CN213845257U - Novel IGBT heat dissipation assembly structure - Google Patents
Novel IGBT heat dissipation assembly structure Download PDFInfo
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- CN213845257U CN213845257U CN202022981117.6U CN202022981117U CN213845257U CN 213845257 U CN213845257 U CN 213845257U CN 202022981117 U CN202022981117 U CN 202022981117U CN 213845257 U CN213845257 U CN 213845257U
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- Prior art keywords
- heat dissipation
- igbt
- aluminum
- assembly structure
- aluminum substrate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 53
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 79
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 79
- 238000003466 welding Methods 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 59
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000004411 aluminium Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract 3
- 239000004519 grease Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a novel IGBT heat dissipation assembly structure, including control panel, heating panel and a plurality of IGBT power devices, set up a plurality of pad holes corresponding with IGBT power devices on the control panel, two relative sides on the heating panel are installed aluminium base board respectively to make the metal level on the aluminium base board contact with the heating panel, form a plurality of printed circuit on the circuit layer of aluminium base board; the IGBT power device is welded on the printed circuit; and pins on the IGBT power device are inserted into the pad holes on the control board, and the pins are fixedly connected with the control board in a welding mode. The assembly structure is simple, convenient to operate, good in consistency and stronger in heat dissipation performance, and production capacity of the controller can be effectively improved.
Description
Technical Field
The utility model relates to an electronic components technical field, more specifically say, it relates to a novel IGBT heat dissipation assembly structure.
Background
The IGBT is a power device and is used for electronic phase change in brushless motor control, wherein G is a control electrode, C is an input electrode, E is an output electrode, and when the motor works, the control panel controls the connection and disconnection between the C electrode and the E electrode by controlling the G electrode level of 6 IGBTs, so that current flows in a motor coil and the motor operation is maintained. Fig. 4 shows that the front of the IGBT is molded, fig. 5 shows that the back metal pad of the IGBT is formed, and the IGBT is provided with an IGBT E pole pin, an IGBT C pole pin and an IGBT G pole pin, wherein the C pole pin is communicated with the back metal pad, and the IGBT generates a large amount of heat when the motor operates, and the heat needs to be conducted out through the metal pad through a heat sink, so as to achieve the purpose that the control temperature does not exceed the safe temperature of the device.
In the control panel of brushless electric tool of high voltage direct current, need use 6 IGBT power devices, the heat dissipation mode usually is to pass through the screw lock with the IGBT and dispel the heat on the fin, this kind of assembly process needs the pure manual completion, paste insulating pad on the IGBT earlier, insulating pad two sides coating heat conduction silicone grease, lock the screw for the IGBT to the fin again, (must overlap insulating particle on the screw, prevent IGBT metal pad and fin short circuit), and define the IGBT position through location frock, insert again and carry out the wave-soldering in the pad hole of PCB board. The process needs to consume a large amount of labor cost, has low production efficiency and is generally the bottleneck of the production process of the control panel.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model provides a novel IGBT heat dissipation assembly structure, this assembly structure is simple, convenient operation, the uniformity is good and heat dispersion is stronger, can effectual improvement controller's production productivity.
In order to achieve the above purpose, the utility model provides a following technical scheme: a novel IGBT heat dissipation assembly structure comprises a control board, a heat dissipation plate and a plurality of IGBT power devices, wherein a plurality of pad holes corresponding to the IGBT power devices are formed in the control board, aluminum substrates are respectively installed on two opposite side surfaces of the heat dissipation plate, metal layers on the aluminum substrates are in contact with the heat dissipation plate, and a plurality of printed circuits are formed on circuit layers of the aluminum substrates;
the IGBT power device is welded on the printed circuit; and pins on the IGBT power device are inserted into the pad holes on the control board, and the pins are fixedly connected with the control board in a welding mode.
The specific assembly steps of the IGBT are as follows: 1) placing a plurality of IGBTs on one aluminum substrate, aligning a metal pad on the back of each IGBT with a circuit layer on the aluminum substrate, and welding the plurality of IGBTs on the aluminum substrate after welding; 2) welding a plurality of IGBTs on the other aluminum substrate according to the steps; 3) the two aluminum substrates are arranged on two opposite side surfaces of the heat dissipation plate through fasteners; 4) and installing the aluminum substrate and the heat dissipation plate, which are assembled with the plurality of IGBTs, on the control board, inserting pins on the IGBTs into welding holes on the control board, and welding the control board in the welding holes of the control board through the pins of the IGBTs by wave soldering. The assembly structure is simple, convenient to operate, good in consistency and stronger in heat dissipation performance, and production capacity of the controller can be effectively improved.
Preferably, the metal layer of the aluminum substrate is made of aluminum.
Preferably, the two aluminum substrates are symmetrically arranged on two opposite side surfaces of the heat dissipation plate, the two aluminum substrates are respectively a first aluminum substrate and a second aluminum substrate, and the plurality of fasteners sequentially penetrate through the first aluminum substrate, the heat dissipation plate and the second aluminum substrate to fixedly connect the first aluminum substrate, the heat dissipation plate and the second aluminum substrate.
Preferably, the heat dissipation plate is made of one material selected from copper, aluminum and iron.
Preferably, the heat dissipation plate is made of aluminum.
Preferably, three printed circuits are formed on the aluminum substrate.
To sum up, the utility model discloses following beneficial effect has:
1. the assembly structure is simple, the operation is convenient, the consistency is good, the heat dissipation performance is stronger, and the production capacity of the controller can be effectively improved;
2. most assembly steps of the assembly structure are completed by a machine, assembly steps which need more labor cost such as coating heat conduction silicone grease, pasting an insulating sheet, sleeving insulating particles, positioning and IGBT locking screws are omitted, and the assembly steps are manually completed only when the aluminum substrate and the heat dissipation plate are fixed and the whole module is inserted into a control plate, so that the assembly efficiency is improved, the working hours are reduced, and the productivity is increased;
3. this assembly structure adopts aluminium base board and IGBT welded mode, has better heat-conduction performance than IGBT through insulating piece and heat conduction silicone grease and the connection of aluminium fin, has improved the radiating effect.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic front view of the assembly of the heat dissipation plate and the aluminum substrate;
FIG. 3 is a schematic structural view of the back surface of the heat sink and the aluminum substrate;
FIG. 4 is a schematic front structure diagram of an IGBT power device;
FIG. 5 is a schematic structural diagram of the back side of an IGBT power device;
fig. 6 is a cross-sectional view of the present invention;
fig. 7 is an enlarged view of a portion a in fig. 6.
Reference numerals: 1. a control panel; 2. a heat dissipation plate; 3. an IGBT power device; 4. an aluminum substrate; 5. a circuit layer; 6. a through hole; 7. and (7) a pin.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
The embodiment discloses a novel IGBT heat dissipation assembly structure, as shown in fig. 1-7, which comprises a control board 1, a heat dissipation plate 2 and a plurality of IGBT power devices 3, wherein the IGBT power devices 3 are provided with a plurality of pins 7, the control board 1 is provided with a plurality of pad holes corresponding to the IGBT power devices 3, two opposite side surfaces of the heat dissipation plate 2 are respectively provided with an aluminum substrate 4, a metal layer on the aluminum substrate 4 is in contact with the heat dissipation plate 2, and a circuit layer 5 of the aluminum substrate 4 is etched by adopting electrolytic copper foil to form a printed circuit to form a plurality of printed circuits; windowing the printed circuit, brushing solder paste, melting the solder paste during welding, and welding the metal pad on the back of the IGBT and the circuit layer 5 of the aluminum substrate 4 together; and a pin 7 on the IGBT power device 3 is inserted into a pad hole on the control board 1, and the pin 7 is fixedly connected with the control board 1 in a welding mode. The specific assembly steps of the IGBT are as follows: 1) placing a plurality of IGBTs on one aluminum substrate 4, aligning a metal pad on the back of each IGBT with a circuit layer 5 on the aluminum substrate 4, and welding the plurality of IGBTs on the aluminum substrate 4 after welding; 2) the other aluminum substrate 4 is welded with a plurality of IGBTs according to the steps; 3) the two aluminum substrates 4 are arranged on two opposite side surfaces of the heat dissipation plate 2 through fasteners; 4) the aluminum substrate 4 and the heat dissipation plate 2, on which a plurality of IGBTs are assembled, are mounted on the control board 1, and the pins 7 on the IGBTs are inserted into the welding holes on the control board 1, and the control board 1 is welded in the welding holes of the control board 1 through the pins 7 of the IGBTs by wave soldering.
The technical scheme has the following advantages: 1) the assembly structure is simple, the operation is convenient, the consistency is good, the heat dissipation performance is stronger, and the production capacity of the controller can be effectively improved; 2) most assembly steps of the assembly structure are completed by a machine, assembly steps of coating heat conduction silicone grease, pasting an insulating sheet, sleeving insulating particles, positioning, IGBT lock screws and the like which need to spend more labor cost are omitted, the assembly structure is manually completed only when the aluminum substrate 4 and the aluminum radiating fins are fixed and the whole module is inserted into the control board 1, the assembly efficiency is improved, the working hours are reduced, and the productivity is increased. 3) The assembly structure adopts a mode of welding the aluminum substrate 4 and the IGBT, has better heat conduction performance than the mode that the IGBT is connected with an aluminum radiating fin through an insulating sheet and heat conduction silicone grease, and improves the radiating effect; 4) compared with the traditional FR-4 plate, the aluminum substrate 4 can bear higher current by adopting the same thickness and line width; 5) compared with the traditional connection mode of the IGBT, the insulation sheet and the radiating fin, the heat-conducting property of the insulation layer of the aluminum substrate 4 is stronger, and the heat radiation of the IGBT is more facilitated.
Preferably, the two aluminum substrates 4 are symmetrically disposed on two opposite side surfaces of the heat sink 2, the two aluminum substrates 4 are respectively a first aluminum substrate 4 and a second aluminum substrate 4, and the plurality of fasteners sequentially pass through the through holes 6 on the first aluminum substrate 4, the heat sink 2 and the second aluminum substrate 4 to fixedly connect the three. Compared with the mode that the two aluminum substrates 4 are respectively matched with the heat dissipation plate 2 through the fasteners, the assembling mode simplifies assembling steps and improves working efficiency.
The material of the metal layer commonly used in the aluminum substrate 4 is aluminum, copper or iron; among the three, the copper has the best heat dissipation effect (heat dissipation performance: copper is more than aluminum is more than iron), the price is the highest, the hardness of iron is higher, the requirement on the production process is high, and the manufacturing difficulty is high; the aluminum has good heat dissipation, mature manufacturing process, high cost performance and wide application.
The heat sink 2 is made of aluminum. The middle heat dissipation plate 2 can be made of copper, aluminum, iron or other metal materials with good heat dissipation performance, the copper has the best heat dissipation performance, and the defect is high price; the aluminum has good heat dissipation capability, light material, high cost performance and wide application; iron has poorer heat dissipation performance than aluminum, is easy to oxidize and corrode, and is not suitable for the environment of tools with high temperature, high humidity and the like.
In the above-described embodiment, three wiring layers 5 are formed on the aluminum substrate 4.
The directions given in the present embodiment are merely for convenience of describing positional relationships between the respective members and the relationship of fitting with each other. It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (6)
1. The utility model provides a novel IGBT heat dissipation assembly structure, characterized by: the LED power module comprises a control board (1), a heat dissipation plate (2) and a plurality of IGBT power devices (3), wherein a plurality of pad holes corresponding to the IGBT power devices (3) are formed in the control board (1), aluminum substrates (4) are respectively installed on two opposite side faces of the heat dissipation plate (2), metal layers on the aluminum substrates (4) are in contact with the heat dissipation plate (2), and the IGBT power devices (3) are welded on a circuit layer (5) of the aluminum substrates (4);
a pin (7) on the IGBT power device (3) is inserted into a pad hole on the control board (1), and the pin (7) is fixedly connected with the control board (1) in a welding mode.
2. The novel IGBT heat dissipation assembly structure of claim 1, characterized in that: the metal layer of the aluminum substrate (4) is made of aluminum.
3. The novel IGBT heat dissipation assembly structure of claim 1, characterized in that: the two aluminum substrates (4) are symmetrically arranged on two opposite side faces of the heat dissipation plate (2), the two aluminum substrates (4) are respectively a first aluminum substrate (4) and a second aluminum substrate (4), and the fasteners sequentially penetrate through the first aluminum substrate (4), the heat dissipation plate (2) and the second aluminum substrate (4) to fixedly connect the first aluminum substrate, the heat dissipation plate and the second aluminum substrate.
4. The novel IGBT heat dissipation assembly structure of claim 1, characterized in that: the material of the heat dissipation plate (2) comprises one of copper, aluminum and iron.
5. The novel IGBT heat dissipation assembly structure of claim 4, characterized in that: the heat dissipation plate (2) is made of aluminum.
6. The novel IGBT heat dissipation assembly structure of claim 1, characterized in that: the three circuit layers (5) are formed on the aluminum substrate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022981117.6U CN213845257U (en) | 2020-12-11 | 2020-12-11 | Novel IGBT heat dissipation assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022981117.6U CN213845257U (en) | 2020-12-11 | 2020-12-11 | Novel IGBT heat dissipation assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213845257U true CN213845257U (en) | 2021-07-30 |
Family
ID=76999091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022981117.6U Active CN213845257U (en) | 2020-12-11 | 2020-12-11 | Novel IGBT heat dissipation assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213845257U (en) |
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2020
- 2020-12-11 CN CN202022981117.6U patent/CN213845257U/en active Active
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