CN214335673U - Heat pipe heat dissipation device for notebook computer - Google Patents
Heat pipe heat dissipation device for notebook computer Download PDFInfo
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- CN214335673U CN214335673U CN202120565202.6U CN202120565202U CN214335673U CN 214335673 U CN214335673 U CN 214335673U CN 202120565202 U CN202120565202 U CN 202120565202U CN 214335673 U CN214335673 U CN 214335673U
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- heat pipe
- side heat
- heating element
- heat
- notebook computer
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 238000001704 evaporation Methods 0.000 claims abstract description 31
- 238000009434 installation Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000009833 condensation Methods 0.000 claims description 23
- 230000005494 condensation Effects 0.000 claims description 23
- 230000008020 evaporation Effects 0.000 claims description 21
- 238000009413 insulation Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 10
- 239000011148 porous material Substances 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 2
- 230000006870 function Effects 0.000 description 4
- 230000015654 memory Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of computer parts, and discloses a notebook computer heat pipe heat dissipation device, which comprises an installation shell, the both sides of the installation shell are respectively provided with a left side heat pipe and a right side heat pipe, a first heating element and a second heating element are respectively arranged on the left side heat pipe and the right side heat pipe, the first heating element and the second heating element operate to generate heat source and transfer heat to the evaporating ends of the left side heat pipe and the right side heat pipe, so that the evaporating ends are heated, the liquid in the capillary cores in the left side heat pipe and the right side heat pipe is evaporated and vaporized, the steam flows to the condensing ends under a small pressure difference to emit heat and is condensed into liquid, the liquid flows back to the evaporating ends along the porous materials in the left side heat pipe and the right side heat pipe by the action of capillary force, the heat dissipation is realized, and the cooling fins connected with the condensing ends can further transfer the heat, and further heat dissipation is carried out by a heat dissipation fan, the heat dissipation effect and the heat dissipation effect inside the notebook computer are improved.
Description
Technical Field
The utility model relates to a computer spare part technical field specifically is a notebook computer heat pipe heat abstractor.
Background
Integrated circuits are heavily used in computer components. It is well known that high temperatures are a rival of integrated circuits. The high temperature can not only cause the unstable operation of the system and shorten the service life, but also possibly burn some parts. The heat that causes the high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. The radiator is used for absorbing the heat and then radiating the heat into the case or out of the case, so that the temperature of the computer components is ensured to be normal. Most heat sinks absorb heat by contacting the surfaces of heat-generating components, and then transfer the heat to a remote location by various methods, such as air in a chassis, and then the chassis transfers the hot air to the outside of the chassis, thereby dissipating heat from the computer. The types of radiators are very many, and CPUs, display cards, mainboard chip sets, hard disks, cases, power supplies and even optical drives and memories all need radiators, and the different radiators cannot be used in a mixed manner, wherein the radiator of the CPU is the most frequently contacted.
At present, when heat dissipation operation is performed on internal devices of a notebook computer, an existing heat dissipation mode is single, and most of the existing heat dissipation modes are heat dissipation by a heat dissipation fan, due to overload operation of chips such as cpu inside the notebook computer, generated heat can not be quickly and effectively dissipated by the heat dissipation fan alone, the temperature of internal devices is very high, burning is easily caused, irretrievable loss is caused, and although heat dissipation is performed by a heat pipe mode at a small part, the stability is not good, quick heat dissipation is not convenient for a heat dissipation end of the heat pipe, and the overall performance of the device is affected.
Disclosure of Invention
The utility model aims at providing a notebook computer heat pipe heat abstractor, it is comparatively single to solve among the prior art radiating mode, mostly be radiator fan and dispel the heat, because the overload function of chips such as the inside cpu of notebook computer, the heat of production singly relies on radiator fan and can not carry out quick and effectual heat dissipation, very easily cause inside components and parts temperature higher, and burn out, lead to the loss that can't be retrieved, and although the mode of few part for the heat pipe dispels the heat, but its stability is not good, be not convenient for dispel the heat fast to the heat dissipation end of heat pipe, influence the problem of the holistic performance of device.
In order to achieve the above object, the utility model provides a following technical scheme: a heat pipe radiating device of a notebook computer comprises an installation shell, wherein a left side heat pipe and a right side heat pipe are arranged on two sides of the installation shell respectively, a first heating element and a second heating element are arranged on the left side heat pipe and the right side heat pipe respectively, an evaporation end and a condensation end are arranged on the left side heat pipe and the right side heat pipe respectively, the evaporation end of the left side heat pipe is connected with the first heating element, the evaporation end of the right side heat pipe is connected with the second heating element, and the condensation ends of the left side heat pipe and the right side heat pipe are connected with the installation shell.
Preferably, the heat pipes on the left side and the heat pipes on the right side are both sleeved with heat insulation sleeves, and the heat insulation sleeves are located between the evaporation end and the condensation end.
Preferably, a cooling fan is arranged in the mounting shell, and a blocking net is arranged at an air outlet of the mounting shell.
Preferably, the back of the condensation end on the left heat pipe and the back of the condensation end on the right heat pipe are both provided with cooling fins, and the cooling fins are attached to the mounting shell.
Preferably, the first heating element and the second heating element are internal heating chips of the notebook computer.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model relates to a notebook computer heat pipe heat abstractor, the left side heat pipe of setting, the right side heat pipe, radiator fan and fin, first heating element and the function of second heating element, produce the heat source, and carry out heat transfer to the evaporating end of left side heat pipe and right side heat pipe, make the evaporating end be heated, the evaporation of liquid in the capillary core in left side heat pipe and the right side heat pipe, steam flows to the condensation end under small pressure differential and emits the heat and condenses into liquid, liquid flows back to the evaporating end along the porous material in left side heat pipe and the right side heat pipe again under the effect of capillary force, realize the heat dissipation, and the fin that the condensation end is connected, can be further transmit the heat, and carry out further heat dissipation by radiator fan, improve inside radiating effect and the radiating effect of notebook computer.
(2) The utility model relates to a notebook computer heat pipe heat abstractor, the adiabatic cover of setting can make the evaporating end and the temperature of condensation end of left side heat pipe and right side heat pipe separate to guarantee the normal function of left side heat pipe and right side heat pipe, promote stability.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
In the reference symbols: 1. installing a shell; 2. a heat radiation fan; 21. blocking the net; 3. a left heat pipe; 31. an evaporation end; 32. a condensing end; 33. a heat insulating jacket; 34. a heat sink; 4. a right side heat pipe; 5. a first heat generating element; 6. a second heating element.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Examples
Referring to fig. 1, the present invention provides a heat pipe heat dissipation device for notebook computer, comprising: the heat pipe comprises a mounting shell 1, a left heat pipe 3 and a right heat pipe 4 are respectively arranged on two sides of the mounting shell 1, a first heating element 5 and a second heating element 6 are respectively arranged on the left heat pipe 3 and the right heat pipe 4, the left heat pipe 3 and the right heat pipe 4 are respectively provided with an evaporation end 31 and a condensation end 32, the evaporation end 31 of the left heat pipe 3 is connected with the first heating element 5, specifically, the evaporation end 31 of the left heat pipe 3 is fixedly connected with the first heating element 5, the evaporation end 31 of the right heat pipe 4 is connected with the second heating element 6, specifically, the evaporation end 31 of the right heat pipe 4 is fixedly connected with the second heating element 6, the condensation ends 32 of the left heat pipe 3 and the right heat pipe 4 are both connected with the mounting shell 1, specifically, the left heat pipe 3 and the right heat pipe 4 are fixedly connected with the mounting shell 1, a cooling fan 2 is arranged in the mounting shell 1, a blocking net 21 is arranged at an air outlet of the mounting shell 1, the baffle net 21 is arranged to block dust or sundries, the back of the condensation end 32 on the left heat pipe 3 and the back of the condensation end 32 on the right heat pipe 4 are both provided with radiating fins 34, and the radiating fins 34 are attached to the mounting shell 1.
In this embodiment, the first heating element 5 and the second heating element 6 operate to generate a heat source, and transfer heat to the evaporation end 31 of the left heat pipe 3 and the right heat pipe 4, so that the evaporation end 31 is heated, the liquid in the capillary wick of the left heat pipe 3 and the right heat pipe 4 is evaporated and vaporized, the vapor flows to the condensation end 32 under a slight pressure difference to release heat and condense into liquid, and the liquid flows back to the evaporation end 31 along the porous material in the left heat pipe 3 and the right heat pipe 4 under the action of capillary force to realize heat dissipation, and the heat sink 34 connected to the condensation end 32 can further transfer heat and further dissipate heat by the heat dissipation fan 2, thereby improving the heat dissipation effect and the heat dissipation effect inside the notebook computer.
Furthermore, the heat-insulating sleeve 33 is sleeved on both the left heat pipe 3 and the right heat pipe 4, and the heat-insulating sleeve 33 is located between the evaporation end 31 and the condensation end 32.
In the present embodiment, the thermal insulation sleeve 33 is provided to separate the temperatures of the evaporation end 31 and the condensation end 32 of the left heat pipe 3 and the right heat pipe 4, so as to ensure the normal operation of the left heat pipe 3 and the right heat pipe 4 and improve the stability.
Further, the first heating element 5 and the second heating element 6 are internal heating chips of the notebook computer, and specifically, the first heating element 5 and the second heating element 6 may be a cpu, a display card, a motherboard chip set, a hard disk, a case, a power supply, even an optical drive and an internal memory.
Specifically, the utility model discloses a theory of operation and use flow: the utility model discloses install the back, first heating element 5 and the 6 functions of second heating element, produce the heat source, and transfer heat to the evaporating terminal 31 of left side heat pipe 3 and right side heat pipe 4, make evaporating terminal 31 be heated, the liquid evaporation vaporization in the capillary core in left side heat pipe 3 and the right side heat pipe 4, steam flows to condensation end 32 under small pressure differential and emits heat and condenses into liquid, liquid flows back to evaporating terminal 31 along the porous material in left side heat pipe 3 and the right side heat pipe 4 again under the effect of capillary force, realize the heat dissipation, and fin 34 that condensation end 32 is connected, can be further transmit the heat, and carry out further heat dissipation by radiator fan 2, improve the inside radiating effect and the radiating effect of notebook computer, until accomplishing whole work order.
In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The notebook computer heat pipe heat dissipation device is characterized by comprising an installation shell (1), wherein a left side heat pipe (3) and a right side heat pipe (4) are arranged on two sides of the installation shell (1) respectively, a first heating element (5) and a second heating element (6) are arranged on the left side heat pipe (3) and the right side heat pipe (4) respectively, an evaporation end (31) and a condensation end (32) are arranged on the left side heat pipe (3) and the right side heat pipe (4), the evaporation end (31) of the left side heat pipe (3) is connected with the first heating element (5), the evaporation end (31) of the right side heat pipe (4) is connected with the second heating element (6), and the condensation ends (32) of the left side heat pipe (3) and the right side heat pipe (4) are connected with the installation shell (1).
2. The notebook computer heat pipe heat sink according to claim 1, wherein: and the heat insulation sleeves (33) are sleeved on the left heat pipe (3) and the right heat pipe (4), and the heat insulation sleeves (33) are positioned between the evaporation end (31) and the condensation end (32).
3. The notebook computer heat pipe heat sink according to claim 1, wherein: a cooling fan (2) is arranged in the mounting shell (1), and a blocking net (21) is arranged at an air outlet of the mounting shell (1).
4. The notebook computer heat pipe heat sink according to claim 1, wherein: the back of the condensation end (32) on the left heat pipe (3) and the back of the condensation end (32) on the right heat pipe (4) are both provided with radiating fins (34), and the radiating fins (34) are attached to the mounting shell (1).
5. The notebook computer heat pipe heat sink according to claim 1, wherein: the first heating element (5) and the second heating element (6) are heating chips inside the notebook computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120565202.6U CN214335673U (en) | 2021-03-19 | 2021-03-19 | Heat pipe heat dissipation device for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120565202.6U CN214335673U (en) | 2021-03-19 | 2021-03-19 | Heat pipe heat dissipation device for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214335673U true CN214335673U (en) | 2021-10-01 |
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ID=77888743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120565202.6U Active CN214335673U (en) | 2021-03-19 | 2021-03-19 | Heat pipe heat dissipation device for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214335673U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024048902A1 (en) * | 2022-08-29 | 2024-03-07 | 삼성전자주식회사 | Electronic device comprising heat pipe surrounding multiple integrated circuits |
-
2021
- 2021-03-19 CN CN202120565202.6U patent/CN214335673U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024048902A1 (en) * | 2022-08-29 | 2024-03-07 | 삼성전자주식회사 | Electronic device comprising heat pipe surrounding multiple integrated circuits |
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Address after: No. 118 Jingui Road, Hangbu Town, Shucheng County, Lu'an City, Anhui Province, 231300 Patentee after: Anhui Dongchao Lianchuang Technology Co.,Ltd. Address before: 231323 north side of Jingui Road, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee before: Shucheng Dongchao Hardware Technology Co.,Ltd. |