface.
In the above pressure sensor, a width of the tin seal between the stainless steel case and the PCB board is larger than a width of the joint surface.
The width of the tin seal between the stainless steel shell and the PCB is larger than that of the joint surface, so that the connection strength between the stainless steel shell and the PCB can be enhanced, and the reliability of the pressure sensor is improved.
In the pressure sensor, the outer wall of the stainless steel shell is provided with an annular groove for placing the sealing ring.
In the above pressure sensor, the stainless steel diaphragm is provided with an annular convex groove that is convex toward the second chamber.
In the pressure sensor, two annular convex grooves are provided.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the technical solutions of the present invention, and are incorporated in and constitute a part of this specification, together with the embodiments of the present invention for explaining the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.
The present invention will be further described with reference to the accompanying drawings and examples;
fig. 1 is a schematic overall structural diagram of a pressure sensor according to an embodiment of the present invention;
fig. 2 is an exploded view of a pressure sensor according to an embodiment of the present invention;
fig. 3 is a cross-sectional view of a pressure sensor according to an embodiment of the present invention;
fig. 4 is an exploded cross-sectional view of a pressure sensor according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a tin-sealed connection between a PCB board and a stainless steel casing of a pressure sensor according to an embodiment of the present invention.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, if there are first and second descriptions for distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the precedence of the indicated technical features.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
An embodiment of the utility model provides a pressure sensor has higher reliability.
The embodiments of the present invention will be further explained with reference to the drawings.
Referring to fig. 1 to 4, an embodiment of the present invention provides a pressure sensor, including a PCB board 100, a wafer 200, and a stainless steel diaphragm assembly 300, wherein:
the PCB board 100 comprises a first surface 101 and a second surface 102 which are oppositely arranged, wherein the first surface 101 is provided with a signal output pin 110;
the wafer 200 is arranged on the second surface 102;
the stainless steel diaphragm assembly 300 includes a stainless steel housing 310 and a stainless steel diaphragm 320 disposed inside the stainless steel housing 310, the stainless steel housing 310 is sleeved on the wafer 200 and hermetically connected to the second surface 102 through tin, the stainless steel diaphragm 320 divides the space inside the stainless steel housing 310 into a first chamber 311 and a second chamber 312, the wafer 200 is located in the first chamber 311, and the first chamber 311 is filled with a pressure conductive medium.
According to the embodiment of the present invention, the pressure sensor directly adopts the PCB 100 as the supporting plate, the wafer 200 is disposed on the second surface 102 of the PCB 100, the stainless steel housing 310 is sleeved on the wafer 200 and is hermetically connected to the second surface 102 through tin, i.e. the PCB 100 seals the first chamber 311 of the stainless steel housing 310, the pressure conducting medium is filled in the first chamber 311, the medium to be measured is pressed against the stainless steel diaphragm 320 from the second chamber 102, and then the pressure is transmitted to the wafer 200 through the pressure conducting medium, and the wafer 200 outputs the pressure signal from the signal output pin 110 after measuring the pressure signal; the stainless steel shell 310 is hermetically connected with the PCB 100 through tin, so that the pressure sensor has high shearing strength, high pressure resistance, high overload capacity and low possibility of damage; compared with a rubber diaphragm or a plastic diaphragm, the stainless steel diaphragm has the advantages of better medium compatibility and stability, difficult aging, high transmission efficiency and strong long-term reliability.
In addition, the pressure sensor in this embodiment, the circuit in PCB board 100 adopts pure analog signal, and sensitivity is higher, consequently has that response time is fast, signal small in noise, advantages such as interference killing feature is strong, is applicable to scenes such as water pump control measurement, intelligent fire control, air compressor machine measurement.
Referring to fig. 3, the pressure sensor further includes a protective cover 400 disposed inside the first chamber 311, the protective cover 400 is disposed on the wafer 200, and the protective cover 400 is provided with a first through hole 410 for allowing a pressure transmission medium to flow therethrough.
Through at the inside safety cover 400 that sets up of first cavity 311, wafer 200 is located to safety cover 400 cover, can play the guard action to wafer 200, in addition, safety cover 400 also can play the limited effect to the deformation of stainless steel diaphragm 320, when the pressure of the medium of measuration pressure is greater than pressure sensor's range, can play the supporting role to stainless steel diaphragm 320, avoids the excessive deformation of stainless steel diaphragm 320 to lead to the fact the damage for pressure sensor has higher reliability.
Referring to fig. 3, in the pressure sensor, the wafer 200 is attached to the center of the second surface 102, and the first through hole 410 is disposed corresponding to the wafer 200.
The wafer 200 is adhered to the center position of the second surface 102, and the pressure from all directions can be sensed relatively uniformly; the first through hole 410 is located corresponding to the wafer 200, and when the stainless steel diaphragm 320 deforms, the pressure transmission medium in the first chamber 311 can flow through the first through hole 410, so as to directly transmit the pressure to the wafer 200.
Referring to fig. 3, in the above-described pressure sensor, the protective cover 400 includes a third surface 401 parallel to the stainless steel diaphragm 320, and the third surface 401 is spaced apart from the stainless steel diaphragm 320 by a first predetermined distance.
When the pressure of the medium to be measured is larger, the stainless steel diaphragm 320 deforms greatly, if the deformation amplitude of the stainless steel diaphragm 320 is larger than the first preset distance, the stainless steel diaphragm 320 will press against the third surface 401, and the third surface 401 of the protective cover 400 supports the stainless steel diaphragm 320, so that the stainless steel diaphragm 320 is prevented from being damaged due to excessive deformation. Referring to fig. 3, in the pressure sensor, the first through hole 410 is disposed on the third surface 401.
Referring to fig. 3, in the pressure sensor, a second through hole 120 for injecting a pressure conductive medium is formed in the PCB 100, the second through hole 120 is communicated to the first chamber 311, and the second through hole 120 is blocked by tin.
Through setting up second through-hole 120 on PCB board 100, can be earlier PCB board 100 and stainless steel casing 310 through tin sealing connection, rethread second through-hole 120 pours into pressure conduction medium into first chamber 311 inside into, can realize high vacuum perfusion pressure conduction medium to make the inside precompression that does not have of first chamber 311, make pressure sensor have higher measurement accuracy.
In the pressure sensor, the PCB 100 has a temperature-sensitive resistor printed thereon, and the temperature-sensitive resistor is not shown in the drawing.
By printing a temperature-sensitive resistor on the PCB 100, the temperature can be directly measured or used for temperature compensation of the pressure sensor. It is understood that the temperature sensitive resistor may be printed on both the first surface 101 and the second surface 102.
Referring to fig. 5, in the above-described pressure sensor, the tin seal between the stainless steel case 310 and the PCB board 100 has a width greater than that of the joint surface. Specifically, the joint surface between the stainless steel case 310 and the PCB 100 is hermetically connected by tin,
the width of the tin seal between the stainless steel case 310 and the PCB 100 is greater than the width of the joint surface, which can enhance the connection strength between the stainless steel case 310 and the PCB 100 and improve the reliability of the pressure sensor.
Referring to fig. 1 and 2, in the above-described pressure sensor, the outer wall of the stainless steel case 310 is provided with an annular groove 313 for seating a seal ring.
The outer wall of the stainless steel shell 310 is provided with the annular groove 313, namely, the pressure sensor is connected with a pipeline of a measured medium by adopting side sealing, so that the impact pressure of the measured medium can be buffered, and a better buffering effect is achieved.
Referring to fig. 1 and 4, in the above-described pressure sensor, the stainless steel diaphragm 320 is provided with an annular convex groove 321 that is convex toward the second chamber 312.
Referring to fig. 1 and 4, in the above-described pressure sensor, two annular bosses 321 are provided.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention within the knowledge range of those skilled in the art.
Claims (10)
1. A pressure sensor, comprising:
the PCB comprises a first surface and a second surface which are oppositely arranged, and the first surface is provided with a signal output pin;
the wafer is arranged on the second surface;
stainless steel diaphragm assembly, stainless steel diaphragm assembly includes the stainless steel casing and sets up the inside stainless steel diaphragm of stainless steel casing, the stainless steel casing cover is located the wafer and with the second surface passes through tin sealing connection, the stainless steel diaphragm will the inside space of stainless steel casing is cut apart into first cavity and second cavity, the wafer is located first cavity, the inside packing of first cavity has pressure conduction medium.
2. The pressure sensor of claim 1, further comprising a protective cover disposed inside the first chamber, wherein the protective cover is disposed on the wafer, and the protective cover is provided with a first through hole for flowing the pressure conductive medium.
3. The pressure sensor of claim 2, wherein the wafer is attached to a center of the second surface, and the first through hole is disposed corresponding to the wafer.
4. The pressure sensor of claim 2, wherein the protective cover includes a third surface parallel to the stainless steel diaphragm, the third surface being spaced a first predetermined distance from the stainless steel diaphragm.
5. The pressure sensor according to claim 1, wherein a second through hole for injecting the pressure conductive medium is formed in the PCB, the second through hole is communicated to the first chamber, and the second through hole is blocked by tin.
6. The pressure sensor of claim 1, wherein the PCB board has a temperature sensitive resistor printed thereon.
7. The pressure sensor of claim 1, wherein a width of the tin seal between the stainless steel housing and the PCB board is greater than a width of the interface.
8. A pressure sensor as claimed in claim 1, wherein the outer wall of the stainless steel housing is provided with an annular groove for seating a sealing ring.
9. A pressure sensor according to claim 1, wherein the stainless steel diaphragm is provided with an annular groove that is convex towards the second chamber.
10. A pressure sensor as claimed in claim 9, wherein there are two of the annular tongues.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120939898.4U CN214502746U (en) | 2021-04-30 | 2021-04-30 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120939898.4U CN214502746U (en) | 2021-04-30 | 2021-04-30 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214502746U true CN214502746U (en) | 2021-10-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120939898.4U Active CN214502746U (en) | 2021-04-30 | 2021-04-30 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214502746U (en) |
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2021
- 2021-04-30 CN CN202120939898.4U patent/CN214502746U/en active Active
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