CN214481492U - Metal substrate circuit board of interlayer connection - Google Patents

Abstract

The utility model discloses a metal substrate circuit board of interlayer connection, including a metal substrate layer, at least two-layer insulating layer and the solder mask that sets gradually, one of them insulating layer is equipped with the main line, is equipped with on the main line and opens circuit, and all the other insulating layers are equipped with the interconnecting link that matches with the disconnection, and the both ends that open circuit are provided with the linkage unit respectively with between the correspondence end of interconnecting link, and the linkage unit passes the insulating layer setting between main line and the interconnecting link. The utility model discloses a connection unit who passes the insulating layer connects main line and interconnecting link, realize the connection between the layer, the cross section that can't avoid when the main line wiring sets up and opens circuit, and switch on through interconnecting link, realize walking the line cross, effectively break through the limitation of metal base circuit board, the circuit complexity that can realize has approached ordinary multilayer PCB's wiring to a certain extent, still keep its heat dispersion's good simultaneously, greatly improved the application ability of metal base circuit board, it uses the scene to widen.

Description

Metal substrate circuit board of interlayer connection

Technical Field

The utility model relates to a circuit board technical field, concretely relates to wiring structure between metal substrate circuit board layer.

Background

The metal-based circuit board is a circuit board using metal as a substrate, and the metal-based circuit board is also of a laminated structure like a common PCB, but the difference is that the metal-based circuit board can be electrified and only has two layers, namely a metal substrate and a circuit layer. The metal substrate is conductive as a whole, and wiring design cannot be performed, and only the wiring layer can be wired, so that the wirings cannot be crossed. For example, in the case of fig. 1, if PAD1 is routed to PADa and PAD2 is routed to PADb, the traces will inevitably intersect and cannot be realized. The common PCB can have multiple circuit layers, layers are changed through via holes between the layers, crossing is avoided, the number of layers of the metal substrate circuit board is small, a via hole structure is not arranged between the layers, the situation that the circuit crossing cannot be avoided is avoided, the limitation can only meet very simple wiring, the slightly complex wiring requirement cannot be achieved, and the application capability and the application scene of the metal substrate circuit board are greatly limited.

The metal substrate is a good thermal conductor, so the metal substrate circuit board has very good heat conduction capability, and in a scene with heat dissipation requirements, the heating device is attached to the metal substrate, and the device is conducted and powered up through the circuit layer, so that the heat dissipation of the heating device is very effective. For example, an aluminum substrate is used for LED lighting, and a copper substrate is used for a chip test environment, which are typical application scenarios. However, the application structure of some chips is more complicated, and more lines need to be led out, so that the probability of crossing of wiring is greatly increased, which is almost unavoidable, and complicated wiring can be realized by using a common PCB, but the excellent temperature control capability of the copper substrate is lost, which causes a dilemma.

Therefore, it is necessary to develop a method capable of effectively enhancing the application capability and application scenario of the metal-based metal plate.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wiring structure between metal base circuit board layer to the metal base circuit board number of piles that exists is few among the solution prior art, does not have via hole structure between the layer, can only satisfy very simple wiring, and the wiring requirement of a little complicacy all can't be realized, has restricted the application ability of metal base circuit board and has used the technical problem of scene greatly.

In order to realize the purpose, the technical scheme of the utility model is that:

the utility model provides a metal substrate circuit board of interlayer connection, is including a metal stratum basale, at least two-layer insulating layer and a solder mask that sets gradually, one of them the insulating layer is kept away from a metal stratum basale side is provided with the main line, be equipped with on the main line and open circuit, all the other the insulating layer is kept away from a metal stratum basale side be provided with the interconnecting link that matches opens circuit, open circuit both ends respectively with be provided with the linkage unit between the end that corresponds of interconnecting link, the linkage unit passes the main line with between the interconnecting link the insulating layer sets up.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a connection unit who passes the insulating layer connects main line and interconnecting link, realize the connection between the layer, the cross section that can't avoid when the main line wiring sets up and opens circuit, and switch on through interconnecting link, realize walking the line cross, break through the limitation of original metal base circuit board effectively, the circuit complexity that can realize has approached ordinary multilayer PCB's wiring to a certain extent, still keep its heat dispersion's good simultaneously, the application ability of metal base circuit board has greatly been improved, it uses the scene to widen.

On the basis of the technical scheme, the utility model discloses can also do as follows the improvement:

furthermore, the insulating layer between the main line and the connection line is provided with openings corresponding to the two ends of the circuit breaker, and the connection unit is arranged at the openings to connect the circuit breaker and the connection line.

Furthermore, the connecting unit is a routing electrode or a conducting device.

Through adopting above-mentioned scheme, can adopt routing electrode to connect the end of opening a circuit and interconnecting link end, also can adopt switches on devices such as resistance, conductor to connect and open a circuit and interconnecting link.

Further, the main line includes two crossed branch lines, and the open circuit is arranged at the crossing of one of the branch lines.

By adopting the scheme, one branch line is communicated at the intersection through the connecting line, so that the cross wiring is realized.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a schematic diagram of a conventional metal-based circuit board in a cross wiring configuration.

Fig. 2 is a schematic structural diagram of an embodiment of the present invention.

Fig. 3 is a schematic sectional structure view of a-a in fig. 2.

Shown in the figure:

1. a metal base layer;

2. an insulating layer; 201. opening a hole;

3. a solder resist layer;

4. a main line; 401. breaking; 402. dividing lines;

5. connecting a line;

6. and (5) routing electrodes.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

As shown in fig. 2 and fig. 3, the metal-based circuit board for interlayer connection provided in this embodiment includes a metal-based layer 1, two insulating layers 2 and a solder resist layer 3, which are sequentially disposed.

One side of the insulating layer 2 away from the metal base layer 1 is provided with a main line 4, and the main line 4 comprises two branch lines 402. One of the branch lines 402 is connected to PADa at a point PAD1, the other branch line 402 is connected to PADb at a point PAD2, and the two branch lines 402 have an unavoidable intersection.

The branch 402 connected to PADa by point PAD1 is provided with an open circuit 401 at the intersection.

The other insulating layer 2 is provided with connecting lines 5 matching the circuit breaks 401 on the side facing away from the metal substrate layer 1.

The insulating layer 2 between the main line 4 and the connection line 5 is opened with two openings 201 corresponding to both ends of the open circuit 401.

Both ends of the disconnection 401 are connected with the corresponding ends of the connection line 5 through connection units, respectively, which are disposed at the openings 201.

Specifically, the connection unit in this embodiment is a wire bonding electrode 6. In other embodiments, a conducting device such as a resistor or a conductor may be used to connect the disconnection 401 and the connection line 5, without affecting the beneficial effect of the present embodiment.

The branch line 402 connected to PADa at the site PAD1 in this embodiment is connected to the connection line 5 at the intersection, thereby realizing the cross wiring.

This embodiment connects main line 4 and interconnecting link 5 through the linkage unit who passes insulating layer 2, realize the interlayer connection, the crossing that can't avoid when main line 4 lays wire sets up open circuit 401, and switch on through interconnecting link 5, realize walking the line cross, break through the limitation of original metal substrate circuit board effectively, the circuit complexity that can realize has approached ordinary multilayer PCB's wiring to a certain extent, still keep its heat dispersion's is good simultaneously, the application ability of metal substrate circuit board has greatly been improved, its application scene has been widened.

In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims (4)

1. The utility model provides a metal substrate circuit board of interlayer connection which characterized in that, including the one deck metal substrate layer, at least two-layer insulating layer and the one deck solder mask that set gradually, one of them the insulating layer is kept away from a metal substrate layer side is provided with the main line, be equipped with on the main line and open circuit, all the other the insulating layer is kept away from a metal substrate layer side be provided with the interconnecting link that matches opens circuit, both ends that open circuit respectively with be provided with the linkage unit between the end that corresponds of interconnecting link, the linkage unit passes the main line with between the interconnecting link the insulating layer sets up.

2. The interlayer-connected metal-base circuit board according to claim 1, wherein openings corresponding to both ends of said disconnection are provided in said insulating layer between said main wiring and said connection wiring, and said connection unit is provided at said openings for connecting said disconnection and said connection wiring.

3. The interlayer connection metal-based circuit board of claim 2, wherein the connection unit is a wire bonding electrode or a conducting device.

4. The interlayer-connected metal-base circuit board of claim 1, wherein said main trace comprises two intersecting branch traces, and said open circuit is disposed at the intersection of one of said branch traces.

Images