CN214271025U - Physical vapor deposition equipment - Google Patents
Physical vapor deposition equipment Download PDFInfo
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- CN214271025U CN214271025U CN202120208301.9U CN202120208301U CN214271025U CN 214271025 U CN214271025 U CN 214271025U CN 202120208301 U CN202120208301 U CN 202120208301U CN 214271025 U CN214271025 U CN 214271025U
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Abstract
The utility model provides a physical vapor deposition equipment, include: a deposition chamber and a motor; the process editing module comprises a process data storage unit and a process matching unit; the process data storage unit stores first type data and second type data, the first type data comprises deposition rate data and deposition condition data corresponding to the deposition rate data, and the second type data comprises data corresponding to the film thickness, the deposition rate and the motor running speed; the process matching unit is suitable for inputting the information of the film thickness to be deposited and is suitable for matching the characteristic deposition rate, the characteristic deposition condition and the motor characteristic running speed for the information of the film thickness to be deposited; the process editing module is suitable for transmitting the matched characteristic deposition rate and characteristic deposition conditions to the deposition chamber, and is also suitable for transmitting the matched motor characteristic running speed to the motor. The physical vapor deposition equipment realizes the intellectualization and the automatic adjustment of the process design.
Description
Technical Field
The utility model relates to a semiconductor device field, concretely relates to physical vapor deposition equipment.
Background
The Deposition process is a process commonly used in the semiconductor field, and the Physical Vapor Deposition (PVD) process is a technique of vaporizing a material source, i.e., a solid or a liquid surface, into gaseous atoms, molecules or partially ionized ions under a vacuum condition by using a Physical method, and depositing a thin film with a certain special function on the surface of a substrate through a low-pressure gas (or plasma) process.
The physical vapor deposition process is carried out in a physical vapor deposition apparatus.
At present, the process parameters of the physical vapor deposition equipment are set in engineering mostly depending on self experience, and the intellectualization and automatic adjustment of process design cannot be met.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model lies in overcoming and relies on the experience of self more when setting up the technological parameter of physical vapor deposition equipment during the engineering among the prior art, can't satisfy the intelligent defect of process design to a physical vapor deposition equipment is provided.
The utility model provides a physical vapor deposition equipment, include: deposition chamber and motor, its characterized in that still includes: the process editing module comprises a process data storage unit and a process matching unit; the process data storage unit stores first type data and second type data, wherein the first type data comprise deposition rate data and deposition condition data corresponding to the deposition rate data, and the second type data comprise data corresponding to the film thickness, the deposition rate and the motor running speed; the process matching unit is suitable for inputting the information of the film thickness to be deposited, and the process matching unit is suitable for matching the characteristic deposition rate, the characteristic deposition condition and the motor characteristic running speed for the information of the film thickness to be deposited according to the first type data and the second type data; the process editing module is suitable for transmitting the matched characteristic deposition rate and characteristic deposition conditions to the deposition chamber and transmitting the matched motor characteristic running speed to the motor.
Optionally, the deposition condition data includes: any one or combination of several of power supply, gas flow, chamber pressure and chamber temperature.
Optionally, the deposition condition data further includes: either or a combination of both of the gaseous material and the target standoff. In the second type of data, under the condition that the running speed of the motor is the same, the film thickness is in direct proportion to the deposition rate; the film thickness is inversely proportional to the motor operating speed for the same deposition rate.
Optionally, the process editing module further includes: the fine adjustment module is suitable for fine adjustment of the motor characteristic running speed matched by the process matching unit and outputting a motor target running speed; the process matching unit is also suitable for matching a target deposition rate and a target deposition condition according to the target running speed of the motor and the information of the film thickness to be deposited.
Optionally, the method further includes: and the judging module is suitable for comparing the characteristic running speed of the motor with the upper running limit speed and the lower running limit speed of the motor.
Optionally, the method further includes: the conveying belt is positioned at the bottom of the deposition chamber, a support plate is arranged on the surface of the conveying belt, and the support plate is suitable for bearing a workpiece to be coated; the motor is adapted to drive the conveyor belt.
Optionally, the method further includes: a position sensor in the deposition chamber, the position sensor being located above the conveyor belt, the position sensor being adapted to detect the position of the carrier plate in the deposition chamber.
Optionally, the method further includes: a cathode located at the top in the deposition chamber, the side of the cathode facing the conveyor belt being adapted to place a target.
Optionally, the cathode is a rotating cathode.
The technical scheme of the utility model following beneficial effect has:
1. the utility model discloses technical scheme provides a physical vapor deposition equipment, include: the process editing module comprises a process data storage unit and a process matching unit; the process data storage unit stores first type data and second type data, wherein the first type data comprise deposition rate data and deposition condition data corresponding to the deposition rate data, and the second type data comprise data corresponding to the film thickness, the deposition rate and the motor running speed; the process matching unit is suitable for inputting the information of the film thickness to be deposited, and the process matching unit is suitable for matching the characteristic deposition rate, the characteristic deposition condition and the motor characteristic running speed for the information of the film thickness to be deposited according to the first type data and the second type data. The physical vapor deposition equipment is provided with a process editing module, the process matching unit is used for inputting the information of the film thickness to be deposited, the process matching unit obtains the characteristic deposition rate matched with the information of the film thickness to be deposited and the motor characteristic running speed through the second type of data matching according to the input information of the film thickness to be deposited, and then the process matching unit obtains the characteristic deposition condition data corresponding to the required characteristic deposition rate through the first type of data according to the matched characteristic deposition rate, so that when the physical vapor deposition equipment carries out film coating, the required characteristic deposition condition and the motor characteristic running speed can be automatically matched according to the input information of the film thickness to be deposited, namely, the physical vapor deposition equipment can match the corresponding process parameters for the thickness of the film coating layer, and the intelligence and the automatic adjustment of process design are improved.
2. Further, the physical vapor deposition apparatus further includes: the fine adjustment module is suitable for fine adjustment of the motor characteristic running speed matched by the process matching unit and outputting a motor target running speed; the process matching unit is also suitable for matching a target deposition rate and a target deposition condition according to the target running speed of the motor and the information of the film thickness to be deposited. Because the physical vapor deposition equipment is influenced by the stability of the equipment and external environmental factors and the limit speed of the motor during actual working, the characteristic running speed of the motor can be adjusted through the fine adjustment module to obtain the target running speed of the motor, the process matching unit matches the target deposition rate and the target deposition condition according to the target running speed of the motor and the information of the thickness of the film to be deposited, and the physical vapor deposition equipment carries out film coating elimination influence through the target deposition rate, the target deposition condition and the target running speed of the motor to achieve the effect of process correction.
3. Further, the physical vapor deposition apparatus further includes: and the judging module is suitable for comparing the characteristic running speed of the motor with the upper running limit speed and the lower running limit speed of the motor. When the characteristic operation speed of the motor is higher than the upper limit speed of the motor, prompting that the thickness of the film to be deposited exceeds the deposition range of the physical vapor deposition equipment, and adjusting deposition conditions to perfect a process window; when the characteristic operation speed of the motor is lower than the lower limit speed of the motor, the fact that the thickness of the film to be deposited is too thick and exceeds the deposition range of the physical vapor deposition equipment is prompted, and deposition conditions need to be adjusted to complete a process window.
4. Further, still include: a position sensor adapted to detect a position of the carrier plate in the deposition chamber. Therefore, the coating starting and finishing time of the deposition chamber can be accurately controlled.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic connection diagram of a process editing module and a motor according to an embodiment of the present invention;
reference numerals:
1. a process editing module; 101. a process data storage unit; 102. a process matching unit; 103. a fine tuning module; 2. a first type of data; 3. a second type of data; 4. an electric motor.
Detailed Description
The thickness delta q t of a film layer coated by the PVD equipment is equal to q t, q is a deposition rate, t is deposition time, the deposition rate q is related to the process environment (power supply, gas types, gas flow and the like), the deposition time t is equal to process stroke d/motor running speed v, therefore, the hardware condition of the PVD equipment is unchanged, and the process stroke d is fixed. In the prior art, in order to obtain a desired film thickness, a process engineer needs to confirm a deposition rate q and adjust a motor operation speed v according to his own experience, so as to obtain the desired film thickness. The method has the defects of high requirements on experience of process engineers and incapability of predicting the thickness of the coating film layer in advance.
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The present embodiment provides a physical vapor deposition apparatus, please refer to fig. 1, which includes:
a deposition chamber;
the motor 4 is suitable for driving the conveyor belt to pass through the deposition chamber, and the workpiece to be coated is placed on the carrier plate above the conveyor belt;
the process editing module 1 comprises a process data storage unit 101 and a process matching unit 102;
the process data storage unit 101 stores first type data 2 and second type data 3, the first type data 2 including deposition rate data and deposition condition data corresponding to the deposition rate data, and the second type data 3 including data corresponding to film thickness, deposition rate and motor operating speed;
the process matching unit 102 is suitable for inputting the information of the film thickness to be deposited, and the process matching unit 102 is suitable for matching the characteristic deposition rate, the characteristic deposition condition and the motor characteristic running speed for the information of the film thickness to be deposited according to the first type data 2 and the second type data 3;
the process editing module 1 is adapted to transmit the matched characteristic deposition rate and characteristic deposition condition to the deposition chamber, and the process editing module 1 is adapted to transmit the matched motor characteristic running speed to the motor 4.
The storage medium of the process data storage unit 101 includes a hard disk, an optical disk, or a usb disk.
The process matching unit 102 includes a programmable logic controller. The physical vapor deposition equipment is provided with a process editing module 1, the process matching unit 102 is input with film thickness information to be deposited, the process matching unit 102 obtains the characteristic deposition rate and the motor characteristic running speed matched with the film thickness information to be deposited through the second type data 3 according to the input film thickness information to be deposited in a matching mode, and the process matching unit 102 obtains the characteristic deposition condition data corresponding to the required characteristic deposition rate through the first type data 2 according to the matched characteristic deposition rate.
The deposition condition data includes: the deposition condition data includes: any one or combination of several of power supply, gas flow, chamber pressure and chamber temperature. Further, the deposition condition data further includes: either or a combination of both of the gaseous material and the target standoff.
In the second type data 3, the film thickness is proportional to the deposition rate in the case where the motor operation speed is the same, and is inversely proportional to the motor operation speed in the case where the deposition rate is the same.
With continued reference to fig. 1, the physical vapor deposition apparatus further includes: the fine adjustment module 103 is adapted to perform fine adjustment on the motor characteristic operation speed matched by the process matching unit 102 and output a motor target operation speed; the process matching unit 102 is further adapted to match a target deposition rate and a target deposition condition according to the target operation speed of the motor and the information of the film thickness to be deposited.
Because the physical vapor deposition equipment is affected by the stability of the equipment and external environmental factors during actual operation and the limiting speed factor of the motor, the characteristic operation speed of the motor can be adjusted through the fine adjustment module 103 to obtain the target operation speed of the motor, the process matching unit 102 matches the target deposition rate and the target deposition condition according to the target operation speed of the motor and the information of the thickness of the film to be deposited, and the physical vapor deposition equipment carries out film coating elimination through the target deposition rate, the target deposition condition and the target operation speed of the motor to achieve the effect of process correction.
The process editing module is adapted to transmit the matched target deposition rate and target deposition condition to the deposition chamber, and the process editing module is adapted to transmit the matched target operation speed of the motor to the motor 4.
The physical vapor deposition apparatus further comprises: a judging module (not shown in the figure) adapted to compare the motor characteristic operating speed with the motor operation upper limit speed and the motor operation lower limit speed.
When the characteristic operation speed of the motor is higher than the upper limit speed of the motor, prompting that the thickness of the film to be deposited exceeds the deposition range of the physical vapor deposition equipment, and adjusting deposition conditions to perfect a process window; when the characteristic operation speed of the motor is lower than the lower limit speed of the motor, the fact that the thickness of the film to be deposited is too thick and exceeds the deposition range of the physical vapor deposition equipment is prompted, and deposition conditions need to be adjusted to complete a process window.
The physical vapor deposition apparatus further comprises: the conveying belt is positioned at the bottom of the deposition chamber, a support plate is arranged on the surface of the conveying belt, and the support plate is suitable for bearing a workpiece to be coated.
The motor 4 is adapted to drive the conveyor belt.
The physical vapor deposition apparatus further comprises: a position sensor in the deposition chamber, the position sensor being located above the conveyor belt, the position sensor being adapted to detect the position of the carrier plate in the deposition chamber. Therefore, the coating starting and finishing time of the deposition chamber can be accurately controlled.
The physical vapor deposition apparatus further comprises: a cathode located at the top in the deposition chamber, the side of the cathode facing the conveyor belt being adapted to place a target.
A cathode is positioned over the position sensor.
The cathode is preferably a rotating cathode, and has better coating uniformity.
When the physical vapor deposition equipment is used, the information of the film thickness to be deposited is input through the process matching unit 102, a product (such as a wafer waiting for film coating workpiece) needing film coating is placed on a carrier plate, the carrier plate is placed on a conveyor belt, the process matching unit 102 is suitable for matching the characteristic deposition rate, the characteristic deposition condition and the motor characteristic running speed for the information of the film thickness to be deposited according to the first type data 2 and the second type data 3, and the conveyor belt is conveyed in a deposition chamber through a motor at the motor characteristic running speed; and in the deposition chamber, under the characteristic deposition rate and the characteristic deposition condition, the target material on the cathode is bombarded and sputtered on the product by the plasma to realize film coating.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (10)
1. A physical vapor deposition apparatus, comprising: deposition chamber and motor, its characterized in that still includes:
the process editing module comprises a process data storage unit and a process matching unit;
the process data storage unit stores first type data and second type data, wherein the first type data comprise deposition rate data and deposition condition data corresponding to the deposition rate data, and the second type data comprise data corresponding to the film thickness, the deposition rate and the motor running speed;
the process matching unit is suitable for inputting the information of the film thickness to be deposited, and the process matching unit is suitable for matching the characteristic deposition rate, the characteristic deposition condition and the motor characteristic running speed for the information of the film thickness to be deposited according to the first type data and the second type data;
the process editing module is suitable for transmitting the matched characteristic deposition rate and characteristic deposition conditions to the deposition chamber and transmitting the matched motor characteristic running speed to the motor.
2. The physical vapor deposition apparatus of claim 1, wherein the deposition condition data comprises: any one or combination of several of power supply, gas flow, chamber pressure and chamber temperature.
3. The physical vapor deposition apparatus of claim 2, wherein the deposition condition data further comprises: either or a combination of both of the gaseous material and the target standoff.
4. The physical vapor deposition apparatus according to claim 1, wherein in the second type of data, the film thickness is proportional to the deposition rate at the same motor operating speed; the film thickness is inversely proportional to the motor operating speed for the same deposition rate.
5. The physical vapor deposition apparatus of claim 1, wherein the process editing module further comprises: the fine adjustment module is suitable for fine adjustment of the motor characteristic running speed matched by the process matching unit and outputting a motor target running speed;
the process matching unit is also suitable for matching a target deposition rate and a target deposition condition according to the target running speed of the motor and the information of the film thickness to be deposited.
6. The physical vapor deposition apparatus of claim 1, further comprising: and the judging module is suitable for comparing the characteristic running speed of the motor with the upper running limit speed and the lower running limit speed of the motor.
7. The physical vapor deposition apparatus of any of claims 1-6, further comprising: the conveying belt is positioned at the bottom of the deposition chamber, a support plate is arranged on the surface of the conveying belt, and the support plate is suitable for bearing a workpiece to be coated;
the motor is adapted to drive the conveyor belt.
8. The physical vapor deposition apparatus of claim 7, further comprising: a position sensor in the deposition chamber, the position sensor being located above the conveyor belt, the position sensor being adapted to detect the position of the carrier plate in the deposition chamber.
9. The physical vapor deposition apparatus of claim 7, further comprising: a cathode located at the top in the deposition chamber, the side of the cathode facing the conveyor belt being adapted to place a target.
10. The physical vapor deposition apparatus of claim 9, wherein the cathode is a rotating cathode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120208301.9U CN214271025U (en) | 2021-01-22 | 2021-01-22 | Physical vapor deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120208301.9U CN214271025U (en) | 2021-01-22 | 2021-01-22 | Physical vapor deposition equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214271025U true CN214271025U (en) | 2021-09-24 |
Family
ID=77768587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120208301.9U Expired - Fee Related CN214271025U (en) | 2021-01-22 | 2021-01-22 | Physical vapor deposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214271025U (en) |
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2021
- 2021-01-22 CN CN202120208301.9U patent/CN214271025U/en not_active Expired - Fee Related
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Granted publication date: 20210924 |
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| CF01 | Termination of patent right due to non-payment of annual fee |