CN214289623U - Silicon chip cleaning mechanism for developing machine - Google Patents
Silicon chip cleaning mechanism for developing machine Download PDFInfo
- Publication number
- CN214289623U CN214289623U CN202023086228.7U CN202023086228U CN214289623U CN 214289623 U CN214289623 U CN 214289623U CN 202023086228 U CN202023086228 U CN 202023086228U CN 214289623 U CN214289623 U CN 214289623U
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- Prior art keywords
- cup
- developing machine
- spray ring
- hole
- cup body
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- 238000004140 cleaning Methods 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 20
- 239000010703 silicon Substances 0.000 title claims abstract description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 title claims abstract description 16
- 239000007921 spray Substances 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000005507 spraying Methods 0.000 claims abstract description 11
- 238000009434 installation Methods 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to the technical field of developing machines, in particular to a silicon wafer cleaning mechanism for a developing machine, which comprises a cleaning cup body, a water spray ring and a fixed base, wherein the water spray ring is fixedly arranged on the cleaning cup body, the fixed base is fixedly arranged at the bottom of the cleaning cup body, the water spray ring and the fixed base are respectively provided with corresponding mounting through holes, the cleaning cup body, the water spraying ring and the fixed base are respectively arranged in the mounting through hole through a screw rod for fixed mounting, a plurality of evenly distributed liquid inlet holes are arranged on the side wall of the cleaning cup body, a plurality of evenly distributed liquid spraying holes are arranged on the water spraying ring, a plurality of channels for liquid circulation are arranged between the liquid inlet holes and the liquid spraying holes, the novel anti-leakage device is simple to process, low in required cost, long in service life, free of leakage risk and capable of meeting market requirements.
Description
Technical Field
The utility model relates to a developing machine technical field especially relates to a silicon chip wiper mechanism for developing machine.
Background
In the more important photoetching part of the semiconductor production process, a matched gluing developing device is needed, a gluing unit of a silicon wafer to be processed is used for gluing, and after a period of work, the silicon wafer of the gluing developing device can have residual photoresist which is sticky and needs to be cleaned by a cleaning mechanism, otherwise, the production of the silicon wafer can be influenced.
However, the existing silicon wafer cleaning mechanism has more runners, which results in high difficulty of the processing technology and increased processing cost, and is easy to cause the blockage or side leakage of a certain runner joint, which results in the scrapping of the whole workpiece.
Disclosure of Invention
In order to overcome the technical defect, the utility model aims at providing a processing is simple, and required cost is low, and long service life does not have the seepage risk, can satisfy the silicon chip wiper mechanism for the developing machine of market demand.
In order to achieve the purpose, the invention is realized by the following technical scheme:
the utility model provides a silicon chip wiper mechanism for developing machine, is including wasing cup, spray ring and unable adjustment base, the spray ring is fixed to be located wash on the cup, unable adjustment base is fixed to be located wash the bottom of cup, wash and be equipped with corresponding installation through-hole on cup, spray ring and the unable adjustment base respectively, wash cup, spray ring and unable adjustment base and locate through the screw rod respectively carry out fixed mounting in the installation through-hole, be equipped with the feed liquor hole that the several distributes evenly on wasing the lateral wall of cup, be equipped with the several spray hole that the several distributes evenly on the spray ring, the feed liquor hole with be equipped with several passageways that are used for the liquid circulation between the spray hole.
Further, the channels respectively comprise a first flow passage, a second flow passage and a third flow passage.
Further, the second flow channel comprises a first flow channel positioned in the cleaning cup body and a second flow channel positioned in the water spray ring.
Furthermore, the number of the liquid inlet holes is four.
Further, the number of the liquid spraying holes is four.
To sum up, the utility model has the advantages that: this silicon chip wiper mechanism has changed and has adopted twenty runners to supply liquid among the prior art, the utility model discloses well passageway includes first runner, second runner and third runner respectively, wherein, the second runner has included second runner one and second runner two, every hydrojet point adopts four runners totally twelve runners promptly, the reduction of runner, its processing technology is easier than original, reduce the processing cost, in addition, reduce the probability that a plurality of runner junctions blockked up or the side leakage, improve the qualification rate of work piece, long service life, still reduce the runner mouth seepage risk that needs to block up, reduce work piece scrap probability, no seepage risk, can satisfy the market demand.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a schematic top view of FIG. 1;
FIG. 3 is a schematic cross-sectional view taken along line C-C of FIG. 2;
the cleaning cup comprises a cleaning cup body 1, a cleaning cup body 2, a water spraying ring 3, a fixed base 4, a liquid inlet hole 5, a liquid spraying hole 6, a first flow channel 7, a second flow channel 8, a first flow channel, a second flow channel 9, a second flow channel 10, a third flow channel 11, an installation through hole 12 and a channel.
Detailed Description
The invention will be further described with reference to the accompanying drawings and the following detailed description:
as shown in fig. 1, 2 and 3, a silicon wafer cleaning mechanism for a developing machine comprises a cleaning cup body 1, a water spray ring 2 and a fixed base 3, wherein the water spray ring 2 is fixedly arranged on the cleaning cup body 1, the fixed base 3 is fixedly arranged at the bottom of the cleaning cup body 1, the water spray ring 2 and the fixed base 3 are respectively provided with a corresponding mounting through hole 11, the cleaning cup body 1, the water spray ring 2 and the fixed base 3 are respectively and fixedly mounted in the mounting through holes 11 through screws, the side wall of the cleaning cup body 1 is provided with a plurality of uniformly distributed liquid inlet holes 4, the water spray ring 2 is provided with a plurality of uniformly distributed liquid spray holes 5, and a plurality of channels 12 for liquid circulation are arranged between the liquid inlet holes 4 and the liquid spray holes 5.
Wherein the passage 12 comprises a first flow passage 6, a second flow passage 7 and a third flow passage 10, respectively.
Wherein. The second flow passage 7 comprises a first flow passage 8 in the washing cup 1 and a second flow passage 9 in the water spray ring 2.
Wherein, the quantity of the liquid inlet holes 4 is four.
Wherein, the number of the liquid spraying holes 5 is four.
When the silicon wafer is cleaned, cleaning liquid flows through the first flow channel 6, the second flow channel 8, the second flow channel 9 and the third flow channel 10 from the four liquid inlet holes 4 respectively, and is sprayed out from the four liquid spraying holes 5 respectively to clean residual glue on the silicon wafer.
This silicon chip wiper mechanism has changed and has adopted twenty runners to supply liquid among the prior art, the utility model discloses well passageway 12 includes first runner 6 respectively, second runner 7 and third runner 10, wherein, second runner 7 has included second runner 8 and second runner two 9, every hydrojet point adopts four runners totally twelve runners promptly, the reduction of runner, its processing technology is easier than originally, reduce the processing cost, in addition, reduce the probability that a plurality of runner junctions blockked up or the side leakage, improve the qualification rate of work piece, long service life, still reduce the runner mouth seepage risk that needs to block up, reduce the work piece probability of scrapping, no seepage risk, can satisfy the market demand.
In conclusion, the novel anti-leakage device is simple to process, low in required cost, long in service life, free of leakage risk and capable of meeting market requirements.
Various other changes and modifications to the above embodiments and concepts will become apparent to those skilled in the art, and all such changes and modifications are intended to be included within the scope of the present invention as defined in the appended claims.
Claims (5)
1. The utility model provides a silicon chip wiper mechanism for developing machine which characterized in that: including wasing cup (1), spray ring (2) and unable adjustment base (3), spray ring (2) are fixed to be located wash on the cup (1), unable adjustment base (3) are fixed to be located wash the bottom of cup (1), wash and be equipped with corresponding installation through-hole (11) on cup (1), spray ring (2) and unable adjustment base (3) respectively, wash cup (1), spray ring (2) and unable adjustment base (3) and locate through the screw rod respectively carry out fixed mounting in installation through-hole (11), be equipped with several evenly distributed's feed liquor hole (4) on the lateral wall of washing cup (1), be equipped with the even spray hole (5) of several distribution on spray ring (2), feed liquor hole (4) with be equipped with several passageway (12) that are used for the liquid circulation between spray hole (5).
2. The silicon wafer cleaning mechanism for a developing machine according to claim 1, characterized in that: the channels (12) comprise a first flow channel (6), a second flow channel (7) and a third flow channel (10), respectively.
3. The silicon wafer cleaning mechanism for a developing machine according to claim 2, characterized in that: the second flow passage (7) comprises a first flow passage (8) positioned in the cleaning cup body (1) and a second flow passage (9) positioned in the water spraying ring (2).
4. The silicon wafer cleaning mechanism for a developing machine according to claim 1, characterized in that: the number of the liquid inlet holes (4) is four.
5. The silicon wafer cleaning mechanism for a developing machine according to claim 1, characterized in that: the number of the liquid spraying holes (5) is four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023086228.7U CN214289623U (en) | 2020-12-21 | 2020-12-21 | Silicon chip cleaning mechanism for developing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023086228.7U CN214289623U (en) | 2020-12-21 | 2020-12-21 | Silicon chip cleaning mechanism for developing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214289623U true CN214289623U (en) | 2021-09-28 |
Family
ID=77858859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023086228.7U Active CN214289623U (en) | 2020-12-21 | 2020-12-21 | Silicon chip cleaning mechanism for developing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214289623U (en) |
-
2020
- 2020-12-21 CN CN202023086228.7U patent/CN214289623U/en active Active
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