CN214039034U - A semiconductor refrigeration device for ship cabin - Google Patents
A semiconductor refrigeration device for ship cabin Download PDFInfo
- Publication number
- CN214039034U CN214039034U CN202023159570.5U CN202023159570U CN214039034U CN 214039034 U CN214039034 U CN 214039034U CN 202023159570 U CN202023159570 U CN 202023159570U CN 214039034 U CN214039034 U CN 214039034U
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- Prior art keywords
- base plate
- refrigeration
- heat dissipation
- locking
- semiconductor
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 84
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- 230000037431 insertion Effects 0.000 claims 5
- 238000003780 insertion Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 abstract description 30
- 238000009434 installation Methods 0.000 abstract description 11
- 238000001816 cooling Methods 0.000 abstract 6
- 230000000694 effects Effects 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型公开了一种用于船舶舱室的半导体制冷装置，包括散热基板、制冷基板、半导体制冷片，所述制冷基板位于散热基板的上方，所述半导体制冷片位于制冷基板的内侧，所述制冷基板的一侧通过铰链与散热基板转动连接，所述制冷基板的另一侧固定连接有连接块，所述散热基板上端设有与连接块对应的连接槽，所述散热基板的侧壁上开设有安装槽，所述安装槽内设有用于固定连接块的锁紧机构，所述制冷基板上端设有制冷翅片，所述散热基板的下端设有散热翅片。本实用新型性能可靠，结构简单，具有较高的制冷性能，且半导体制冷片的安装、拆卸便捷，极大方便了半导体制冷片安装、拆卸时的操作。
The utility model discloses a semiconductor refrigeration device for a ship cabin, comprising a heat dissipation substrate, a refrigeration substrate and a semiconductor refrigeration sheet. The refrigeration substrate is located above the heat dissipation substrate, and the semiconductor refrigeration sheet is located inside the refrigeration substrate. One side of the cooling base plate is rotatably connected to the heat dissipation base plate through a hinge, the other side of the cooling base plate is fixedly connected with a connecting block, the upper end of the heat dissipation base plate is provided with a connecting groove corresponding to the connecting block, and the side wall of the heat dissipation base plate is provided with a connecting block. An installation groove is provided, a locking mechanism for fixing the connection block is arranged in the installation groove, a cooling fin is arranged on the upper end of the cooling base plate, and a cooling fin is arranged at the lower end of the cooling base plate. The utility model has reliable performance, simple structure, high refrigerating performance, and convenient installation and disassembly of the semiconductor refrigerating sheet, which greatly facilitates the installation and disassembly of the semiconductor refrigerating sheet.
Description
Technical Field
The utility model relates to a boats and ships cabin refrigeration technology field especially relates to a semiconductor refrigerating plant for boats and ships cabin.
Background
The prior ship refrigeration cabin adopts a compressor refrigeration system as a refrigeration source, but the structure of the compressor refrigeration system is complex, the compressor refrigeration system needs a refrigerant as a refrigeration carrier, the refrigerant causes great pollution to the environment, and a semiconductor refrigeration device is adopted for refrigeration.
However, the semiconductor refrigeration pieces mounted on the existing semiconductor refrigeration device are usually mounted and fixed on the periphery through a plurality of bolts, so that the semiconductor refrigeration pieces are complex to mount, and are inconvenient to replace and disassemble, and therefore, the semiconductor refrigeration device for the ship cabin needs to be designed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects in the prior art and providing a semiconductor refrigerating device for a ship cabin.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a semiconductor refrigerating plant for boats and ships cabin, includes heat dissipation base plate, refrigeration base plate, semiconductor refrigeration piece, the refrigeration base plate is located the top of heat dissipation base plate, the semiconductor refrigeration piece is located the inboard of refrigeration base plate, one side of refrigeration base plate is passed through the hinge and is connected with the rotation of heat dissipation base plate, the opposite side fixedly connected with connecting block of refrigeration base plate, heat dissipation base plate upper end is equipped with the spread groove that corresponds with the connecting block, the mounting groove has been seted up on the lateral wall of heat dissipation base plate, be equipped with the locking mechanism who is used for fixed connection piece in the mounting groove, refrigeration base plate upper end is equipped with the refrigeration fin, the lower extreme of heat dissipation base plate is equipped with radiating fin.
Preferably, locking mechanism is including setting up the locking inserted bar in the mounting groove, the one end of locking inserted bar runs through the inner wall of mounting groove and extends to the spread groove in, be equipped with the locking slot with locking inserted bar adaptation on the connecting block, the cover is equipped with the extension spring on the locking inserted bar, the both ends of extension spring are connected respectively on the inner wall of locking inserted bar, mounting groove.
Preferably, the four corners of the heat dissipation substrate are provided with bolt holes, and first bolts are arranged in the bolt holes.
Preferably, both sides of the lower end of the heat dissipation substrate are fixedly connected with mounting columns, a heat dissipation fan is arranged below the heat dissipation substrate, and the heat dissipation fan is fixedly mounted on the mounting columns through second bolts.
Preferably, a limiting plate is arranged at the upper end of the heat dissipation substrate, and the limiting plate surrounds the outer side of the semiconductor refrigeration sheet.
Preferably, the locking inserted bar is located the one end in the spread groove and is the tip, the one end fixedly connected with pull ring that the locking inserted bar is located the mounting groove.
The utility model has the advantages that:
through setting up locking mechanism, can be with stable locking of connecting block in the spread groove through the locking inserted bar, it is fixed with refrigeration base plate locking, and then fixed with the semiconductor refrigeration piece, and when needing to be changed, dismantling the semiconductor refrigeration piece, only need pull out the spread groove with the locking inserted bar through the pull ring, will refrigerate the base plate and turn up and can take off the semiconductor refrigeration piece fast, convenient operation is swift, greatly improves operating efficiency.
Through setting up the limiting plate, can carry out effectual spacing fixed to the semiconductor refrigeration piece for the semiconductor refrigeration piece installation is stable.
Through setting up radiator fan, can further dispel the heat to radiating fin, and then improve the heat dispersion of radiating basal plate, can improve the refrigeration effect of refrigeration base plate.
The utility model discloses the dependable performance, simple structure has higher refrigeration performance, and the installation of semiconductor refrigeration piece, dismantlement are convenient, have greatly made things convenient for the operation when semiconductor refrigeration piece installs, dismantles.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor refrigeration device for a ship cabin according to the present invention;
FIG. 2 is an enlarged view of FIG. 1 at A;
fig. 3 is a schematic top view of a heat dissipation substrate of a semiconductor refrigeration device for a ship cabin according to the present invention.
In the figure: the structure comprises a heat dissipation substrate 1, a first bolt 2, a hinge 3, a refrigeration substrate 4, a refrigeration fin 5, a semiconductor refrigeration sheet 6, a limiting plate 7, an installation column 8, a second bolt 9, a heat dissipation fan 10, a heat dissipation fin 11, a bolt hole 12, an installation groove 13, a pull ring 14, a locking inserted bar 15, a tension spring 16, a connecting block 17, a locking slot 18 and a connecting groove 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-3, a semiconductor refrigeration device for ship cabins comprises a heat dissipation substrate 1, a refrigeration substrate 4, and semiconductor refrigeration sheets 6, wherein bolt holes 12 are formed at four corners of the heat dissipation substrate 1, first bolts 2 are arranged in the bolt holes 12, the refrigeration substrate 4 is positioned above the heat dissipation substrate 1, the semiconductor refrigeration sheets 6 are positioned at the inner side of the refrigeration substrate 4, the upper refrigeration surface of the semiconductor refrigeration sheets 6 is in contact with the refrigeration substrate 4, the lower heat dissipation surface is in contact with the heat dissipation substrate 1, one side of the refrigeration substrate 4 is rotatably connected with the heat dissipation substrate 1 through hinges 3, the other side of the refrigeration substrate 4 is fixedly connected with a connecting block 17, a connecting groove 19 corresponding to the connecting block 17 is arranged at the upper end of the heat dissipation substrate 1, an installation groove 13 is formed in the side wall of the heat dissipation substrate 1, a locking mechanism for fixing the connecting block 17 is arranged in the installation groove 13, and refrigeration fins 5 are arranged at the upper end of the refrigeration substrate 4, the lower end of the heat radiating base plate 1 is provided with heat radiating fins 11.
The utility model discloses in, locking mechanism is including setting up locking inserted bar 15 in mounting groove 13, the one end of locking inserted bar 15 runs through the inner wall of mounting groove 13 and extends to in the spread groove 19, be equipped with the locking slot 18 with locking inserted bar 15 adaptation on connecting block 17, the cover is equipped with extension spring 16 on the locking inserted bar 15, the both ends of extension spring 16 are connected respectively at locking inserted bar 15, mounting groove 13's inner wall, the one end that locking inserted bar 15 is located spread groove 19 is the tip, when connecting block 17 in spread groove 19, through directly supporting the lower extreme that presses locking inserted bar 15 with connecting block 17, can make locking inserted bar 15 remove, locking inserted bar 15 inserts locking slot 18 under the pulling force effect of extension spring 16 in, can be fixed with connecting block 17 locking, locking inserted bar 15 is located the one end fixedly connected with pull ring 14 in mounting groove 13.
Further, the mounting columns 8 are fixedly connected to two sides of the lower end of the heat dissipation substrate 1, the heat dissipation fan 10 is arranged below the heat dissipation substrate 1, the heat dissipation fan 10 is fixedly mounted on the mounting columns 8 through the second bolts 9, the heat dissipation fins 11 can be further dissipated through the heat dissipation fan 10, the heat dissipation performance of the heat dissipation substrate 1 is further improved, and the refrigeration effect of the refrigeration substrate 4 can be improved.
Further, 1 upper end of heat dissipation base plate is equipped with limiting plate 7, and limiting plate 7 encloses to be established in the outside of semiconductor refrigeration piece 6, can carry out effectual spacing fixed to semiconductor refrigeration piece 6 for semiconductor refrigeration piece 6 installation is stable.
The utility model discloses during the use, can be with stable locking of connecting block 17 in spread groove 19 through locking inserted bar 15, it is fixed to refrigerate base plate 4 locking, and then it is fixed with semiconductor refrigeration piece 6, and need change, when dismantling semiconductor refrigeration piece 6, only need pull ring 14 with locking inserted bar 15 pull out spread groove 19, it can take off semiconductor refrigeration piece 6 fast to have turned up refrigeration base plate 4, convenient operation is swift, greatly improve operating efficiency, can further dispel the heat to radiating fin 11 through radiator fan 10, and then improve radiating basal plate 1's heat dispersion, can improve refrigeration base plate 4's refrigeration effect.
Above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a semiconductor refrigerating plant for boats and ships cabin, includes radiating basal plate (1), refrigeration base plate (4), semiconductor refrigeration piece (6), its characterized in that, refrigeration base plate (4) are located the top of radiating basal plate (1), semiconductor refrigeration piece (6) are located the inboard of refrigeration base plate (4), one side of refrigeration base plate (4) is passed through hinge (3) and is connected with radiating basal plate (1) rotation, the opposite side fixedly connected with connecting block (17) of refrigeration base plate (4), radiating basal plate (1) upper end is equipped with spread groove (19) that correspond with connecting block (17), mounting groove (13) have been seted up on the lateral wall of radiating basal plate (1), be equipped with the locking mechanism who is used for fixed connection block (17) in mounting groove (13), refrigeration base plate (4) upper end is equipped with refrigeration fin (5), the lower end of the heat dissipation base plate (1) is provided with heat dissipation fins (11).
2. The semiconductor refrigerating device for the ship cabin is characterized in that the locking mechanism comprises a locking insertion rod (15) arranged in a mounting groove (13), one end of the locking insertion rod (15) penetrates through the inner wall of the mounting groove (13) and extends into a connecting groove (19), a locking slot (18) matched with the locking insertion rod (15) is formed in the connecting block (17), a tension spring (16) is sleeved on the locking insertion rod (15), and two ends of the tension spring (16) are connected to the inner walls of the locking insertion rod (15) and the mounting groove (13) respectively.
3. The semiconductor refrigeration device for the ship cabin is characterized in that bolt holes (12) are formed in four corners of the heat dissipation base plate (1), and first bolts (2) are arranged in the bolt holes (12).
4. The semiconductor refrigeration device for the ship cabin is characterized in that mounting columns (8) are fixedly connected to two sides of the lower end of the heat dissipation base plate (1), a heat dissipation fan (10) is arranged below the heat dissipation base plate (1), and the heat dissipation fan (10) is fixedly mounted on the mounting columns (8) through second bolts (9).
5. The semiconductor refrigeration device for the ship cabin is characterized in that a limiting plate (7) is arranged at the upper end of the heat dissipation base plate (1), and the limiting plate (7) is enclosed outside the semiconductor refrigeration sheet (6).
6. A semiconductor refrigeration unit for ship's cabins according to claim 2, characterized in that the end of the locking bayonet (15) in the connecting groove (19) is a beveled end, and the end of the locking bayonet (15) in the mounting groove (13) is fixedly connected with the pulling ring (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023159570.5U CN214039034U (en) | 2020-12-24 | 2020-12-24 | A semiconductor refrigeration device for ship cabin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023159570.5U CN214039034U (en) | 2020-12-24 | 2020-12-24 | A semiconductor refrigeration device for ship cabin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214039034U true CN214039034U (en) | 2021-08-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023159570.5U Expired - Fee Related CN214039034U (en) | 2020-12-24 | 2020-12-24 | A semiconductor refrigeration device for ship cabin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214039034U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114698339A (en) * | 2022-03-24 | 2022-07-01 | 江苏科技大学 | Cooling and heat dissipation system of ship electric cabinet |
-
2020
- 2020-12-24 CN CN202023159570.5U patent/CN214039034U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114698339A (en) * | 2022-03-24 | 2022-07-01 | 江苏科技大学 | Cooling and heat dissipation system of ship electric cabinet |
| CN114698339B (en) * | 2022-03-24 | 2024-06-11 | 江苏科技大学 | Cooling and heat dissipation system of ship electric cabinet |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210824 |