CN213713020U - Power supply heat dissipation device - Google Patents
Power supply heat dissipation device Download PDFInfo
- Publication number
- CN213713020U CN213713020U CN202120021071.5U CN202120021071U CN213713020U CN 213713020 U CN213713020 U CN 213713020U CN 202120021071 U CN202120021071 U CN 202120021071U CN 213713020 U CN213713020 U CN 213713020U
- Authority
- CN
- China
- Prior art keywords
- power supply
- heat
- heat sink
- fins
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 241001465382 Physalis alkekengi Species 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a power supply heat dissipation device, which comprises a shell, a cover body, a heat dissipation sheet and a heat conduction pad, wherein a cavity is formed inside the shell, a power supply board is arranged inside the cavity, the shell is provided with first fins on a side plate towards the outside, and the heat dissipation sheet is arranged between the side plate and the power supply board; the cover body is fixed on the shell, and is provided with second fins towards the outer side and a lug boss towards the inner side; the heat conducting pad is arranged between the boss and the power panel. In the power supply heat dissipation device, the shell and the cover body form an integral heat dissipation structure, and the heat dissipation sheet and the heat conduction pad are additionally arranged in the cavity of the shell, so that heat generated by the power supply board can be dissipated out through the shell and the cover body in time, and the service life of an LED lamp of a medium-power and high-power supply is prolonged.
Description
Technical Field
The utility model belongs to the technical field of the radiating technique of lamps and lanterns and specifically relates to a well powerful power heat abstractor is related to.
Background
In commercial lighting systems, to increase the illumination level, LED lamps of medium and high power are generally used. The LED lamp with medium and high power is easy to generate faults under the condition of overhigh temperature, the service life of the lamp is influenced, and the illumination can be stopped.
At present, a glue pouring process is mainly adopted for radiating a power supply of an LED lamp with medium and high power, the cost is high, the requirements on glue materials and the glue pouring process are high, and the glue can react with electronic components chemically to influence the reliability of products.
Chinese patent publication No. CN202469998U discloses an LED lamp radiator, which includes a radiator and a mounting base, wherein the radiator is formed by connecting radiating fins and ribs into a whole, a heat pipe mounting groove is formed on the ribs, a heat pipe is mounted in the heat pipe mounting groove of the ribs in a close-fitting manner, a condensing end of the heat pipe is tightly connected with the radiating fins of the radiator through the ribs, and an evaporating end of the heat pipe is fixedly connected with the mounting base. The heat radiator radiates heat in a mode of combining the heat pipe with the heat radiating fins, only aiming at the flat-plate-shaped LED lamp body, and needing a corresponding condensation structure, the heat radiating effect is still to be improved.
Therefore, it is necessary to optimize the heat dissipation structure of the lamp, and improve the heat dissipation efficiency of the medium and high power lamp.
Disclosure of Invention
In order to solve the above problems existing in the prior art, the utility model provides a power supply heat abstractor forms holistic heat radiation structure through casing and lid to add in the cavity of casing and established fin and heat conduction pad, can in time distribute away the heat that the power strip produced through casing and lid, the LED lamps and lanterns life-span of high-power in the improvement.
In order to achieve the above object, the present invention provides the following technical solutions:
a power supply heat dissipation device comprises a shell, a cover body, a heat dissipation sheet and a heat conduction pad, wherein a cavity is formed in the shell, a power supply board is installed in the cavity, a first fin is arranged on a side plate of the shell towards the outer side, and the heat dissipation sheet is arranged between the side plate and the power supply board;
the cover body is fixed on the shell, and is provided with second fins towards the outer side and a lug boss towards the inner side; the heat conducting pad is arranged between the boss and the power panel.
In the power supply heat dissipation device, a heat dissipation sheet is arranged between a power supply board and a shell, and a heat conduction pad is arranged between the power supply board and a cover plate, so that heat generated by the power supply board can be transferred to the shell and a cover body; meanwhile, the first fins and the second fins are arranged on the shell and the cover body respectively and outwards, so that the heat exchange area is effectively increased in a limited space, the heat exchange coefficient of the device is improved, and the heat dissipation performance of the power supply heat dissipation device is effectively improved.
As a technical scheme of the utility model further describe, the casing still is provided with the IC boss in the cavity, the laminating of IC boss connect in IC chip on the power strip.
As a further description of the technical solution of the present invention, the IC boss and the IC chip are further provided with an IC heat conduction pad therebetween.
The shell is also provided with an IC boss in the cavity in a targeted manner, and the IC boss is used for guiding heat generated by the IC chip to the bottom plate of the shell; in order to enhance the heat-conducting property, an IC heat-conducting pad is arranged between the IC boss and the IC chip, so that the heat-radiating effect of the device on the electronic element with large heat productivity is further improved.
As a further description of the technical solution of the present invention, the first fin is provided on one of the side plates or the multi-side plate of the housing.
From the comprehensive consideration of production cost and heat dispersion, the outer panel of casing can set up first fin on one side or many sides wherein as required, effectively increases heat radiating area.
As a further description of the technical solution of the present invention, the heat sink with curb plate parallel arrangement, and closely laminating connect in the curb plate.
As the technical scheme of the utility model further describe, the fin includes riveting fixed first fin and second fin together, first fin laminating connect in the power strip, the laminating of second fin connect in the curb plate.
Through the heat conduction of the first radiating fin and the second radiating fin which are riveted together, the heat of electronic elements, such as MOS (metal oxide semiconductor) tubes, diodes and triodes, attached to the power panel can be timely led out to the shell, and the heat can be emitted through the fins.
As a further description of the technical solution of the present invention, the heat conducting pad is respectively connected with the boss and the transformer lamination of the power panel.
As a further description of the technical solution of the present invention, the number of the heat conduction pads is one or more.
The heat productivity of the transformer of the power panel is also larger, and the boss of the cover body is attached to the heat conducting pad, so that the heat produced by the transformer can be smoothly and timely dissipated.
As a further description of the technical solution of the present invention, the lengths of the fins inside the first fins are not the same; the lengths of the fins in the second fins are different.
As a further description of the technical solution of the present invention, the housing and the cover are made of metal.
In the shell and the cover body, the lengths of the first fins and the second fins are different, so that the length difference is formed, the contact area between the shell and the cover body and air can be increased, and the heat dissipation performance is improved through air convection.
Based on foretell technical scheme, the utility model discloses the technological effect who gains does:
(1) the utility model provides a power supply heat abstractor forms holistic heat radiation structure through casing and lid to add in the cavity of casing and established fin and heat conduction pad, can in time distribute away the heat that the power strip produced through casing and lid, the LED lamps and lanterns life-span of high-power in the improvement.
(2) The utility model discloses a power heat abstractor is provided with first fin and second fin on casing and lid respectively, and the length of fin differs moreover, can effectively increase heat transfer area in limited space to improve device's heat transfer coefficient promotes the convection current with the outside air, and has effectively promoted power heat abstractor's heat dispersion.
Drawings
Fig. 1 is an exploded view of the power supply heat sink of the present invention.
Detailed Description
To facilitate an understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings and specific examples. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example 1
Fig. 1 shows an exploded view of the power supply heat sink of the present embodiment, and as shown in fig. 1, the power supply heat sink includes a housing 1, a cover 2, a heat sink 3 and a heat conducting pad 4, wherein the housing 1 serves as a main frame of the heat sink and forms a cavity 11 therein for mounting a power supply board 5. The housing 1 may be square or cylindrical according to the shape of the power supply board 5 and the structure of the lamp body arranged later, and the square housing is taken as an example for the present embodiment. The housing 1 has four side plates 12, where the side plates meet, with a cambered surface treatment.
The power board 5 installed in the cavity 11 is a PCB board, and a plurality of electronic components are disposed on the PCB board, and the IC chip 51 and the transformer 53, as well as MOS transistors, diodes, and triodes (not shown) and the like generate a large amount of heat. Since the power supply board 5 generates a large amount of heat, the heat generated by the power supply board 5 needs to be transmitted out through the housing 1 and the cover 2 in time in order to ensure normal use thereof.
The side plate 12 of the housing 1 is provided with a first fin 13, the first fin 13 is arranged outward, the length of the fins is the same or different, that is, the length difference exists between the fins, so as to increase the heat exchange area between the first fin 13 and the outside air. The first fins 13 of the present embodiment are set to have the same length, and in the production process, the housing 1 made of metal can be stamped or engraved.
According to the requirement of the heat dissipation area, the first fins 13 may be fully distributed on all the side plates of the housing 1, or only one side plate thereof, or several side plates thereof, which is mainly considered from the production cost, the appearance of the product and the actual heat dissipation requirement.
In the embodiment, as shown in fig. 1, the first fins 13 are uniformly arranged on one side plate 12 of the housing 1, and the lengths of the first fins 13 are the same, so that the heat dissipation area of the housing can be effectively increased, and the heat exchange with the outside air is improved.
The heat sink 3 is disposed between the side plate 12 on which the first fins 13 are disposed and the power supply board 5, and the heat sink 3 is a sheet having good heat dissipation performance and is disposed parallel to the side plate 12 of the case 1. In this embodiment, the heat sink 3 includes a first heat sink 31 and a second heat sink 32, which are riveted together, wherein the first heat sink 31 is attached to the power board 5, and the second heat sink 32 is attached to the side board 12. The first radiating fin and the second radiating fin can be made of copper sheets or aluminum sheets.
Through the heat conduction of the first heat sink 31 and the second heat sink 32, the heat of the electronic components, such as MOS transistors, diodes, and triodes, attached to the power board 5 can be conducted out to the housing in time, and dissipated through the first fins 13.
The heat emitted by the power panel 5 can be conducted through the side plate 12 of the housing on the side surface; on the top surface, the present embodiment is provided with a cover 2 having second fins 21 for further heat conduction and dissipation.
The cover 2 is also made of metal, and is fixed on the casing 1, and is provided with a second fin 21 on the outer side and a boss 22 on the inner side, and it should be noted that a heat conducting pad 4 is further provided between the boss and the power board 5, and the heat conducting pad 4 is a pad with good heat conducting property, such as an aluminum pad, and has a top surface attached to the boss 22 and a bottom surface attached to the transformer 53 of the power board 4. The heat conductive pad 4 may be provided in one or more pieces according to the number of transformers 53 and heat dissipation. The thermal pad 4 of the present embodiment is provided in two pieces.
The heat generated by the transformer 53 with a large heat value is transferred to the surface of the cover 2 through the heat conducting pad 4 and the boss 22 attached to the heat conducting pad, and then is dissipated out in time through the second fins 21.
It should be further noted that the housing 1 is further provided with an IC boss 14 in the cavity 11, the IC boss is attached to the IC chip 51 connected to the power board 5, and is used for guiding heat generated by the IC chip 51 to a bottom plate of the housing 1; in order to enhance the thermal conductivity, an IC thermal pad 52 is further disposed between the IC pad 14 and the IC chip 51, so as to further improve the heat dissipation effect of the device on the electronic component with large heat generation.
The power supply heat dissipation device provided by the embodiment forms an integral heat dissipation structure through the shell and the cover body, and the heat dissipation sheet and the heat conduction pad are additionally arranged in the cavity of the shell, heat generated by the power supply board can be timely transmitted to the shell and the cover body, and the shell and the cover body are respectively provided with the first fins and the second fins, so that the heat exchange area can be effectively increased in a limited space, the heat exchange coefficient of the device is improved, convection with outside air is promoted, the heat dissipation performance of the power supply heat dissipation device is effectively promoted, and further the service life of an LED lamp with a medium-high power supply is prolonged.
The foregoing is merely illustrative and explanatory of the structure of the present invention, which is described in more detail and with greater particularity, and is not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, many variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (10)
1. A power supply heat dissipation device comprises a shell (1), a cover body (2), heat dissipation fins (3) and a heat conduction pad (4), wherein a cavity (11) is formed inside the shell (1), and a power supply board (5) is installed inside the cavity (11), and the power supply heat dissipation device is characterized in that first fins (13) are arranged on a side plate (12) of the shell (1) towards the outside, and the heat dissipation fins (3) are arranged between the side plate (12) and the power supply board (5);
the cover body (2) is fixed on the shell (1), and the cover body (2) is provided with a second fin (21) at the outer side and a lug boss (22) at the inner side; the heat conducting pad (4) is arranged between the boss (22) and the power panel (5).
2. The power supply heat sink according to claim 1, wherein the housing (1) is further provided with an IC boss (14) in the cavity (11), and the IC boss (14) is attached to an IC chip (51) on the power supply board (5).
3. The power heatsink of claim 2, further comprising an IC thermal pad (52) disposed between the IC boss (14) and the IC chip (51).
4. The power supply heat sink according to claim 1, wherein the first fins (13) are provided on one or more side plates of the housing (1).
5. The power supply heat sink according to claim 1, wherein the heat sink (3) is disposed parallel to the side plate (12) and is closely attached to the side plate (12).
6. The power supply heat sink according to claim 1, wherein the heat sink (3) comprises a first heat sink (31) and a second heat sink (32) riveted together, the first heat sink (31) is attached to the power supply board (5), and the second heat sink (32) is attached to the side board (12).
7. The power supply heat sink according to claim 1, wherein the heat conducting pad (4) is attached to the boss (22) and the transformer (53) of the power board (5).
8. The mains heat sink according to claim 7, wherein the number of thermal pads (4) is one or more.
9. The power supply heat sink according to claim 1, wherein the fins inside the first fins (13) are not uniform in length; the lengths of the fins in the second fins (21) are different.
10. The power supply heat sink according to any one of claims 1-9, wherein the housing (1) and the cover (2) are made of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120021071.5U CN213713020U (en) | 2021-01-04 | 2021-01-04 | Power supply heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120021071.5U CN213713020U (en) | 2021-01-04 | 2021-01-04 | Power supply heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213713020U true CN213713020U (en) | 2021-07-16 |
Family
ID=76789856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120021071.5U Active CN213713020U (en) | 2021-01-04 | 2021-01-04 | Power supply heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213713020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115135103A (en) * | 2022-06-20 | 2022-09-30 | 中国电子科技集团公司第十一研究所 | Driver component heat dissipation device and Stirling refrigerator |
-
2021
- 2021-01-04 CN CN202120021071.5U patent/CN213713020U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115135103A (en) * | 2022-06-20 | 2022-09-30 | 中国电子科技集团公司第十一研究所 | Driver component heat dissipation device and Stirling refrigerator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213777653U (en) | High-power LED lamp | |
| CN213713020U (en) | Power supply heat dissipation device | |
| CN217509342U (en) | Centralized heat dissipation structure | |
| CN207820437U (en) | A kind of vehicle device cooling system | |
| CN201892180U (en) | Combination structure of folded fin module and heat source | |
| CN205920849U (en) | Heat abstractor and high -voltage high -frequency power module of transformer | |
| CN201425286Y (en) | Heat dissipation structure of LED lamp | |
| CN209977927U (en) | Heat dissipation structure of automobile lamp | |
| CN210035423U (en) | Efficient stage lamp heat dissipation lamp stand | |
| CN210864552U (en) | CPU chip and display card integrated heat dissipation module | |
| CN210891581U (en) | Lamp shell and lamp | |
| CN106961822B (en) | Cooling cabinet and its printed board assembly | |
| CN208983060U (en) | The lamps and lanterns mould group of high efficiency and heat radiation | |
| CN210226051U (en) | Composite embedded radiating fin | |
| CN216744266U (en) | Heat radiation structure and circuit board used by LED lamp | |
| CN216282947U (en) | Heat pipe radiator | |
| CN2599641Y (en) | Vacuum heat-conducting pipe type heat sink for computer | |
| CN217423184U (en) | Special-shaped loop heat pipe radiator | |
| CN210928149U (en) | Circuit board design structure with heat dissipation structure | |
| CN219834548U (en) | Compact detector shell heat radiation structure | |
| CN220965267U (en) | Buffer type chip conduction heat dissipation structure | |
| CN223039911U (en) | Inverter and energy storage power supply | |
| CN219628226U (en) | Power inverter capable of improving heat dissipation efficiency | |
| CN209278884U (en) | A new lamp body structure | |
| CN221881393U (en) | Low-attenuation semiconductor lighting module with heat radiation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |