CN214382009U - A signal processing device used in wireless local area network electronic communication - Google Patents
A signal processing device used in wireless local area network electronic communication Download PDFInfo
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- CN214382009U CN214382009U CN202120621234.3U CN202120621234U CN214382009U CN 214382009 U CN214382009 U CN 214382009U CN 202120621234 U CN202120621234 U CN 202120621234U CN 214382009 U CN214382009 U CN 214382009U
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- 238000004891 communication Methods 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 65
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 238000005057 refrigeration Methods 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 10
- 238000013016 damping Methods 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
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Abstract
本实用新型公开了信号处理装置技术领域中一种用于无线局域网络电子通信中的信号处理装置，在处理装置本体的底壁上贯穿设置冷源组件，冷源组件为处理装置本体提供冷源，冷源组件包括支撑座，支撑座的内部为空腔结构，支撑座的空腔内均匀设置有导热片，导热片上分别电连接有第一半导体、第二半导体和电导板，第一半导体和第二半导体构成制冷模块，制冷模块的端部电连接有导冷片，导冷片贯穿于处理装置本体的底壁上，且导冷片与散冷板连接，将电导板与外部电源连接，电子从外部电源出发，通过第一半导体放热及第二半导体吸热，每经过一组半导体就有热量由导冷片被送至导热片,由此导冷片成为冷源，保持处理装置本体处于正常工作温度范围内。
The utility model discloses a signal processing device used in the electronic communication of a wireless local area network in the technical field of signal processing devices. A cold source assembly is arranged through the bottom wall of a processing device body, and the cold source assembly provides a cold source for the processing device body. , the cold source assembly includes a support seat, the interior of the support seat is a cavity structure, the cavity of the support seat is evenly arranged with a heat conducting sheet, the heat conducting sheet is electrically connected with a first semiconductor, a second semiconductor and a conducting plate respectively, the first semiconductor and The second semiconductor constitutes a cooling module, the end of the cooling module is electrically connected with a cooling fin, the cooling fin runs through the bottom wall of the processing device body, and the cooling fin is connected with the cooling plate, and the conducting plate is connected with the external power supply, The electrons start from the external power supply and pass through the first semiconductor to release heat and the second semiconductor to absorb heat. Each time a group of semiconductors pass through, heat is sent to the heat-conducting sheet by the cold-conducting sheet, so the cold-conducting sheet becomes a cold source and maintains the body of the processing device. within the normal operating temperature range.
Description
Technical Field
The utility model relates to a signal processing apparatus technical field, specific field is a signal processing apparatus for among wireless local area network electronic communication.
Background
Signal processing is the general term for processing various types of electrical signals for various intended purposes and requirements. The processing of analog signals is referred to as analog signal processing, and the processing of digital signals is referred to as digital signal processing. The term "signal processing" refers to a process of processing a signal recorded on a certain medium to extract useful information, and is a generic term for processes of extracting, converting, analyzing, and synthesizing the signal. A signal processing device in the electronic communication of the wireless local area network is a device which processes and re-sends out signals after receiving the signals, and the wireless local area network is characterized in that a computer is not connected with the network by using a communication cable any more, but is connected in a wireless mode, so that the construction of the network and the movement of a terminal are more flexible. The signal processing device in the wireless local area network electronic communication in the prior art can not perform better heat dissipation, thereby affecting the working efficiency.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a signal processing device for among wireless local area network electronic communication to solve the problem mentioned in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a signal processing device used in wireless local area network electronic communication comprises a processing device body, wherein a cold source assembly penetrates through the bottom wall of the processing device body and provides a cold source for the processing device body so as to keep the processing device body within a normal working temperature range;
the cold source component comprises a supporting seat, the inside of the supporting seat is of a cavity structure, heat-conducting fins are uniformly arranged in the cavity of the supporting seat, the heat conducting sheet is electrically connected with a first semiconductor, a second semiconductor and an electric conduction plate respectively, the first semiconductor and the second semiconductor form a refrigeration module, the end part of the refrigeration module is electrically connected with a cold guide sheet which penetrates through the bottom wall of the processing device body, the cold conducting sheet is connected with the cold dissipating plate to connect the electric conduction plate with an external power supply, electrons start from the external power supply, heat is transferred from the cold-conducting fin to the heat-conducting fin through each group of semiconductors by heat release of the first semiconductor and heat absorption of the second semiconductor, therefore, the cold guide plate becomes a cold source, the contact area of the cold dissipation plate and the processing device body is large, and the processing device body can be further kept within a normal working temperature range.
Preferably, just be located in the cavity of supporting seat the equal fixedly connected with radiating fin in both sides of conducting strip, evenly set up the ventilation hole that is linked together with the cavity on the lateral wall of supporting seat, radiating fin is right when the conducting strip plays the radiating action, it is right also the conducting strip plays the supporting role, radiating fin's setting does benefit to right the heat of conducting strip gives off, the setting in ventilation hole is used for ventilation cooling in the cavity of supporting seat.
Preferably, a fan is arranged on the side wall of the supporting seat and on the opposite side of the ventilation hole, the output end of the fan is communicated with the cavity of the supporting seat, hot air in the cavity of the supporting seat is continuously blown out through the work of the fan, the hot air blown out from the ventilation hole can be used for heating, and resources are saved.
Preferably, the four corners of the lower end face of the supporting seat are provided with universal wheels, the four corners of the upper end face of the supporting seat are fixedly connected with one end of a damping spring, the other end of the damping spring is fixedly connected with the processing device body, and the universal wheels are arranged to facilitate the integral movement of the signal processing device.
Preferably, the first semiconductor and the second semiconductor are an N-type semiconductor and a P-type semiconductor, respectively, the N-type semiconductor and the P-type semiconductor form an NP refrigeration module, and the heat sink and the heat conductive sheet serve as heat sources, respectively, by heat dissipation of the N-type semiconductor and heat absorption of the P-type semiconductor, the cold guide sheet serves as a cold source.
Compared with the prior art, the beneficial effects of the utility model are that: the bottom wall of the processing device body is provided with a cold source component in a penetrating way, the cold source component provides a cold source for the processing device body so as to keep the processing device body within a normal working temperature range, the cold source component comprises a supporting seat, the inside of the supporting seat is of a cavity structure, heat conducting fins are uniformly arranged in the cavity of the supporting seat, a first semiconductor, a second semiconductor and an electric guide plate are respectively and electrically connected onto the heat conducting fins, the first semiconductor and the second semiconductor form a refrigeration module, the end part of the refrigeration module is electrically connected with a cold conducting fin, the cold conducting fins penetrate through the bottom wall of the processing device body, the cold conducting fins are connected with a cold dissipation plate, the electric guide plate is connected with an external power supply, electrons start from the external power supply, heat is sent to the heat conducting fins by the cold conducting fins through the first semiconductor and heat absorption of the second semiconductor, each group of semiconductors, the cold conducting fins become the cold source, the cold dissipation plate has a large contact area with the processing device body, the processing apparatus body can be further kept within a normal operating temperature range.
Drawings
FIG. 1 is a sectional view of the main structure of the present invention;
FIG. 2 is a side view of the main structure of the present invention;
fig. 3 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.
In the figure: 1-a processing device body, 2-a cold source component, 201-a support seat, 202-a heat conducting sheet, 203-a first semiconductor, 204-a second semiconductor, 205-a cold conducting sheet, 206-a cold dissipating sheet, 207-an electric guide plate, 3-a heat dissipating fin, 4-a vent hole, 5-a fan, 6-a universal wheel and 7-a vibration damping spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The description of the directions (up, down, left, right, front, and back) is made with reference to the structure shown in fig. 1 of the drawings attached to the specification, but the practical direction of the present invention is not limited thereto.
Example (b):
referring to fig. 1-3, the present invention provides a technical solution: a signal processing device used in wireless local area network electronic communication comprises a processing device body 1, wherein a cold source component 2 penetrates through the bottom wall of the processing device body 1, and the cold source component 2 provides a cold source for the processing device body 1 so as to keep the processing device body 1 within a normal working temperature range;
the cold source assembly 2 includes a supporting base 201, the supporting base 201 has a cavity structure, heat-conducting fins 202 are uniformly disposed in the cavity of the supporting base 201, the heat-conducting fins 202 are electrically connected to a first semiconductor 203, a second semiconductor 204 and an electrical conducting plate 207, respectively, the first semiconductor 203 and the second semiconductor 204 constitute a refrigeration module, an end of the refrigeration module is electrically connected to a cold-conducting fin 205, the cold-conducting fin 205 penetrates through a bottom wall of the processing apparatus body 1, the cold-conducting fin 205 is connected to a cold-dissipating plate 206, the electrical conducting plate 207 is connected to an external power source, electrons are sent from the external power source, heat is released through the first semiconductor 203 and absorbed through the second semiconductor 204, heat is sent from the cold-conducting fin 205 to the heat-conducting fins 202 through each group of semiconductors, so that the cold-conducting fin 205 becomes a cold source, and a contact area between the cold-dissipating plate 206 and the processing apparatus body 1 is large, it is possible to further maintain the processing apparatus body 1 within a normal operating temperature range.
Particularly, just be located in the cavity of supporting seat 201 the equal fixedly connected with radiating fin 3 in both sides of conducting strip 202, evenly set up the ventilation hole 4 that is linked together with the cavity on the lateral wall of supporting seat 201, radiating fin 3 is right when conducting strip 202 plays the radiating action, it is also right conducting strip 202 plays the supporting role, radiating fin 3's setting does benefit to right conducting strip 202's heat gives off, the setting in ventilation hole 4 is used for ventilation cooling in the cavity of supporting seat 201.
Specifically, the fan 5 is arranged on the side wall of the supporting seat 201 and on the opposite side of the vent hole 4, the output end of the fan 5 is communicated with the cavity of the supporting seat 201, hot air in the cavity of the supporting seat 201 is continuously blown out through the work of the fan 5, and the hot air blown out from the vent hole 4 can be used for heating, so that resources are saved.
Particularly, the lower terminal surface four corners department of supporting seat 201 all is provided with universal wheel 6, the equal fixed connection damping spring 7's of the up end four corners department of supporting seat 201 one end, damping spring 7's the other end with processing apparatus body 1 fixed connection, the signal processing apparatus moving as a whole of being convenient for is arranged to universal wheel 6.
Specifically, the first semiconductor 203 and the second semiconductor 204 are an N-type semiconductor and a P-type semiconductor, respectively, and the N-type semiconductor and the P-type semiconductor constitute an NP cooling module, so that the cooling fin 205 serves as a cooling source and the heat conductive fin 202 serves as a heat source by heat radiation of the N-type semiconductor and heat absorption of the P-type semiconductor.
The working principle is as follows: the cold source component 2 is arranged on the bottom wall of the processing device body 1 in a penetrating manner, and the cold source component 2 provides a cold source for the processing device body 1 so as to keep the processing device body 1 within a normal working temperature range; the cold source component 2 comprises a supporting seat 201, the supporting seat 201 is internally of a cavity structure, heat conducting fins 202 are uniformly arranged in the cavity of the supporting seat 201, the heat conducting fins 202 are respectively and electrically connected with a first semiconductor 203, a second semiconductor 204 and an electric conducting plate 207, the first semiconductor 203 and the second semiconductor 204 form a refrigeration module, the end part of the refrigeration module is electrically connected with a cold conducting fin 205, the cold conducting fin 205 penetrates through the bottom wall of the processing device body 1, and the cold conducting plate 205 is connected with the cold dissipating plate 206, the electric conducting plate 207 is connected with an external power supply, electrons start from the external power supply, by heat release from the first semiconductor 203 and heat absorption from the second semiconductor 204, heat is transferred from the cold conductive fin 205 to the heat conductive fin 202 for each group of semiconductors, therefore, the cold conducting plate 205 becomes a cold source, and the contact area between the cold dissipating plate 206 and the processing device body 1 is large, so that the processing device body 1 can be further kept within a normal working temperature range.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses the standard parts that use all can purchase from the market, and dysmorphism piece all can be customized according to the record of description and attached drawing.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120621234.3U CN214382009U (en) | 2021-03-27 | 2021-03-27 | A signal processing device used in wireless local area network electronic communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120621234.3U CN214382009U (en) | 2021-03-27 | 2021-03-27 | A signal processing device used in wireless local area network electronic communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214382009U true CN214382009U (en) | 2021-10-08 |
Family
ID=77972822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120621234.3U Expired - Fee Related CN214382009U (en) | 2021-03-27 | 2021-03-27 | A signal processing device used in wireless local area network electronic communication |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214382009U (en) |
-
2021
- 2021-03-27 CN CN202120621234.3U patent/CN214382009U/en not_active Expired - Fee Related
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211008 |
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| CF01 | Termination of patent right due to non-payment of annual fee |